TW200725233A - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
- Publication number
- TW200725233A TW200725233A TW094144732A TW94144732A TW200725233A TW 200725233 A TW200725233 A TW 200725233A TW 094144732 A TW094144732 A TW 094144732A TW 94144732 A TW94144732 A TW 94144732A TW 200725233 A TW200725233 A TW 200725233A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipation device
- heat dissipation
- spreader
- heat sink
- Prior art date
Links
Abstract
A heat dissipation device includes a heat spreader for contacting an electronic component, a heat sink mounted on the heat spreader, a fan mounted on the heat sink, a heat-dissipating component, and a heat pipe thermally connecting the heat spreader, the heat sink and the electronic component together. The heat sink includes a core corresponding to the heat spreader and located under the fan, and a plurality of fins extending from the core.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94144732A TWI308682B (en) | 2005-12-16 | 2005-12-16 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94144732A TWI308682B (en) | 2005-12-16 | 2005-12-16 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200725233A true TW200725233A (en) | 2007-07-01 |
TWI308682B TWI308682B (en) | 2009-04-11 |
Family
ID=45071877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94144732A TWI308682B (en) | 2005-12-16 | 2005-12-16 | Heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI308682B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI815294B (en) * | 2022-01-28 | 2023-09-11 | 奇鋐科技股份有限公司 | Thermal module structure |
-
2005
- 2005-12-16 TW TW94144732A patent/TWI308682B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI815294B (en) * | 2022-01-28 | 2023-09-11 | 奇鋐科技股份有限公司 | Thermal module structure |
Also Published As
Publication number | Publication date |
---|---|
TWI308682B (en) | 2009-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |