TW200721952A - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
- Publication number
- TW200721952A TW200721952A TW094141518A TW94141518A TW200721952A TW 200721952 A TW200721952 A TW 200721952A TW 094141518 A TW094141518 A TW 094141518A TW 94141518 A TW94141518 A TW 94141518A TW 200721952 A TW200721952 A TW 200721952A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- fan
- heat
- dissipation device
- heat dissipation
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device includes a heat sink, a first fan disposed on one part of the heat sink, a second fan disposed on another part of the heat sink and a cover disposed to enclose the heat sink, the first fan and the second fan. The second fan helps the airflow produced by the first fan flowing to the heat sink to quickly leave the heat sink so that heat absorbed by the heat sink from a heat-generating electronic component can be quickly and efficiently taken away.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94141518A TWI318097B (en) | 2005-11-25 | 2005-11-25 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94141518A TWI318097B (en) | 2005-11-25 | 2005-11-25 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200721952A true TW200721952A (en) | 2007-06-01 |
TWI318097B TWI318097B (en) | 2009-12-01 |
Family
ID=45073457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94141518A TWI318097B (en) | 2005-11-25 | 2005-11-25 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI318097B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI517782B (en) | 2011-11-11 | 2016-01-11 | 華碩電腦股份有限公司 | Heat dissipating module |
TWI812154B (en) * | 2022-04-11 | 2023-08-11 | 宏碁股份有限公司 | Graphics card and computer host |
-
2005
- 2005-11-25 TW TW94141518A patent/TWI318097B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI318097B (en) | 2009-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |