CN103672528B - High heat-sinking capability LED lamp - Google Patents
High heat-sinking capability LED lamp Download PDFInfo
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- CN103672528B CN103672528B CN201310748998.9A CN201310748998A CN103672528B CN 103672528 B CN103672528 B CN 103672528B CN 201310748998 A CN201310748998 A CN 201310748998A CN 103672528 B CN103672528 B CN 103672528B
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- circuit substrate
- passage
- metal pipe
- heat dissipation
- led lamp
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Abstract
The invention belongs to lighting, relate to a kind of high heat-sinking capability LED lamp.This high heat-sinking capability LED lamp includes a front and has the circuit substrate of LED chip, and the front of LED chip and circuit substrate is encapsulated by hemispheric light-distribution lens, and the back side of circuit substrate is provided with driving module and housing；Passage through before and after having on described light-distribution lens, passage rear end communicates with the installing hole on circuit substrate, is installed with heat dissipation metal pipe in installing hole；Heat dissipation metal pipe front end communicates with passage, and gas outlet, rear end is stretched out from back side of shell.The gas channel that one aspect of the present invention is through before and after being formed by passage and heat dissipation metal pipe, enhance gaseous exchange radiating effect, on the other hand directly it is connected with circuit substrate by heat dissipation metal pipe, make heat loss through conduction more quickly, effectively, thus be the heat-sinking capability that improve LED lamp in entirety.
Description
Technical field
The invention belongs to lighting, relate to a kind of high heat-sinking capability LED lamp.
Background technology
As the high-power LED lamp of lighting source, its heat radiation is the outstanding problem needing first to solve.Use the LED lamp of lens packages especially for front, its heat radiation is more difficult.The heat dissipating method generally used is the radiator installed at the circuit substrate back side of LED chip and have radiating fin, by radiator, the heat that LED produces is distributed, the LED chip opposition side being positioned on circuit substrate due to radiator, the heat that LED produces needs through circuit substrate, heat radiation glue-line, heat sink.Owing in heat transfer process, heat conductivility and heat-conducting area by material is affected, radiating effect can not reach preferable.
Summary of the invention
The technical problem to be solved is to provide that a kind of heat-sinking capability is strong, the high heat-sinking capability LED lamp of good operating stability.
The high heat-sinking capability LED lamp of the present invention includes a front and has the circuit substrate of LED chip, and the front of LED chip and circuit substrate is encapsulated by hemispheric light-distribution lens, and the back side of circuit substrate is provided with driving module and housing；Passage through before and after having on described light-distribution lens, passage rear end communicates with the installing hole on circuit substrate, is installed with heat dissipation metal pipe in installing hole；Heat dissipation metal pipe front end communicates with passage, and gas outlet, rear end is stretched out from back side of shell.
Described passage is circumferentially evenly distributed with multiple on light-distribution lens.
The heat dissipation metal pipe installed in each installing hole described is many bundle structure.
Described heat dissipation metal pipe back segment opens radially to circumferential outer edge bending.
The gas channel that one aspect of the present invention is through before and after being formed by passage and heat dissipation metal pipe, enhance gaseous exchange radiating effect, on the other hand directly it is connected with circuit substrate by heat dissipation metal pipe, make heat loss through conduction more quickly, effectively, thus be the heat-sinking capability that improve LED lamp in entirety.
Accompanying drawing explanation
Fig. 1 is the axial section structural representation of the embodiment of the present invention；
Fig. 2 is the front end view of the embodiment of the present invention.
Detailed description of the invention
As it is shown in figure 1, this high heat-sinking capability LED lamp includes a front has the circuit substrate 2 of LED chip 1, the front of LED chip 1 and circuit substrate 2 is encapsulated by hemispheric light-distribution lens 3, and the back side of circuit substrate is provided with driving module 4 and housing 5；Passage 6 through before and after having on described light-distribution lens 3, passage rear end communicates with the installing hole 7 on circuit substrate, is installed with heat dissipation metal pipe 8 in installing hole；Heat dissipation metal pipe 8 front end communicates with passage 6, and gas outlet, rear end is stretched out from housing 5 back side.Passage 6 is circumferentially evenly distributed with multiple (such as Fig. 2) on light-distribution lens.The heat dissipation metal pipe 8 installed in each installing hole 7 is many bundle structure.Heat dissipation metal pipe 8 back segment opens radially to circumferential outer edge bending.
Claims (3)
1. one kind high heat-sinking capability LED lamp, include a front and there is the circuit substrate (2) of LED chip (1), the front of LED chip (1) and circuit substrate (2) is encapsulated by hemispheric light-distribution lens (3), and the back side of circuit substrate is provided with driving module (4) and housing (5)；It is characterized in that: passage (6) through before and after having on described light-distribution lens (3), passage rear end communicates with the installing hole (7) on circuit substrate, is installed with heat dissipation metal pipe (8) in installing hole；Heat dissipation metal pipe (8) front end communicates with passage (6), and gas outlet, rear end is stretched out from housing (5) back side；The heat dissipation metal pipe (8) installed in each installing hole (7) is many bundle structure.
High heat-sinking capability LED lamp the most according to claim 1, is characterized in that: passage (6) is circumferentially evenly distributed with multiple on light-distribution lens.
High heat-sinking capability LED lamp the most according to claim 1, is characterized in that heat dissipation metal pipe (8) back segment opens radially to circumferential outer edge bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310748998.9A CN103672528B (en) | 2013-12-31 | 2013-12-31 | High heat-sinking capability LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310748998.9A CN103672528B (en) | 2013-12-31 | 2013-12-31 | High heat-sinking capability LED lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103672528A CN103672528A (en) | 2014-03-26 |
| CN103672528B true CN103672528B (en) | 2016-08-03 |
Family
ID=50310899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310748998.9A Active CN103672528B (en) | 2013-12-31 | 2013-12-31 | High heat-sinking capability LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103672528B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105757548A (en) * | 2016-03-31 | 2016-07-13 | 漳州立达信灯具有限公司 | LED spotlight |
| CN111156450B (en) * | 2020-02-28 | 2020-10-27 | 深圳飞德利照明科技有限公司 | Illuminating lamp with automatic heat dissipation structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201772837U (en) * | 2010-08-27 | 2011-03-23 | 重庆长安汽车股份有限公司 | Multifunctional detection plug for car body stamping part check tool |
| CN102162587A (en) * | 2010-12-31 | 2011-08-24 | 海星海事电气集团有限公司 | Adjustable search lamp |
| CN203743909U (en) * | 2013-12-31 | 2014-07-30 | 北京交通大学长三角研究院 | High-dissipation LED lamp |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009040918A (en) * | 2007-08-09 | 2009-02-26 | Mitsubishi Chemicals Corp | Fluorescent substance and its production method, composition containing fluorescent substance, light emitting device, and image display and illuminating device |
| KR20110035469A (en) * | 2009-09-30 | 2011-04-06 | 한국해양대학교 산학협력단 | The stubbornness light-emitting diode fish-luring light which is established in the starboard of the body of ship |
| CN103148366B (en) * | 2012-12-20 | 2014-12-31 | 北京交通大学 | Improved high-power LED (Light-emitting Diode) lamp |
-
2013
- 2013-12-31 CN CN201310748998.9A patent/CN103672528B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201772837U (en) * | 2010-08-27 | 2011-03-23 | 重庆长安汽车股份有限公司 | Multifunctional detection plug for car body stamping part check tool |
| CN102162587A (en) * | 2010-12-31 | 2011-08-24 | 海星海事电气集团有限公司 | Adjustable search lamp |
| CN203743909U (en) * | 2013-12-31 | 2014-07-30 | 北京交通大学长三角研究院 | High-dissipation LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103672528A (en) | 2014-03-26 |
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