CN102622069A - Computer radiating pad - Google Patents
Computer radiating pad Download PDFInfo
- Publication number
- CN102622069A CN102622069A CN2012100519141A CN201210051914A CN102622069A CN 102622069 A CN102622069 A CN 102622069A CN 2012100519141 A CN2012100519141 A CN 2012100519141A CN 201210051914 A CN201210051914 A CN 201210051914A CN 102622069 A CN102622069 A CN 102622069A
- Authority
- CN
- China
- Prior art keywords
- heat
- computer
- radiating
- pad
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000000875 corresponding Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 description 2
- 230000002035 prolonged Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000000630 rising Effects 0.000 description 1
Abstract
The invention discloses a computer radiating pad, which comprises a radiating base and is characterized by further comprising a plurality of radiating fins which are disposed on the surface of the radiating base. Each radiating fin is correspondingly connected with a heat conducting tube. The computer radiating pad resolves the problem in the prior art that a computer only adopts a fan mode for radiating, is poor in radiating effect, easily causes damage to a chip and affects working of the computer. The computer radiating pad is capable of improving computer radiating efficiency and beneficial for computer chip protection. By using the radiating fins and the heat conducting tubes for twice radiating, the computer radiating pad is capable of effectively transmitting heat emitted by the computer chip during work to the heat conducting tubes. By means of extremely strong heat-transfer capability, the radiating fins enable heat to be transmitted to the heat conducting tubes efficiently, and the heat is emitted through heat exchange of the heat conducting tubes and the air. The computer radiating pad has efficient conducting and radiating capability and prolongs service life of the computer.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly relate to a kind of computer heat radiation plate.
Background technology
When computer work, cabinet inside can produce high temperature, and along with the continuous progress of computer technology and constantly update, the integrated circuit of computer is more and more accurate, and volume is also more and more littler.Because the rising of temperature will influence the work of each parts in the computer, so must add heat abstractor to reduce the temperature of computer, still many at present fans that in cabinet, are provided with; Utilize fan that chip in the computer is dispelled the heat, adopt the heat radiation of this kind method, though fan is dried to chip; But the heat in the chip can't be passed out; Cause radiating effect bad like this, cause the damage of chip easily, influence the work of computer.
Summary of the invention
Computer only adopts the heat radiation of fan form in the prior art in order to solve, and radiating effect is bad, causes the damage of chip easily, influences the problem of computer work, the invention provides a kind of computer heat radiation efficient that improves, and helps the computer heat radiation plate of computer chip protection.
In order to address the above problem, the technical scheme that the present invention taked is:
A kind of computer heat radiation plate comprises heat dissipation base, it is characterized in that: also comprise some heat radiator, be provided with heat radiator on the heat dissipation base surface, heat pipe of corresponding connection on said each heat radiator.
Aforesaid a kind of computer heat radiation plate is characterized in that: saidly be located at some heat radiator on the heat dissipation base by radial arrangement around the middle mind-set.
Aforesaid a kind of computer heat radiation plate is characterized in that: said heat dissipation base adopts copper material to process.
Aforesaid a kind of computer heat radiation plate is characterized in that: a sheathed outer cover on heat dissipation base is provided with fan in outer cover.
The invention has the beneficial effects as follows: the present invention carries out twice heat radiation through heat radiator and heat pipe; The heat that distributes in the time of can computer chip being worked is transmitted to heat pipe effectively; Heat radiator rely on its extremely strong heat-transfer capability with the heat high efficiency of transmission to heat pipe, the heat interchange through heat pipe and air distributes heat.Had the efficient conduction heat-sinking capability, prolonged the serviceable life of computer.Radial arrangement around the mind-set cooperated the work of fan during heat radiator adopted simultaneously, can more easily the heat transferred on the heat radiator be gone out better heat-radiation effect.
Description of drawings
Fig. 1 is a computer heat radiation plate structure synoptic diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing the present invention is done further description.
As shown in Figure 1, a kind of computer heat radiation plate comprises heat dissipation base 1 and some heat radiator 2; Heat dissipation base 1 adopts copper material to process; Be provided with some heat radiator 2 on heat dissipation base 1 surface, some heat radiator 2 are by radial arrangement around the middle mind-set, and correspondence connects a heat pipe 3 on each heat radiator 2.A sheathed outer cover is provided with fan in outer cover on heat dissipation base 1.
Computer chip contacts with heat dissipation base 1; Carry out twice heat radiation through heat radiator 2 and heat pipe 3; The heat that distributes in the time of can computer chip being worked is transmitted to heat pipe 3 effectively; Heat radiator 2 relies on its extremely strong heat-transfer capability that the heat high efficiency of transmission is arrived heat pipe 3, through the heat interchange of heat pipe 3 with air heat is distributed.Had the efficient conduction heat-sinking capability, prolonged the serviceable life of computer.Radial arrangement around the mind-set cooperated the work of fan during heat radiator 2 adopted simultaneously, can more easily the heat transferred on the heat radiator be gone out better heat-radiation effect.
More than show and described ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the instructions just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection domain to be defined by appending claims and equivalent thereof.
Claims (4)
1. a computer heat radiation plate comprises heat dissipation base, it is characterized in that: also comprise some heat radiator, be provided with heat radiator on the heat dissipation base surface, heat pipe of corresponding connection on said each heat radiator.
2. a kind of computer heat radiation plate according to claim 1 is characterized in that: saidly be located at some heat radiator on the heat dissipation base by radial arrangement around the middle mind-set.
3. a kind of computer heat radiation plate according to claim 2 is characterized in that: said heat dissipation base adopts copper material to process.
4. a kind of computer heat radiation plate according to claim 3 is characterized in that: a sheathed outer cover on heat dissipation base is provided with fan in outer cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100519141A CN102622069A (en) | 2012-03-01 | 2012-03-01 | Computer radiating pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100519141A CN102622069A (en) | 2012-03-01 | 2012-03-01 | Computer radiating pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102622069A true CN102622069A (en) | 2012-08-01 |
Family
ID=46562025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100519141A Pending CN102622069A (en) | 2012-03-01 | 2012-03-01 | Computer radiating pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102622069A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106767058A (en) * | 2016-11-25 | 2017-05-31 | 重庆大学 | Big plane small space free convection heat pipe |
| CN107272846A (en) * | 2017-06-28 | 2017-10-20 | 昆山特酷信息科技有限公司 | A kind of heat radiator for notebook computer |
-
2012
- 2012-03-01 CN CN2012100519141A patent/CN102622069A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106767058A (en) * | 2016-11-25 | 2017-05-31 | 重庆大学 | Big plane small space free convection heat pipe |
| CN107272846A (en) * | 2017-06-28 | 2017-10-20 | 昆山特酷信息科技有限公司 | A kind of heat radiator for notebook computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120801 |