US20090288802A1 - Heat sink for chips - Google Patents

Heat sink for chips Download PDF

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Publication number
US20090288802A1
US20090288802A1 US12/155,852 US15585208A US2009288802A1 US 20090288802 A1 US20090288802 A1 US 20090288802A1 US 15585208 A US15585208 A US 15585208A US 2009288802 A1 US2009288802 A1 US 2009288802A1
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US
United States
Prior art keywords
heat
base board
dispensing unit
heat sink
heat dispensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/155,852
Inventor
Wei-Hau Chen
Steven Yen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Comptake Tech Inc
Original Assignee
Comptake Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Comptake Tech Inc filed Critical Comptake Tech Inc
Assigned to COMPTAKE TECHNOLOGY INC. reassignment COMPTAKE TECHNOLOGY INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, WEI-HAU, YEN, STEVEN
Publication of US20090288802A1 publication Critical patent/US20090288802A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink for removing heat from chips and the chips are connected with first heat dispensing units and the second dispensing units are connected to the first heat dispensing units by clamping members.
  • a conventional way to remove heat from the chip is to provide two heat dispensing plates between which the chip is clamped, the heat generated from the chip is conducted to the heat dispensing plates and escapes to the air via the heat dispensing plates.
  • the present invention intends to provide a heat sink for chips and includes two heat dispensing units, one of the heat dispensing units clamps the chips and the other heat dispensing unit is connected on the first heat dispensing unit by using a base board and two clamping members.
  • the heat from the chips that is conducted to the first heat dispensing unit is removed by from the first heat dispensing units via the second heat dispensing units.
  • the present invention relates to a heat sink which comprises a first heat dispensing unit composed of multiple heat dispensing plates between which the chips are clamped.
  • a base board has a contact surface defined in an underside of the base board and the contact surface is in contact with a top of the first heat dispensing unit.
  • a second heat dispensing unit is fixed on a top of the base board. Two clamping members connect the base board to the first heat dispensing unit.
  • FIG. 1 is an exploded view to show the chips and the heat sink of the present invention
  • FIG. 2 is a perspective view to show the connection of the chips and the heat sink of the present invention
  • FIG. 3 is an exploded view to show the chips and a second embodiment of the present invention.
  • FIG. 4 is a perspective view to show the connection of the chips and the heat sink in FIG. 3 of the present invention.
  • FIG. 5 is an exploded view to show the chips and a third embodiment of the heat sink of the present invention.
  • FIG. 6 is an exploded view to show the chips and a fourth embodiment of the heat sink of the present invention.
  • FIG. 7 is a perspective view to show the connection of the chips and the heat sink in FIG. 6 of the present invention.
  • FIG. 8 is an exploded view to show the chips and a fifth embodiment of the heat sink of the present invention.
  • FIG. 9 is an exploded view to show the chips and a sixth embodiment of the heat sink of the present invention.
  • the heat sink 10 for chips 5 of the present invention comprises multiple first heat dispensing units 3 , a base board 1 , two second heat dispensing units 4 and two clamping members 2 .
  • the first heat dispensing units 3 each include multiple heat dispensing plates between which the chips 5 are clamped.
  • the base board 1 has a contact surface 11 defined in an underside of the base board 1 and the contact surface 11 is shaped to match with the top of the first heating dispensing units 3 .
  • Two holes 12 are defined through the base board 1 and a plurality of threaded holes 13 are located around the holes 12 .
  • the contact surface 11 is in contact with the top of the first heat dispensing unit 3 and two first connection holes 14 are defined through two ends of the base board 1 .
  • the second heat dispensing units 4 are fixed on a top of the base board 1 by extending bolts through passages 41 in the second heat dispensing units 4 and connected to the threaded holes 13 in the base board 1 .
  • the second heat dispensing units 4 are located corresponding to the holes 12 .
  • the two clamping members 2 connect the base board 1 to the first heat dispensing units 3 .
  • Each heat dispensing plate of the first heat dispensing unit 3 includes recesses 31 defined in two ends thereof and each clamping member 2 includes a horizontal part 21 , a connection part 22 extending from a side thereof and a hook part 23 which extends from a distal end of the connection part 22 .
  • the horizontal part 21 of each clamping member 2 has a second connection hole 24 so that when clamping the base board 1 to the first heat dispensing units 3 , the hook parts 23 are hooked to the recesses 31 of the heat dispensing plates and bolts extend through the second and first connection holes 24 , 14 to fix the clamping members 2 to the base board 1 .
  • the heat generated from the chips 5 is conducted to the heat dispensing plates of the first heat dispensing unit 3 and then brought out from the first dispensing unit 3 by the second heat dispensing units 4 via the holes 12 .
  • the second heat dispensing units 4 are fans.
  • FIGS. 3 and 4 which show the second embodiment of the heat sink 10 of the present invention, wherein the base board 1 does not have the holes 12 as shown in FIG. 1 and the second heat dispensing unit 4 is a water-cooling unit.
  • the third embodiment of the heat sink 10 of the present invention is disclosed wherein the second heat dispensing unit 4 is an aluminum extruding member which include the base board 1 on the underside of the aluminum extruding member.
  • the aluminum extruding member includes multiple fins extending therefrom so as to increase area that releases the heat.
  • FIGS. 6 and 7 show a fourth embodiment of the heat sink 10 of the present invention is disclosed wherein the base board 1 and the clamping members 2 are integrally formed as a one piece. Accordingly, the first and second connection holes as shown in the first embodiment can be omitted.
  • FIG. 8 show a fifth embodiment of the heat sink 10 of the present invention and the fifth embodiment is similar to the fourth embodiment, that is to say, the base board 1 and the clamping members 2 are integrally formed as a one piece.
  • the second heat dispensing unit 4 is the water-cooling unit and no holes are needed in the base board 1 .
  • FIG. 9 show a sixth embodiment of the heat sink 10 of the present invention, wherein the base board 1 and the clamping members 2 are integrally formed as a one piece, and the second heat dispensing unit 4 is the aluminum extruding member.
  • the base board 1 includes an opening 15 through which the fins of the aluminum extruding member extend.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

Description

    BACKGROUND OF THE INVENTION
  • (1) Field of the Invention
  • The present invention relates to a heat sink for removing heat from chips and the chips are connected with first heat dispensing units and the second dispensing units are connected to the first heat dispensing units by clamping members.
  • (2) Description of the Prior Art
  • The chips used in electronic devices such as computers generate a significant heat during high speed operation and the heat may damage the chips and slow down the speed that the CPU operates. A conventional way to remove heat from the chip is to provide two heat dispensing plates between which the chip is clamped, the heat generated from the chip is conducted to the heat dispensing plates and escapes to the air via the heat dispensing plates.
  • However, the latest chips generate much heat with higher temperature than those made by old technology so that the conventional heat dispensing plates cannot remove the heat efficiently. This is because the area that heat is transferred from the chip is insufficient and the conventional heat dispensing plates can only remove a certain amount of heat because of limited heat dispensing area. Extra heat removing units are needed and because the limited space available in the computers so that how to provide a high efficiency heat removing units is an important problem.
  • The present invention intends to provide a heat sink for chips and includes two heat dispensing units, one of the heat dispensing units clamps the chips and the other heat dispensing unit is connected on the first heat dispensing unit by using a base board and two clamping members. The heat from the chips that is conducted to the first heat dispensing unit is removed by from the first heat dispensing units via the second heat dispensing units.
    • SUMMARY OF THE INVENTION
  • The present invention relates to a heat sink which comprises a first heat dispensing unit composed of multiple heat dispensing plates between which the chips are clamped. A base board has a contact surface defined in an underside of the base board and the contact surface is in contact with a top of the first heat dispensing unit. A second heat dispensing unit is fixed on a top of the base board. Two clamping members connect the base board to the first heat dispensing unit.
  • The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view to show the chips and the heat sink of the present invention;
  • FIG. 2 is a perspective view to show the connection of the chips and the heat sink of the present invention;
  • FIG. 3 is an exploded view to show the chips and a second embodiment of the present invention;
  • FIG. 4 is a perspective view to show the connection of the chips and the heat sink in FIG. 3 of the present invention;
  • FIG. 5 is an exploded view to show the chips and a third embodiment of the heat sink of the present invention;
  • FIG. 6 is an exploded view to show the chips and a fourth embodiment of the heat sink of the present invention;
  • FIG. 7 is a perspective view to show the connection of the chips and the heat sink in FIG. 6 of the present invention;
  • FIG. 8 is an exploded view to show the chips and a fifth embodiment of the heat sink of the present invention, and
  • FIG. 9 is an exploded view to show the chips and a sixth embodiment of the heat sink of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Referring to FIGS. 1 and 2, the heat sink 10 for chips 5 of the present invention comprises multiple first heat dispensing units 3, a base board 1, two second heat dispensing units 4 and two clamping members 2. The first heat dispensing units 3 each include multiple heat dispensing plates between which the chips 5 are clamped. The base board 1 has a contact surface 11 defined in an underside of the base board 1 and the contact surface 11 is shaped to match with the top of the first heating dispensing units 3. Two holes 12 are defined through the base board 1 and a plurality of threaded holes 13 are located around the holes 12. The contact surface 11 is in contact with the top of the first heat dispensing unit 3 and two first connection holes 14 are defined through two ends of the base board 1. The second heat dispensing units 4 are fixed on a top of the base board 1 by extending bolts through passages 41 in the second heat dispensing units 4 and connected to the threaded holes 13 in the base board 1. The second heat dispensing units 4 are located corresponding to the holes 12. The two clamping members 2 connect the base board 1 to the first heat dispensing units 3.
  • Each heat dispensing plate of the first heat dispensing unit 3 includes recesses 31 defined in two ends thereof and each clamping member 2 includes a horizontal part 21, a connection part 22 extending from a side thereof and a hook part 23 which extends from a distal end of the connection part 22. The horizontal part 21 of each clamping member 2 has a second connection hole 24 so that when clamping the base board 1 to the first heat dispensing units 3, the hook parts 23 are hooked to the recesses 31 of the heat dispensing plates and bolts extend through the second and first connection holes 24, 14 to fix the clamping members 2 to the base board 1.
  • The heat generated from the chips 5 is conducted to the heat dispensing plates of the first heat dispensing unit 3 and then brought out from the first dispensing unit 3 by the second heat dispensing units 4 via the holes 12. In this embodiment, the second heat dispensing units 4 are fans.
  • As shown in FIGS. 3 and 4, which show the second embodiment of the heat sink 10 of the present invention, wherein the base board 1 does not have the holes 12 as shown in FIG. 1 and the second heat dispensing unit 4 is a water-cooling unit.
  • As shown in FIG. 5, the third embodiment of the heat sink 10 of the present invention is disclosed wherein the second heat dispensing unit 4 is an aluminum extruding member which include the base board 1 on the underside of the aluminum extruding member. The aluminum extruding member includes multiple fins extending therefrom so as to increase area that releases the heat.
  • FIGS. 6 and 7 show a fourth embodiment of the heat sink 10 of the present invention is disclosed wherein the base board 1 and the clamping members 2 are integrally formed as a one piece. Accordingly, the first and second connection holes as shown in the first embodiment can be omitted.
  • FIG. 8 show a fifth embodiment of the heat sink 10 of the present invention and the fifth embodiment is similar to the fourth embodiment, that is to say, the base board 1 and the clamping members 2 are integrally formed as a one piece. The second heat dispensing unit 4 is the water-cooling unit and no holes are needed in the base board 1.
  • FIG. 9 show a sixth embodiment of the heat sink 10 of the present invention, wherein the base board 1 and the clamping members 2 are integrally formed as a one piece, and the second heat dispensing unit 4 is the aluminum extruding member. The base board 1 includes an opening 15 through which the fins of the aluminum extruding member extend.
  • While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (9)

1. A heat sink comprising:
a first heat dispensing unit including multiple heat dispensing plates which are adapted to clamp chips therebetween;
a base board having a contact surface defined in an underside of the base board, the contact surface being in contact with a top of the first heat dispensing unit, a second heat dispensing unit fixed on a top of the base board, and
two clamping members connecting the base board to the first heat dispensing unit.
2. The heat sink as claimed in claim 1, wherein each heat dispensing plate of the first heat dispensing unit includes recesses defined in two ends thereof and the clamp members connect two ends of the base board and the recesses of the first heat dispensing unit.
3. The heat sink as claimed in claim 1, wherein the base board includes a hole defined therethrough and the second heat dispensing unit is located corresponding to the hole.
4. The heat sink as claimed in claim 1, the second heat dispensing unit is a fan.
6. The heat sink as claimed in claim 1, the second heat dispensing units is a water-cooling unit.
7. The heat sink as claimed in claim 1, the second heat dispensing unit is an aluminum extruding member.
8. The heat sink as claimed in claim 7, wherein the base board is integrally connected with the aluminum extruding member.
9. The heat sink as claimed in claim 7, wherein the base board is integrally connected with the clamping members which are connected on two ends of the base board, an opening is defined through the base board and the aluminum extruding member extends through the opening.
10. The heat sink as claimed in claim 1, wherein each clamping member includes a top part and a connection part extends from a side of the top part, a hook part extends from a distal end of the connection part, the top part is fixed to the baser board and the hook part is engaged with the recesses of the first heat dispensing unit.
US12/155,852 2008-05-21 2008-06-11 Heat sink for chips Abandoned US20090288802A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097208854 2008-05-21
TW097208854U TWM354784U (en) 2008-05-21 2008-05-21 Connecting platform structure for memory heat dissipation device

Publications (1)

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US20090288802A1 true US20090288802A1 (en) 2009-11-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090290308A1 (en) * 2008-05-23 2009-11-26 Comptake Technology Inc. Heat sink for chips

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10114433B2 (en) 2014-04-30 2018-10-30 Hewlett Packard Enterprise Development Lp Thermal management assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090290308A1 (en) * 2008-05-23 2009-11-26 Comptake Technology Inc. Heat sink for chips

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Publication number Publication date
TWM354784U (en) 2009-04-11

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Legal Events

Date Code Title Description
AS Assignment

Owner name: COMPTAKE TECHNOLOGY INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, WEI-HAU;YEN, STEVEN;REEL/FRAME:021123/0958

Effective date: 20080604

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION