M320294 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種散熱器結構，特別是一種具有氣液相循 環迴路之散熱器結構。 【先前技術】M320294 VIII. New description: [New technical field] This creation is about a radiator structure, especially a radiator structure with a gas-liquid phase circulation loop. [Prior Art]
隨著電腦資訊等高科技產業的快速發展及其應用範圍的擴 大’電月甸裝置處理資料的速度也越來越快。目前電腦設備内部之 電子元件的體積趨於微型化，積體電路（Integrated drcuit，汇） 的密集度也械增加，連帶使得輕面積難生之歸亦相對地 增加。若不及時將電子元件產生社餘能散除，將會造成電子 元件的損壞，使電腦裝置無法運作。 為了降低發熱電子元件的工作溫度以保持電腦裝置的運作， 傳統的方式係姻金屬材質之散鮮，亦可於散齡上加設籍片 t:Γ吸，電子元件之熱量，並將熱能傳導至外部的大氣環境。 但是散熱H或是散絲面積有限，導致傳統以空氣冷卻 =式之散熱裝置的散熱功率不佳，已無法滿足現今電子树因快 速運算所產生之高魏的散熱需求。 、 為了能在短時_大量逸散電子元件所產生的高熱能，更可 泵（pump)至散熱裝置上，冷卻水藉由核的循環抽引， ==版L蝴餘版間必須藉 二"'接_相_接’贿冷卻水可補地進賴環冷卻。 疋漏水的問題，且水泵必須配合一動力裝置的牽 M320294 如此將導致散熱裝置之整魅成過於 引，方可執行抽引的動作， 複雜且輕便性不足。 健傳_錢散絲上加設複數個連接至 2則組之熱管（heatplpe)，以進—步改善藉由水With the rapid development of high-tech industries such as computer information and the expansion of its application range, the speed of processing data by the electric Yuedian device is also getting faster and faster. At present, the volume of electronic components inside computer equipment tends to be miniaturized, and the density of integrated circuits (integrated drcuit) is also increased, and the associated loss of light area is relatively increased. If the electronic components are not dissipated in time, the electronic components will be damaged and the computer device will not operate. In order to reduce the operating temperature of the heat-generating electronic components to maintain the operation of the computer device, the traditional method is to scatter the metal material, or to add a piece of film t: sucking, heat of the electronic components, and conducting the heat energy. To the outside atmosphere. However, the heat dissipation H or the area of the loose wire is limited, which leads to the poor heat dissipation of the conventional air-cooling type heat sink, which cannot meet the high heat dissipation demand of the current electronic tree due to the fast calculation. In order to be able to pump high-energy heat generated by a large amount of electronic components in a short time, it can be pumped to the heat sink. The cooling water is pumped by the core, and the == version of the version must be borrowed. " '接_相_接' bribe cooling water can make up the land to cool the ring. The problem of water leakage, and the pump must be matched with a power unit. M320294 will cause the heat sink to be over-exposed, so that the pumping action can be performed, which is complicated and inconvenient. Jianchuan _ Qianshang added a number of heat pipes (heatplpe) connected to the 2 groups to improve the water by step
=_題。歸細作流轉受熱_熱量並^ Y、動至連接散熱則組的冷凝端，透過散醜片 作流體冷凝為·，毛細_力麵力喊至熱源，^需夢 =水泵的抽引，於熱管内部即可進行自體循環冷卻的作動。散^ 為透過工傾體因驗錢化職生的賴，得以將大量的鮮 自電子元件料至散脑版，藉明加散絲的散熱效能'。、、、匕 為了提升習賴管之散熱效率，其熱管通常會做—較大長产 之延伸，但卻造成作流體科於絲的半途中即凝4 液體狀態關題。滯留於鮮中間段的液態工作流體將成為氣離 工作流體於熱管内流動的阻力，嚴重影響熱管中的工作流體之迴 麵路的運作，甚至是產生逆向流動（e贿㈣㈣），使得熱管之 療發端因無工作流體的供應，而造成乾化（办⑽）的現象，這 些都將大幅降低熱管整體的散熱效果，導致電子零組制過高溫 度而燒毀失效。 為了避免上述之乾化現象的發生，因此習知熱管的設計配 置’大多㈣直方向設置於散姑，以滿足紐向上 工作流體因重力而向下流動之物理縣，_電子裝置必須配r 散熱器的結構麵韻變其㈣之電路配置（ia卿），或是迫使 電子裝置之整體_必網加，村容_積獻之散熱器。改 6 M320294 變電子裝制部之電路配置將增加製程上的複龜，而使得制造 成本相對增加，體積過大的電子裝置亦不符合目前消費二5 子產品必須輕薄短小的使用需求。 【新型内容】 ~ 鑒於以上的問題，本創作提供一種散熱器結構 術讀管_的工錢體因逆向流_造缝化，日以及餘 益因熱官配置上的_，導致製程複雜度與成本增加的問題。 之埶ί創^提出—種散熱器結構，制以散除—發熱單元所產生 體二且i包括/—腔體、至少—循環管、以及—工作流體。腔 體㈣具有—中空之容置空間，且腔體具有-底座及至少一管 ==係肋接_發解元，f路係形成於腔體之腔壁内並 包含一第一流孔及-第二流孔，第-流 Α[/、、谷二間，而弟二流孔係連通於管路。循環管且有二端 部，二端部分別連接於第—流孔及第二流孔。== 容置空間内循产其中工作流體係於循環管及腔體之 之熱能後，？作越自該底座吸收發熱單元 入循環管γ、ι μ體。氣g之工作_自第一流孔導 流體夢由引凝結為液態之工作流體。凝結為液態之工作 氣二流孔導入管路並回流至底座，爾- 管，管路_置’使得工作流體由第-流孔導入猶環 單_方向·孔通過官路而回流至腔體之容置空間内，以形成 v夜相魏迴路，使得本創作散熱器結構之散熱效率=_ question. The heat transfer _ heat and ^ Y, move to the connection of the heat dissipation group, the condensation end of the group, through the ugly sheet for fluid condensation to ·, capillary _ force surface force shouted to the heat source, ^ need dream = pump pumping, in the heat pipe Internal self-circulation cooling can be performed inside. In order to pass the work of the workers, it is possible to transfer a large amount of fresh electronic components to the scattered brain version, and to use the heat dissipation performance of the filaments. , , , 匕 In order to improve the heat dissipation efficiency of the Xilai tube, the heat pipe usually does the extension of the larger long-term production, but it causes the fluid to be in the middle of the wire. The liquid working fluid retained in the fresh middle section will become the resistance of the working fluid flowing in the heat pipe, which seriously affects the operation of the returning path of the working fluid in the heat pipe, and even generates reverse flow (e bribe (4) (4)), so that the heat pipe The phenomenon of drying (doesing (10)) due to the lack of supply of working fluids will greatly reduce the heat dissipation effect of the heat pipe as a whole, resulting in an excessive temperature of the electronic zero system and burning failure. In order to avoid the above-mentioned drying phenomenon, the design configuration of the conventional heat pipe is mostly set in the straight direction to meet the physical conditions of the New Zealand working fluid flowing downward due to gravity. The electronic device must be equipped with r heat dissipation. The structural surface of the device changes its circuit configuration (ia), or forces the whole of the electronic device to be added. Changing the circuit configuration of the M320294 transformer-changing department will increase the compound turtle on the process, and the manufacturing cost will increase relatively. The over-sized electronic device will not meet the needs of the current consumption of the 5th sub-products. [New content] ~ In view of the above problems, this creation provides a kind of radiator structure. The working body of the radiator is _sewn, the day and the benefit are due to the configuration of the heat officer, resulting in process complexity and cost. Increased problem. The 埶 创 创 提出 — — — — — 种 种 种 种 种 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器The cavity (4) has a hollow accommodating space, and the cavity has a base and at least one tube == rib joint _ hair splicing element, and the f road system is formed in the cavity wall of the cavity and includes a first flow hole and The second flow hole, the first flow Α [/, 谷谷, and the second flow system is connected to the pipeline. The circulation pipe has two ends, and the two ends are respectively connected to the first flow hole and the second flow hole. == After the thermal energy of the circulation system and the cavity is processed in the accommodating space? The more the heat-absorbing unit is absorbed from the base into the circulation tube γ, ι μ body. The work of gas g _ from the first orifice guide fluid dreams are condensed into a liquid working fluid. The working fluid two-flow hole condensed into a liquid is introduced into the pipeline and returned to the base, and the pipe is placed in the first-flow hole to introduce the working fluid into the yoke ring. The _direction hole is returned to the cavity through the official road. In the accommodating space, the v-night phase Wei loop is formed, so that the heat dissipation efficiency of the heat sink structure of the present invention is made.