TW200717220A - Heat radiator - Google Patents

Heat radiator

Info

Publication number
TW200717220A
TW200717220A TW094136980A TW94136980A TW200717220A TW 200717220 A TW200717220 A TW 200717220A TW 094136980 A TW094136980 A TW 094136980A TW 94136980 A TW94136980 A TW 94136980A TW 200717220 A TW200717220 A TW 200717220A
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
computer system
conducting pipe
heat dissipation
Prior art date
Application number
TW094136980A
Other languages
Chinese (zh)
Other versions
TWI289252B (en
Inventor
Po-Jen Shih
Shi-Feng Lin
Original Assignee
Giga Byte Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Tech Co Ltd filed Critical Giga Byte Tech Co Ltd
Priority to TW94136980A priority Critical patent/TWI289252B/en
Publication of TW200717220A publication Critical patent/TW200717220A/en
Application granted granted Critical
Publication of TWI289252B publication Critical patent/TWI289252B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a heat radiator applicable for a computer system. It comprises a heat absorption board, a first heat-conducting pipe, and a first heat sink. The heat absorption board contacts a heating element on a circuit board. The first heat-conducting pipe has a first end, and a second end. The first end connects with the heat absorption board. The first heat sink connects with the second end of the heat-conducting pipe. The first heat sink comprises plural heat dissipation fins and a retaining structure. By means of the retaining structure, it lets the heat sink retain in the computer system, and extend part of the plural heat dissipation fins into the outside of computer system. The invention design enlarges the heat dissipation area, and enhances capability of heat dissipation. Moreover, the method of fixing the heat sink is firmly, and it is detachable easily.
TW94136980A 2005-10-21 2005-10-21 Heat radiator TWI289252B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94136980A TWI289252B (en) 2005-10-21 2005-10-21 Heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94136980A TWI289252B (en) 2005-10-21 2005-10-21 Heat radiator

Publications (2)

Publication Number Publication Date
TW200717220A true TW200717220A (en) 2007-05-01
TWI289252B TWI289252B (en) 2007-11-01

Family

ID=39294942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94136980A TWI289252B (en) 2005-10-21 2005-10-21 Heat radiator

Country Status (1)

Country Link
TW (1) TWI289252B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI736445B (en) * 2020-10-14 2021-08-11 瑞展動能股份有限公司 Heat dissipating device

Also Published As

Publication number Publication date
TWI289252B (en) 2007-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees