TW200721952A - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
TW200721952A
TW200721952A TW094141518A TW94141518A TW200721952A TW 200721952 A TW200721952 A TW 200721952A TW 094141518 A TW094141518 A TW 094141518A TW 94141518 A TW94141518 A TW 94141518A TW 200721952 A TW200721952 A TW 200721952A
Authority
TW
Taiwan
Prior art keywords
heat sink
fan
heat
dissipation device
heat dissipation
Prior art date
Application number
TW094141518A
Other languages
Chinese (zh)
Other versions
TWI318097B (en
Inventor
Xue-Wen Peng
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94141518A priority Critical patent/TWI318097B/en
Publication of TW200721952A publication Critical patent/TW200721952A/en
Application granted granted Critical
Publication of TWI318097B publication Critical patent/TWI318097B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device includes a heat sink, a first fan disposed on one part of the heat sink, a second fan disposed on another part of the heat sink and a cover disposed to enclose the heat sink, the first fan and the second fan. The second fan helps the airflow produced by the first fan flowing to the heat sink to quickly leave the heat sink so that heat absorbed by the heat sink from a heat-generating electronic component can be quickly and efficiently taken away.
TW94141518A 2005-11-25 2005-11-25 Heat dissipation device TWI318097B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94141518A TWI318097B (en) 2005-11-25 2005-11-25 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94141518A TWI318097B (en) 2005-11-25 2005-11-25 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200721952A true TW200721952A (en) 2007-06-01
TWI318097B TWI318097B (en) 2009-12-01

Family

ID=45073457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94141518A TWI318097B (en) 2005-11-25 2005-11-25 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI318097B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI517782B (en) 2011-11-11 2016-01-11 華碩電腦股份有限公司 Heat dissipating module
TWI812154B (en) * 2022-04-11 2023-08-11 宏碁股份有限公司 Graphics card and computer host

Also Published As

Publication number Publication date
TWI318097B (en) 2009-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees