US20090255658A1 - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
US20090255658A1
US20090255658A1 US12/101,076 US10107608A US2009255658A1 US 20090255658 A1 US20090255658 A1 US 20090255658A1 US 10107608 A US10107608 A US 10107608A US 2009255658 A1 US2009255658 A1 US 2009255658A1
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US
United States
Prior art keywords
cooling block
base
heat dissipation
hole
dissipation module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/101,076
Inventor
Ching-Hang Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to US12/101,076 priority Critical patent/US20090255658A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHEN, CHING-HANG
Publication of US20090255658A1 publication Critical patent/US20090255658A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention is related to a heat dissipation module and particularly to a heat dissipation module, which is capable of removing the heat effectively and lowering the cost greatly.
  • the computer As an example, the central processing unit (CPU) on the main board runs in company with the heat generation. The generated heat increases along with better performance of the CPU. In order to keep running normally for the computer, it is necessary to lower the temperature of the CPU.
  • the prior art to solve the problem of heat dissipation is to add more heat sinks for removing the generated heat outward.
  • the conventional heat sink is made of copper or aluminum.
  • the aluminum heat sink is lighter and cheaper than the copper heat sink but the heat transfer efficiency of the copper heat sink is better than the aluminum heat sink.
  • a heat sink shown in FIG. 7 provides a cooling base 10 a with a hollow aluminum cylindrical member 12 a and a solid copper cylindrical member 20 a .
  • a plurality of fins 14 a extends outward radially from the outer circumferential side of cooling base 10 a .
  • the solid copper cylindrical member 20 a fits with the hollow cylindrical member 12 a to form a complete structure of the heat sink.
  • the improved heat sink shown in FIG. 7 has combined the two different metals, aluminum and copper, to enhance the heat transfer efficiency, the cost and weight of the heat sink is unable to be lowered down significantly because of the solid copper cylindrical member 20 a.
  • an object of the present invention is to provide a heat dissipation module, which is capable of not only enhancing the heat transfer efficiency but also lower the cost and the weight thereof effectively.
  • a heat dissipation module comprises an aluminum cooling block and a copper base.
  • the cooling block has a plurality of fins extending outward radially from the periphery of the cooling block.
  • the base fits with the cooling block.
  • a central recess is disposed at the bottom of the cooling block with at least an elongated through hole piercing the cooling block from the recess to the top of the cooling block.
  • the base fits with the recess and has at least a support leg corresponding to the respective through hole to insert into the respective through hole.
  • the heat dissipation module is less in cost and weight and enables the heat source to transmit to the fins of the cooling block rapidly and effectively.
  • FIG. 1 is a perspective view of the first embodiment of a heat dissipation module according to the present invention
  • FIG. 2 is a disassembling perspective view of the heat dissipation module shown in FIG. 1 ;
  • FIG. 3 is a sectional view along line A-A shown in FIG. 1 ;
  • FIG. 4 is a perspective view of the second embodiment of a heat dissipation module according to the present invention.
  • FIG. 5 is a disassembling perspective view of the heat dissipation module shown in FIG. 4 ;
  • FIG. 6 is a perspective view illustrating an applicable example for the embodiments of the present invention.
  • FIG. 7 is a sectional view of the conventional heat dissipation.
  • the first embodiment of a heat dissipation module includes a rectangular cooling block 11 and a base 12 .
  • the cooling block 11 is made of aluminum and a plurality of fins 111 extend outward radially from the periphery of the cooling block 11 .
  • the bottom of the cooling block 11 has a central recess and at least an elongated through hole 112 pierces the cooling block 11 from the top to the bottom thereof. Further, the respective through hole 112 is parallel to the axial line of the cooling blocks 11 .
  • the through hole 112 has a rectangular-shaped periphery hole shown in FIGS. 1 and 2 and the respective rectangular through hole 112 is arranged to space apart from each other near the four sides of the cooling block 11 .
  • the base 12 which is made of copper, is employed to fit with the central recess of the cooling block 11 and provides a plurality of elongated upright support legs 121 corresponding to the through holes 112 . That is, the number of the support legs 121 is the same as the number of the through holes 121 . Further, the support legs 121 are arranged to have different lengths.
  • the base 12 fits with the cooling block 11 in such a way of the support legs 121 inserting into the through holes 112 and the base 12 fitting with the central recess at the bottom of the cooling block 11 such that the base 12 is joined to the cooling block 11 as shown in FIG. 3 to perform heat conduction.
  • the cooling block 21 is cylindrical and made of aluminum with a plurality of fins 211 extending outward radially from the circumferential side of the cooling block 11 .
  • the bottom of the cooling block 21 has a circular central recess and at least an elongated through hole 212 pierces the cooling block 21 from the top to the bottom thereof.
  • the respective through hole is parallel with the axial line of the cooling block 21 .
  • the respective through hole 212 has a circular periphery and is arranged in a way of spacing apart from each other near the circumferential side of the cooling block 11 .
  • the base 22 which is made of copper, is employed to fit with the central recess of the cooling block 21 and provides a plurality of elongated upright circular support legs 221 corresponding to the through holes 212 . That is, the number of the support legs 221 is the same as the number of the through holes 121 . Further, the support legs 221 are arranged to have different lengths.
  • the base 22 fits with the cooling block 21 in such a way of the support legs 221 inserting into the through holes 212 and the base 22 fitting with the central recess at the bottom of the cooling block 21 to enable the heat conduction between the cooling block 21 and the base 22 effectively.
  • the through holes ( 112 , 212 ) of the cooling block ( 11 , 21 ) can be provided with a triangular or polygon periphery and the support legs ( 121 , 221 ) can be provided with a triangular or polygon cross section respectively instead.
  • the cooling block 11 which has the fins 111 and the through holes 112 to join the base and the support legs (not shown), is attached to the main board 5 with the copper base (not shown) contacting with the CPU 51 on the main board 5 .
  • the heat generated by the running CPU 51 is transmitted to the fins 111 on the aluminum cooling block 11 via the support legs effectively and the heat is able to be dissipated with the large surface areas of the fins 111 rapidly.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation module comprises an aluminum cooling block and a copper base. The cooling block has a plurality of fins extending outward radially from the periphery of the cooling block. The base fits with the cooling block. A central recess is disposed at the bottom of the cooling block with at least an elongated through hole piercing the cooling block from the recess to the top of the cooling block. The base fits with the recess and has at least a support leg corresponding to the respective through hole to insert into the respective through hole. The heat dissipation module is less in cost and weight and enables the heat source to transmit to the fins of the cooling block rapidly and effectively.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention is related to a heat dissipation module and particularly to a heat dissipation module, which is capable of removing the heat effectively and lowering the cost greatly.
  • 2. Brief Description of the Related Art
  • It is known that various electronic devices have been developed with incessantly progress of technology. Taking the most popular electronic device, the computer, as an example, the central processing unit (CPU) on the main board runs in company with the heat generation. The generated heat increases along with better performance of the CPU. In order to keep running normally for the computer, it is necessary to lower the temperature of the CPU. Usually, the prior art to solve the problem of heat dissipation is to add more heat sinks for removing the generated heat outward. The conventional heat sink is made of copper or aluminum. The aluminum heat sink is lighter and cheaper than the copper heat sink but the heat transfer efficiency of the copper heat sink is better than the aluminum heat sink.
  • In order to overcome the preceding problems, a heat sink shown in FIG. 7 provides a cooling base 10 a with a hollow aluminum cylindrical member 12 a and a solid copper cylindrical member 20 a. A plurality of fins 14 a extends outward radially from the outer circumferential side of cooling base 10 a. The solid copper cylindrical member 20 a fits with the hollow cylindrical member 12 a to form a complete structure of the heat sink.
  • Although the improved heat sink shown in FIG. 7 has combined the two different metals, aluminum and copper, to enhance the heat transfer efficiency, the cost and weight of the heat sink is unable to be lowered down significantly because of the solid copper cylindrical member 20 a.
    • SUMMARY OF THE INVENTION
  • In order to overcome the deficiencies of the prior art, an object of the present invention is to provide a heat dissipation module, which is capable of not only enhancing the heat transfer efficiency but also lower the cost and the weight thereof effectively.
  • Accordingly, a heat dissipation module according to the present invention comprises an aluminum cooling block and a copper base. The cooling block has a plurality of fins extending outward radially from the periphery of the cooling block. The base fits with the cooling block. A central recess is disposed at the bottom of the cooling block with at least an elongated through hole piercing the cooling block from the recess to the top of the cooling block. The base fits with the recess and has at least a support leg corresponding to the respective through hole to insert into the respective through hole. The heat dissipation module is less in cost and weight and enables the heat source to transmit to the fins of the cooling block rapidly and effectively.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:
  • FIG. 1 is a perspective view of the first embodiment of a heat dissipation module according to the present invention;
  • FIG. 2 is a disassembling perspective view of the heat dissipation module shown in FIG. 1;
  • FIG. 3 is a sectional view along line A-A shown in FIG. 1;
  • FIG. 4 is a perspective view of the second embodiment of a heat dissipation module according to the present invention;
  • FIG. 5 is a disassembling perspective view of the heat dissipation module shown in FIG. 4;
  • FIG. 6 is a perspective view illustrating an applicable example for the embodiments of the present invention; and
  • FIG. 7 is a sectional view of the conventional heat dissipation.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1 and 2, the first embodiment of a heat dissipation module according to the present invention includes a rectangular cooling block 11 and a base 12. The cooling block 11 is made of aluminum and a plurality of fins 111 extend outward radially from the periphery of the cooling block 11. The bottom of the cooling block 11 has a central recess and at least an elongated through hole 112 pierces the cooling block 11 from the top to the bottom thereof. Further, the respective through hole 112 is parallel to the axial line of the cooling blocks 11. The through hole 112 has a rectangular-shaped periphery hole shown in FIGS. 1 and 2 and the respective rectangular through hole 112 is arranged to space apart from each other near the four sides of the cooling block 11.
  • The base 12, which is made of copper, is employed to fit with the central recess of the cooling block 11 and provides a plurality of elongated upright support legs 121 corresponding to the through holes 112. That is, the number of the support legs 121 is the same as the number of the through holes 121. Further, the support legs 121 are arranged to have different lengths.
  • The base 12 fits with the cooling block 11 in such a way of the support legs 121 inserting into the through holes 112 and the base 12 fitting with the central recess at the bottom of the cooling block 11 such that the base 12 is joined to the cooling block 11 as shown in FIG. 3 to perform heat conduction.
  • Referring to FIGS. 4 and 5, the second embodiment of the of a heat dissipation module according to the present invention is illustrated. The cooling block 21 is cylindrical and made of aluminum with a plurality of fins 211 extending outward radially from the circumferential side of the cooling block 11. The bottom of the cooling block 21 has a circular central recess and at least an elongated through hole 212 pierces the cooling block 21 from the top to the bottom thereof. Further, the respective through hole is parallel with the axial line of the cooling block 21. The respective through hole 212 has a circular periphery and is arranged in a way of spacing apart from each other near the circumferential side of the cooling block 11.
  • The base 22, which is made of copper, is employed to fit with the central recess of the cooling block 21 and provides a plurality of elongated upright circular support legs 221 corresponding to the through holes 212. That is, the number of the support legs 221 is the same as the number of the through holes 121. Further, the support legs 221 are arranged to have different lengths.
  • The base 22 fits with the cooling block 21 in such a way of the support legs 221 inserting into the through holes 212 and the base 22 fitting with the central recess at the bottom of the cooling block 21 to enable the heat conduction between the cooling block 21 and the base 22 effectively.
  • The through holes (112, 212) of the cooling block (11, 21) can be provided with a triangular or polygon periphery and the support legs (121, 221) can be provided with a triangular or polygon cross section respectively instead.
  • Referring to FIG. 6, when the heat dissipation module of the present invention is in use, the cooling block 11, which has the fins 111 and the through holes 112 to join the base and the support legs (not shown), is attached to the main board 5 with the copper base (not shown) contacting with the CPU 51 on the main board 5. In this way, the heat generated by the running CPU 51 is transmitted to the fins 111 on the aluminum cooling block 11 via the support legs effectively and the heat is able to be dissipated with the large surface areas of the fins 111 rapidly.
  • It is appreciated that the heat dissipation module according to the present invention has the following advantages:
      • (1) The aluminum cooling block is joined to the copper base to form a complete heat dissipation module instead of the conventional copper heat sink for greatly lowering down the production cost directly.
      • (2) The through holes provided in the cooling block are inserted with the support legs of the base such that the cooling block can be attached to the base firmly.
  • While the invention has been described with referencing to the preferred embodiments thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.

