CN203517425U - Multi-chip high-power LED (Light Emitting Diode) lamp and heat radiation structure - Google Patents
Multi-chip high-power LED (Light Emitting Diode) lamp and heat radiation structure Download PDFInfo
- Publication number
- CN203517425U CN203517425U CN201320636512.8U CN201320636512U CN203517425U CN 203517425 U CN203517425 U CN 203517425U CN 201320636512 U CN201320636512 U CN 201320636512U CN 203517425 U CN203517425 U CN 203517425U
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- China
- Prior art keywords
- heat radiation
- power led
- chip high
- groove
- circuit substrate
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- Expired - Fee Related
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Abstract
The utility model provides a multi-chip high-power LED (Light Emitting Diode) heat radiation structure. The multi-chip high-power LED heat radiation structure comprises a circuit board; the front side of the circuit board is provided with a groove which is used for bearing an LED; the back side of the circuit board is provided with a heat radiation copper plate; parallel heat conduction pipes are arranged on the lateral sides located at two ends of the circuit board; heat radiation fins are arranged perpendicular to the parallel heat conduction pipes; the opening portion of the groove is sealed by one end of a cylindrical lens; the other end of the cylindrical lens is connected with the plane of a plano-convex lens. The utility model also provides a multi-chip high-power LED lamp comprising the heat radiation structure. According to the multi-chip high-power LED lamp and the heat radiation structure, the use of bonding agents and heat sinks is reduced, the multiple heat resistance is omitted, and accordingly the heat radiation speeds up and the heat radiation efficiency is improved.
Description
Technical field
The invention belongs to LED lighting technical field, particularly a kind of multi-chip high power LED light fixture and radiator structure.
Background technology
The conventional light source comparing, LED lighting tool has the absolute advantage that colourity is good and energy consumption is low, in every field, be all applied widely, and heat radiation is the greatest problem that LED lighting field faces all the time, while especially working under high temperature (40 ℃ of left and right) environment, because heat is difficult to Quick diffusing, cause LED to be easy to break down, spoilage is high.Prior art is generally by installing fan additional or substrate bonding being overcome to this problem in heat sink, but because fan itself also will consume energy, provided with fan cost is higher in addition, so promote the use of, is restricted; And when by substrate bonding during in heat sink, radiating effect is received again the heat conductivility restriction of bonding agent itself and heat sink copper post.
Summary of the invention
In order to overcome the shortcoming of above-mentioned prior art, the object of the present invention is to provide a kind of multi-chip high power LED light fixture and radiator structure, efficiently solve the heat dissipation problem in LED illumination.
To achieve these goals, the technical solution used in the present invention is:
A kind of multi-chip high power LED radiator structure, comprise circuit substrate 1, in the front of circuit substrate 1, have for carrying the groove 2 of LED, the back side is provided with heat radiation copper coin 8, on the side at circuit substrate 1 two ends, be furnished with parallel conductive heat pipe 3, be vertically installed with upper radiating fin 4 with parallel conductive heat pipe 3, the peristome of groove 2 is with an end closure of cylindrical lens 6, the plane of another termination planoconvex spotlight 7 of cylindrical lens 6.
The utility model provides a kind of multi-chip high power LED light fixture that adopts this radiator structure simultaneously, in the front of circuit substrate 1, have groove 2, on the side at circuit substrate 1 two ends, be furnished with parallel conductive heat pipe 3, the back side is provided with heat radiation copper coin 8, be vertically installed with upper radiating fin 4 with parallel conductive heat pipe 3, a plurality of LED light sources 5 are distributed in groove 2, and the peristome of groove 2 is with an end closure of cylindrical lens 6, the plane of another termination planoconvex spotlight 7 of cylindrical lens 6.
Compared with prior art, the present invention has reduced bonding agent and heat sink use, has saved multiple thermal resistance, thereby has accelerated radiating rate, has improved radiating efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
The specific embodiment
Below in conjunction with drawings and Examples, describe embodiments of the present invention in detail.
As shown in Figure 1, a kind of multi-chip high power LED light fixture and radiator structure, comprise circuit substrate 1, different from traditional circuit substrate, in the front of circuit substrate 1, have groove 2, on the side at two ends, be furnished with parallel conductive heat pipe 3, be vertically installed with upper radiating fin 4 with parallel conductive heat pipe 3, a plurality of LED light sources 5 are distributed in groove 2, and the peristome of groove 2 is with an end closure of cylindrical lens 6, the plane of another termination planoconvex spotlight 7 of cylindrical lens 6.Wherein, circuit substrate 1 back side can also arrange radiator coil tube, now needs circuit substrate 1 side direction to install.
Based on above structure, circuit substrate 1 heat by parallel conductive heat pipe 3 or radiator coil tube to external diffusion, middle without heat sink, and reduced bonding agent, therefore can significantly improve radiating efficiency.
Claims (2)
1. a multi-chip high power LED radiator structure, comprise circuit substrate (1), be characterised in that, in the front of circuit substrate (1), have the groove (2) for carrying LED, the back side is provided with heat radiation copper coin (8), on the side at circuit substrate (1) two ends, be furnished with parallel conductive heat pipe (3), be vertically installed with upper radiating fin (4) with parallel conductive heat pipe (3), the peristome of groove (2) is with an end closure of cylindrical lens (6), the plane of another termination planoconvex spotlight (7) of cylindrical lens (6).
2. a multi-chip high power LED light fixture, comprise circuit substrate (1), it is characterized in that, in the front of circuit substrate (1), have groove (2), on the side at circuit substrate (1) two ends, be furnished with parallel conductive heat pipe (3), the back side is provided with heat radiation copper coin (8), be vertically installed with upper radiating fin (4) with parallel conductive heat pipe (3), a plurality of LED light sources (5) are distributed in groove (2), the peristome of groove (2) is with an end closure of cylindrical lens (6), the plane of another termination planoconvex spotlight (7) of cylindrical lens (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320636512.8U CN203517425U (en) | 2013-10-15 | 2013-10-15 | Multi-chip high-power LED (Light Emitting Diode) lamp and heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320636512.8U CN203517425U (en) | 2013-10-15 | 2013-10-15 | Multi-chip high-power LED (Light Emitting Diode) lamp and heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203517425U true CN203517425U (en) | 2014-04-02 |
Family
ID=50376355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320636512.8U Expired - Fee Related CN203517425U (en) | 2013-10-15 | 2013-10-15 | Multi-chip high-power LED (Light Emitting Diode) lamp and heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203517425U (en) |
-
2013
- 2013-10-15 CN CN201320636512.8U patent/CN203517425U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20181015 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |