1289252 九、發明說明： 【發明所屬之技術領域】 尤其係關於一種電子產品的散 本發明係關於一種散熱裝置 熱裝置。 【先前技術】 目前’現代化髓産品，尤其是具有許多精密的電子零件的 奸産品，例如電腦、DVD播放機、數位影片播放機(請）、擴 音裔等’其巾㈣擎、f腦財央處驾(cpu)、影韻、顯示卡 以=腦機殼等部件會産生大量的熱量，為了保證上述機器運作 的穩定，電子料的散熱魏就變得極為重要。 利用散熱器來排除熱量，以防止機械裝置或者電子產品等過 '、、、而抽壞’成為—種重要配備。目前用財種電子零件的常見 賴料顧的散齡置，μ要包括直接與錢 面積以提〜^巾放熱體外表面域片狀，可提高與空氣的接觸 管;能，内部密封有冷凝液’透過 導吸熱片内，當吸熱片吸收了發熱元件的熱量， _迅二二二::二一 Γ連的導熱管蒸發端的冷凝 伊，ν散熱體相連的冷凝端，速度非常 、心在散熱體凝結液化以後，通過毛細作用，流回鮮端， 5 1289252 而散熱體透侧絲_散熱，將熱量傳導至空 低 =【度:如_潍復，不斷地將熱量帶向溫齡 ΐ，i至損ί種政熱料可有效避免發熱部件過熱而降低工作效 眾所周知’散熱的面簡大，散熱效果越好，然而，先前技 何的散熱裝置湘扣具把賴片固定在發熱元件上，散埶體直接 =在吸刻上，這麵定方式吸熱•散熱體較近，散熱體的 I不能充分的散發到空氣中，不利於散熱，而且現有的固定方 式的過於繁瑣不便拆卸，給伽造成不便。因此，—種既能安全 二斥p的□疋又i加大散熱力度的散熱裝置係為—種較佳的選 擇0 【發明内容】 #於以上的問題，本發明的主要目的在於提供—種既可安全 可拆卸的固定又能加大散熱力度的散熱裝置。 ^因此’為達上述目的，本發明所揭露之—種散熱裝置，用於 電腦土統中，包括：-吸熱模塊，與一電路板上的一發熱元件接 觸’第一導熱官’具有第一端及第二端，第一端係與吸熱模塊相 ,，第一散熱體’與第一導熱管之第二端相連，其中第一散熱 體更包括複數散_片及—定位結構，藉由定位結構將散熱體定 位於4系統内’並使複數散減片之—部份延伸出電腦系統外 1289252 t發明的優點在於將第_散熱體增加—系舰定位作用的縛 片，不僅擴大了散熱面積，加大了散熱力度，而且，使用的固定 方式ρΐ單牢固’便於拆卸，而且本發明散絲置採用兩個散熱體 的α置更保$ 了充分散熱，兩個散熱體分別位於電路板的兩側， 合理利用了空間。 【實施方式】 以下，將結合附圖對本發明的優選實施方式作詳細說明。 考第1圖」至「第3圖」，分別係本發明散熱裝置分解 不思圖、組合後的前視圖和組合後的後視圖，其中該散熱裝置固 2於電腦電路板上，包括：散熱模塊〗卜兩個_管12和吸熱 模塊13。其中，吸熱模塊13與電路板上的發熱元件1〇〇相接觸 以吸收其發出的歸，其包括兩個對稱的吸刻⑶、133，兩個 位於吸熱片131、133之間且分別與之接觸的對稱的導熱管收容體 135、137和散熱片2〇。其中，吸熱片131、133和導熱管收容體 135、137都係用於吸收發熱元件觸發出的熱量，由高導熱性材 ，製成’如金屬鋼，吸熱片13卜133尾部分別向上趣起，以接觸 散熱」20，從而將熱量傳導至散熱片2〇上，導熱管收容體出、 =7密封導熱管12和其中的冷凝液，導熱管收容體⑶、⑺略 突出於吸熱片13卜133以方便連接導熱管12，散熱片2〇覆蓋吸 '、、、片31 133和導熱官收容體135、137，並將二者固定到電路 板上’放熱片20外表面包括複數向外突出的鰭片，用於散熱，頂 1289252 ^還有Γ突出於外表面的收容體，該收容體與該散刻-體設 可對應收谷導熱管12與導熱管收容體135、137突出與吸熱 的連接和起到保護作用，而且，散熱片μ與吸熱 131, 133的趣起部分接觸，可將吸熱片⑶、⑶上的熱量吸 收’ ϋ透過複數鰭片將熱量散發出去。 ，兩個導熱官12類型相同，一端分別與導熱管收容體135、⑺ 對應連接，該端為蒸發端(加熱端），導熱管ΐ2内部真空密封有冷 =液|冷辦遇熱迅速變為氣體。散熱模塊η包括兩個散熱體 、113，散熱體m與吸熱模塊13都位於魏板的同一侧，散 Γ113位於電路編―側，與散熱體⑴及吸熱模塊η所處 =相對。如第3圖所示，其中散熱體113為長方體，其包括 ^大起=鰭片’用於散熱，收容導熱管12的固定部位於籍片的 月面’以雄封導熱管12的另—端(冷凝端或冷卻 ::τ:包括兩細定板，固持在電路板一 ^ 邛内，Λ現散熱體113與電路板的固定。 n體m形狀為長方體，在其—側面包括一突出的定位部 城ΓΓ位部與電路板平行，由複數大小相同的並排排列的 月m成長方形狀，可實現散熱，與該侧面相對的另一側面 也包括稷數鰭片，内嵌與散熱體m内，導熱管12的的另一端(冷 凝端或冷卻端)插人魏鐘内，實聽傳遞。 ⑴ 安全定位顧電職上，如第1圖卿，電職上更“-收容 8 .1289252 Μ放熱體ill的定位部的收容卡扣，該收容卡扣的主體定位 卡扣與疋位部3〇〇對應設計，包括一收容定位部3〇〇 、曰片的長方形卡孔400和兩個位於卡孔400兩側的彈性卡片 彈性卡片5〇〇均與定位部3〇〇的鰭片形狀相仿。當組裝時， 將散熱體m的定位部·插入收容卡扣的長方形卡孔中， 兩個兔性卡片隨即夾持住鰭片，實現電路板與散熱體⑴之 間的活動定位。1289252 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a thermal device thermal device. [Prior Art] At present, 'modern marrow products, especially those with many sophisticated electronic parts, such as computers, DVD players, digital video players (please), audio-visuals, etc.'s towel (four) engine, f brain money The central office driving (cpu), shadow rhyme, display card to the brain shell and other components will generate a lot of heat, in order to ensure the stability of the above machine operation, the heat dissipation of the electronic material becomes extremely important. The use of a heat sink to remove heat is an important feature to prevent mechanical devices or electronic products from being smashed. At present, the common use of electronic components of the financial sector is set, the μ should be included directly with the money area to lift the surface of the outer surface of the towel, which can improve the contact with the air; 'Through the heat absorbing sheet, when the heat absorbing sheet absorbs the heat of the heating element, _Xun 2 22:: Condensation of the evaporation end of the heat pipe of the 2nd Γ, condensing end of the ν heat sink, the speed is very high, the heart is cooling After the body condenses and liquefies, it flows back to the fresh end by capillary action, 5 1289252 and the heat sink passes through the side wire _ heat dissipation, and the heat is transferred to the air low = [degree: such as _ 潍 ,, continuously bring the heat to the warm age ΐ, i to damage 种 种 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热Directly in the sputum body = in the suction, this surface is heat-absorbing and heat-dissipating body is relatively close, the heat-dissipating body I can not be fully radiated into the air, which is not conducive to heat dissipation, and the existing fixing method is too cumbersome to disassemble, giving Gambling Inconvenience. Therefore, a kind of heat sink that can safely repudiate p and increase the heat dissipation is a preferred option. [Inventive content] # The above main problem is to provide A heat sink that can be safely and detachably fixed and can increase heat dissipation. Therefore, in order to achieve the above object, the present invention discloses a heat dissipating device for use in a computer system, comprising: a heat absorbing module, in contact with a heating element on a circuit board, the first heat conducting officer has a first The first end is connected to the heat absorbing module, and the first heat sink is connected to the second end of the first heat pipe. The first heat sink further includes a plurality of scatterers and a positioning structure. The positioning structure locates the heat sink in the 4 system' and extends the part of the plurality of discrete pieces out of the computer system. 1928252. The invention has the advantage of adding the first heat sink to the anchor of the ship, which not only expands the The heat dissipating area increases the heat dissipation, and the fixing method is sturdy and easy to disassemble, and the dispersing wire of the present invention adopts two heat dissipating bodies to ensure sufficient heat dissipation, and the two heat dissipating bodies are respectively located in the circuit. On both sides of the board, the space is used reasonably. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 to 3, respectively, are the front view and the combined rear view of the heat dissipating device of the present invention, wherein the heat dissipating device is fixed on the computer circuit board, including: heat dissipation The module is a two-tube 12 and a heat absorption module 13. Wherein, the heat absorbing module 13 is in contact with the heating element 1 电路 on the circuit board to absorb the entanglement thereof, which comprises two symmetric absorbing openings (3), 133, and two are located between the heat absorbing sheets 131, 133 and respectively The symmetrical heat pipe receiving bodies 135, 137 and the heat sink 2 are contacted. Wherein, the heat absorbing sheets 131, 133 and the heat pipe storage bodies 135, 137 are used for absorbing heat generated by the heat generating component, and are made of high thermal conductive material, such as metal steel, and the end portions of the heat absorbing sheet 13 and 133 are respectively upward. In order to contact the heat sink 20, the heat is conducted to the heat sink 2, the heat pipe receives the body, =7 seals the heat pipe 12 and the condensate therein, and the heat pipe storage body (3), (7) slightly protrudes from the heat sink 13 133, in order to facilitate the connection of the heat pipe 12, the heat sink 2 〇 covers the suction, the film 31 133 and the heat conductive body 135, 137, and fix the two to the circuit board. The outer surface of the heat release sheet 20 includes a plurality of outward protrusions The fin is used for heat dissipation, and the top 1829252 is further provided with a receiving body protruding from the outer surface. The receiving body and the scatter-body arrangement can correspond to the heat-receiving tube 12 and the heat-conducting tube receiving body 135, 137 protruding and absorbing heat. The connection and protection are provided, and the heat sink μ is in contact with the interesting portion of the heat absorption 131, 133, and the heat on the heat absorption sheets (3), (3) can be absorbed and transmitted through the plurality of fins. The two heat-conducting officers 12 are of the same type, one end is respectively connected with the heat-conducting tube receiving body 135, (7), the end is the evaporation end (heating end), and the heat-transfer tube ΐ2 is internally vacuum-sealed with cold=liquid|cold heat rapidly becomes gas. The heat dissipating module η includes two heat dissipating bodies 113, and the heat dissipating body m and the heat absorbing module 13 are located on the same side of the slab, and the sputum 113 is located on the side of the circuit, opposite to the heat sink (1) and the heat absorbing module η. As shown in FIG. 3, the heat dissipating body 113 is a rectangular parallelepiped, which includes a ^fig = fin 'for heat dissipation, and the fixing portion for accommodating the heat pipe 12 is located on the lunar surface of the piece to seal the heat pipe 12 another. End (condensing end or cooling:: τ: including two thin plates, which are held in the circuit board, and the heat sink 113 is fixed to the circuit board. The n body m shape is a rectangular parallelepiped, and a protrusion is included on the side thereof. The positioning portion of the positioning portion is parallel to the circuit board, and is formed by a plurality of square-shaped square shapes arranged side by side in the same size, and the other side surface opposite to the side surface also includes the number of fins, the inlay and the heat sink. In m, the other end of the heat pipe 12 (condensing end or cooling end) is inserted into Wei Zhong, and the actual transmission is carried out. (1) Safety positioning, such as the first figure, the electric service is more "- containment 8". 1289252 The receiving buckle of the positioning portion of the heat releasing body ill, the main body positioning buckle of the receiving buckle is designed corresponding to the clamping portion 3〇〇, and comprises a rectangular card hole 400 for accommodating the positioning portion 3〇〇, the cymbal and two The elastic card elastic cards 5 on both sides of the card hole 400 are respectively aligned with the positioning portion 3 The shape of the sheet is similar. When assembling, the positioning portion of the heat sink m is inserted into the rectangular card hole of the receiving buckle, and the two rabbit cards are then clamped to the fin to realize the active positioning between the circuit board and the heat sink (1). .
_毛月放熱衣置的工作原理為··隨著發熱元件100溫度的升 Γ ’吸熱模塊13中的吸熱片13卜133將其熱量吸收到自身，並 猎由散熱片20散熱’導熱f收容體13s、137中的冷凝液受執後 2速吸收，變錢體透稱錄12蒸發到散顯塊n的散 體m、113中’氣體經導熱f 12與散熱體中的冷驗體接觸， ^潛，而完成了傳熱任務，蘭冷凝成為液態，再流回到熱源，_ The working principle of the Maoyue heat-dissipating garment is... With the temperature rise of the heating element 100, the heat absorbing sheet 13 133 in the heat absorbing module 13 absorbs its heat to itself, and hunts the heat sink 20 to dissipate heat. The condensate in the bodies 13s and 137 is absorbed at the second speed after being controlled, and the variable body is vaporized into the bulk bodies m, 113 of the bulk n, and the gas is contacted with the cold test body in the heat radiator via the heat conduction f 12 . ^潜, and completed the heat transfer task, the blue condensation becomes liquid, and then flows back to the heat source,
=緒在设棚’叫賴體111的定位部的㈣和散熱體113 、老.、’、曰片均彻外部空氣將内部的冷凝液的溫度進—步降低，從而 達到良好的散熱效果。 定位方式連接 夕p弓本L月月欠熱衣置的散熱體111的定位部300矛口電路板上卡扣 〜勺又彳不僅局限於上述的結構，也可透過其它彈性或螺釘 ’其中一個散熱體增加一系列 積’加大了散熱力度，而且， 本發明實施例所述的散熱裴置 起定位作_鰭片，擴大了散熱面 1289252 使用的疋位方式料牢目，便於拆卸，而且本發明散熱裝置採用 兩個散熱體的設置，更_了充分散熱，兩個散熱體分別位於電 路板的兩侧，合理利用了空間。 •—軸本發明以前述之優選實施方式揭露如上，然其並非用以 限疋本發明。本領義細人貞賴意朗在賴縣發明所附 之申请專娜騎揭示的本發明之範圍和精神的情況下，所爲之 #更動與潤飾，均屬本發明之專利保護範圍之内。關於本發明所界 定之保護範圍請參考所附之申請專利範圍。 【圖式簡單說明】 第1圖」係本發明散熱裝置的分解示意圖； 「第2圖」係本發明散熱裝置的組合後的前視圖；及 第3圖」係本發明散熱裝置的組合後的後視圖。 【主要元件符號說明】 11 散熱模塊 12 導熱管 13 吸熱模塊 20 散熱片 100 發熱元件 1289252= "In the shed" (the fourth part of the positioning part of the Lai body 111 and the heat sink 113, the old, the ', and the cymbal are all external air to lower the temperature of the internal condensate, so as to achieve a good heat dissipation effect. Positioning mode connection 夕 弓 弓 弓 L L L L L L L L L L L L 〜 定位 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 〜 The heat sink adds a series of products to increase the heat dissipation. Moreover, the heat dissipation device described in the embodiment of the present invention is positioned as a fin, and the clamping method used for the heat dissipation surface 1829252 is expanded to facilitate the disassembly, and The heat dissipating device of the invention adopts the arrangement of two heat dissipating bodies, and further fully dissipates heat, and the two heat dissipating bodies are respectively located on both sides of the circuit board, and the space is utilized reasonably. The present invention has been disclosed above in the preferred embodiments described above, but is not intended to limit the invention. In the case of the scope and spirit of the invention disclosed in the application of the Lai County invention, it is within the scope of the patent protection of the present invention. Please refer to the attached patent application for the scope of protection defined by the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a heat sink of the present invention; FIG. 2 is a front view of the heat sink of the present invention; and FIG. 3 is a combination of the heat sink of the present invention. Rear view. [Main component symbol description] 11 Heat dissipation module 12 Heat pipe 13 Heat absorbing module 20 Heat sink 100 Heating element 1289252
in、ii3 散熱體 131 、 133 吸熱片 135 、 137 導熱管收容體 300 定位部 400 卡孑L 500 彈性卡片In, ii3 heat sink 131, 133 heat sink 135, 137 heat pipe storage body 300 positioning part 400 cassette L 500 elastic card