CN201038191Y - Semiconductor refrigeration chip radiating device - Google Patents
Semiconductor refrigeration chip radiating device Download PDFInfo
- Publication number
- CN201038191Y CN201038191Y CN 200720108699 CN200720108699U CN201038191Y CN 201038191 Y CN201038191 Y CN 201038191Y CN 200720108699 CN200720108699 CN 200720108699 CN 200720108699 U CN200720108699 U CN 200720108699U CN 201038191 Y CN201038191 Y CN 201038191Y
- Authority
- CN
- China
- Prior art keywords
- liquid storage
- heat
- pipe
- semiconductor chilling
- chilling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor refrigeration slice heat dissipation device, which comprises an evaporation bracket made of heat pipes and a heat dissipation piece connected together and pertains to the refrigeration heat dissipation device technical field. The characteristic lies in that the heat inlet pipe and the heat outlet pipe are connected through a liquid storage pipe and a semiconductor refrigeration slice. The outer surface of the core chamber end of the liquid storage pipe is jointed with the heat end of the semiconductor refrigeration slice. The opening end of the liquid storage pipe, sealed by a cover board, is connected with the heat pipes through a through hole arranged on the cover board and is communicated with the liquid storage core chamber. The utility model has novel design, simple and reasonable structure, convenient processing, low cost and a small welding area. Thickness of joined wall of the semiconductor refrigeration slice heat end is thin and even; the interface between the liquid storage core chamber and the semiconductor refrigeration slice heat end is large. Thus quality problems caused by leaking are reduced; heat exchange efficiency between the semiconductor refrigeration slice and the refrigeration working fluid is improved, quality stability is increased, and use & maintenance cost is cut down.
Description
Technical field
The utility model belongs to refrigeration radiating device technique field, is specifically related to a kind of semiconductor chilling plate heat abstractor that is applicable to electronic refrigerator.
Background technology
Semiconductor refrigerating technology is applied to electronic refrigerator, generally join in its heat abstractor by liquid storage cylinder and semiconductor chilling plate hot junction, liquid storage cylinder is is normally connected and composed by two column chambers that interconnect, the outside of liquid storage cylinder is provided with the heat conduction outer wall, the corresponding heat conduction outer wall one side of the cylinder of column chamber fits with the semiconductor chilling plate hot junction, another opposite face and an installation base plate join, and the turnover heat pipe of evaporation jig is connected with two chambers after passing installation base plate respectively.Such construction for heat radiating device complexity, difficulty of processing is big, production cost is high, the position that need connect is many, bonding area is big, cause quality problems, maintenance cost height such as leakage easily, applying pipe thickness in semiconductor chilling plate hot junction is irregular, chamber is also relative with the contact area in semiconductor chilling plate hot junction less, can influence the radiating effect of semiconductor chilling plate, increase use cost, reduce refrigeration performance.
The utility model content
The utility model aims to provide a kind of simple and reasonable, easy to process, semiconductor chilling plate heat abstractor that heat exchanger effectiveness is high, to overcome problems of the prior art.
Described semiconductor chilling plate heat abstractor, comprise the evaporation jig that connects and composes by heat pipe and heat sink, it is characterized in that passing in and out between the heat pipe and be connected with the hot junction of semiconductor chilling plate by liquid storage pipe, in the liquid storage pipe fit in liquid storage core chamber end envelope outer surface and semiconductor chilling plate hot junction, the liquid storage pipe openend is cooperated by cover plate for sealing, be connected with the turnover heat pipe by the through hole that is provided with on the cover plate, and be communicated with the liquid storage core chamber.
Described semiconductor chilling plate heat abstractor is characterized in that being provided with on the cover plate liquid injection hole.
Described semiconductor chilling plate heat abstractor is characterized in that the liquid storage pipe openend is connected with the weldering of cover plate aluminium.
Described semiconductor chilling plate heat abstractor is characterized in that the turnover heat pipe of evaporation jig is connected with the weldering of cover plate aluminium.
Described semiconductor chilling plate heat abstractor, it is characterized in that with semiconductor chilling plate hot junction applying pipe thickness be 3-4mm.
Described semiconductor chilling plate heat abstractor is characterized in that the one extension of liquid storage pipe both sides is provided for installing the convex shoulder of cold scattering piece.
Novel, simple and reasonable, easy to process, the low cost of manufacture of above-mentioned semiconductor chilling plate heat abstractor, the bonding area that relates in the heat abstractor is little, applying pipe thickness in semiconductor chilling plate hot junction is thin and even, the contact-making surface in liquid storage core chamber and semiconductor chilling plate hot junction is big, can reduce to leak and wait the quality problems that cause, improve the heat exchange validity of semiconductor chilling plate hot junction and refrigeration working medium, the stability of improving the quality of products reduces use, maintenance cost.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the backsight structural representation of Fig. 1;
The syndeton schematic diagram of Fig. 3 liquid storage pipe.
Embodiment
Below in conjunction with Figure of description the utility model is further specified:
The evaporation jig 1 of semiconductor chilling plate heat abstractor is connected and composed by heat pipe and heat sink, heat pipe is made of the Bandaid pipe, heat sink can adopt fin or heat radiation iron wire to make, arrangement is connected on the heat pipe to increase area of dissipation, to promote radiating effect, heat sink is connected with the hot junction of semiconductor chilling plate 6 by liquid storage pipe 2 between the turnover heat pipe of evaporation jig 1 for the heat radiation iron wire in the present embodiment; Liquid storage core chamber 9 is the bigger short cylindrical chamber of diameter in the liquid storage pipe 2, fit in liquid storage core chamber 9 ends envelope outer surface and semiconductor chilling plate 6 hot junctions, distance between liquid storage core chamber 9, joint place and semiconductor chilling plate 6 hot junctions is even, thickness is 3-4mm, make that the tube wall of fitting between liquid storage core chamber 9 and semiconductor chilling plate 6 hot junctions is smooth and area is big, wall thin, can effectively improve radiating effect.Liquid storage pipe 2 openends are sealed and matched by cover plate 4, cover plate 4 is connected liquid storage pipe 2 openends by the aluminium weldering, through hole 8, through hole 8a that cover plate 4 upper edge radial symmetric settings are communicated with liquid storage core chamber 9, distance between two holes is amplified as far as possible, to promote the adequacy of heat exchange, through hole 8,8a are connected with the turnover heat pipe aluminium weldering of evaporation jig 1.The heat pipe of evaporation jig 1, symmetrically arranged through hole 8,8a and liquid storage core chamber 9 constitute the circulation canal of refrigeration working medium.Liquid injection hole 3 is set on the cover plate 4 is connected, use for fluid injection with liquid injection pipe.Liquid storage pipe 2 both sides one are extended convex shoulder 7, the 7a that is provided for installing cold scattering piece, and the cold scattering piece 5 that amplexiforms at semiconductor chilling plate 6 cold junctions is screwed on convex shoulder 7,7a.
Claims (6)
1. semiconductor chilling plate heat abstractor, comprise the evaporation jig (1) that connects and composes by heat pipe and heat sink, it is characterized in that passing in and out between the heat pipe and be connected with the hot junction of semiconductor chilling plate (6) by liquid storage pipe (2), in the liquid storage pipe (2) fit in liquid storage core chamber (9) end envelope outer surface and semiconductor chilling plate (6) hot junction, liquid storage pipe (2) openend is sealed and matched by cover plate (4), the through hole that go up to be provided with by cover plate (4) (8,8a) with pass in and out heat pipe and be connected, and be communicated with liquid storage core chamber (9).
2. semiconductor chilling plate heat abstractor as claimed in claim 1 is characterized in that being provided with on the cover plate (4) liquid injection hole (3).
3. semiconductor chilling plate heat abstractor as claimed in claim 1 is characterized in that liquid storage pipe (2) openend is connected with the weldering of cover plate (4) aluminium.
4. semiconductor chilling plate heat abstractor as claimed in claim 1 is characterized in that the turnover heat pipe of evaporation jig (1) is connected with the weldering of cover plate (4) aluminium.
5. semiconductor chilling plate heat abstractor as claimed in claim 1 is characterized in that and semiconductor chilling plate (6) hot junction applying pipe thickness is 3-4mm.
6. semiconductor chilling plate heat abstractor as claimed in claim 1 is characterized in that liquid storage pipe (2) both sides one extends the convex shoulder that is provided for installing cold scattering piece (7,7a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720108699 CN201038191Y (en) | 2007-04-30 | 2007-04-30 | Semiconductor refrigeration chip radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720108699 CN201038191Y (en) | 2007-04-30 | 2007-04-30 | Semiconductor refrigeration chip radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201038191Y true CN201038191Y (en) | 2008-03-19 |
Family
ID=39210711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720108699 Expired - Fee Related CN201038191Y (en) | 2007-04-30 | 2007-04-30 | Semiconductor refrigeration chip radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201038191Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790022A (en) * | 2012-07-05 | 2012-11-21 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| CN105716454A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Assembling method of heat pipe radiation type heat exchange device |
| CN109491419A (en) * | 2018-09-25 | 2019-03-19 | 芜湖优能自动化设备有限公司 | A kind of pressure valve pressure regulation temperature control device |
-
2007
- 2007-04-30 CN CN 200720108699 patent/CN201038191Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790022A (en) * | 2012-07-05 | 2012-11-21 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| CN102790022B (en) * | 2012-07-05 | 2015-04-08 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| CN105716454A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Assembling method of heat pipe radiation type heat exchange device |
| CN105716454B (en) * | 2014-12-01 | 2019-05-31 | 青岛海尔特种电冰柜有限公司 | The assemble method of heat pipe heat radiation type heat-exchange device |
| CN109491419A (en) * | 2018-09-25 | 2019-03-19 | 芜湖优能自动化设备有限公司 | A kind of pressure valve pressure regulation temperature control device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080319 Termination date: 20150430 |
|
| EXPY | Termination of patent right or utility model |