CN203743909U - High-dissipation LED lamp - Google Patents

High-dissipation LED lamp Download PDF

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Publication number
CN203743909U
CN203743909U CN201320887822.7U CN201320887822U CN203743909U CN 203743909 U CN203743909 U CN 203743909U CN 201320887822 U CN201320887822 U CN 201320887822U CN 203743909 U CN203743909 U CN 203743909U
Authority
CN
China
Prior art keywords
circuit substrate
heat dissipation
metal pipe
passage
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN201320887822.7U
Other languages
Chinese (zh)
Inventor
徐征
赵谡玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yangtze River Delta Research Institute Of Beijing Jiaotong University
Original Assignee
Yangtze River Delta Research Institute Of Beijing Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yangtze River Delta Research Institute Of Beijing Jiaotong University filed Critical Yangtze River Delta Research Institute Of Beijing Jiaotong University
Priority to CN201320887822.7U priority Critical patent/CN203743909U/en
Application granted granted Critical
Publication of CN203743909U publication Critical patent/CN203743909U/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model belongs to lamps and particularly relates to a high-dissipation LED lamp comprising a circuit substrate. The front of the circuit substrate is provided with an LED chip. The front of the LED chip and the circuit substrate is packaged with a semispherical distribution lens. The back of the circuit substrate is provided with a drive module and a shell. The distribution lens is provided with air holes passing through from front to rear. The rear ends of the air holes are communicated with mounting holes in the circuit substrate. Metal radiating tubes are fixedly mounted in the mounting holes. The front ends of the metal radiating tubes are communicated with the air holes; the rear ends of the metal radiating tubes extend out of the back of the shell from air outlets. The high-dissipation LED lamp has the advantages that air passages which are through from front to rear and which are formed by the air holes and the metal radiating tubes enhance the effect of heat dissipation by air convection; the metal radiating tubes are directly connected with the circuit substrate, heat conduction is faster and more effective, and the heat dissipation capability of the LED lamp is improved on the whole.

Description

High heat-sinking capability LED light fixture
Technical field
The utility model belongs to lighting, relates to a kind of high heat-sinking capability LED light fixture.
Background technology
As the high-power LED lamp of lighting source, its heat radiation is the outstanding problem that need to first solve.For front, adopt especially the LED light fixture of lens packages, its heat radiation is more difficult.Conventionally the heat dissipating method adopting is, at the circuit substrate back side of LED chip, the radiator with radiating fin is installed, dissipation of heat LED being produced by radiator is gone out, because radiator is positioned at the LED chip opposition side on circuit substrate, the caloric requirement that LED produces is through circuit substrate, heat radiation glue-line, heat sink.Owing to being subject to the impact of heat conductivility and the heat-conducting area of material in heat transfer process, it is desirable that radiating effect can not reach.
Summary of the invention
Technical problem to be solved in the utility model is, provides that a kind of heat-sinking capability is strong, the high heat-sinking capability LED light fixture of good operating stability.
High heat-sinking capability LED light fixture of the present utility model includes the circuit substrate that a front has LED chip, and the front of LED chip and circuit substrate is encapsulated by hemispheric light-distribution lens, and the back side of circuit substrate is provided with driver module and housing; The passage connecting before and after having on described light-distribution lens, passage rear end communicates with the installing hole on circuit substrate, is installed with heat dissipation metal pipe in installing hole; Heat dissipation metal pipe front end communicates with passage, and stretch out from back side of shell gas outlet, rear end.
Described passage is distributed with a plurality of on light-distribution lens along even circumferential.
The heat dissipation metal pipe of installing in described each installing hole is many bundle structure.
Described heat dissipation metal pipe back segment opens and is radial to circumferential outer edge bending.
The gas channel that the utility model connects before and after forming by passage and heat dissipation metal pipe on the one hand, strengthened gaseous exchange radiating effect, by heat dissipation metal pipe, be directly connected with circuit substrate on the other hand, make heat loss through conduction more fast, effectively, thereby in integral body, be the heat-sinking capability that has improved LED light fixture.
Accompanying drawing explanation
Fig. 1 is the axial section structural representation of the utility model embodiment;
Fig. 2 is the positive end view of the utility model embodiment.
The specific embodiment
As shown in the figure, this high heat-sinking capability LED light fixture includes the circuit substrate 2 that a front has LED chip 1, and the front of LED chip 1 and circuit substrate 2 is by hemispheric light-distribution lens 3 encapsulation, and the back side of circuit substrate is provided with driver module 4 and housing 5; The passage 6 connecting before and after having on described light-distribution lens 3, passage rear end communicates with the installing hole 7 on circuit substrate, is installed with heat dissipation metal pipe 8 in installing hole; Heat dissipation metal pipe 8 front ends communicate with passage 6, and stretch out from housing 5 back sides gas outlet, rear end.Passage 6 is distributed with a plurality of (as Fig. 2) along even circumferential on light-distribution lens.The heat dissipation metal pipe 8 of installing in each installing hole 7 is many bundle structure.Heat dissipation metal pipe 8 back segments open and are radial to circumferential outer edge bending.

Claims (4)

1. one kind high heat-sinking capability LED light fixture, include the circuit substrate (2) that a front has LED chip (1), the front of LED chip (1) and circuit substrate (2) is by hemispheric light-distribution lens (3) encapsulation, and the back side of circuit substrate is provided with driver module (4) and housing (5); It is characterized in that: the passage (6) connecting before and after having on described light-distribution lens (3), passage rear end communicates with the installing hole (7) on circuit substrate, is installed with heat dissipation metal pipe (8) in installing hole; Heat dissipation metal pipe (8) front end communicates with passage (6), and stretch out from housing (5) back side gas outlet, rear end.
2. high heat-sinking capability LED light fixture according to claim 1, is characterized in that: passage (6) is distributed with a plurality of on light-distribution lens along even circumferential.
3. high heat-sinking capability LED light fixture according to claim 1, is characterized in that: the heat dissipation metal pipe (8) of installing in each installing hole (7) is many bundle structure.
4. high heat-sinking capability LED light fixture according to claim 1, is characterized in that heat dissipation metal pipe (8) back segment opens and is radial to circumferential outer edge bending.
CN201320887822.7U 2013-12-31 2013-12-31 High-dissipation LED lamp Withdrawn - After Issue CN203743909U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320887822.7U CN203743909U (en) 2013-12-31 2013-12-31 High-dissipation LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320887822.7U CN203743909U (en) 2013-12-31 2013-12-31 High-dissipation LED lamp

Publications (1)

Publication Number Publication Date
CN203743909U true CN203743909U (en) 2014-07-30

Family

ID=51343709

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320887822.7U Withdrawn - After Issue CN203743909U (en) 2013-12-31 2013-12-31 High-dissipation LED lamp

Country Status (1)

Country Link
CN (1) CN203743909U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103672528A (en) * 2013-12-31 2014-03-26 北京交通大学长三角研究院 LED lamp high in heat dissipation capability
CN110832246A (en) * 2017-05-12 2020-02-21 帕齐戴蒙德工程有限公司 Light source for a luminaire

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103672528A (en) * 2013-12-31 2014-03-26 北京交通大学长三角研究院 LED lamp high in heat dissipation capability
CN103672528B (en) * 2013-12-31 2016-08-03 北京交通大学长三角研究院 High heat-sinking capability LED lamp
CN110832246A (en) * 2017-05-12 2020-02-21 帕齐戴蒙德工程有限公司 Light source for a luminaire

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20140730

Effective date of abandoning: 20160803

C25 Abandonment of patent right or utility model to avoid double patenting