TWI267345B - Heat dissipation device and method for making the same - Google Patents
Heat dissipation device and method for making the sameInfo
- Publication number
- TWI267345B TWI267345B TW94130295A TW94130295A TWI267345B TW I267345 B TWI267345 B TW I267345B TW 94130295 A TW94130295 A TW 94130295A TW 94130295 A TW94130295 A TW 94130295A TW I267345 B TWI267345 B TW I267345B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation device
- making
- same
- chip unit
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation device includes a chip unit and a heat dissipation unit thermally attached to the chip unit. The chip unit includes a substrate and a die electrically coupled to the substrate. The heat dissipation unit includes a heat spreader thermally contacting the die and a heat dissipation element contacting the heat spreader. The heat spreader and the heat dissipation element are integrated together before they are attached to the chip unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94130295A TWI267345B (en) | 2005-09-05 | 2005-09-05 | Heat dissipation device and method for making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94130295A TWI267345B (en) | 2005-09-05 | 2005-09-05 | Heat dissipation device and method for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI267345B true TWI267345B (en) | 2006-11-21 |
TW200714177A TW200714177A (en) | 2007-04-01 |
Family
ID=38191836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94130295A TWI267345B (en) | 2005-09-05 | 2005-09-05 | Heat dissipation device and method for making the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI267345B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI471718B (en) * | 2011-08-24 | 2015-02-01 | Ability Entpr Co Ltd | Thermal conductivity structure and electronic device using the same |
CN115332226A (en) * | 2022-10-14 | 2022-11-11 | 北京华封集芯电子有限公司 | Packaging structure based on ceramic intermediate layer and manufacturing method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI812430B (en) * | 2022-08-26 | 2023-08-11 | 艾姆勒科技股份有限公司 | Two-phase immersion-cooling heat-dissipation structure having different thermal conductivities of fin |
-
2005
- 2005-09-05 TW TW94130295A patent/TWI267345B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI471718B (en) * | 2011-08-24 | 2015-02-01 | Ability Entpr Co Ltd | Thermal conductivity structure and electronic device using the same |
CN115332226A (en) * | 2022-10-14 | 2022-11-11 | 北京华封集芯电子有限公司 | Packaging structure based on ceramic intermediate layer and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW200714177A (en) | 2007-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006132822A3 (en) | Method for making electronic devices | |
TW551612U (en) | Piercing type IC heat dissipating device | |
TW200711561A (en) | Electronic apparatus and thermal dissipating module thereof | |
TWI370496B (en) | Bonding pad on ic substrate and method for making the same | |
TWI265775B (en) | Portable electronic device and heat dissipation method and cradle thereof | |
TW200802782A (en) | Chip module for complete power train | |
EP1873827A4 (en) | Heat sink device | |
GB0617493D0 (en) | Integrated circuit device incorporating metallurigacal bond to enhance thermal conduction to a heat sink | |
EP1901350A4 (en) | Heat dissipation device and power module | |
EP1976004A4 (en) | Semiconductor element mounting substrate, semiconductor device using the same, and process for producing semiconductor element mounting substrate | |
TW584218U (en) | Mounting device for heat sink | |
EP2232543A4 (en) | Thermal mechanical flip chip die bonding | |
TW200739867A (en) | Tape carrier package and display unit equipped with it | |
EP1983568A4 (en) | Heat dissipating member and semiconductor device using same | |
SG126899A1 (en) | Light-emitting device, method for making the same,and nitride semiconductor substrate | |
EP2020023A4 (en) | Method for forming c4 connections on integrated circuit chips and the resulting devices | |
TW584260U (en) | Heat sink device | |
DE60320799D1 (en) | SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR CHIP | |
TW200943500A (en) | Semiconductor package using an active type heat-spreading element | |
SG122956A1 (en) | Semiconductor package system with substrate heat sink | |
TW200705582A (en) | Semiconductor device and manufacturing method therefor | |
EP2135281A4 (en) | Thermal dissipation in chip substrates | |
EP1821342A4 (en) | Heat sink material, method for manufacturing such heat sink material, and semiconductor laser device | |
EP2023387A4 (en) | Semiconductor device, electronic parts module, and method for manufacturing the semiconductor device | |
DE602004010061D1 (en) | High reliability, low cost and thermally enhanced semiconductor chip mounting technology with AuSn |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |