TW200709767A - Heat dissipation device with heat pipes - Google Patents

Heat dissipation device with heat pipes

Info

Publication number
TW200709767A
TW200709767A TW094128477A TW94128477A TW200709767A TW 200709767 A TW200709767 A TW 200709767A TW 094128477 A TW094128477 A TW 094128477A TW 94128477 A TW94128477 A TW 94128477A TW 200709767 A TW200709767 A TW 200709767A
Authority
TW
Taiwan
Prior art keywords
heat
dissipation device
heat dissipation
base
fins
Prior art date
Application number
TW094128477A
Other languages
Chinese (zh)
Other versions
TWI341171B (en
Inventor
Hsieh-Kun Lee
Wan-Lin Xia
Tao Li
Min-Qi Xiao
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW094128477A priority Critical patent/TWI341171B/en
Publication of TW200709767A publication Critical patent/TW200709767A/en
Application granted granted Critical
Publication of TWI341171B publication Critical patent/TWI341171B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device with heat pipes is used for dissipating heat generated by an electronic device. The heat dissipation device includes a base with a plurality of fins, a heat pipe attached to the base, and two heat sinks sandwiching one end of the heat pipe therebetween. The heat sinks each comprisea conductive plate and a plurality of fins laterally extending from the conductive plate. The heat dissipation device draws heat via the base and spreads it around, then dissipates it out via the fins respectively formed on thebase and the conductive plates.
TW094128477A 2005-08-19 2005-08-19 Heat dissipation device with heat pipes TWI341171B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094128477A TWI341171B (en) 2005-08-19 2005-08-19 Heat dissipation device with heat pipes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128477A TWI341171B (en) 2005-08-19 2005-08-19 Heat dissipation device with heat pipes

Publications (2)

Publication Number Publication Date
TW200709767A true TW200709767A (en) 2007-03-01
TWI341171B TWI341171B (en) 2011-04-21

Family

ID=55855774

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128477A TWI341171B (en) 2005-08-19 2005-08-19 Heat dissipation device with heat pipes

Country Status (1)

Country Link
TW (1) TWI341171B (en)

Also Published As

Publication number Publication date
TWI341171B (en) 2011-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees