JP3140605U - Column-shaped radiator with radiating fins - Google Patents
Column-shaped radiator with radiating fins Download PDFInfo
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- JP3140605U JP3140605U JP2008000251U JP2008000251U JP3140605U JP 3140605 U JP3140605 U JP 3140605U JP 2008000251 U JP2008000251 U JP 2008000251U JP 2008000251 U JP2008000251 U JP 2008000251U JP 3140605 U JP3140605 U JP 3140605U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
【課題】一種の放熱フィンを備えた柱形状放熱器を提供する。
【解決手段】一種の放熱フィン２を備えた柱形状放熱器であって、主にベース板１と複数の放熱フィンより構成する。ベース板の表面には複数の一体化して垂直方向に延ばし放熱柱１１を設け、それぞれの放熱フィンに放熱柱と緊密に締結する複数の孔を設け、複数の放熱フィンを順番にベース板の放熱柱に装入し、隣接するように緊密に締結する。該ベース板に備える放熱柱と放熱フィンの孔は合わせて、様々な形状を形成し、放熱柱の根元部又は先端部は面取り加工を施し、ベース板と放熱フィンにファンを取り付けるか又は熱パイプに結合して、放熱器の高速放熱効果の強化を図る。
【選択図】図１A column-shaped radiator having a kind of heat radiation fin is provided.
A columnar radiator having a kind of heat radiation fins 2 is mainly composed of a base plate 1 and a plurality of heat radiation fins. A plurality of integrated and vertically extending heat radiation columns 11 are provided on the surface of the base plate, and a plurality of holes are formed in each heat radiation fin to be tightly coupled to the heat radiation columns. Insert the column and fasten it so that it is adjacent. The base plate and the holes of the radiating columns and the radiating fins are combined to form various shapes, the base or tip of the radiating column is chamfered, and a fan is attached to the base plate and the radiating fins or a heat pipe To enhance the high-speed heat dissipation effect of the radiator.
[Selection] Figure 1
Description
本考案は、一種の放熱フィンを備えた柱形状放熱器に係り、特にベース板の表面に一体化して複数の放熱柱と放熱フィンを対応して成形された孔を緊密に締結するか又はファン、あるいは熱パイプに結合して、放熱器の放熱効率向上を図るものに関する。 The present invention relates to a pillar-shaped radiator having a kind of heat radiation fin, and in particular, it is integrated on the surface of a base plate and a hole formed by corresponding a plurality of heat radiation pillars and heat radiation fins is tightly fastened or a fan. Or, it relates to a device that is connected to a heat pipe to improve the heat dissipation efficiency of the radiator.
公知技術の放熱器は、主に複数の放熱フィンより構成された放熱フィンモジュールとベース板を組み合わせるか、又は高放熱効率需要に応じて、熱パイプに結合して構成するもので、放熱フィンやベース板ともアルミ又は銅金属を用いる。放熱フィンモジュールは複数の放熱フィンを隣接し間隔を置いて配列する。該ベース板により、電子部品などの熱源を複数の放熱フィンを通過させ、放熱機能を実現する。 A known radiator is a combination of a radiating fin module mainly composed of a plurality of radiating fins and a base plate, or coupled to a heat pipe according to demand for high radiating efficiency. Aluminum or copper metal is used for the base plate. The heat dissipating fin module has a plurality of heat dissipating fins arranged adjacent to each other at intervals. With the base plate, a heat source such as an electronic component is passed through a plurality of heat radiation fins to realize a heat radiation function.
公知の小型放熱器はベース板にて一体化成形により、複数の平行に配列された放熱フィンを設け、ベース板により電子部品などの熱源を複数の平行に配列した放熱フィンを通過させ、放熱の目的を実現する。しかしながら、この種の放熱器は放熱効率が低いため、必要な放熱効果が得られない。もう一種の熱パイプを備えた公知の放熱器は、放熱効果は良いものの、容積が大きいほか構造も複雑なため、コストが高い。よって、熱パイプ式放熱器を低放熱需要の電子部品などは、パワーが大きすぎて適切ではない。かえって勿体ないと不経済な投資になりかねない。このため、最適な放熱器の設計は実務上の放熱需要を満足すれば良い。過不足とも適切ではない。 A known small heatsink is provided with a plurality of parallelly arranged heat radiation fins by integral molding with a base plate, and a heat source such as an electronic component is passed through a plurality of parallel heatsink fins through the base plate to dissipate heat. Realize the purpose. However, since this type of radiator has low heat dissipation efficiency, the necessary heat dissipation effect cannot be obtained. A known radiator having another kind of heat pipe has a good heat dissipation effect, but is expensive due to its large volume and complicated structure. Therefore, the heat pipe type heat radiator and the electronic parts with low heat radiation demand are not suitable because the power is too large. On the contrary, it can be an uneconomic investment if it is unnecessarily. For this reason, the design of an optimal heatsink should just satisfy the heat dissipation demand in practice. Neither excess nor deficiency is appropriate.
主にベース板と複数の放熱フィンより構成し、ベース板の表面に一体化して複数の垂直方向に延ばし放熱柱を設け、それぞれの放熱フィンは放熱柱に対応して複数の孔を設け、ベース板の放熱柱と緊密に締結し、ベース板より誘導された電子部品などの熱源を素早く複数の放熱フィンを通過させ、放熱効果の向上を図る、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案の主な目的である。 It is mainly composed of a base plate and a plurality of radiating fins, integrated with the surface of the base plate and provided with a plurality of vertically extending radiating columns, each radiating fin having a plurality of holes corresponding to the radiating columns, A column-shaped heatsink with a kind of heat-dissipating fin that is fastened to the heat-dissipating column of the plate and quickly passes a plurality of heat-dissipating fins through a heat source such as an electronic component derived from the base plate to improve the heat dissipation effect. It is the main purpose of the present invention to provide.
該ベース板はそれぞれの放熱効果の要求に従い、放熱フィンの数を任意に増減でき、高い放熱効果が要求されるとき、放熱フィンの数を適宜に増やし、逆の場合、適宜に減少して、最適な放熱効果を正確に対応し、様々な放熱要求を満足でき、構造の簡素化及びコスト経済化の要求に合致する、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案の主な目的である。 The base plate can arbitrarily increase / decrease the number of radiating fins according to the requirements of each radiating effect, and when a high radiating effect is required, increase the number of radiating fins appropriately, and in the opposite case, decrease appropriately, The present invention is to provide a column-shaped heatsink with a kind of heat-dissipating fins that can accurately meet the optimum heat dissipation effect, satisfy various heat dissipation requirements, and meet the requirements of simplification of structure and cost economy. Is the main purpose.
該ベース板の放熱柱と放熱フィンの孔部は様々な形状を組み合わせて形成できる。たとえば、放熱柱と放熱フィンの孔部は矩形と矩形孔、円柱と円孔、十字柱と十字孔、六角柱と六角孔、細長い柱と細長い溝など様々な組み合わせ形態を形成できる、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案もう一つの目的である。 The heat radiation column of the base plate and the hole of the heat radiation fin can be formed by combining various shapes. For example, the holes of the radiating column and radiating fin are a kind of heat radiation that can form various combinations such as rectangle and rectangular hole, cylinder and circular hole, cross column and cross hole, hexagonal column and hexagonal hole, elongated column and elongated groove. It is another object of the present invention to provide a columnar radiator with fins.
該ベース板の放熱柱は高さがまちまちの柱体であっても良い。高さがまちまちの放熱柱により高低階層に分布し、大きさや形状の異なる放熱フィンを用いて緊密に締結する、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案の又一つの目的である。 The heat radiation column of the base plate may be a column body with various heights. Another object of the present invention is to provide a column-shaped radiator with a kind of radiation fin, which is distributed in high and low levels by heat radiation pillars of various heights and is tightly fastened using radiation fins of different sizes and shapes. For one purpose.
該ベース板の放熱柱は２階層又は多階層の柱体を用いて、放熱フィンもこれに合わせて改変し緊密に締結する、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案のさらに一つの目的である。 It is an object of the present invention to provide a column-shaped heat radiator having a kind of heat radiation fin, in which a heat radiation column of the base plate uses a two-layer or multi-layer pillar body, and the heat radiation fin is also modified and tightened closely. It is one more purpose of the device.
該ベース板はアルミ又は銅金属その他良好な熱伝導の金属部材のほか、ベース板表面の接触部に、より高い熱伝送係数の金属部材を嵌め込んで、複合金属のベース板を構成する、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案のさらに一つの目的である。 The base plate is composed of aluminum or copper metal or other metal member having good heat conduction, and a metal plate having a higher heat transfer coefficient is fitted into the contact portion on the surface of the base plate to constitute a composite metal base plate. It is a further object of the present invention to provide a columnar radiator having a plurality of heat radiation fins.
該複数の放熱フィン孔は、２階層に形成し、前後に隣接する放熱フィンを互いに締結して、より安定、かつ緊密な締結を図る、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案のさらに一つの目的である。 The plurality of radiating fin holes are formed in two layers, and provide a columnar radiator having a kind of radiating fins that fasten radiating fins adjacent to each other in the front and back to achieve more stable and tight fastening. This is a further object of the present invention.
各放熱柱の根元部又は先端部にＣ角、突き出しＲもしくは凹みＲなど様々な面取りを適宜に加工する。根元部の面取り加工により、電子部品などの熱源を根元部より素早く放熱柱と放熱フィンに搬送させ、高速放熱効果を実現する。一方、先端部の面取り加工は放熱フィンの緊密締結に便利を提供し、シャープな表面を避ける、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案のさらに一つの目的である。 Various chamfers such as a C angle, a protrusion R, or a recess R are appropriately processed at the base portion or the tip portion of each heat radiation column. By chamfering the base part, heat sources such as electronic parts are quickly transferred from the base part to the heat radiation pillars and heat radiation fins, realizing a high-speed heat radiation effect. On the other hand, it is another object of the present invention to provide a column-shaped heatsink with a kind of heatsink, which provides chamfering of the tip part for convenient fastening of the heatsink and avoids a sharp surface. .
ベース板と複数の放熱フィンの構成について、さらにベース板で選択された位置（側面又は中央部）に任意形態のファンを取り付ける。ファンより風を送り放熱器の放熱機能を加速化させる、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案のさらに一つの目的である。 Regarding the configuration of the base plate and the plurality of radiating fins, a fan having an arbitrary form is attached to a position (side surface or center portion) selected by the base plate. It is still another object of the present invention to provide a columnar heat radiator having a kind of heat radiation fins that sends air from a fan and accelerates the heat radiation function of the heat radiator.
該ベース板と複数の放熱フィンの構成について、さらに、ベース板に熱パイプを結合し、熱パイプ付きの放熱器にして、ベース板と熱パイプとの結合とは緊密締結方式を用いて、放熱器の放熱効果を向上させ、熱パイプの組立コストを軽減する、一種の放熱フィンを備えた柱形状放熱器を提供することを本考案のさらに一つの目的である。 Regarding the configuration of the base plate and the plurality of heat radiating fins, further, a heat pipe is coupled to the base plate to form a radiator with a heat pipe, and the coupling between the base plate and the heat pipe is radiated using a close fastening method. It is a further object of the present invention to provide a columnar radiator with a kind of radiation fin that improves the heat dissipation effect of the radiator and reduces the assembly cost of the heat pipe.
一種の放熱フィンを備えた柱形状放熱器であって、主にベース板と複数の放熱フィンより構成する。ベース板の表面に複数の一体化して垂直方向に延ばし放熱柱を設け、それぞれの放熱フィンに放熱柱と緊密に締結する複数の孔を設け、複数の放熱フィンを順番にベース板の放熱柱に装入し隣接するように緊密に締結する。該ベース板に備える放熱柱と放熱フィンの孔は合わせて様々な形状を形成し、放熱柱の根元部又は先端部は面取り加工を施し、ベース板と放熱フィンにファンを取り付けるか又は熱パイプに結合して、放熱器の高速放熱効果の強化を図る。 It is a column-shaped heat radiator provided with a kind of heat radiation fin, and is mainly composed of a base plate and a plurality of heat radiation fins. A plurality of integrated and vertically extending heat dissipating columns are provided on the surface of the base plate, each heat dissipating fin is provided with a plurality of holes for tightly fastening to the heat dissipating column, and the plurality of heat dissipating fins are sequentially used as the heat dissipating column of the base plate. Insert and fasten tightly so that they are adjacent. The holes of the radiating column and the radiating fin provided on the base plate are combined to form various shapes, and the base or tip of the radiating column is chamfered, and a fan is attached to the base plate and the radiating fin, or a heat pipe is attached. Combined to enhance the high-speed heat dissipation effect of the radiator.
図１、２に示す通り、本考案の放熱フィンを備えた柱形状放熱器は、主にベース板１と複数の放熱フィン２より構成する。そのうち、ベース板１は良い熱伝導金属ベース体（アルミ又は銅金属などにより、アルミ底部又は銅底部を形成する）を設け、特にベース板１の表面に一体化して垂直方向に延ばし放熱柱１１を設け、各放熱柱１１は規則又は不規則形状を隣接して配列する。本実施例において、放熱柱１１は矩形の規則状配列を用いる。 As shown in FIGS. 1 and 2, the columnar radiator having the heat dissipating fins of the present invention is mainly composed of a base plate 1 and a plurality of heat dissipating fins 2. Among them, the base plate 1 is provided with a good heat conductive metal base body (the aluminum bottom portion or the copper bottom portion is formed of aluminum or copper metal). In particular, the base plate 1 is integrated with the surface of the base plate 1 and extends in the vertical direction to form the heat radiation column 11. Each radiating column 11 is arranged adjacent to a regular or irregular shape. In this embodiment, the radiating column 11 uses a rectangular regular array.
複数の放熱フィン２、前記の放熱柱１１に対応して複数の孔２１を開け、孔２１は放熱柱１１に装入して、ベース板１と結合する。孔２１と放熱柱１１との緊密締結により、放熱フィン２の孔２１を順番にベース板１の放熱柱１１に装入して緊密に締結し、ベース板１と隣接して緊密の結合を形成する。 A plurality of holes 21 are formed corresponding to the plurality of radiating fins 2 and the radiating columns 11, and the holes 21 are inserted into the radiating columns 11 to be coupled to the base plate 1. By tightly fastening the holes 21 and the radiating columns 11, the holes 21 of the radiating fins 2 are sequentially inserted into the radiating columns 11 of the base plate 1 and tightened tightly to form a tight bond adjacent to the base plate 1. To do.
前記のベース板１と複数の放熱フィン２より構成された放熱器は、ベース板１の垂直方向に延ばし放熱柱１１を用いて各放熱フィン２の孔に対応して装入し結合するため、ベース板１が接触し誘導された電子部品などの熱源を複数の放熱フィン２を通過させ、素早い放熱を行い放熱効果の向上を図る。 The radiator composed of the base plate 1 and the plurality of radiating fins 2 extends in the vertical direction of the base plate 1 and is inserted into and coupled to the holes of the radiating fins 2 using the radiating columns 11. A heat source such as an electronic component brought into contact with the base plate 1 is passed through the plurality of heat dissipating fins 2 to quickly dissipate heat and improve the heat dissipating effect.
本考案の構成により、放熱柱１１と放熱フィンの孔２１との結合は、主に対応して緊密に組み合わせることで、放熱フィン２の孔２１を放熱柱１１の径より小さく設けることにより、放熱柱１１に装入して緊密に結合し、組み立て工程を簡素化させコスト軽減を実現できる。 With the configuration of the present invention, the coupling between the radiating column 11 and the hole 21 of the radiating fin is mainly performed in close correspondence, so that the hole 21 of the radiating fin 2 is provided smaller than the diameter of the radiating column 11, thereby radiating heat. It is possible to reduce the cost by inserting the pillar 11 and tightly coupling it to simplify the assembly process.
本考案のベース板１は各種電子部品などの放熱要求に従い、必要な放熱フィン２の数を任意に増減できるため、高い放熱要求のとき、放熱フィン２の数を増加し、逆の場合は減少して、様々な電子部品などの放熱要求を満足でき、構造の簡素化及びコスト経済化を両立し理想な放熱効果を提供する。 The base plate 1 of the present invention can arbitrarily increase or decrease the number of heat-dissipating fins 2 according to the heat-dissipation requirements of various electronic components, etc. As a result, it is possible to satisfy the heat dissipation requirements of various electronic components, etc., and to provide both the simplification of the structure and the cost economy while providing an ideal heat dissipation effect.
前記のベース板１に備える放熱柱１１と放熱フィン２の孔２１について、柱体又は孔の形状は特に制限されない。各種の対応形状を形成すれば良い。たとえば、図３又は図４に示す通り、十字柱形状の放熱柱１１ａと十字孔形状の孔２１ａを組み合わせて成形するか、放熱柱１１に装入してベース板１ａと放熱フィン２ａとの結合を完了する。 The shape of the column body or the hole is not particularly limited with respect to the heat radiation column 11 and the hole 21 of the heat radiation fin 2 provided in the base plate 1. Various corresponding shapes may be formed. For example, as shown in FIG. 3 or 4, the cross-shaped heat radiation column 11 a and the cross-hole 21 a are formed in combination, or the heat radiation column 11 is inserted into the base plate 1 a and the heat radiation fins 2 a. To complete.
同じく、図５乃至図９に示す通り、放熱柱１１ｂ〜１１ｆと放熱フィン２ｂ〜２ｆは、矩形の柱形状の放熱柱１１ｂと矩形孔形状の孔２１ｂ(図５)、又は円柱形状の放熱柱１１ｃと円孔形状の孔２１ｃ(図６)、あるいは六角柱形状の放熱柱１１ｄと六角孔形状の孔２１ｄ(図７)、もしくは三角柱形状の放熱柱１１ｅと三角孔形状の孔２１ｅ(図８)又は細長い形状の放熱柱１１ｆと細長い形状の孔２１ｆ(図９)など、様々な組み合わせ形態に仕上げることができる。ただし、前記した説明は一つの好ましい実施例にすぎない、これに限られないものとする。 Similarly, as shown in FIGS. 5 to 9, the heat radiation columns 11 b to 11 f and the heat radiation fins 2 b to 2 f include a rectangular column-shaped heat radiation column 11 b and a rectangular hole-shaped hole 21 b (FIG. 5), or a column-shaped heat radiation column. 11c and a circular hole 21c (FIG. 6), a hexagonal column-shaped heat radiation column 11d and a hexagonal hole-shaped hole 21d (FIG. 7), or a triangular column-shaped heat radiation column 11e and a triangular hole-shaped hole 21e (FIG. 8). ) Or an elongated heat radiation column 11f and an elongated hole 21f (FIG. 9). However, the above description is only one preferred embodiment and is not limited thereto.
図１０乃至１２に示す通り、前記の放熱柱１１(１１ａ〜１１ｆも同様)とベース板１との連なる根元部１２１又は１２２又は１２３をＣ各又は突き出しＲあるいは凹みＲなど様々な面取り加工形状を形成し、電子部品などの熱源をベース板１の連なる根元部１２１又は１２２又は１２３より、素早く放熱柱１１と放熱フィン２を通過させ放熱を加速化する。 As shown in FIGS. 10 to 12, various chamfered shapes such as C each or a protrusion R or a recess R are formed on the base 121, 122, or 123 connecting the heat radiation column 11 (same as 11 a to 11 f) and the base plate 1. The heat source such as an electronic component is quickly passed through the heat radiation column 11 and the heat radiation fin 2 from the base part 121, 122, or 123 connected to the base plate 1 to accelerate heat radiation.
図１及び図１３に示す通り、前記の複数の放熱フィン２(又は２ａ〜２ｆ)に設ける孔２１(又は２１ａ〜２１ｆ)は、孔２１の壁部に側枠２１１を形成する。よって、放熱フィン２を一つずつベース板１の放熱柱１１(又は１１ａ〜１１ｆ)に挿入するとき、側枠２１１と放熱柱１１により、さらに大きい接触面を形成して、素早く放熱にそなえる。 As shown in FIGS. 1 and 13, the holes 21 (or 21 a to 21 f) provided in the plurality of radiating fins 2 (or 2 a to 2 f) form a side frame 211 on the wall portion of the hole 21. Therefore, when the radiating fins 2 are inserted into the radiating columns 11 (or 11a to 11f) of the base plate 1 one by one, a larger contact surface is formed by the side frames 211 and the radiating columns 11 to quickly radiate heat.
図１４に示す通り、本考案のベース板はアルミ又は銅の単一金属部材を使用するか、又はベース板の底面接触部に良い電熱係数の金属塊１３を埋め込んで、複合金属部材のベース板１ｂを構成する。 As shown in FIG. 14, the base plate of the present invention uses a single metal member of aluminum or copper, or embeds a metal block 13 having a good electric heat coefficient in the bottom surface contact portion of the base plate to form a base plate of a composite metal member. 1b is constituted.
図１５に示す通り、前記のベース板１の放熱柱１１(１１ａ〜１１ｆ)は高さがまちまちの柱体を設け、高さがまちまちの放熱柱１１により、高低階層の配置を行い、大きさ、形状の異なる放熱フィン２を装入し緊密に締結する。 As shown in FIG. 15, the heat radiation pillars 11 (11 a to 11 f) of the base plate 1 are provided with pillar bodies having various heights, and the heat radiation pillars 11 having various heights are arranged in a high and low hierarchy. The heat radiation fins 2 having different shapes are inserted and tightened tightly.
さらに、本考案ベース板１の放熱柱１１(又は１１ａ〜１１ｆ)は、２階層又は多階層の柱体を用いることができる。図１６に示すものは、３階層柱体の放熱柱１１による実施形態である。ベース板１の放熱柱１１は第１層柱１１１、第２層柱１１２及び第３層柱１１３を同時に形成し、かつ放熱フィン２の孔２１の大きさもこれに対応して改変し、各放熱フィン２を数回に分けて各層の柱１１１、１１２及び１１３に装入して緊密締結させる。 Furthermore, the heat radiation column 11 (or 11a to 11f) of the base plate 1 of the present invention can be a two-layer or multi-layer column. What is shown in FIG. 16 is embodiment by the thermal radiation pillar 11 of a three-layered column. The heat radiation column 11 of the base plate 1 forms the first layer column 111, the second layer column 112, and the third layer column 113 at the same time, and the size of the hole 21 of the radiation fin 2 is modified correspondingly. The fin 2 is divided into several times and inserted into the pillars 111, 112, and 113 of each layer and tightened tightly.
図１７に示すものは、本考案もう一つの好ましい実施例である。別形態の放熱フィン２ｇを用いて、ベース板１の放熱柱１１(又は１１ａ〜１１ｆも同じ)に装入して緊密締結する。図示の複数の放熱フィン２ｇに開けられた孔２１ｇは２階層の孔形状に成形されているため、前後に隣接した放熱フィン２１ｇ同士を互いに噛み合わせて装入し緊密に締結して、より安定な結合を図る。同じく、前記の方法は２階層又は多階層の柱体に応用でき、２階層の放熱フィン同士を互いに締結した上、多階層の柱体に装入する。 FIG. 17 shows another preferred embodiment of the present invention. Using the heat radiation fin 2g of another form, it inserts in the heat radiation column 11 (or 11a-11f is the same) of the base board 1, and carries out the tight fastening. Since the holes 21g opened in the plurality of radiating fins 2g shown in the figure are formed in a two-layered hole shape, the radiating fins 21g adjacent to each other in the front and rear are engaged with each other, and are tightened and tightened more securely. To make a good bond. Similarly, the above-described method can be applied to a two-level or multi-level column body, and the two-level heat radiation fins are fastened to each other and then inserted into the multi-level column body.
図１８に示す通り、各放熱柱１１の先端部１１４はＣ角又は、突き出しＲあるいは凹みＲなど様々な面取り加工形状を形成して、放熱フィン２の緊密締結に便利し、とがった角を避ける。同じく、図１９〜２１に示す放熱柱１１ａ、１１ｃ、１１ｄ又は他の形状の放熱柱は、その先端部１１４ａ、１１４ｃ、１１４ｄにて面取り加工の設計であっても良い。 As shown in FIG. 18, the tip 114 of each radiating column 11 is formed with various chamfered shapes such as a C corner or a protrusion R or a dent R, which is convenient for tight fastening of the radiating fins 2 and avoids a sharp corner. . Similarly, the heat radiation columns 11a, 11c, 11d shown in FIGS. 19 to 21 or other shapes of heat radiation columns may be designed to be chamfered at the tip portions 114a, 114c, 114d.
本考案のベース板１と複数の放熱フィン２との配置及び組み合わせについて、ベース板１（ベース板の形状は制限しない）の選択された位置に任意形態のファンを取付ける。図２２及び図２３に示すものは、主にベース板１の側面にファンの取付け場所を残して、ファン３又は３ａの締結結合に備える。一方、ベース板１他の区域は複数の放熱柱１１を設けることにより、ファン３又は３ａより送風させ、放熱器の高速放熱を向上できる。 With regard to the arrangement and combination of the base plate 1 and the plurality of heat dissipating fins 2 of the present invention, a fan having an arbitrary form is attached to a selected position of the base plate 1 (the shape of the base plate is not limited). 22 and 23 are prepared for fastening connection of the fan 3 or 3a, mainly leaving a mounting position of the fan on the side surface of the base plate 1. On the other hand, the base plate 1 and other areas are provided with a plurality of heat dissipating columns 11 so that the fan 3 or 3a blows air, thereby improving the high-speed heat dissipation of the radiator.
同じく、図２４及び図２５に示すものは、ベース板１（ベース板の形状は制限しない）の中央部にファンの取付け場所を残しておき、ファン３ｂ又は３ｃを取付けて結合に備える。ベース板１の周辺区域に複数の放熱柱１１を成形することにより、ファン３ｂ又は３ｃより送風を行い、放熱柱の高速放熱を向上できる。 Similarly, in the case shown in FIGS. 24 and 25, a fan mounting location is left in the central portion of the base plate 1 (the shape of the base plate is not limited), and the fan 3b or 3c is mounted to prepare for the connection. By forming the plurality of heat radiation pillars 11 in the peripheral area of the base plate 1, air can be blown from the fan 3 b or 3 c to improve high-speed heat radiation of the heat radiation pillars.
本考案の設計主旨について、該ベース板１と複数の放熱フィン２の構成は必要に応じてファン３(又は３ａ、３ｂ)を追加できるほか、ベース板１の底面にて一つ又は以上の熱パイプ４(図２６〜２８の実施例を参照)に結合し、熱パイプ４付きの放熱器を構成する。該ベース板１は底部表面に一つ又は以上の取付溝１４(図２８)を設けて、熱パイプ４を装入して緊密に締結、もしくは熱パイプ４は半田付けにより、ベース板１の底面に取付け、熱パイプ４底面は扁平状で、ベース板１の底面と同一な平面を形成するため、そのまま電子部品などに接触させ、高効率の快速放熱効果を提供できる。このほか、ベース板１、放熱フィン２、ファン３(３ａ、３ｂ、３ｃ)及び熱パイプ４の組み合わせ配置は、前記した実施例に限られない。たとえば、図２６〜図２８に示すものは、熱パイプ４の彎曲部をベース板１に埋め込みなど、熱パイプ４についても、片方の管柱とベース板１と緊密な埋め込み結合も同じく実行可能である。しかし、これらの形態は公知技術に属するため、ここでの説明を省略する。 Regarding the design concept of the present invention, the base plate 1 and the plurality of heat dissipating fins 2 can be added with a fan 3 (or 3a, 3b) as needed, and one or more heats can be added to the bottom surface of the base plate 1. It couple | bonds with the pipe 4 (refer the Example of FIGS. 26-28), and the heat radiator with the heat pipe 4 is comprised. The base plate 1 is provided with one or more mounting grooves 14 (FIG. 28) on the bottom surface, and the heat pipe 4 is inserted and tightened tightly, or the heat pipe 4 is soldered, so that the bottom surface of the base plate 1 is provided. Since the bottom surface of the heat pipe 4 is flat and forms the same plane as the bottom surface of the base plate 1, it can be brought into contact with an electronic component as it is to provide a high-efficiency rapid heat dissipation effect. In addition, the combination arrangement of the base plate 1, the heat radiating fins 2, the fans 3 (3a, 3b, 3c) and the heat pipe 4 is not limited to the above-described embodiment. For example, in the case shown in FIGS. 26 to 28, the curved pipe portion of the heat pipe 4 is embedded in the base plate 1. For the heat pipe 4, close embedded coupling between one tube pillar and the base plate 1 can be similarly performed. is there. However, since these forms belong to a known technique, description thereof is omitted here.
前記の実施例は本考案の主な技術の説明を目的とし、本考案の技術範囲に何らの制限を加わるものではない。よって、これによる等効果の応用又は前記した技術による簡単な変更又は置き換えするものは、なお本考案の技術範囲に含まれるものとする。 The embodiments described above are for the purpose of explaining the main technology of the present invention, and do not limit the technical scope of the present invention. Therefore, the application of the equivalent effect by this or the simple change or replacement by the above-described technique is still included in the technical scope of the present invention.
１ ベース板
１ａ ベース板
１ｂ ベース板
２ 放熱フィン
２ａ 放熱フィン
２ｂ 放熱フィン
２ｃ 放熱フィン
２ｄ 放熱フィン
２ｅ 放熱フィン
２ｆ 放熱フィン
２ｇ 放熱フィン
１１ 放熱柱
１１ａ 放熱柱
１１ｂ 放熱柱
１１ｃ 放熱柱
１１ｄ 放熱柱
１１ｅ 放熱柱
１１ｆ 放熱柱
２１ 開口部
２１ａ 開口部
２１ｂ 開口部
２１ｃ 開口部
２１ｄ 開口部
２１ｅ 開口部
２１ｆ 開口部
２１ｇ 開口部
１２１ 連結根元部
１２２ 連結根元部
１２３ 連結根元部
２１１ 側枠
１３ 金属塊
１１１ 第１層柱
１１２ 第２層柱
１１３ 第３層柱
１１４ 先端部
１１４ａ 先端部
１１４ｃ 先端部
１１４ｄ 先端部
３ ファン
３ａ ファン
３ｂ ファン
３ｃ ファン
４ 熱パイプ
１４ 取付溝
1 Base plate 1a Base plate 1b Base plate
2 radiation fin 2a radiation fin 2b radiation fin 2c radiation fin 2d radiation fin 2e radiation fin 2f radiation fin 2g radiation fin 11 radiation column 11a radiation column 11b radiation column 11c radiation column 11d radiation column 11e radiation column 11f radiation column 21 opening 21a opening Part 21b opening part 21c opening part 21d opening part 21e opening part 21f opening part 21g opening part 121 connecting root part 122 connecting root part 123 connecting root part 211 side frame 13 metal lump 111 first layer pillar 112 second layer pillar 113 third Layer pillar 114 Tip 114a Tip 114c Tip 114d Tip 3 Fan 3a Fan 3b Fan 3c Fan 4 Heat pipe 14 Mounting groove
Claims (22)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096147379A TW200926945A (en) | 2007-12-12 | 2007-12-12 | Cylindrical heat dissipater equipped with cooling fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3140605U true JP3140605U (en) | 2008-04-03 |
Family
ID=39326888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008000251U Expired - Fee Related JP3140605U (en) | 2007-12-12 | 2008-01-21 | Column-shaped radiator with radiating fins |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20090151900A1 (en) |
| JP (1) | JP3140605U (en) |
| DE (1) | DE202008002041U1 (en) |
| TW (1) | TW200926945A (en) |
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2008
- 2008-01-21 JP JP2008000251U patent/JP3140605U/en not_active Expired - Fee Related
- 2008-01-22 US US12/018,187 patent/US20090151900A1/en not_active Abandoned
- 2008-02-14 DE DE202008002041U patent/DE202008002041U1/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011038702A (en) * | 2009-08-11 | 2011-02-24 | 崇賢 ▲黄▼ | Heat exhauster increasing heat exhaust efficiency |
| JP2014045136A (en) * | 2012-08-28 | 2014-03-13 | Mitsubishi Electric Corp | Junction material between heating element and heat radiator |
| JP2019192780A (en) * | 2018-04-25 | 2019-10-31 | かがつう株式会社 | Heat sink, electronic component package, and manufacturing method of the heat sink |
| JP7022426B2 (en) | 2018-04-25 | 2022-02-18 | かがつう株式会社 | How to manufacture heat sinks, electronic component packages and heat sinks |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200926945A (en) | 2009-06-16 |
| US20090151900A1 (en) | 2009-06-18 |
| TWI411383B (en) | 2013-10-01 |
| DE202008002041U1 (en) | 2008-04-24 |
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