TWI471718B - Thermal conductivity structure and electronic device using the same - Google Patents

Thermal conductivity structure and electronic device using the same Download PDF

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Publication number
TWI471718B
TWI471718B TW100130386A TW100130386A TWI471718B TW I471718 B TWI471718 B TW I471718B TW 100130386 A TW100130386 A TW 100130386A TW 100130386 A TW100130386 A TW 100130386A TW I471718 B TWI471718 B TW I471718B
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TW
Taiwan
Prior art keywords
heat conducting
heat
portion
conducting portion
member
Prior art date
Application number
TW100130386A
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Chinese (zh)
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TW201310211A (en
Inventor
Hsien Chang Lee
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Ability Entpr Co Ltd
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Publication date
Application filed by Ability Entpr Co Ltd filed Critical Ability Entpr Co Ltd
Priority to TW100130386A priority Critical patent/TWI471718B/en
Publication of TW201310211A publication Critical patent/TW201310211A/en
Application granted granted Critical
Publication of TWI471718B publication Critical patent/TWI471718B/en

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Description

Thermal conductive structure and electronic device using the same

The present invention relates to a heat conducting structure and an electronic device using the same, and more particularly to an elastic heat conducting structure and an electronic device using the same.

The conventional heat conducting structure is disposed between the heat source and the heat sink. Since the heat source and the heat sink may change the size of the gap therebetween due to the thermal expansion and contraction relationship. Therefore, in order to stably provide the heat conducting structure between the heat source and the heat sink, the heat conducting structure is mostly made of a soft deformable material, such as silicone.

However, the thermal material has a very low heat dissipation coefficient (the thermal conductivity of silicone is only about 3 to 5), and its thermal conductivity is very poor.

The invention relates to a heat-conducting structure and an electronic device using the same, and the thermal conductivity of the heat-conducting structure is high, so that the heat conduction effect of the electronic device is very good.

According to an embodiment of the invention, a thermally conductive structure is proposed. The heat conducting structure comprises a heat conducting member and an elastic member. The thermal conductivity of the thermally conductive member is substantially equal to or greater than 50. The heat conducting member includes a first heat conducting portion and a second heat conducting portion. The first heat conducting portion is adjacent to a heat source. The second heat conducting portion is adjacent to a heat sink. The elastic member connects the first heat conducting portion and the second heat conducting portion, and the elastic member provides an elastic force to the first heat conducting portion and the second heat conducting portion.

According to an embodiment of the invention, an electronic device is presented. The electronic device includes a heat sink, a heat source and a heat conducting structure. The heat conducting structure comprises a heat conducting member and an elastic member. The thermal conductivity of the thermally conductive member is substantially equal to or greater than 50. The heat conducting member includes a first heat conducting portion and a second heat conducting portion. The first heat conducting portion is adjacent to the heat source. The second heat conducting portion is adjacent to the heat sink. The elastic member connects the first heat conducting portion and the second heat conducting portion, and the elastic member provides an elastic force to the first heat conducting portion and the second heat conducting portion.

In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

Please refer to FIG. 1 , which is a cross-sectional view of an electronic device according to an embodiment of the invention. The electronic device 100 is, for example, a digital camera, a digital camera, a mobile phone, a Personal Digital Assistant (PDA), or the like. The electronic device 100 of this embodiment is described by taking a digital camera as an example.

The electronic device 100 includes a heat source 110, a heat sink 120, and a heat conducting structure 130. The heat source 110 is, for example, a photo sensor such as a Complementary Metal-Oxide-Semiconductor (CMOS) or a Charge-Coupled Device (CCD). The heat sink 120 is, for example, a heat conductive bracket, and the heat sink 120 can conduct heat of the heat source 110 to the outside of the electronic device 100.

The electronic device 100 further includes a circuit board 140, and the heat source 110 is disposed on the circuit board 140. In addition, the circuit board 140 further includes a plurality of electrical components 141, such as active components or passive components.

Please refer to FIG. 2A and FIG. 2B simultaneously. FIG. 2A is an enlarged view of the heat source, the heat sink and the heat conducting structure in FIG. 1 , and FIG. 2B is a perspective view of the heat conducting member in FIG. 2A . The heat conductive structure 130 includes a heat conductive member 131 and an elastic member 132. The coefficient of thermal conductivity of the heat conductive member 131 is, for example, equal to or greater than 50 (W/m-K). The heat conductive member 131 includes a first heat conducting portion 1311 and a second heat conducting portion 1312. The first heat transfer portion 1311 is adjacent to the heat source 110. The second heat conducting portion 1312 is adjacent to the heat sink 120. The elastic member 132 connects the first heat conducting portion 1311 and the second heat conducting portion 1312 , and the elastic member 132 provides an elastic force to the first heat conducting portion 1311 and the second heat conducting portion 1312 .

The elastic member 132 is, for example, a sponge, a rubber or a silicone. The elastic member 132 is compressively disposed between the first heat conducting portion 1311 and the second heat conducting portion 1312 to provide an elastic force to the first heat conducting portion 1311 and the second heat conducting portion 1312 to contact the first heat conducting portion 1311 with the heat source 110. And contacting the second heat conducting portion 1312 with the heat sink 120.

In one embodiment, the free state of the elastic member 132 is about 1.2 mm, and the thickness between the first heat conducting portion 1311 and the second heat conducting portion 1312 is about 1.0 mm. That is, the elastic member 132 is compressed by 2 mm. However, the amount of compression of the elastic member 132 is not limited by the embodiments of the present invention.

Since the heat conductive member 131 is, for example, a heat conductive member having excellent heat conductivity, the heat of the heat source 110 can be quickly conducted to the heat sink 120. In this embodiment, the thermal conductivity of the heat conductive member 131 is, for example, substantially equal to or greater than 50. The heat conducting member 131 may be made of a metal material selected from the group consisting of at least one of copper, aluminum, iron, platinum, gold, silver, magnesium, molybdenum, zinc, steel, nickel, and tin, and combinations thereof. In another embodiment, the material of the heat conductive member 131 may also be non-metal. As long as the thermal conductivity of the heat conductive member 131 is equal to or greater than 50, the material of the heat conductive member 131 is not limited by the embodiment of the present invention.

The first heat transfer portion 1311 is connected to the second heat transfer portion 1312. The first heat conducting portion 1311 has a first free end 1311a, the second heat conducting portion 1312 has a second free end 1312a, and the first free end 1311a is adjacent to the second free end 1312a. The first free end 1311a of the first heat conducting portion 1311 and the second free end 1312a of the second heat conducting portion 1312 are deformable, so that the heat conducting member 131 has elasticity, which is similar to the elastic member.

The heat conductive member 131 has an arc structure C. An opening 133 is defined between the first free end 1311a of the first heat conducting portion 1311 and the second free end 1312a of the second heat conducting portion 1312. The opening 133 is positioned relative to the curved structure C.

The heat conducting member 131 is, for example, an open annular structure having a cross-sectional shape of an open ring shape (Fig. 2A). In this embodiment, the opposite sides of the heat conducting member 131 are, for example, the opening 133 and the curved structure C, and the opposite sides of the heat conducting member 131 are, for example, the openings 131a1 and 131a2.

The heat conductive member 131 can be formed by a bending process such that the bent portion of the heat conductive member 131 forms the curved structure C. In other embodiments, the heat conductive member 131 can be formed by cutting or casting.

The area of the upper surface 131u of the heat conductive member 131 is smaller than or equal to the area of the lower surface 110b of the heat source 110. Therefore, the heat conductive member 131 is viewed from the plan view direction of FIG. 2A, and the upper surface 131u of the heat conductive member 131 is completely covered by the heat source 110. Since the area of the upper surface 131u of the heat conducting member 131 is less than or equal to the area of the lower surface 110b of the heat generating source 110, the heat conducting member 131 is not electrically connected to the horizontal two sides (the extending direction of the circuit board 140) to electrically contact the surrounding heat source 110. Element 141, this avoids the occurrence of a short circuit.

Please refer to FIG. 3, which is a perspective view of a heat conducting member according to another embodiment of the present invention. The heat conducting member 231 is a closed annular structure, and its cross-sectional shape is closed to the ring shape. In this embodiment, the heat conducting member 231 has a relatively two-arc structure C.

The heat conductive member 231 can be formed by bending, so that the bent portion of the heat conductive member 231 forms the curved structure C. In other embodiments, the heat conductive member 131 can be formed by cutting or casting.

The cross-sectional shape of the heat conducting member 231 may be circular, elliptical, quadrangular (such as ladder, rectangular or prismatic, etc.) or irregular shape. The cross-sectional shape of the heat conducting member 231 is not limited in this embodiment.

Please refer to FIG. 4, which is a perspective view of a heat conducting member according to still another embodiment of the present invention.

The heat conducting member 331 is a closed annular structure, and its sectional shape is closed to the ring shape. The heat conducting member 331 includes a first heat conducting portion 3311 and a second heat conducting portion 3312. The first heat transfer portion 3311 includes a first sub heat transfer portion 3311c and two first elastic portions 3311d. The first sub-heat transfer portion 3311c is, for example, a flat plate that is in contact with the heat source 110. The first elastic portion 3311d is connected to the first sub heat transfer portion 3311c. The second heat conducting portion 3312 includes a second sub heat conducting portion 3312c and two second elastic portions 3312d. The second sub-heat transfer portion 3312c is, for example, a flat plate that is in contact with the heat sink 120. The second elastic portion 3312d connects the second sub-heat transfer portion 3312c and the first elastic portion 3311d. In another embodiment, the heat conducting member 331 can also omit one of the first elastic portions 3311d and the corresponding second elastic portion 3312d, so that the heat conducting member 331 has an opening 133 similar to the heat conducting member 131.

A first obtuse angle A1 is sandwiched between the first sub-heat transfer portion 3311c and the first elastic portion 3311d, and a second obtuse angle A2 is sandwiched between the second sub-heat transfer portion 3312c and the second elastic portion 3312d, and the first elastic portion 3311d and the second elastic portion The acute angle A3 is sandwiched between the portions 3312d. In this way, the heat conducting member 331 has elasticity, which is similar to the elastic member. In addition, the connection between the first elastic portion 3311d and the first sub-heat transfer portion 3311c and the connection between the second elastic portion 3312d and the second sub-heat transfer portion 3312c form a significant transition, so that the flexibility of the heat-conducting member 331 can be increased. Or flexible.

5A and 5B, FIG. 5A is a cross-sectional view of a heat source, a heat dissipating member, and a heat conducting structure according to an embodiment of the present invention, and FIG. 5B is a perspective view of the heat conducting member in FIG. 5A.

The heat conducting member 431 includes a first heat conducting portion 4311 and a second heat conducting portion 4312. The first heat conducting portion 4311 has a first free end 4311a, and the second heat conducting portion 4312 has a second free end 4312a, the first free end 4311a being adjacent to the second free end 4312a. In this embodiment, the end surface of the first free end 4311a is opposite to the end surface of the second free end 4312a.

An opening 433 is defined between the first free end 4311a of the first heat conducting portion 4311 and the second free end 4312a of the second heat conducting portion 4312. The opening 433 is adjacent to the heat source 110 or the heat sink 120. The opening 433 of the embodiment is The example is adjacent to the heat source 110.

6A and 6B, FIG. 6A is a cross-sectional view showing a heat source, a heat dissipating member, and a heat conducting structure according to still another embodiment of the present invention, and FIG. 6B is a perspective view showing the heat conducting member of FIG. 6A.

The heat conducting structure 530 further includes an insulating sheet 534, which is, for example, a Mylar film. The insulating sheet 534 is disposed on the outer surface 531s1 of the heat conducting member 531 and has a first opening 534a1 and a second opening 534a2. The first opening 534a1 and the second opening 534a2 expose the heat conducting member 531.

As shown in FIG. 6A, the elastic force of the elastic member 132 acts on the heat conducting member 531, the first portion 531a1 of the heat conducting member 531 is deformed to contact the heat source 110 through the first opening 534a1, and the second portion of the heat conducting member 531. The portion 531a2 is deformed to contact the heat sink 120 through the second opening 534a2.

Please refer to FIGS. 7A and 7B for a manufacturing process diagram of the heat conducting structure of FIG. 6A.

As shown in FIG. 7A, the insulating sheet 534 is provided on the outer surface 531s1 of the heat conducting member 531. The manner in which the insulating sheet 534 is provided on the heat conducting member 531 is, for example, pasting.

As shown in Fig. 7B, the elastic member 132 is placed on the inner side surface 531s2 of the heat conductive member 531.

Then, the heat conducting member 531 and the insulating sheet 534 are bent, for example, by a bending method to form the heat conducting structure 530 of FIG. 6A.

In another embodiment, the insulating sheet 534 can also be applied to the heat conductive members 131, 231, 331 and 431.

Please refer to FIG. 8 , which is a cross-sectional view showing a heat source, a heat sink and a heat conducting structure according to other embodiments of the present invention.

The insulating sheet 634 has an opening 634a that exposes the heat source 110 and covers the electrical component 141 around the heat source 110. Thus, by the barrier of the insulating sheet 634, the thermal conductive structure 130 (not shown) can be prevented from electrically contacting the electrical component 141 to cause a short circuit.

Although not shown, the size of the heat conductive member 131 may be larger than the size of the heat source 110. In detail, since the insulating sheet 634 covers the electrical component 141, even if the dimension of the heat conducting member 131 is larger than the size of the heat generating source 110, the heat conducting member 131 is blocked by the insulating sheet 634 without being in contact with the heat of the heat generating source 110. Sexual element 141.

Although the first heat conducting portion and the second heat conducting portion of the heat conducting structure of the above embodiment are directly connected as an example, the first heat conducting portion and the second heat conducting portion may be connected through another element, which will be exemplified below.

Please refer to FIG. 9, which is a cross-sectional view showing a heat conducting structure according to another embodiment of the present invention. The heat conducting structure 730 includes a heat conducting member 731 and at least one elastic member 732. The heat conductive member 731 includes a first heat transfer portion 7311 and a second heat transfer portion 7312. The elastic member 732 is, for example, a spring. In this embodiment, the first heat conducting portion 7311 and the second heat conducting portion 7312 are separated by the elastic member 732. The elastic member 732 may be disposed between the first heat conducting portion 7311 and the second heat conducting portion 7312, for example, the spacing between any adjacent ones of the elastic members 732. the same.

In another embodiment, the heat conducting structure 730 may further include an elastic member 132 (not shown) disposed between the first heat conducting portion 7311 and the second heat conducting portion 7312.

Due to the configuration of the elastic member 732, the heat transfer path of the heat source 110 to the heat sink 120 is shortened, so that the heat of the heat source 110 can be quickly transmitted to the heat sink 120 through the elastic member 732 (providing a short conductive path).

The material of the elastic member 732 is preferably, but not limited to, a material having a high thermal conductivity, for example, a material having a thermal conductivity greater than 50. In one embodiment, the material of the elastic member 732 can be the same as that of the heat conductive member 731.

Please refer to FIG. 10, which is a cross-sectional view showing a heat conducting structure according to another embodiment of the present invention. The heat conducting structure 830 includes a heat conducting member 731, insulating sheets 834 and 835. The insulating sheet 834 has a first opening 834a, and the insulating sheet 835 has a second opening 835a.

The elastic member 732 can be disposed corresponding to the position of the first opening 834a of the insulating sheet 834 and the second opening 835a of the insulating sheet 835. Thus, the elastic force of the elastic member 732 acts on the heat conducting member 731, so that the heat conducting member 731 One portion is deformed to contact the heat source 110 through the first opening 834a, and the other portion of the heat conductive member 731 is deformed to contact the heat sink 120 through the second opening 835a.

The materials of the heat conducting members 231, 331, 431, 531, and 731 may be selected from the group consisting of at least one of copper, aluminum, iron, platinum, gold, silver, magnesium, molybdenum, zinc, steel, and nickel, and combinations thereof. group. In one embodiment, the heat conductive members 131, 231, 331, 431, 531, and 731 are, for example, copper foil.

The heat conducting members 131, 231, 331, 431, 531, and 731 have a thickness of between about 0.1 and 0.05 mm.

The heat conducting structure and the electronic device using the same disclosed in the above embodiments of the present invention have high thermal conductivity of the heat conducting structure, so that the electronic device has a good heat conducting effect.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100. . . Electronic device

110. . . Heat source

110b. . . lower surface

120. . . Heat sink

130, 530, 730, 830. . . Thermal structure

131, 231, 331, 431, 531, 731. . . Heat conductive member

131u. . . Upper surface

1331, 3311, 4311, 7311. . . First heat conducting portion

1311a, 4311a‧‧‧ first free end

1312a, 4312a‧‧‧ second free end

1312, 3312, 4312, 7312‧‧‧ second heat transfer section

132, 732‧‧‧ elastic parts

133, 131a1, 131a2, 433‧‧‧ openings

140‧‧‧ boards

141‧‧‧Electrical components

3311c‧‧‧The first child heat conduction department

3311d‧‧‧First Elastic Department

3312c‧‧‧Second Child Heat Transfer

3312d‧‧‧Second elastic part

534, 634, 834, 835 ‧ ‧ insulating sheets

534a1, 834a‧‧‧ first opening

534a2, 835a‧‧‧ second opening

634a‧‧‧Opening

531a1‧‧‧Part 1

531a2‧‧‧Part II

531s1‧‧‧Outside

531s2‧‧‧ inside

C‧‧‧arc structure

A1‧‧‧ first obtuse angle

A2‧‧‧second obtuse angle

A3‧‧‧ acute angle

1 is a cross-sectional view of an electronic device in accordance with an embodiment of the present invention.

FIG. 2A is an enlarged view of the heat source, the heat sink, and the heat conducting structure in FIG. 1 .

FIG. 2B is a perspective view showing the heat conductive member in FIG. 2A.

3 is a perspective view of a heat conductive member according to another embodiment of the present invention.

4 is a perspective view of a heat conductive member according to still another embodiment of the present invention.

FIG. 5A is a cross-sectional view showing a heat source, a heat sink, and a heat conducting structure according to an embodiment of the invention.

Fig. 5B is a perspective view showing the heat conducting member in Fig. 5A.

FIG. 6A is a cross-sectional view showing a heat source, a heat sink, and a heat conducting structure according to still another embodiment of the present invention.

Fig. 6B is a perspective view showing the heat conductive member of Fig. 6A.

7A and 7B are views showing a manufacturing process of the heat conducting structure of Fig. 6A.

FIG. 8 is a cross-sectional view showing a heat source, a heat sink, and a heat conducting structure according to another embodiment of the present invention.

Figure 9 is a cross-sectional view showing a heat conducting structure of another embodiment of the present invention.

Figure 10 is a cross-sectional view showing a heat conducting structure of another embodiment of the present invention.

110. . . Heat source

120. . . Heat sink

130. . . Thermal structure

131. . . Heat conductive member

1311. . . First heat conducting portion

1311a. . . First free end

1312a. . . Second free end

1312. . . Second heat transfer portion

132. . . Elastic part

133. . . Opening

140. . . Circuit board

141. . . Electrical component

C. . . Curved structure

Claims (16)

  1. A heat conducting structure comprising: a heat conducting member comprising: a first heat conducting portion having a first surface adjacent to a heat source; and a second heat conducting portion having a second surface adjacent to a heat sink; and An elastic member disposed between the first surface of the first heat conducting portion and the second surface of the second heat conducting portion to space the first heat conducting portion and the second heat conducting portion; wherein the first heat conducting portion Connecting the second heat conducting portion.
  2. A heat conducting structure comprising: a heat conducting member comprising: a first heat conducting portion adjacent to a heat source; a second heat conducting portion adjacent to a heat sink and isolated from the first heat conducting portion, and the second heat conducting portion Forming an accommodating space between the portion and the first heat conducting portion; and a connecting portion connecting one end of the first heat conducting portion and one end of the second heat conducting portion; and an elastic member disposed in the accommodating space Connecting the first heat conducting portion and the second heat conducting portion, the elastic member provides an elastic force to the first heat conducting portion and the second heat conducting portion.
  3. The heat conducting structure of claim 2, wherein the first heat conducting portion is directly connected to the second heat conducting portion.
  4. The heat conducting structure according to claim 1 or 2, wherein The first heat conducting portion has a first free end, and the second heat conducting portion has a second free end, the first free end being adjacent to the second free end.
  5. The heat-conducting structure of claim 4, wherein the heat-conducting member has an arc-shaped structure, and the first free end of the first heat-conducting portion and the second free end of the second heat-conducting portion are between An opening having a position relative to the arcuate structure.
  6. The heat-conducting structure of claim 4, wherein an opening is formed between the first free end of the first heat conducting portion and the second free end of the second heat conducting portion, the opening being adjacent to the heat Source or the heat sink.
  7. The thermally conductive structure of claim 1 or 2, wherein the thermally conductive member has an arcuate structure.
  8. The heat-conducting structure of claim 1 or 2, wherein the heat-conducting member has a closed outer shape.
  9. The heat conducting structure of claim 1 or 2, wherein the first heat conducting portion comprises: a first sub heat conducting portion; and a first elastic portion connected to the first sub heat conducting portion; and the second The heat conducting portion includes: a second sub-heat conducting portion; and a second elastic portion connecting the second sub-heat conducting portion and the first elastic portion; wherein the first sub-heat conducting portion and the first elastic portion are first An obtuse angle, and the second sub-heat conducting portion and the second elastic portion have a second obtuse angle, and the first elastic portion and the second elastic portion are at an acute angle.
  10. As disclosed in the heat transfer structure described in claim 1 or 2, The method includes an insulating sheet disposed on an outer side surface of the heat conducting member and having a first opening and a second opening, the first opening and the second opening exposing the heat conducting member.
  11. The heat conducting structure of claim 1 or 2, wherein the heat source completely covers the heat conducting member.
  12. The heat conducting structure of claim 2, wherein the first heat conducting portion and the second heat conducting portion are separated by the elastic member.
  13. The heat conducting structure according to claim 1, wherein the heat conducting member is made of a metal material.
  14. The heat conductive structure according to claim 13, wherein the metal material is selected from the group consisting of copper, aluminum, iron, platinum, gold, silver, magnesium, molybdenum, zinc, steel, nickel, and at least one of them. Group.
  15. The thermally conductive structure of claim 1 or 2, wherein the elastic member is a foam, a rubber, a silicone or a spring.
  16. An electronic device comprising: a heat dissipating member; a heat generating source; and a heat conducting structure according to claim 1 or 2.
TW100130386A 2011-08-24 2011-08-24 Thermal conductivity structure and electronic device using the same TWI471718B (en)

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Application Number Priority Date Filing Date Title
TW100130386A TWI471718B (en) 2011-08-24 2011-08-24 Thermal conductivity structure and electronic device using the same

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TW201310211A TW201310211A (en) 2013-03-01
TWI471718B true TWI471718B (en) 2015-02-01

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI267345B (en) * 2005-09-05 2006-11-21 Foxconn Tech Co Ltd Heat dissipation device and method for making the same
TWM339030U (en) * 2008-03-17 2008-08-21 Cooler Master Co Ltd Heat conduction structure
TWI346279B (en) * 2005-10-25 2011-08-01 Ibm Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI267345B (en) * 2005-09-05 2006-11-21 Foxconn Tech Co Ltd Heat dissipation device and method for making the same
TWI346279B (en) * 2005-10-25 2011-08-01 Ibm Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
TWM339030U (en) * 2008-03-17 2008-08-21 Cooler Master Co Ltd Heat conduction structure

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