Claims (3)

1. A heat dissipation module comprising:
an aluminum cooling block with a plurality of fins extending outward radially from a periphery of said cooling block; and
a copper base fitting with said cooling block;
wherein, a central recess is disposed at the bottom of said cooling block to fit with said base, at least an elongated through hole pierces said cooling block from said recess to the top of said cooling block, at least a support leg extends outward from said base to correspond to the respective through hole such that said base is joined to said cooling block firmly in such a way of the respective support leg inserting into the respective through hole.
2. The heat dissipation module as defined in claim 1, wherein the respective through hole has a periphery with a shape of circle, triangle, rectangle or polygon and the respective support leg has a cross-section with a shape corresponding to said periphery.
3. The cooling fin as defined in claim 1, wherein the respective support leg is different from each in length.
US12/101,076 2008-04-10 2008-04-10 Heat dissipation module Abandoned US20090255658A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD787455S1 (en) * 2015-10-23 2017-05-23 Harman International Industries, Incorporated Loudspeaker heat sink
USD962879S1 (en) * 2020-04-09 2022-09-06 Acer Incorporated Heat-dissipation unit

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US5567986A (en) * 1993-06-04 1996-10-22 Diamond Electric Mfg. Co., Ltd. Heat sink
US5784255A (en) * 1995-12-04 1998-07-21 Integrated Device Technology, Inc. Device and method for convective cooling of an electronic component
US6209623B1 (en) * 1997-06-30 2001-04-03 Sun Microsystems, Inc. Post mounted heat sink method and apparatus
US20010037875A1 (en) * 1999-06-11 2001-11-08 Andrea L. Mays Stackable heat sink for electronic components
US6330908B1 (en) * 2000-03-15 2001-12-18 Foxconn Precision Components Co., Ltd. Heat sink
US20020033249A1 (en) * 2000-09-21 2002-03-21 Chia-Chin Chuang Heat dissipation apparatus
US6439299B1 (en) * 1999-11-16 2002-08-27 Matsushita Electric Industrial Co., Ltd. Heatsink apparatus
US20040108104A1 (en) * 2002-11-08 2004-06-10 Chin-Kuang Luo Axial heat-dissipating device
US20040118550A1 (en) * 2002-12-20 2004-06-24 James Turocy Heatsink with multiple, selectable fin densities
US7142422B2 (en) * 2003-08-13 2006-11-28 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20090151900A1 (en) * 2007-12-12 2009-06-18 Tsung-Hsien Huang Heat sink

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US5567986A (en) * 1993-06-04 1996-10-22 Diamond Electric Mfg. Co., Ltd. Heat sink
US5784255A (en) * 1995-12-04 1998-07-21 Integrated Device Technology, Inc. Device and method for convective cooling of an electronic component
US6209623B1 (en) * 1997-06-30 2001-04-03 Sun Microsystems, Inc. Post mounted heat sink method and apparatus
US20010037875A1 (en) * 1999-06-11 2001-11-08 Andrea L. Mays Stackable heat sink for electronic components
US6439299B1 (en) * 1999-11-16 2002-08-27 Matsushita Electric Industrial Co., Ltd. Heatsink apparatus
US6330908B1 (en) * 2000-03-15 2001-12-18 Foxconn Precision Components Co., Ltd. Heat sink
US20020033249A1 (en) * 2000-09-21 2002-03-21 Chia-Chin Chuang Heat dissipation apparatus
US20040108104A1 (en) * 2002-11-08 2004-06-10 Chin-Kuang Luo Axial heat-dissipating device
US20040118550A1 (en) * 2002-12-20 2004-06-24 James Turocy Heatsink with multiple, selectable fin densities
US7142422B2 (en) * 2003-08-13 2006-11-28 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20090151900A1 (en) * 2007-12-12 2009-06-18 Tsung-Hsien Huang Heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD787455S1 (en) * 2015-10-23 2017-05-23 Harman International Industries, Incorporated Loudspeaker heat sink
USD962879S1 (en) * 2020-04-09 2022-09-06 Acer Incorporated Heat-dissipation unit

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Legal Events

Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHEN, CHING-HANG;REEL/FRAME:020786/0281

Effective date: 20080410

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION