CN202203910U

CN202203910U - Embedded air-cooling heat-dissipating device

Info

Publication number: CN202203910U
Application number: CN201120266712XU
Authority: CN
Inventors: 陈刚
Original assignee: DUJIANGYAN HUAGANG ELECTRONIC TECHNOLOGY CO LTD
Current assignee: DUJIANGYAN HUAGANG ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2011-07-27
Filing date: 2011-07-27
Publication date: 2012-04-25
Anticipated expiration: 2021-07-27

Abstract

The utility model discloses an embedded air-cooling heat-dissipating device, which comprises a heat dissipating base, wherein heat-dissipating fins (1) are formed on one side of the heat-dissipating base. The heat-dissipating device is characterized in that a box-shaped structure surrounded by an upper substrate (3) and a lower substrate (4) is arranged on the heat-dissipating base, wherein air holes (2) are respectively formed on the upper substrate (3) and the lower substrate (4); an inner cavity is formed between the upper substrate (3) and the lower substrate (4); and a heat-dissipating fan (5) is arranged in the inner cavity. By adopting the structure of the embedded air-cooling heat-dissipating device, the fan is integrated in the heat-dissipating device to form an integral heat-dissipating device, so that the standardization of the heat-dissipating device is facilitated and the uniformity of products is conveniently kept by a packaging factory; in addition, the structures of the non-communicated upper and lower substrates with the air holes formed thereon, and the columnar heat-dissipating fins positioned at the center of the fan are adopted, so that the heat passage of the heat-dissipating structure is more reasonable, and the heat-dissipating effect is better.

Description

Embedded air-cooled radiator

Technical field

The utility model relates to the LED field of light fittings, relates in particular to a kind of embedded air-cooled radiator.

Background technology

Led light source has that long service life, start-up time are short, energy-saving effect significantly, no ultra-violet radiation, can not bring plurality of advantages such as mercury pollution, safety in utilization height, becoming the main flow of lighting source gradually, still; Although the luminous efficiency of LED is in continuous improve, heat in the course of the work produces and still can't avoid, especially for high-power, high-density applications; These heats can badly influence the life-span and the performance of product, and existing LED light fixture mainly relies on heat radiation to dispel the heat; Heat dispersion is limited, and is in order to adapt to the application need that the heat radiation requirement improves constantly, existing through the device appearance that fan distributes to strengthen heat is set; Chinese patent document CN201401764Y just discloses a kind of " high-power LED lamp structure that has fan "; This high-power LED lamp structure that has fan is characterised in that: be provided with fan, radiator is the tubular body that is provided with the hollow tube chamber, and fan is fixed in the center of radiator tail end; Though this successful fan being incorporated in the heat sink conception of LED of high-power LED lamp structure that has fan; But on the one hand, its current path is unreasonable, and radiating effect has much room for improvement; On the other hand, this way of acquiring fan in the radiator outside causes fitting structure complicated, is not easy to the assembling production of light fixture, also is difficult to the reliability that guarantees that fan is installed.

The utility model content

The purpose of the utility model is to overcome the deficiency of prior art, and a kind of incorporate, rational in infrastructure, the better embedded air-cooled radiator of radiating effect is provided.

The utility model adopts following technical scheme to realize: embedded air-cooled radiator; Include cooling base; Side at cooling base is formed with radiating fin; Said cooling base is surrounded by upper substrate that offers the wind hole and infrabasal plate and forms box like structure, between upper substrate and infrabasal plate, is formed with internal cavity, has radiator fan to be placed in the internal cavity.

Further technical scheme is that said wind hole is evenly arranged on upper substrate and the infrabasal plate, and staggers each other in the position in upper substrate and infrabasal plate windward hole.

Technical scheme further is, said radiating fin is a column, and hash is at the upper substrate end face.

Further technical scheme is that said radiating fin has multiple height, arranges according to form from high to low to peripheral position from upper substrate end face middle position again.

Adopt the embedded air-cooled radiator of this structure; Fan has been gathered in the radiator; The heat abstractor of becoming one, standardization and the encapsulation producer of being convenient to radiator keep consistency of product, and adopt the upper and lower base plate wind well format of non-perforation, the position of fan that is positioned at central authorities, the radiating fin of column; Make that the heat passage of this radiator structure is more reasonable, radiating effect is better.

Below in conjunction with accompanying drawing and embodiment the utility model is further set forth, the protection domain of the utility model includes but are not limited to accompanying drawing and the disclosed content of embodiment.

Description of drawings

Fig. 1 is the exploded perspective view of the utility model.

The specific embodiment

Below in conjunction with accompanying drawing the utility model is done further to set forth.

As shown in Figure 1, the cooling base of this embedded air-cooled radiator is surrounded by upper substrate 3 and infrabasal plate 4 and forms, and the periphery of infrabasal plate has the sidewall of setting; The entire heat dissipation pedestal becomes to have the box like structure of internal cavity, has radiator fan 5 to be placed in this internal cavity, all offers leg-of-mutton wind hole 2 on upper substrate 3 and the infrabasal plate 4; And stagger each other in the position in upper substrate and infrabasal plate windward hole; Thereby form more effective gas channel, be beneficial to the enhancing of wind-cooling heat dissipating effect, also be formed with the radiating fin 1 of column at the end face of upper substrate 3; Radiating fin 1 in the present embodiment has two kinds of height; Have the bigger radiating fin of six roots of sensation height 1 to be positioned at the middle position of upper substrate end face, have the lower radiating fin of six roots of sensation height to be positioned at the peripheral position of upper substrate end face, this arrangement form more helps the heat radiation on the radiating fin 1.

The embodiment of the utility model is not limited to the foregoing description, all should belong within the protection domain of the utility model in the various variations that do not break away under the utility model design prerequisite.

Claims

1. embedded air-cooled radiator; Include cooling base; Side at cooling base is formed with radiating fin (1); It is characterized in that: said cooling base is surrounded by upper substrate that offers wind hole (2) (3) and infrabasal plate (4) and forms box like structure, between upper substrate (3) and infrabasal plate (4), is formed with internal cavity, has radiator fan (5) to be placed in the internal cavity.

2. embedded air-cooled radiator according to claim 1 is characterized in that: said wind hole (2) is evenly arranged on upper substrate (3) and the infrabasal plate (4), and staggers each other in the position in upper substrate (3) and infrabasal plate (4) windward hole.

3. embedded air-cooled radiator according to claim 2 is characterized in that: said radiating fin (1) is a column, and hash is at upper substrate (3) end face.

4. embedded air-cooled radiator according to claim 3 is characterized in that: said radiating fin (1) has multiple height, arranges according to form from high to low to peripheral position from upper substrate (3) end face middle position.