1248781 15390twf.doc/g 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種散熱系統及其散熱元件，且特別 是有關於一種熱管冷卻系統及其熱傳遞用連接器。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a heat dissipating system and a heat dissipating component thereof, and more particularly to a heat pipe cooling system and a heat transfer connector therefor. [Prior Art]
為了能夠迅速地移除發熱元件在運作時所產生的熱 量，以避免發熱元件因熱量的累積而造成發熱元件過熱的 問題。習知的散熱技術通常會在發熱元件上配置多個散熱 為（heat sink)並且利用風扇以強制對流的方式，來迅速 地將散熱器之熱量移除，避免熱量於發熱元件上累積。 丨一&田奴恐凡什的赞熱1提昇時，習知之散熱技術便 面臨了瓶頸。為了因應發熱元件發熱量的提昇，並且將發 熱70件之溫度維持在正常的工作溫度範圍内，習知的散熱 技術須相對應地增加散熱鰭片的表面積或是增加風扇的轉' 速然而，當發熱件被配置於一個空間有限的封閉殼體 時’增加散熱則的將會使得散麟片所佔 =工間增加，而使得此—方法變得窒礙難行。增加風扇 ，速的作法__增加_對流的效率，但是卻會伴隨 者震動與料的產纽及能_耗量增加的問題。曰 近，來-種利用相變化的熱傳裝置已逐漸受 目H採用相變化的熱傳裝置例如有迴路 heat pipe)及毛細栗迴踗f ”、、g U〇〇p 作的原耗细财 等’其1 吸收發熱元恤— 1248781 15390twf.doc/g 結構將液態工質與汽態工質 出來為所吸收之熱 可以產生相;大二於Ϊ傳裝⑽ ^ 力以補償工質於熱傳裝置内流動所 的埶曰二’因此這種利用相變化的熱傳裝置具有將埶泝 =遞至長距離以外的地點，再藉由冷凝器將熱量: 有限之電腦^心I央處理器（cpu)被配置於内部空間 熱讀除的優點，因此散熱裝置的配置可 = 高敎傳量、卩㈣更具有強健性、 二寻里s路具可撓曲性、不受地㈣力影響以及 月b源即可運作等諸多優點。 而 【發明内容】 本毛明的目的就是在提供-種熱傳遞用連接器，用以 將熱管冷卻系統之連接管路連接至-個物體，並且以此物 體作為熱管冷卻系統之冷凝器。 本發明的再一目的是提供一種熱管冷卻系統，用以將 發熱兀件之熱量傳遞至-個物體，並且以此物體作為此執 管冷卻系統之冷凝器將熱量排除。 本發明提出一種熱傳遞用連接器包括第一導熱塊、第 1248781 15390twf.doc/g 一導熱塊。第一導熱塊具有多個第一叙合部及一個接觸表 面，其中接觸表面係適於服貼至一件物體之一個表面上。 第二導熱塊具有多個第二嵌合部，這些第二嵌合部適於分 別嵌合至前述之第一嵌合部。當這些第二嵌合部分別嵌合 至第一嵌合部時，第一導熱塊及第二導熱塊會共同構成一 個管路通道，並且此一管路通道適於容納或作為連接管路 之一段。In order to quickly remove the heat generated by the heating element during operation, the problem that the heating element is overheated due to the accumulation of heat is prevented. Conventional heat dissipation techniques typically employ a plurality of heat sinks on the heat generating components and utilize a fan to force convection to quickly remove heat from the heat sink to prevent heat buildup on the heat generating components. When the singer of the singer and the singer of the singer was raised, the conventional heat dissipation technology faced a bottleneck. In order to cope with the increase in the heat generation of the heating element and to maintain the temperature of the heat generating component within the normal operating temperature range, the conventional heat dissipation technology must correspondingly increase the surface area of the heat sink fin or increase the speed of the fan. When the heat generating component is disposed in a closed casing with a limited space, 'increasing the heat dissipation will cause the space to occupy the work space, and this method becomes difficult. Increasing the fan, the speed of the method __ increase _ convection efficiency, but it will accompany the vibration and material production and energy consumption increase. In the near future, the heat transfer device using the phase change has gradually been subjected to the heat loss of the phase change heat transfer device such as the circuit heat pipe and the capillary pump back f", g U〇〇p. Cai et al's 1 absorption of hot t-shirts - 1248781 15390twf.doc / g structure of liquid and vapor working fluids out of the heat absorbed can produce phase; sophomore Yu Yu transmission (10) ^ force to compensate for the quality of the work The heat transfer device in the heat transfer device is therefore such that the heat transfer device utilizing the phase change has the ability to transfer the trace to a location other than a long distance, and then the heat is transferred by the condenser: a limited computer The device (cpu) is configured to have the advantage of internal space heat reading, so the configuration of the heat sink can be = high enthalpy, 卩 (four) more robust, finder s road flexible, unacceptable (four) force The influence and the monthly source of b can be operated, and the like. [Invention] The purpose of the present invention is to provide a heat transfer connector for connecting the connecting pipe of the heat pipe cooling system to an object, and This object is used as a condenser for the heat pipe cooling system. The object is to provide a heat pipe cooling system for transferring heat of a heat generating element to an object, and using the object as a condenser of the pipe cooling system to remove heat. The present invention provides a heat transfer connector including A thermally conductive block, 1248871 15390 twf.doc/g a thermally conductive block. The first thermally conductive block has a plurality of first merging portions and a contact surface, wherein the contact surface is adapted to conform to one surface of an object. The two heat conducting blocks have a plurality of second fitting portions, and the second fitting portions are adapted to be respectively fitted to the first fitting portions. When the second fitting portions are respectively fitted to the first fitting portions, The first heat-conducting block and the second heat-conducting block together form a line channel, and this line channel is adapted to accommodate or as a section of the connecting line.
依照本發明的較佳實施例所述之熱傳遞用連接器，其 中第一嵌合部之一係為凸肋，而第二嵌合部之對應者係 嵌槽。 ' ' 依照本發明的較佳實施例所述之熱傳遞用連接器，其 中第一肷合部之一係為嵌槽，而第二嵌合部之對應者係 一凸肋。 ^ “… 依照本發明的較佳實施例所述之熱傳遞用連接器，其 中管路通道係曲折地延伸於組合後之第一導熱塊及第二 熱塊的内部。 依照本發明的較佳實施例所述之熱傳遞用連接器，其 中、、且a後之第一導熱塊及第二導熱塊的表面縫隙係以 材料加以封閉。 戈 依，本發明的較佳實施例所述之熱傳遞用連接器，其 第一嵌合部之一係緊配地嵌合至第二嵌合部之對應者。、 中照本發明的較佳實施例所述之熱傳遞用連接器，其 當官路通道侧來⑽連鮮路部份時，管路 以 緊配的方式容納連接管路。 7 !248781 15390twf.doc/g 依照本發明的較佳實施例所述之熱傳遞用連接器，其 中組合後之第一導熱塊及第二導熱塊係可拆卸式地連接於 物體’以使接觸表面能夠服貼於物體之表面。 依照本發明的較佳實施例所述之熱傳遞用連接器，其 中、、且S後之第一導熱塊及第二導熱塊係以螺絲鎖固的方式 連接至物體上，以使接觸表面能夠服貼於物體之表面。 依照本發明的較佳實施例所述之熱傳遞用連接器，其 中、、且S後之第一導熱塊及第二導熱塊係以磁性吸附的方式 連接至物體上，以使接觸表面能夠服貼於物體之表面。 本發明提出一種熱管冷卻系統包括蒸發器、連接管 路、工質以及前述之熱傳遞用連接器。其中，蒸發器係連 ，至發熱元件，連接管路係連接至蒸發器，而工質係通入 蒸發益及連接管路所構成之封閉迴路。 依照本發明的較佳實施例所述之熱管冷卻系統，其中 更^括連接於蒸發器之散熱模組，其中此散熱模組例如包 括多個連接於熱傳遞用連接器之鰭片以及於這些鰭 風扇。 本發明能夠將熱源的熱量藉由熱管冷卻系統之連接 官路傳遞至與導熱塊服貼的物體上，並以此物體之表面積 作為散熱面積配合自然對流或強制對流的方式將熱量排 除。因此’採用本發明作為冷卻系統之發熱元件，能夠在 極低的能源成本之下將發熱元件所產生之熱量移除。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易僅’下文特舉較佳實施例，並配合所附圖式，作詳細說 1248781 15390twf.doc/g 明如下。 【實施方式】 圖1係為本發明之一實施例之一種熱管冷卻系統的剖 面示意圖。請參照圖1，熱管冷卻系統1〇〇包括蒸發器 (evaporator)、連接管路12〇、工質13〇以及熱傳遞σ用連 接器140。療發器11〇係連接至發熱元件15〇，而連接管路 120連接至瘵發态11〇，且工質丨3〇被灌注於蒸發器 與連接管路120所構成之封閉迴路中。蒸發器11〇更包括 瘵發态壁112、毛細結構1丨4 (Wick)以及蒸氣溝槽116 (vapor groove)，毛細結構114係配置於蒸發器壁112内， 而条發ϋ壁112與毛細結構114之間具有多條蒸氣溝槽 116。 請繼續參照圖1，當發熱元件150所產生的熱量q傳 遞至蒸發器110時，熱量Q透過蒸發器壁112傳遞至毛細 結構，為毛細結構114所汲取之液態工質吸收熱量q 之後蒸發為Ά恶工質130。之後，汽態工質流經蒸氣 溝槽116及連接管路120，並經由熱傳遞用連接器14〇將 熱篁Q排除。在Ά態工質130將熱量排除的同時，汽態工 質130凝結回液態工質130，之後沿著連接管路120回到 蒸發器11〇，並且再度為毛細結構114所汲取而完成一循 環。 值得注意的是，本發明的主要概念係在於熱傳遞用連 接器140的設計係適於貼附於物體160上，並且以物體160 為熱管冷卻糸統之冷凝器，並可利用自然對流或是強 9 1248781 15390twf.doc/g 制對流的方式將熱量排除，其中物體副例如可以為一個 金屬殼體或是任何適於與外界產生熱交換的材質。以下將 針對熱傳遞用連接器140的結構以及熱管冷卻系統的應用 加以舉例說明。 圖2係為圖！之熱傳遞用連接器的示意圖。圖3係為 圖2之熱傳遞用連接器的爆炸圖。圖4係為圖3第一導埶 塊^示意圖。圖5係為本發明之一實施例之第二導熱塊的 • 不思圖。請共同參照圖丨〜圖5，熱傳遞用連接器14〇包括 第一導熱塊142以及第二導熱塊144，其中第一導熱塊142 具有多個第-嵌合部146，且第-嵌合部146例如為凸肋 (見圖4)。第—導熱塊144具有多個第二嵌合部ι48，其 分別對應於上述之第一嵌合部146，且第二嵌合部148例 如為嵌槽（見圖5)。當然，在其他實施例中，第一嵌合 部146亦可以為嵌槽，而第二嵌合部148亦可以為凸肋。 當第一導熱塊142與第二導熱塊144緊配地結合時，會於 熱傳遞用連接器140之内部形成管路通道149，使得工質 130例如可以流動於管路通道149中。此外，第一導熱塊 142與第二導熱塊144結合的方法例如以焊接材料將兩導 熱塊142及144之間的縫隙加以封閉，以預防工質13〇從 兩導熱塊142及144之間的縫隙滲出。 圖6係為圖1之熱管冷卻系統的外觀示意圖。請共同 參照圖5與圖6，當熱傳遞用連接器14〇與連接管路12〇 銜接時，圖5之管路通道149即可成為連接管路no之一 部份。因此，當汽態工質13〇進入熱傳遞用連接器14〇時， 1248781 15390twf.doc/g 汽態工質130便能夠直接將熱量q傳遞給熱傳遞用連接器 14〇，再經由此熱傳遞用連接器140而傳遞至物體16〇 (見 圖1)。值得注意的是，熱管冷卻系統100更可以配合發 熱元件（未繪示）之幾何形狀，利用適當外型的鞍座UX8 將熱里Q更均勻地傳遞至療發器11 〇。此外，熱管冷卻系 統100更可以視需要而適當地彎折連接管路12〇，使得熱 管冷卻系統100在外形上更具變化的彈性。 圖7係為本發明之另一實施例之一種熱管冷卻系統的 外觀示意圖。熱管冷卻系統1〇〇更例如可以包括一散熱模 組170，其中此散熱模組170包括多個鰭片172以及一配 置於這些韓片172上之風扇174。如以一來，便能夠彈性 地調整熱傳遞用連接器140的大小與風扇174的風量，而 使熱管冷卻系統100之散熱能力最佳化。 圖8係為本發明之另一實施例之一種熱傳遞用連接器 的爆炸圖，而圖9係為圖8之第二導熱塊的示意圖。請共 同參照圖4、圖8與圖9，第一導熱塊142,更可以採用第 二嵌合部146,之凸肋設計，而第二導熱塊144，更可以採用 第二嵌合部148’之嵌槽設計，例如形成直線型之管路通道 149’，來緊配地容納連接管路120。 圖10係為本發明之另一實施例之一種熱管冷卻系統 應用圖8之熱傳遞用連接器的外觀示意圖。請參照圖8與 圖丨〇,當連接管路120配置於熱傳遞用連接器14〇,時，管 路通道149用以容納連接管路12〇之一部份。因此，位在 熱傳遞用連接器14〇,内部之連接管路120的汽態工質13〇 1248781 15390twf.doc/g 便能藉由連接管路120的管壁將熱量q傳遞給熱傳遞用連 接器140,再經由此熱傳遞用連接器14〇而傳遞至物體16〇 (見圖1)。 圖11係為圖6之熱管冷卻系統應用於發光二極體路 燈的示意圖。發光二極體路燈為一種極具潛力的公共照明 设備，若將本發明應用於此一照明設備，可以大幅降低散 熱系統的能源成本。請參照圖1〇，熱管冷卻系統1〇〇之蒸 發器110係藉由一鞍座118而配置於發光二極體路燈2〇〇 之發光二極體燈源220上。熱傳遞用連接器ι4〇例如以可 拆卸的方式緊密地貼附於金屬殼體21〇上。熱傳遞用連接 器140貼附於金屬殼體21〇之方式例如可以是以螺絲鎖固 或者是磁性吸附，且熱傳遞用連接器14()與金屬殼體210 之間更存在一導熱層，例如一層導熱膏或一導熱墊 〇如此 一來’熱管冷卻系統100便可以利用發光二極體路燈2〇〇 之金屬殼體210之表面作為熱管冷卻系統1〇()之冷凝器， 例如利用金屬殼體210與外界環境的自然對流，將發光二 ，體燈源220所發出的熱量移除。值得注意的是，由於熱 官冷卻系統100係為一種被動的熱傳遞元件，不需要額外 的能源供給便可以將熱量自發光二極體燈源22〇傳遞至金 屬殼體210之表面，並且藉由金屬殼體21〇所具有的表面 積將熱量排除至外界。因此，對發光二極體路燈2〇〇這種 需要長時間運作的照明元件而言，熱管冷卻系統1〇〇可以 有效地節省能源的成本。 圖12係為圖6之熱管冷卻系統應用於桌上型電腦的 12 1248781 15390twf.doc/g 12 ’熱管冷卻系統⑽According to a preferred embodiment of the present invention, in the heat transfer connector, one of the first fitting portions is a rib, and the corresponding one of the second fitting portions is a groove. According to a preferred embodiment of the present invention, in the connector for heat transfer, one of the first merging portions is a recessed groove, and the corresponding one of the second fitting portions is a rib. [...] A connector for heat transfer according to a preferred embodiment of the present invention, wherein the conduit passage extends in a meandering manner to the interior of the combined first and second thermal blocks and the second thermal block. In the connector for heat transfer according to the embodiment, the surface gaps of the first heat-conducting block and the second heat-conducting block after a, are sealed by materials. Goi, the heat of the preferred embodiment of the present invention a connector for transmission, wherein one of the first fitting portions is tightly fitted to a counterpart of the second fitting portion. The heat transfer connector according to the preferred embodiment of the present invention When the side of the official passageway (10) is connected to the fresh road portion, the pipeline accommodates the connecting pipe in a tightly fitted manner. 7 !248781 15390twf.doc/g The heat transfer connector according to the preferred embodiment of the present invention, The combined first heat conducting block and the second heat conducting block are detachably coupled to the object 'to enable the contact surface to conform to the surface of the object. The heat transfer connector according to the preferred embodiment of the present invention , and the first heat conduction block and the second guide after S The block is attached to the object in a screw-locking manner so that the contact surface can be attached to the surface of the object. The heat transfer connector according to the preferred embodiment of the present invention, wherein A heat conducting block and a second heat conducting block are magnetically coupled to the object to enable the contact surface to conform to the surface of the object. The present invention provides a heat pipe cooling system including an evaporator, a connecting pipe, a working medium, and the foregoing The heat transfer connector, wherein the evaporator is connected to the heating element, the connecting pipe is connected to the evaporator, and the working medium is connected to the closed circuit formed by the evaporation benefit and the connecting pipe. The heat pipe cooling system of the preferred embodiment further includes a heat dissipation module connected to the evaporator, wherein the heat dissipation module includes, for example, a plurality of fins connected to the heat transfer connector and the fin fans. The heat of the heat source can be transmitted to the object attached to the heat conducting block by the connecting official path of the heat pipe cooling system, and the surface area of the object is used as the heat radiating area to cooperate with the natural convection The forced convection method excludes heat. Therefore, the heat generating element of the cooling system can be removed by using the present invention as a heating element of the cooling system. The above and other objects and features of the present invention are provided for the extremely low energy cost. And the advantages can be more obvious. The following is a detailed description of the preferred embodiment, and in conjunction with the drawings, the detailed description of 124881 15390 twf.doc/g is as follows. [Embodiment] FIG. 1 is an embodiment of the present invention. A schematic cross-sectional view of a heat pipe cooling system. Referring to Figure 1, the heat pipe cooling system 1 includes an evaporator, a connecting pipe 12, a working fluid 13〇, and a heat transfer σ connector 140. The hairdresser 11〇 It is connected to the heating element 15A, and the connecting line 120 is connected to the burst state 11〇, and the working medium 丨3〇 is poured into the closed loop formed by the evaporator and the connecting line 120. The evaporator 11 further includes a burst wall 112, a capillary structure 1 丨 4 (Wick), and a vapor groove 116. The capillary structure 114 is disposed in the evaporator wall 112, and the strip wall 112 and the capillary There are a plurality of vapor channels 116 between the structures 114. Referring to FIG. 1, when the heat q generated by the heating element 150 is transmitted to the evaporator 110, the heat Q is transmitted to the capillary structure through the evaporator wall 112, and the liquid working medium taken up by the capillary structure 114 absorbs heat q and then evaporates into Abomination of the working medium 130. Thereafter, the vaporous working medium flows through the vapor channel 116 and the connecting line 120, and the heat enthalpy Q is removed via the heat transfer connector 14?. While the hot working medium 130 removes the heat, the vaporous working medium 130 condenses back to the liquid working medium 130, and then returns to the evaporator 11〇 along the connecting line 120, and again draws the capillary structure 114 to complete a cycle. . It should be noted that the main concept of the present invention is that the design of the heat transfer connector 140 is suitable for attaching to the object 160, and the object 160 is used as a heat pipe to cool the condenser of the system, and can utilize natural convection or Strong 9 1248781 15390twf.doc / g convection method to exclude heat, wherein the object pair can be, for example, a metal shell or any material suitable for heat exchange with the outside world. The structure of the heat transfer connector 140 and the application of the heat pipe cooling system will be exemplified below. Figure 2 is a picture! Schematic diagram of the connector for heat transfer. Fig. 3 is an exploded view of the heat transfer connector of Fig. 2. Figure 4 is a schematic view of the first guide block of Figure 3. Figure 5 is a diagram of a second thermally conductive block in accordance with one embodiment of the present invention. Referring to FIG. 5 to FIG. 5 together, the heat transfer connector 14A includes a first heat transfer block 142 and a second heat transfer block 144, wherein the first heat transfer block 142 has a plurality of first-fitting portions 146, and the first-fitting The portion 146 is, for example, a rib (see Fig. 4). The first heat-conducting block 144 has a plurality of second fitting portions ι48, which respectively correspond to the first fitting portions 146 described above, and the second fitting portions 148 are, for example, recessed grooves (see Fig. 5). Of course, in other embodiments, the first fitting portion 146 may also be a recessed groove, and the second fitting portion 148 may also be a rib. When the first heat conducting block 142 is tightly coupled to the second heat conducting block 144, a line passage 149 is formed inside the heat transfer connector 140 so that the working medium 130 can flow, for example, in the line passage 149. In addition, the method of combining the first heat conducting block 142 with the second heat conducting block 144 is, for example, sealing the gap between the two heat conducting blocks 142 and 144 with a solder material to prevent the working medium 13 〇 from between the two heat conducting blocks 142 and 144. The gap leaked out. Figure 6 is a schematic view showing the appearance of the heat pipe cooling system of Figure 1. Referring to Fig. 5 and Fig. 6, when the heat transfer connector 14 is engaged with the connecting pipe 12, the pipe passage 149 of Fig. 5 can be a part of the connecting pipe no. Therefore, when the vaporous medium 13〇 enters the heat transfer connector 14〇, the 1248781 15390twf.doc/g vaporous working medium 130 can directly transfer the heat q to the heat transfer connector 14〇, and then through the heat. The transfer is transmitted to the object 16 by the connector 140 (see Fig. 1). It should be noted that the heat pipe cooling system 100 can be more compatible with the geometry of the heat generating element (not shown), and the heat styling Q can be more uniformly transmitted to the hair styling device 11 by using the appropriate shape of the saddle UX8. In addition, the heat pipe cooling system 100 can more appropriately bend the connecting pipe 12 turns as needed, so that the heat pipe cooling system 100 is more elastic in shape. Fig. 7 is a schematic view showing the appearance of a heat pipe cooling system according to another embodiment of the present invention. The heat pipe cooling system 1 can further include, for example, a heat dissipation module 170, wherein the heat dissipation module 170 includes a plurality of fins 172 and a fan 174 disposed on the Korean sheets 172. In the first place, the size of the heat transfer connector 140 and the air volume of the fan 174 can be flexibly adjusted to optimize the heat dissipation capability of the heat pipe cooling system 100. Fig. 8 is an exploded view of a heat transfer connector according to another embodiment of the present invention, and Fig. 9 is a schematic view of the second heat transfer block of Fig. 8. Referring to FIG. 4, FIG. 8 and FIG. 9 together, the first heat conducting block 142 may further adopt a second fitting portion 146, and the second heat conducting block 144 may further adopt a second fitting portion 148'. The slotted design, for example, forms a linear conduit passage 149' to closely receive the connecting conduit 120. Fig. 10 is a view showing the appearance of a heat pipe cooling system according to another embodiment of the present invention. Referring to Fig. 8 and Fig. 8, when the connecting pipe 120 is disposed in the heat transfer connector 14, the pipe passage 149 is for receiving a portion of the connecting pipe 12〇. Therefore, in the heat transfer connector 14〇, the vapor working medium 13〇1248781 15390twf.doc/g of the internal connecting line 120 can transfer the heat q to the heat transfer by connecting the pipe wall of the pipe 120. The connector 140 is further transmitted to the object 16 via the heat transfer connector 14 (see Fig. 1). Fig. 11 is a schematic view showing the heat pipe cooling system of Fig. 6 applied to a light-emitting diode street lamp. A light-emitting diode street lamp is a highly promising public lighting device, and if the present invention is applied to such a lighting device, the energy cost of the heat dissipation system can be greatly reduced. Referring to Fig. 1A, the evaporator 110 of the heat pipe cooling system is disposed on the light-emitting diode lamp source 220 of the LED street lamp 2 by a saddle 118. The heat transfer connector ι4 〇 is attached to the metal casing 21 紧密 in a detachable manner, for example. The heat transfer connector 140 may be attached to the metal casing 21, for example, by screwing or magnetically adsorbing, and a heat conducting layer is further disposed between the heat transfer connector 14 () and the metal casing 210. For example, a layer of thermal paste or a thermal pad 〇 such that the heat pipe cooling system 100 can utilize the surface of the metal casing 210 of the LED street lamp as a condenser of the heat pipe cooling system, for example, using metal. The natural convection of the housing 210 with the external environment removes the heat emitted by the light source 220. It is worth noting that since the thermal cooling system 100 is a passive heat transfer element, heat can be transferred from the light-emitting diode light source 22 to the surface of the metal casing 210 without additional energy supply, and The surface area of the metal casing 21 将 removes heat to the outside. Therefore, the heat pipe cooling system 1 can effectively save the cost of energy for the light-emitting diode street lamp 2 such a lighting element that requires long-time operation. Figure 12 is a heat pipe cooling system of Figure 6 applied to a desktop computer 12 1248781 15390twf.doc/g 12 'heat pipe cooling system (10)
110係措由一較庙ηβ和里狄占，t Ύ “、U 件320上，其於桌上型電腦的發熱元 片或是其他財 ，則1附於桌上型電腦300的機殼31〇上，其貼附的； i::材C及磁性吸附等可拆卸式連接方式。由於 u h例如可以為齡金等金屬材f，因此+The 110 series is controlled by a temple ηβ and Ridizhan, t Ύ ", U piece 320, its heating element on the desktop computer or other wealth, then 1 attached to the case of the desktop computer 31 31 On the raft, it is attached; i: detachable connection method such as material C and magnetic adsorption. Since uh can be metal material such as gold, f
二 於機殼310時，機殼310便成:;、熱管 外_:二係，7之熱管冷卻系統應用於桌上型電腦的 外觀不思圖/ Μ共同參照圖13，本發明更可將圖7所示之 具有散熱魅170的熱管冷㈣統⑽配置於桌上型電腦 300内並且例如利用將多個熱傳遞用連接器14〇配 機殼側板312’使得熱管冷卻系統1〇〇可利用機殼側板312 作為其冷;破。When the casing 310 is in the casing 310, the casing 310 is:;, the outside of the heat pipe _: the second system, the heat pipe cooling system of 7 is applied to the appearance of the desktop computer, and the present invention can be further referred to FIG. The heat pipe cooling system (10) having the heat dissipation charm 170 shown in FIG. 7 is disposed in the desktop computer 300 and the heat pipe cooling system 1 is configured by, for example, arranging a plurality of heat transfer connectors 14 with the cabinet side plate 312'. The casing side plate 312 is utilized as its cold; broken.
綜上所述，因為本發明之導熱塊能夠藉由導熱塊將發 熱元件的熱量傳遞至與導熱塊服貼之物體上，並且利用丄 一物體作為熱管冷卻系統之冷凝器。因此，採用本發明之 熱管卻系統夠在極低的能源成本之下，將熱量自發熱元 移除。 X μ 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 13 1248781 15390twf.doc/g 範圍當視後附之申請專利範圍所界定者 【圖式簡單說明】 種熱營冷卻系統的剖 圖1係為本發明之一實施例之一 面示意圖。 圖2係為圖1之熱傳遞用連接器的示立 圖3係為圖2之熱傳遞用連接器的爆=。 圖4係為圖3之第一導熱塊的示意圖。回In summary, because the heat conducting block of the present invention can transfer the heat of the heat generating element to the object to which the heat conducting block is applied by the heat conducting block, and use the object as the condenser of the heat pipe cooling system. Therefore, the heat pipe of the present invention is used to remove heat from the heat element at a very low energy cost. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and it is obvious to those skilled in the art that some modifications and refinements may be made without departing from the spirit and scope of the invention. The present invention is protected by the scope of the appended patent application. Fig. 2 is an illustration of the heat transfer connector of Fig. 1. Fig. 3 is a view of the heat transfer connector of Fig. 2. 4 is a schematic view of the first heat conducting block of FIG. 3. return
圖5係為圖3之第二導熱塊的示意圖。 圖6係為圖1之熱管冷卻系統的外觀示意圖。 圖7係為本發明之另一實施例之一種熱管冷卻系統的 外觀示意圖。 圖8係為本發明之另一實施例之一種熱傳遞用連接器 的爆炸圖。 圖9係為圖8之第二導熱塊的示意圖。 圖1〇係為本發明之另一實施例之一種熱管冷卻系統 …用圖8之熱傳遞用連接器的外觀示意圖。 圖Π係為圖6之熱管冷卻系統應用於發光二極體路 燈的示意圖。 一 圖12係為圖ό之熱管冷卻系統應用於桌上型電腦的 示意圖。 圖13係為圖7之熱管冷卻系統應用於桌上型電腦的 外觀示意圖。 【主要元件符號說明】 100 :熱管冷卻系統 1248781 15390twf.doc/g 110 :蒸發器 112 :蒸發器壁 114 :毛細結構 116 :蒸氣溝槽 118 :鞍座 120 :連接管路 130 :工質 140 :熱傳遞用連接器 • 142、142,：第-導熱塊 144、144’ ：第二導熱塊 146、146’ ：第一嵌合部 148、 148’ ：第二嵌合部 149、 149’ ：管路通道 150 :發熱元件 160 :物體 170 :散熱模組 • 172 :鰭片 174 :風扇 190 :流動方向 200 :發光二極體路燈 210 :金屬殼體 220 :發光二極體燈源 300 ··桌上型電腦 310 :機殼 15 1248781 15390twf.doc/g 312 :機殼侧板 320 :發熱元件Figure 5 is a schematic view of the second thermally conductive block of Figure 3. Figure 6 is a schematic view showing the appearance of the heat pipe cooling system of Figure 1. Fig. 7 is a schematic view showing the appearance of a heat pipe cooling system according to another embodiment of the present invention. Fig. 8 is an exploded view of a connector for heat transfer according to another embodiment of the present invention. Figure 9 is a schematic view of the second thermally conductive block of Figure 8. 1 is a heat pipe cooling system according to another embodiment of the present invention. FIG. 8 is a schematic view showing the appearance of the heat transfer connector of FIG. The figure is a schematic diagram of the heat pipe cooling system of Fig. 6 applied to a light-emitting diode street lamp. Figure 12 is a schematic diagram of the heat pipe cooling system of Figure 应用于 applied to a desktop computer. Figure 13 is a schematic view showing the appearance of the heat pipe cooling system of Figure 7 applied to a desktop computer. [Main component symbol description] 100: Heat pipe cooling system 124881 15390twf.doc/g 110: evaporator 112: evaporator wall 114: capillary structure 116: vapor groove 118: saddle 120: connecting pipe 130: working fluid 140: Connector for heat transfer • 142, 142,: heat-conducting block 144, 144': second heat-conducting block 146, 146': first fitting portion 148, 148': second fitting portion 149, 149': tube Road channel 150: heating element 160: object 170: heat dissipation module • 172: fin 174: fan 190: flow direction 200: light-emitting diode street light 210: metal housing 220: light-emitting diode light source 300 · table Upper computer 310: housing 15 1248781 15390twf.doc/g 312: chassis side panel 320: heating element