TW200724013A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200724013A
TW200724013A TW094142531A TW94142531A TW200724013A TW 200724013 A TW200724013 A TW 200724013A TW 094142531 A TW094142531 A TW 094142531A TW 94142531 A TW94142531 A TW 94142531A TW 200724013 A TW200724013 A TW 200724013A
Authority
TW
Taiwan
Prior art keywords
heat
heat dissipation
dissipation member
intercrossed
base
Prior art date
Application number
TW094142531A
Other languages
Chinese (zh)
Other versions
TWI308048B (en
Inventor
Yi-Qiang Wu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94142531A priority Critical patent/TWI308048B/en
Publication of TW200724013A publication Critical patent/TW200724013A/en
Application granted granted Critical
Publication of TWI308048B publication Critical patent/TWI308048B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device includes a base for contacting an heat-generating electronic device, a heat dissipation member provided with two fin groups intercrossed with each other and at least a heat pipe connecting the base to the heat dissipation member to transfer heat from the base to the heat dissipation member. A first heat sink and a second heat sink respectively contact with the heat dissipation member. The heat pipe is sandwiched between the heat dissipation member and the first, the second heat sink. The first heat-dissipating plates and the second heat-dissipating plates of the dissipation member are intercrossed with each other So, the heat dissipation member has a solid heat-dissipating plate structure. On the other hand, the intercrossed heat-dissipating plate configuration avails to form an even and smooth heat distribution in the heat dissipation member. Accordingly heat dissipation performance of the heat dissipation device is enhanced.
TW94142531A 2005-12-02 2005-12-02 Heat dissipation device TWI308048B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94142531A TWI308048B (en) 2005-12-02 2005-12-02 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94142531A TWI308048B (en) 2005-12-02 2005-12-02 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200724013A true TW200724013A (en) 2007-06-16
TWI308048B TWI308048B (en) 2009-03-21

Family

ID=45071744

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94142531A TWI308048B (en) 2005-12-02 2005-12-02 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI308048B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413890B (en) * 2008-09-05 2013-11-01 Foxconn Tech Co Ltd Heat dissipation device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413890B (en) * 2008-09-05 2013-11-01 Foxconn Tech Co Ltd Heat dissipation device

Also Published As

Publication number Publication date
TWI308048B (en) 2009-03-21

Similar Documents

Publication Publication Date Title
CN101573017A (en) Radiating device
TW200626059A (en) Systems to cool multiple electrical components
TWI257285B (en) Heat-dissipating module of electronic device
TW200611110A (en) Heatsink
US10108237B1 (en) Heat dissipating device with improved cooling performance
TWI498519B (en) Heat dissipating module
US20130168055A1 (en) Thermal module
TW200724013A (en) Heat dissipation device
US20130020056A1 (en) Heat dissipation device
TW200725234A (en) Heat dissipation device
TWI265267B (en) Heat dissipation device with heat pipe
TWI265268B (en) Heat dissipating device incorporating heat pipe
TW200715948A (en) Heat dissipation device
TWI413889B (en) Heat dissipation device
TW200721953A (en) Heat dissipation device
TW200736887A (en) Heat dissipating device
TW200637468A (en) Heat dissipation device with heat pipe
TW200709767A (en) Heat dissipation device with heat pipes
TW200733860A (en) Heat dissipation device
TW200704905A (en) Heat dissipation device with heat pipes
TW200725233A (en) Heat dissipation device
TW200736888A (en) Heat dissipating device and base thereof
TW200716939A (en) A method to form a heat sink and its positioning structure
TW200743944A (en) Heat dissipation device
TW200731054A (en) Heat dissipation device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees