1315174 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種彈片固定結構及具該彈片固定結 構的散熱模組，尤係涉及一種對發熱電子元件散熱之彈片 固定結構及具該彈片固定結構的散熱模組。 【先前技術】 隨著電子産業之快速發展，電子元件的高速、高頻以 及集成化使其發熱量劇増，因此散熱已成爲業者所重點考 慮的問題。 在散熱領域中’通常係採用一種散熱模組對發熱 電子元件進行散熱’如圖7所示，該散熱模組3〇包 括壓鑄件31’熱管32’散熱鰭片組33,以及彈片34, 該壓鑄件31與一發熱電子元件（圖未示）接觸，其 上設有兩小圓柱311以及一收容該熱管32 —端的收容 孔312，該熱管32的另一端與散熱鰭片組33結合， 該彈片34上設有與兩小圓柱311相對應的兩鎖定孔 341以及兩通孔342,將兩小圓柱311分別穿設于兩鎖 定孔341内’並利用穿過該兩通孔342的螺釘、柳釘 等固定元件（圖未示）將該壓鑄件31固定於一電路 板（圖未示）上，使壓鑄件31與發熱電子元件緊密 接觸以吸收其熱量，然後藉由熱管32將壓鑄件31上 的熱量傳遞給散熱鰭片組33,最終散發到周圍的空氣 中〇 6 1315174 該散熱模組30中的壓鑄件31係將金屬材料經過 壓鑄加工，然後在壓鑄件上設計小圓柱311形成，而 在生産過程中，壓鑄工藝生産效率低且成本高，故需 加以改進。 【發明内容】 有鑒於此，有必要提供一種生產工藝簡單之彈片 固定結構及具該彈片固定結構的散熱模組。 該散熱模組包括散熱鰭片組，熱管以及彈片固定 結構，該彈片固定結構包括與一發熱電子元件接觸以 從其吸收熱量的板件及彈片，該熱管與板件結合以將 板件上的熱量傳遞至散熱鰭片組，該彈片用於將該熱 管固定至該板件上，該彈片與該板件其中之一上設有 兩鎖定孔，該板件一體彎折成型，該板件與該彈片其 中之另一上設有與兩鎖定孔相對應的兩凸柱。 該散熱模組藉由彈片將熱管固定於板件上，該板 件一體彎折成型，其製作工藝簡單，生產速度快，可 降低成本，組裝時，只需經過穿設、壓平等操作，組 裝程序簡單。 【實施方式】 下面參照附圖結合實施例對本發明作進一步說 明。 請參照圖1及圖2,本發明散熱模組10包括一散 熱鰭片組13，一熱管12以及一彈片固定結構16，該 彈片固定結構16包括一與發熱電子元件（圖未示） 1315174 接觸以從其吸收熱量的板件11及一彈片14,該熱管 12與板件11結合以將板件11上的熱量傳遞至散熱鰭 片組13,該彈片14用於將熱管12固定至板件11上。 該熱管12呈扁平狀，其具有一貼設於板件11的 蒸發段121及一穿設於散熱鰭片組13内的冷凝段 122，該散熱鰭片組13包括複數散熱鰭片131，每一 散熱鰭片131均開設一收容該熱管12冷凝段122的 穿孔132。 該板件11具有與發熱電子元件熱接觸之接觸板 111，一收容該熱管12之蒸發段121的U形收容部 112,以及沿該收容部112兩側水平向外延伸之兩固定 部113。該接觸板111延伸出收容部112的兩侧壁以 增加板件11與發熱電子元件的熱接觸面積，該兩固定 部113形狀相同，每一固定部113上均設有一向上沖 壓形成的凸柱114，該兩凸柱114以兩固定部113之 對稱中心0成中心對稱。 請參照圖3,該圖係本發明彈片固定結構16中板 件11之原始構件15之俯視圖，該構件15係由銅或鋁 材料經過簡單加工而製成，該構件15可一體彎折形 成板件11，該構件15與板件Π之接觸板111、固定 部113所對應之部位分別爲接觸板11Γ、固定部113'。 請再參照圖1及圖2,該彈片14呈兩端設有圓弧 倒角之矩形，其中間位置設有一向下沖壓形成之圓柱 狀突部141，該突部141兩邊各設有一鎖定孔142， 8 1315174 該兩鎖定孔；142分別與該板件u上之兩凸柱114對 應，該彈片14在靠近兩端的位置各設有一通孔143。 組裝時，將熱管12之蒸發段12ι置於該板件n 之收容部112内，爲使熱管12與板件11能充分接觸， 達到更好的散熱效果，可在熱管12與板件u接觸板 111之接觸面間塗一層熱傳導介質（圖未示），如導熱 膏等。將該板件11之兩凸柱114對應穿設於該彈片 14之兩鎖定孔142内，然後將凸柱114壓平，從而將 熱官12固定至板件11上，該彈片14上的突部141 位於該板件U接觸板lu中央位置的上方並向下抵頂 該熱管u之蒸發段121，實現熱管12與板件n之緊 密接觸。藉由穿過該彈片14上的兩通孔143的螺釘、、 鉚釘等ϋ定元件將該板件U蚊於—電路板（圖未 不）上，使板件11之接觸板ηι與發熱電子元件充分[Technical Field] The present invention relates to a shrapnel fixing structure and a heat dissipating module having the shrapnel fixing structure, and more particularly to a shrapnel fixing structure for dissipating heat from an electronic component and fixing the shrapnel Structure of the thermal module. [Prior Art] With the rapid development of the electronics industry, the high-speed, high-frequency and integration of electronic components have made them more powerful, so heat dissipation has become a key consideration for the industry. In the field of heat dissipation, a heat dissipation module is generally used to dissipate heat-generating electronic components. As shown in FIG. 7, the heat dissipation module 3 includes a die-casting member 31' heat pipe 32' heat-dissipating fin group 33, and a spring piece 34. The die casting 31 is in contact with a heat-generating electronic component (not shown), and is provided with two small cylinders 311 and a receiving hole 312 for receiving the heat pipe 32. The other end of the heat pipe 32 is combined with the heat dissipation fin group 33. The elastic piece 34 is provided with two locking holes 341 corresponding to the two small cylinders 311 and two through holes 342. The two small cylinders 311 are respectively disposed in the two locking holes 341 and utilize the screws passing through the two through holes 342. A fixing member (not shown) such as a rivet is fixed to a circuit board (not shown) such that the die casting 31 is in close contact with the heat-generating electronic component to absorb heat thereof, and then the die-casting member is pressed by the heat pipe 32. The heat on the heat transfer fins 33 is transmitted to the heat dissipation fin group 33, and finally is radiated to the surrounding air. 136 1315174 The die-casting part 31 in the heat dissipation module 30 is subjected to die-casting processing of the metal material, and then a small cylinder 311 is formed on the die-casting part. While in the production process , Low productivity and high casting cost process, it needs to be improved. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a shrapnel fixing structure with a simple production process and a heat dissipating module having the shrapnel fixing structure. The heat dissipation module includes a heat dissipation fin set, a heat pipe and a spring fixing structure, and the elastic piece fixing structure includes a plate member and a spring piece that are in contact with a heat generating electronic component to absorb heat therefrom, and the heat pipe is combined with the plate member to be mounted on the plate member. The heat is transferred to the heat dissipation fin group, and the elastic piece is used for fixing the heat pipe to the plate member, and the elastic piece and the plate member are provided with two locking holes, and the plate member is integrally bent and formed, and the plate member is integrally formed The other of the elastic pieces is provided with two protrusions corresponding to the two locking holes. The heat dissipating module fixes the heat pipe on the plate by the elastic piece, and the plate piece is integrally bent and formed, the manufacturing process is simple, the production speed is fast, the cost can be reduced, and the assembly is only required to be assembled and pressed, and assembled. The program is simple. [Embodiment] Hereinafter, the present invention will be further described with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the heat dissipation module 10 of the present invention includes a heat dissipation fin set 13, a heat pipe 12 and a spring fixing structure 16, and the elastic piece fixing structure 16 includes a contact with a heat-generating electronic component (not shown) 1315174. With the plate member 11 and a resilient piece 14 from which heat is absorbed, the heat pipe 12 is combined with the plate member 11 to transfer heat on the plate member 11 to the heat dissipation fin group 13, which is used for fixing the heat pipe 12 to the plate member. 11 on. The heat pipe 12 has a flat shape, and has an evaporation section 121 attached to the plate member 11 and a condensation section 122 penetrating the heat dissipation fin group 13. The heat dissipation fin group 13 includes a plurality of heat dissipation fins 131. A heat dissipation fin 131 defines a through hole 132 for receiving the condensation section 122 of the heat pipe 12. The plate member 11 has a contact plate 111 in thermal contact with the heat-generating electronic component, a U-shaped receiving portion 112 for receiving the evaporation portion 121 of the heat pipe 12, and two fixing portions 113 extending horizontally outward along both sides of the receiving portion 112. The contact plate 111 extends from the two side walls of the receiving portion 112 to increase the thermal contact area of the plate member 11 with the heat-generating electronic component. The two fixing portions 113 are identical in shape, and each of the fixing portions 113 is provided with a protruding column formed by upward punching. 114. The two protrusions 114 are symmetric with respect to the center of symmetry of the two fixing portions 113. Referring to FIG. 3, which is a plan view of the original member 15 of the panel member 11 in the elastic member fixing structure 16 of the present invention, the member 15 is made of a copper or aluminum material, and the member 15 can be integrally bent to form a panel. The member 11 and the contact plate 111 and the fixing portion 113 of the plate member are respectively a contact plate 11A and a fixing portion 113'. Referring to FIG. 1 and FIG. 2 again, the elastic piece 14 has a rectangular shape with arc chamfers at both ends, and a cylindrical protrusion 141 formed by punching downward is disposed at a middle position thereof, and each of the protrusions 141 is provided with a locking hole on each side. 142, 8 1315174 The two locking holes 142 respectively correspond to the two protrusions 114 on the plate member u. The elastic piece 14 is provided with a through hole 143 at a position close to both ends. During assembly, the evaporation section 12 of the heat pipe 12 is placed in the accommodating portion 112 of the plate n, so that the heat pipe 12 and the plate member 11 can be sufficiently contacted to achieve better heat dissipation effect, and the heat pipe 12 can be in contact with the plate member u. A thermal conductive medium (not shown), such as a thermal paste, is applied between the contact faces of the plates 111. The two protrusions 114 of the plate member 11 are correspondingly disposed in the two locking holes 142 of the elastic piece 14, and then the protrusions 114 are flattened, thereby fixing the heat register 12 to the plate member 11. The protrusion on the elastic piece 14 The portion 141 is located above the central position of the plate member U contact plate lu and abuts against the evaporation portion 121 of the heat pipe u to achieve close contact between the heat pipe 12 and the plate member n. The plate member U is placed on the circuit board (not shown) by a screw, a rivet or the like through the two through holes 143 of the elastic piece 14, so that the contact plate ηι of the plate member 11 and the heat-generating electrons Fully component
該散熱模組10藉由彈片14將收容於板件u收容 部出内的熱管12固定至板件1:上，該板们丄經沖 壓一體彎折成型，其上的凸柱114也由沖壓形成，因 =板件11之製作工藝簡單’生産速度快，可降低成 t二且裝時’只紐過穿設、壓平等操作，組裝簡軍t ，於該板件11兩凸柱114以兩固定部113之對稍 二：::?稱’即彈片14之施力點位於該板科 η接觸板m上方的中央區域， 固持力均勻分佈於接觸板m上，有利於板件 1315174 熱電子元件之充分接觸，再者該彈片14中間位置還 設有向下抵頂該熱管12之蒸發段121的突部141，從 而可使固持力集中於接觸板111與發熱電子元件中央 部位相對應的位置上，而且，當熱管12之厚度L略 小於板件11收容部112之高度Η時，該彈片14上的 突部141可將彈片之固持力傳遞給熱管12,實現熱管 12與彈片14之緊密接觸，最終可提高散熱效果。 圖4係本發明另一實施方式中彈片固定結構26 的板件21之立體圖，其與第一實施方式不同的是在 該板件21位於U形收容部212開口處設有一金屬板 215，該金屬板215可由銅或鋁材料製成，爲達到最 低用料之設計，該板件21可由如圖5所示之原始板 件25 —體彎折成型，該構件25與板件21之接觸板 211、固定部213、金屬板215所對應之部位分別爲接 觸板211'、固定部213、金屬板215’。 請參照圖6，該實施方式中彈片24與板件21之 固定方式與第一實施方式相似，熱管22置於該板件 21位於金屬板215下面的收容部212内，彈片24位 於金屬板215上方，該金屬板215可增加熱管22之 受力面積，從而可減小壓強，避免熱管22因管壁薄 而損壞，有效地對熱管22進行保護，另，熱管22之 蒸發段221同時與接觸板211及金屬板215接觸，可 增大熱管22與板件21之接觸面積，從而實現快速將 熱量從板件21傳遞至熱管22,提升散熱模組20之整 1315174 體散熱效果。 本發明中，板件11、21上均設有向上沖壓形成之 兩凸柱114、214,彈片14、24上均設有分別與該板 件11、21上的兩凸柱114、214相對應之兩鎖定孔 142、242，在實際應用中，也可在彈片14、24上均 設向下沖壓形成之兩凸柱，而在板件11、21上均設分 別與該彈片14、24上兩凸柱相對應之兩鎖定孔。 【圖式簡單說明】 圖1係本發明散熱模組之立體組裝圖。 圖2係本發明散熱模組之立體分解圖。 圖3係本發明彈片固定結構中板件之原始構件之 俯視圖。 圖4係本發明另一實施方式中彈片固定結構的板 件之立體圖。 圖5係本發明另一實施方式中彈片固定結構的板 件原始構件之俯視圖。 圖6係本發明散熱模組另一實施方式之立體組裝 圖。 圖7係習知技術散熱模組之立體組裝圖。 【主要元件符號說明】 散熱模組10、20 板件 11、21 接觸板 111、11Γ、211、21Γ 固定部 113、113'、213、213' 114、214 收容部 112、212 凸柱 π 221 1315174 熱管 12、22 蒸發段 121 冷凝段 122 ' 222 散熱鰭片組 13 散熱鰭片 131 > 231 穿孔 132 彈片 14 ' 24 突部 141 鎖定孔 142 、 242 通孔 143 構件 15 > 25 彈片固定結構 16 金屬板 215 、 215' 23 232 241 243 26The heat dissipation module 10 fixes the heat pipe 12 received in the outlet of the plate member accommodating portion to the plate member 1 by means of the elastic piece 14. The plates are bent and integrally molded by punching, and the protrusions 114 on the plate are also stamped. Forming, because = the manufacturing process of the plate 11 is simple 'the production speed is fast, can be reduced to t 2 and the loading time is only used to pass through, the pressure equal operation, assembly simple t, in the plate 11 two protrusions 114 The pair of two fixing portions 113 is slightly two:::?, that is, the point of application of the elastic piece 14 is located in the central area above the contact plate m of the plate, and the holding force is evenly distributed on the contact plate m, which is favorable for the heat of the plate 1315174. The electronic component is in sufficient contact, and the middle portion of the elastic piece 14 is further provided with a protrusion 141 that abuts against the evaporation section 121 of the heat pipe 12, so that the holding force is concentrated on the contact plate 111 corresponding to the central portion of the heat-generating electronic component. In the position of the heat pipe 12 and the elastic piece 12, the protrusion 141 on the elastic piece 14 can transmit the holding force of the elastic piece to the heat pipe 12 when the thickness L of the heat pipe 12 is slightly smaller than the height Η of the receiving portion 112 of the plate member 11. The close contact can ultimately improve the heat dissipation. 4 is a perspective view of a plate member 21 of the elastic piece fixing structure 26 according to another embodiment of the present invention, which is different from the first embodiment in that a metal plate 215 is disposed at the opening of the plate member 21 at the U-shaped receiving portion 212. The metal plate 215 may be made of a copper or aluminum material. To achieve the lowest material design, the plate member 21 may be formed by bending the original plate member 25 as shown in FIG. 5, and the contact plate between the member member 25 and the plate member 21 is formed. The portions corresponding to the fixing portion 213 and the metal plate 215 are the contact plate 211', the fixing portion 213, and the metal plate 215'. Referring to FIG. 6 , in the embodiment, the elastic piece 22 is disposed in the receiving portion 212 of the plate member 21 under the metal plate 215 , and the elastic piece 24 is located on the metal plate 215 . Above, the metal plate 215 can increase the stress area of the heat pipe 22, thereby reducing the pressure, preventing the heat pipe 22 from being damaged due to the thin wall of the pipe, effectively protecting the heat pipe 22, and simultaneously, the evaporation section 221 of the heat pipe 22 is simultaneously in contact with The contact between the plate 211 and the metal plate 215 can increase the contact area between the heat pipe 22 and the plate member 21, thereby rapidly transferring heat from the plate member 21 to the heat pipe 22, and improving the heat dissipation effect of the entire 1315174 body of the heat dissipation module 20. In the present invention, the plates 11 and 21 are respectively provided with two protrusions 114 and 214 which are formed by upward punching, and the elastic pieces 14 and 24 are respectively provided corresponding to the two protrusions 114 and 214 on the plate members 11 and 21 respectively. The two locking holes 142 and 242 are respectively disposed on the elastic pieces 14 and 24, and the two protrusions are formed on the elastic pieces 14 and 24, and the upper plates 11 and 21 are respectively disposed on the elastic pieces 14 and 24. Two locking holes corresponding to the two protrusions. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat dissipation module of the present invention. 2 is an exploded perspective view of the heat dissipation module of the present invention. Fig. 3 is a plan view showing the original members of the panel in the elastic fixing structure of the present invention. Fig. 4 is a perspective view showing a panel of a spring fixing structure in another embodiment of the present invention. Fig. 5 is a plan view showing the original member of the panel of the elastic fixing structure in another embodiment of the present invention. Figure 6 is a perspective assembled view of another embodiment of the heat dissipation module of the present invention. FIG. 7 is a perspective assembled view of a conventional heat dissipation module. [Description of main component symbols] Heat dissipation module 10, 20 Plates 11, 21 Contact plates 111, 11Γ, 211, 21Γ Fixing portions 113, 113', 213, 213' 114, 214 Housings 112, 212 Tabs π 221 1315174 Heat pipe 12, 22 Evaporation section 121 Condensation section 122' 222 Heat sink fin set 13 Heat sink fin 131 > 231 Pierce 132 Spring 14 ' 24 Projection 141 Locking hole 142, 242 Through hole 143 Member 15 > 25 Shrapnel fixing structure 16 Metal plate 215, 215' 23 232 241 243 26
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