USD962879S1 - Heat-dissipation unit - Google Patents
Heat-dissipation unit Download PDFInfo
- Publication number
- USD962879S1 USD962879S1 US29/741,641 US202029741641F USD962879S US D962879 S1 USD962879 S1 US D962879S1 US 202029741641 F US202029741641 F US 202029741641F US D962879 S USD962879 S US D962879S
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- US
- United States
- Prior art keywords
- heat
- dissipation unit
- view
- design
- boundary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The ornamental design which is claimed is shown in the drawings as solid lines and surfaces having surface shading. The broken lines in FIG. 9 showing the additional fan module depict environmental structure only and form no part of the claim design. The broken lines consisting of a long dash and two short dashes depict reference to the enlargements shown in FIGS. 1 and 8 and form no part of the claim design. The broken line consisting of a long dash and one short dash defines the boundary of the claim design, which extends to the boundary but does not include the boundary. All other broken lines in the drawings form no part of the claimed design.
Claims (1)
- The ornamental design for a heat-dissipation unit, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109301879F TWD210771S (en) | 2020-04-09 | 2020-04-09 | Heat-dissipation fin |
TW109301879 | 2020-04-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD962879S1 true USD962879S1 (en) | 2022-09-06 |
Family
ID=83112699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/741,641 Active USD962879S1 (en) | 2020-04-09 | 2020-07-14 | Heat-dissipation unit |
Country Status (2)
Country | Link |
---|---|
US (1) | USD962879S1 (en) |
TW (1) | TWD210771S (en) |
Citations (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3239003A (en) * | 1962-11-30 | 1966-03-08 | Wakefield Engineering Co Inc | Heat transfer |
US4715438A (en) * | 1986-06-30 | 1987-12-29 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
US20020017378A1 (en) * | 2000-08-09 | 2002-02-14 | Hu Chin Yi | Heat ventilation device |
US20020018336A1 (en) * | 2000-08-08 | 2002-02-14 | Liang C. Y. | Heat sink apparatus |
US20020046826A1 (en) * | 2000-10-25 | 2002-04-25 | Chao-Chih Kao | CPU cooling structure |
US6479895B1 (en) * | 2001-05-18 | 2002-11-12 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
US6535385B2 (en) * | 2000-11-20 | 2003-03-18 | Intel Corporation | High performance heat sink configurations for use in high density packaging applications |
USD473529S1 (en) * | 2002-04-04 | 2003-04-22 | Designs For Vision, Inc. | Heat sink for a fiber optic light source |
US6557626B1 (en) * | 2000-01-11 | 2003-05-06 | Molex Incorporated | Heat sink retainer and Heat sink assembly using same |
US6705144B2 (en) * | 2001-09-10 | 2004-03-16 | Intel Corporation | Manufacturing process for a radial fin heat sink |
US6851467B1 (en) * | 1999-08-30 | 2005-02-08 | Molex Incorporated | Heat sink assembly |
US20060034058A1 (en) * | 2004-08-13 | 2006-02-16 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating device and method for manufacturing it |
US7120020B2 (en) * | 2001-09-10 | 2006-10-10 | Intel Corporation | Electronic assemblies with high capacity bent fin heat sinks |
US20070217159A1 (en) * | 2006-03-17 | 2007-09-20 | Foxconn Technology Co., Ltd. | Clip assembly for attaching a heat sink to an electronic device |
USD552564S1 (en) * | 2006-06-01 | 2007-10-09 | Fujikura Ltd. | Heat sink |
US7284596B2 (en) * | 2001-06-05 | 2007-10-23 | Heat Technology, Inc. | Heatsink assembly and method of manufacturing the same |
USD568829S1 (en) * | 2006-10-12 | 2008-05-13 | Nidec Corporation | Heat sink |
USD576964S1 (en) * | 2007-11-08 | 2008-09-16 | Abl Ip Holding, Llc | Heat sink |
US20090009999A1 (en) * | 2007-07-06 | 2009-01-08 | Bily Wang | LED lamp structure and system with high-efficiency heat-dissipating function |
US20090073656A1 (en) * | 2007-09-18 | 2009-03-19 | Nidec Corporation | Heat sink, heat sink fan, and method for manufacturing the same |
US20090147517A1 (en) * | 2007-12-07 | 2009-06-11 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led recessed lamp with screws fixing a recessed fixture thereof |
US20090147520A1 (en) * | 2007-12-07 | 2009-06-11 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with a heat sink |
US20090255658A1 (en) * | 2008-04-10 | 2009-10-15 | Asia Vital Components Co., Ltd. | Heat dissipation module |
US20090288806A1 (en) * | 2008-05-21 | 2009-11-26 | Asia Vital Components Co., Ltd. | Heat Radiating Unit |
USD608876S1 (en) * | 2009-03-21 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
USD622675S1 (en) * | 2009-07-21 | 2010-08-31 | Foxsemicon Integrated Technology, Inc. | Heat dissipation device |
USD634279S1 (en) * | 2009-12-08 | 2011-03-15 | Agency For Science, Technology And Research | Heat sink |
USD642732S1 (en) * | 2010-03-23 | 2011-08-02 | Cooper Technologies Company | Lighting fixture |
US8322897B2 (en) * | 2010-04-05 | 2012-12-04 | Cooper Technologies Company | Lighting assemblies having controlled directional heat transfer |
USD762181S1 (en) * | 2014-09-30 | 2016-07-26 | Aeonovalite Technologies, Inc. | High bay LED device |
US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
US10103081B2 (en) * | 2014-09-08 | 2018-10-16 | Ashwin Bharadwaj | Heat sink |
USD836571S1 (en) * | 2017-02-15 | 2018-12-25 | SAIJOINX Co., Ltd. | Heat sink |
USD838251S1 (en) * | 2017-02-15 | 2019-01-15 | SAIJOINX Co., Ltd. | Heat sink |
-
2020
- 2020-04-09 TW TW109301879F patent/TWD210771S/en unknown
- 2020-07-14 US US29/741,641 patent/USD962879S1/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3239003A (en) * | 1962-11-30 | 1966-03-08 | Wakefield Engineering Co Inc | Heat transfer |
US4715438A (en) * | 1986-06-30 | 1987-12-29 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
US6851467B1 (en) * | 1999-08-30 | 2005-02-08 | Molex Incorporated | Heat sink assembly |
US6557626B1 (en) * | 2000-01-11 | 2003-05-06 | Molex Incorporated | Heat sink retainer and Heat sink assembly using same |
US20020018336A1 (en) * | 2000-08-08 | 2002-02-14 | Liang C. Y. | Heat sink apparatus |
US20020017378A1 (en) * | 2000-08-09 | 2002-02-14 | Hu Chin Yi | Heat ventilation device |
US20020046826A1 (en) * | 2000-10-25 | 2002-04-25 | Chao-Chih Kao | CPU cooling structure |
US6535385B2 (en) * | 2000-11-20 | 2003-03-18 | Intel Corporation | High performance heat sink configurations for use in high density packaging applications |
US6479895B1 (en) * | 2001-05-18 | 2002-11-12 | Intel Corporation | High performance air cooled heat sinks used in high density packaging applications |
US7284596B2 (en) * | 2001-06-05 | 2007-10-23 | Heat Technology, Inc. | Heatsink assembly and method of manufacturing the same |
US6705144B2 (en) * | 2001-09-10 | 2004-03-16 | Intel Corporation | Manufacturing process for a radial fin heat sink |
US7120020B2 (en) * | 2001-09-10 | 2006-10-10 | Intel Corporation | Electronic assemblies with high capacity bent fin heat sinks |
USD473529S1 (en) * | 2002-04-04 | 2003-04-22 | Designs For Vision, Inc. | Heat sink for a fiber optic light source |
US20060034058A1 (en) * | 2004-08-13 | 2006-02-16 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating device and method for manufacturing it |
US20070217159A1 (en) * | 2006-03-17 | 2007-09-20 | Foxconn Technology Co., Ltd. | Clip assembly for attaching a heat sink to an electronic device |
USD552564S1 (en) * | 2006-06-01 | 2007-10-09 | Fujikura Ltd. | Heat sink |
USD568829S1 (en) * | 2006-10-12 | 2008-05-13 | Nidec Corporation | Heat sink |
US20090009999A1 (en) * | 2007-07-06 | 2009-01-08 | Bily Wang | LED lamp structure and system with high-efficiency heat-dissipating function |
US20090073656A1 (en) * | 2007-09-18 | 2009-03-19 | Nidec Corporation | Heat sink, heat sink fan, and method for manufacturing the same |
USD576964S1 (en) * | 2007-11-08 | 2008-09-16 | Abl Ip Holding, Llc | Heat sink |
US20090147517A1 (en) * | 2007-12-07 | 2009-06-11 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led recessed lamp with screws fixing a recessed fixture thereof |
US20090147520A1 (en) * | 2007-12-07 | 2009-06-11 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with a heat sink |
US20090255658A1 (en) * | 2008-04-10 | 2009-10-15 | Asia Vital Components Co., Ltd. | Heat dissipation module |
US20090288806A1 (en) * | 2008-05-21 | 2009-11-26 | Asia Vital Components Co., Ltd. | Heat Radiating Unit |
USD608876S1 (en) * | 2009-03-21 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Heat dissipation apparatus |
USD622675S1 (en) * | 2009-07-21 | 2010-08-31 | Foxsemicon Integrated Technology, Inc. | Heat dissipation device |
USD634279S1 (en) * | 2009-12-08 | 2011-03-15 | Agency For Science, Technology And Research | Heat sink |
USD657490S1 (en) * | 2010-03-23 | 2012-04-10 | Cooper Technologies Company | Lighting fixture |
USD642732S1 (en) * | 2010-03-23 | 2011-08-02 | Cooper Technologies Company | Lighting fixture |
USD657492S1 (en) * | 2010-03-23 | 2012-04-10 | Cooper Technologies Company | Lighting fixture |
USD657908S1 (en) * | 2010-03-23 | 2012-04-17 | Cooper Technologies Company | Lighting fixture |
USD664291S1 (en) * | 2010-03-23 | 2012-07-24 | Cooper Technologies Company | Lighting fixture |
US10103089B2 (en) * | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
US8322897B2 (en) * | 2010-04-05 | 2012-12-04 | Cooper Technologies Company | Lighting assemblies having controlled directional heat transfer |
US10103081B2 (en) * | 2014-09-08 | 2018-10-16 | Ashwin Bharadwaj | Heat sink |
USD762181S1 (en) * | 2014-09-30 | 2016-07-26 | Aeonovalite Technologies, Inc. | High bay LED device |
USD836571S1 (en) * | 2017-02-15 | 2018-12-25 | SAIJOINX Co., Ltd. | Heat sink |
USD838251S1 (en) * | 2017-02-15 | 2019-01-15 | SAIJOINX Co., Ltd. | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
TWD210771S (en) | 2021-04-01 |
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Legal Events
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---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |