TWI267345B - Heat dissipation device and method for making the same - Google Patents

Heat dissipation device and method for making the same

Info

Publication number
TWI267345B
TWI267345B TW94130295A TW94130295A TWI267345B TW I267345 B TWI267345 B TW I267345B TW 94130295 A TW94130295 A TW 94130295A TW 94130295 A TW94130295 A TW 94130295A TW I267345 B TWI267345 B TW I267345B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation device
making
same
chip unit
Prior art date
Application number
TW94130295A
Other languages
Chinese (zh)
Other versions
TW200714177A (en
Inventor
Chuen-Shu Hou
Chao-Nien Tung
Tay-Jian Liu
Chih-Hao Yang
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94130295A priority Critical patent/TWI267345B/en
Application granted granted Critical
Publication of TWI267345B publication Critical patent/TWI267345B/en
Publication of TW200714177A publication Critical patent/TW200714177A/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a chip unit and a heat dissipation unit thermally attached to the chip unit. The chip unit includes a substrate and a die electrically coupled to the substrate. The heat dissipation unit includes a heat spreader thermally contacting the die and a heat dissipation element contacting the heat spreader. The heat spreader and the heat dissipation element are integrated together before they are attached to the chip unit.
TW94130295A 2005-09-05 2005-09-05 Heat dissipation device and method for making the same TWI267345B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94130295A TWI267345B (en) 2005-09-05 2005-09-05 Heat dissipation device and method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94130295A TWI267345B (en) 2005-09-05 2005-09-05 Heat dissipation device and method for making the same

Publications (2)

Publication Number Publication Date
TWI267345B true TWI267345B (en) 2006-11-21
TW200714177A TW200714177A (en) 2007-04-01

Family

ID=38191836

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94130295A TWI267345B (en) 2005-09-05 2005-09-05 Heat dissipation device and method for making the same

Country Status (1)

Country Link
TW (1) TWI267345B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471718B (en) * 2011-08-24 2015-02-01 Ability Entpr Co Ltd Thermal conductivity structure and electronic device using the same
CN115332226A (en) * 2022-10-14 2022-11-11 北京华封集芯电子有限公司 Packaging structure based on ceramic intermediate layer and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812430B (en) * 2022-08-26 2023-08-11 艾姆勒科技股份有限公司 Two-phase immersion-cooling heat-dissipation structure having different thermal conductivities of fin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471718B (en) * 2011-08-24 2015-02-01 Ability Entpr Co Ltd Thermal conductivity structure and electronic device using the same
CN115332226A (en) * 2022-10-14 2022-11-11 北京华封集芯电子有限公司 Packaging structure based on ceramic intermediate layer and manufacturing method thereof

Also Published As

Publication number Publication date
TW200714177A (en) 2007-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees