CN102790022B - Radiator for semi-conductor refrigeration - Google Patents
Radiator for semi-conductor refrigeration Download PDFInfo
- Publication number
- CN102790022B CN102790022B CN201210231936.6A CN201210231936A CN102790022B CN 102790022 B CN102790022 B CN 102790022B CN 201210231936 A CN201210231936 A CN 201210231936A CN 102790022 B CN102790022 B CN 102790022B
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- China
- Prior art keywords
- evaporation
- lug boss
- evaporation cavity
- radiator
- heat
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000005057 refrigeration Methods 0.000 title abstract 2
- 238000001704 evaporation Methods 0.000 claims abstract description 102
- 230000008020 evaporation Effects 0.000 claims abstract description 99
- 239000006096 absorbing agent Substances 0.000 claims description 49
- 239000007788 liquid Substances 0.000 claims description 35
- 238000009434 installation Methods 0.000 claims description 30
- 239000003507 refrigerant Substances 0.000 claims description 24
- 238000010992 reflux Methods 0.000 claims description 12
- 230000002787 reinforcement Effects 0.000 claims description 2
- 238000001035 drying Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000009833 condensation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000010412 perfusion Effects 0.000 description 3
- 230000005494 condensation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 125000004122 cyclic group Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- -1 during work Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a radiator for semi-conductor refrigeration. The radiator comprises a heat absorbing body, an evaporation tube, a condenser pipe, a wire net and a return pipe. The heat absorbing body has two installing lateral supporting arms and a front protruding portion. A front evaporation cavity is arranged in the front protruding portion provided with an installing plane which extends forwards in protruding mode and is opposite to the two installing lateral supporting arms. The heat absorbing body is further provided with a rear protruding portion opposite to the front protruding portion, and a rear wall of the rear protruding portion extends backwards and opposite to the two installing lateral supporting arms in protruding mode. A rear evaporation cavity communicated with the inside of the front evaporation cavity is arranged in the rear protruding portion and forms an evaporation cavity together with the front evaporation cavity. The rear protruding portion is provided with an evaporation outlet communicated with the inside an evaporation tube and a backflow port communicated with the inside of a backflow tube. Compare with the prior art, the volume of the evaporation cavity is increased, a drying phenomenon caused by few working medium is avoided, inner surface area is increased, heat transmission capacity is increased, and radiating performance of a heat pipe radiator is improved.
Description
Technical field
The present invention relates to heat dissipation technology, particularly relate to a kind of radiator for semiconductor refrigerating.
Background technology
Radiator at present for semiconductor refrigerating is roughly divided into two classes: a class is that fin type radiator adds the heat exchange of fan pressure mode; The another kind of heat pipe heat radiation mode utilizing Working fluid phase changing to conduct heat.The first kind is widely used in the hot-side heat dissipation of semiconductor refrigerating because of features such as structure are simple, with low cost.Equations of The Second Kind heat spreader structures is complicated, cost is high but owing to adopting phase-change heat transfer, heat transfer resistance is far below first kind radiator, heat dissipation capacity is higher than fin type radiator, noiseless, the heat transfer free convection of heat and air can be realized without the need to fan, mechanical noise, failure rate is low, applies more in the high-end product of semiconductor refrigerating.This type of Natural Heat Convection heat-pipe radiator, adopt thermal source absorber and net formula pipe silk in conjunction with heat exchange mode, evaporation cavity containing hollow in absorber, during work, absorber absorbs the heat of thermal source, make the liquid refrigerant heat absorption evaporation in evaporation cavity, exported by the evaporation communicated with evaporation cavity inside in absorber, heat transmission is carried out along evaporation pipeline, in condenser pipe part by being welded on silk screen on pipeline and cross-ventilation heat exchange, in pipe, gaseous working medium heat exchange is condensed into liquid state, utilize self gravitation along condenser pipe tube wall, return duct, refluxing opening comes back to the evaporation cavity in absorber, complete and once circulate, do not stop this cyclic process of repetition, by conduction to the exchange heat on absorber, dissipate, realize heat sinking function.
At present for the radiator absorber of semiconductor refrigerating with the side of mounting plane 100(left installation side support arm 101 and right installation side support arm 102) for benchmark, basic employing one side bulge-structure (as shown in Figure 1), for preventing hot short circuit, bossing 200 cross section of laminated semiconductor chip part is close to equal with semiconductor chip size, take into account mounting structure and reliability, the radial a size of absorber is usually at 2cm ~ 4cm, by the evaporation tube 120 be communicated with evaporation cavity in absorber 110, condenser pipe 130, return duct 140 and the silk screen 150 be welded on condenser pipe complete conduction and the exchange of heat.Because absorber adopts the composite factor such as one side bulge-structure and aforesaid installation, reliability, absorber is all restricted in horizontal b, radial a direction, absorber need ensure that its certain wall thickness is to bear the pressure that in evaporation cavity, liquid refrigerant produces when maximum temperature is evaporated simultaneously, thus cause evaporation cavity 110 volume actual in absorber very limited, consider adopting heat pipes for heat transfer performance, liquid storage amount in evaporation cavity is limited, proposes requirements at the higher level on the one hand in actual heat pipe makes to the perfusion precision of the liquid refrigerant amount being filled into heat pipe.On the other hand, when in radiator absorber evaporation cavity, liquid refrigerant evaporation capacity is greater than condensing reflux amount, larger for radiator area, evaporation, condenser pipe is longer, when the liquid refrigerant of a large amount of condensation remains in condenser pipe internal face, will there will be in evaporation cavity without the situation that liquid refrigerant evaporates, namely " dry up " phenomenon, cause absorber endothermic heat to reduce, thermal resistance increases, and heat radiation is unstable.Name is called the heat pipe modified node method of semi-conductor electronic refrigerator, Authorization Notice No. is the utility model patent of CN201255534Y, in order to the liquid working substance in supplementary evaporation cavity, the liquid storage bend pipe of an approximate U shape is connected at refluxing opening 170 place, the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening, utilize liquid storage bend pipe tube chamber storing liquid working medium, as the buffering of working medium in evaporation cavity, design return duct is lower than absorber minimum point, this scheme alleviates evaporation cavity " drying up " to a certain extent, but because liquid storage bend pipe is lower than absorber 1, under same area of dissipation condition, the efficiently radiates heat area proportion of radiator is reduced.In addition, because absorber adopts one side bulge-structure, and the actual mounting structure restriction using heat-pipe radiator, evaporation outlet 160 can only be arranged on the back side of bossing 200, and when causing heat pipe to work equally, working medium evaporation resistance increases.How to guarantee that high-power silk screen type heat-pipe radiator is in varying environment temperature (different rings temperature, in heat-pipe radiator, liquid refrigerant is different at the tension force of pipeline inner wall, the speed being back to evaporation cavity is all different from the time) under higher heat-transfer capability and stable heat dispersion, be current problem demanding prompt solution.
Summary of the invention
The invention provides a kind of radiator for semiconductor refrigerating, for overcoming defect of the prior art, realize high-power silk screen type heat-pipe radiator heat-transfer capability higher at different ambient temperatures and stable heat dispersion, effectively alleviate " drying up " phenomenon of evaporation cavity.
Radiator for semiconductor refrigerating provided by the invention, this radiator comprises absorber, evaporation tube, condenser pipe, silk screen and return duct, absorber have two installation side support arms and between these two installation side support arms before lug boss, the front evaporator chamber of hollow is provided with in this front lug boss, front lug boss has one for the mounting plane of laminated semiconductor refrigerating chip, described installation side support arm is equipped with the installation through hole for mechanical engagement semiconductor chip, this absorber also has a rear lug boss be oppositely arranged with described front lug boss, the relatively described two installation side support arms of rear wall of described rear lug boss protrude out backward, the rear evaporation cavity of hollow is provided with in rear lug boss, this rear evaporation cavity forms evaporation cavity jointly with front evaporator chamber inner connection, described rear lug boss is provided with and is communicated with the evaporation of evaporating for liquid refrigerant in evaporation cavity with evaporation tube inside and exports, be communicated with return duct is inner the refluxing opening being back to evaporation cavity for liquid condensed working medium.
Radiator for semiconductor refrigerating provided by the invention, the heat that the mounting plane laminated semiconductor chip of front lug boss produces to absorb semiconductor chip can be made during installation, by the through hole on two installation side support arms, absorber is fixed on a semiconductor die, rear lug boss convex stretches in the outside of semiconductor chip, not by the restriction of semiconductor chip installing space, by establishing the rear evaporation cavity that is communicated with front evaporator chamber thus greatly increase the volume of evaporation cavity in rear lug boss, and then the reserves of liquid refrigerant in increase evaporation cavity, working medium in evaporation cavity is by liquid refrigerant evaporation capacity, the influence of fluctuations of condensing reflux amount is relatively little, larger to area of dissipation, when the longer heat-pipe radiator of condenser pipe solves heat-pipe radiator work, because of " drying up " phenomenon that working medium amount causes less, because evaporation cavity volume increases, then inner surface volume increases.Absorber completes the transmission of heat to liquid refrigerant by evaporation cavity inwall, increases with working medium contact area, liquid refrigerant evaporation capacity is increased after absorbing heat, and heat output improves, and improves the heat dispersion of heat-pipe radiator; Increase owing to storing liquid refrigerant total amount in evaporation cavity, under ensureing the condition of same heat dispersion, the liquid refrigerant amount perfusion absolute error required precision in opposite heat tube manufacture process reduces, and the product qualified rate that heat-pipe radiator is made improves, and cost reduces.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art;
Fig. 2 is the cross sectional representation of absorber in Fig. 1;
Fig. 3 is the structural representation of embodiment one provided by the invention;
Fig. 4 is the stereogram of absorber in Fig. 1;
Fig. 5 is the cross sectional representation of Fig. 4 absorber;
Fig. 6 is the concrete structure schematic diagram one of absorber in embodiment one;
Fig. 7 is the concrete structure schematic diagram two of absorber in embodiment one;
Fig. 8 is the concrete structure schematic diagram three of absorber in embodiment one;
Fig. 9 is the cross sectional representation of Fig. 6;
Figure 10 is the cross sectional representation of Fig. 7;
Figure 11 is the cross sectional representation of Fig. 8;
Figure 12 is the structural representation one of evaporation tube in embodiment one provided by the invention and condenser pipe;
Figure 13 is the structural representation two of evaporation tube in embodiment one provided by the invention and condenser pipe;
Figure 14 is the structural representation three of evaporation tube in embodiment one provided by the invention and condenser pipe.
Figure 15 is the cross sectional representation of the absorber in embodiment two provided by the invention;
Figure 16 is the stereogram one of the absorber in embodiment three provided by the invention;
Figure 17 is the stereogram two of the absorber in embodiment three provided by the invention;
Figure 18 is the stereogram three of the absorber in embodiment three provided by the invention;
Figure 19 is the decomposing schematic representation of a kind of absorber of embodiment provided by the invention.
Embodiment
Embodiment one
As in Figure 3-5, the radiator for semiconductor that the embodiment of the present invention provides, this radiator comprises absorber 1, evaporation tube 2, condenser pipe 3, silk screen 4 and return duct 5, absorber 1 has left installation side support arm 11, right installation side support arm 12 and one between this left installation side support arm 11 and right installation side support arm 12 before lug boss 13, the front evaporator chamber 131 of hollow is provided with in this front lug boss, front lug boss has one for the mounting plane 132 of laminated semiconductor refrigerating chip, left installation side support arm 11, right installation side support arm 12 is equipped with the installation through hole 10 for mechanical engagement semiconductor chip, this absorber 1 also has a rear lug boss 14 be oppositely arranged with front lug boss 11, the relatively left installation side support arm 11 of rear wall 141 of rear lug boss 14 and right installation side support arm 12 protrude out backward, the rear evaporation cavity 40 of hollow is provided with in rear lug boss 14, this rear evaporation cavity 40 forms evaporation cavity 20(as shown in figs. 9-11 jointly with front evaporator chamber 30 inner connection), rear lug boss 14 is provided with and is communicated with the evaporation of evaporating for liquid refrigerant in evaporation cavity with evaporation tube 2 inside and exports 142, be communicated with return duct 5 is inner the refluxing opening 143 being back to evaporation cavity for liquid condensed working medium.
Radiator for semiconductor refrigerating provided by the invention, the heat that the mounting plane laminated semiconductor chip of front lug boss produces to absorb semiconductor chip can be made during installation, by the through hole on two installation side support arms, absorber is fixed on a semiconductor die, rear lug boss convex stretches in the outside of semiconductor chip, not by the restriction of semiconductor chip installing space, by establishing the rear evaporation cavity that is communicated with front evaporator chamber thus greatly increase the volume of evaporation cavity in rear lug boss, and then the reserves of liquid refrigerant in increase evaporation cavity, working medium in evaporation cavity is by liquid refrigerant evaporation capacity, the influence of fluctuations of condensing reflux amount is relatively little, larger to area of dissipation, when the longer heat-pipe radiator of condenser pipe solves heat-pipe radiator work, because of " drying up " phenomenon that working medium amount causes less, because evaporation cavity volume increases, then inner surface volume increases.Absorber completes the transmission of heat to liquid refrigerant by evaporation cavity inwall, increases with working medium contact area, liquid refrigerant evaporation capacity is increased after absorbing heat, and heat output improves, and improves the heat dispersion of heat-pipe radiator; Increase owing to storing liquid refrigerant total amount in evaporation cavity, under ensureing the condition of same heat dispersion, the liquid refrigerant amount perfusion absolute error required precision in opposite heat tube manufacture process reduces, and the product qualified rate that heat-pipe radiator is made improves, and cost reduces.Because evaporation cavity internal volume increases, overcome " drying up " phenomenon, then the minimum point of return duct can arrange the extreme lower position higher than absorber, designs like this, and the efficiently radiates heat area of heat-pipe radiator increases on the one hand; On the other hand utilize gravity, it is more smooth and easy that the liquid refrigerant of condensation is back to evaporation cavity, ensure that the Efficient Cycle of working medium evaporation-condensation in evaporation cavity-evaporate again.
As the specific implementation form of embodiment one, as shown in figs 6-8, the cross section of rear lug boss 14 is rectangle, trapezoidal, semicircle.As shown in figs. 9-11, the cross section of evaporation cavity 20 is rectangle or ellipse.
Evaporation tube 2 can adopt mode one to one with the connection of condenser pipe 3, namely an evaporation tube 2 connects a condenser pipe 3(as Figure 12), when condenser pipe 3 quantity is more than evaporation tube 2 quantity, connect by threeway, an evaporation tube 2 connects two condenser pipe 3(as Figure 13), also can be connected by four-way, an evaporation tube 2 connects three condenser pipe 3(as Figure 14) connect; Absorber comprises the evaporation cavity 20 of front lug boss 13, rear lug boss 14 and hollow, left installation side support arm 11 and right installation side support arm 12 as section bar, can an extrusion molding, as shown in figure 19, in the openwork part two sides welding of the evaporation cavity 20 then in centre, package board 50 can complete.
Embodiment two
As shown in figure 15, be enhanced heat exchange and increase evaporation body mechanical strength, evaporation cavity madial wall is provided with many conduits 144 and/or reinforcement 145.
Embodiment three
As shown in figs. 16-18, later lug boss 14 cross section is the absorber of rectangle is that the particular location of example to its evaporation outlet and refluxing opening is described, and the evaporation outlet 142 of absorber is arranged on the roof 146(of rear lug boss 14 as shown in figure 16) or the top (as shown in Figure 17, Figure 18) of rear wall 141; Refluxing opening 143 is arranged on the bottom (as shown in Figure 16, Figure 17) of rear lug boss sidewall 147 or the bottom (as shown in figure 18) of rear wall 141.
Due to the mounting structure of the actual use procedure of heat pipe radiator and the restriction of installation reliability, the absorber of one side projection, evaporation cavity outlet can only on datum clamp face, and after changing the absorber of two-sided bulge-structure into, evaporation cavity outlet can be arranged at the roof of newly-increased rear bossing, and as shown in figure 16, liquid refrigerant evaporation flow paths is more smooth and easy, evaporation resistance reduces, and heat output increases.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (4)
1. the radiator for semiconductor refrigerating, comprise absorber, evaporation tube, condenser pipe, silk screen and return duct, absorber have two installation side support arms and between these two installation side support arms before lug boss, the front evaporator chamber of hollow is provided with in this front lug boss, front lug boss has one for the mounting plane of laminated semiconductor refrigerating chip, the relative two installation side support arms of this mounting plane protrude out forward, described installation side support arm is equipped with the installation through hole for mechanical engagement semiconductor chip, it is characterized in that, this absorber also has a rear lug boss be oppositely arranged with described front lug boss, the relatively described two installation side support arms of rear wall of described rear lug boss protrude out backward, the rear evaporation cavity of hollow is provided with in rear lug boss, this rear evaporation cavity forms evaporation cavity jointly with front evaporator chamber inner connection, described rear lug boss is provided with and is communicated with the evaporation of evaporating for liquid refrigerant in evaporation cavity with evaporation tube inside and exports, be communicated with return duct is inner the refluxing opening being back to evaporation cavity for liquid condensed working medium,
Wherein, the evaporation outlet of described absorber is arranged on the roof of rear lug boss or the top of rear wall; Described refluxing opening is arranged on the rear bottom of lug boss sidewall or the bottom of rear wall.
2. the radiator for semiconductor refrigerating according to claim 1, is characterized in that, the cross section of described rear lug boss is rectangle, trapezoidal or semicircle.
3. the radiator for semiconductor refrigerating according to claim 1 and 2, is characterized in that, the cross section of described evaporation cavity is rectangle or ellipse.
4. the radiator for semiconductor refrigerating according to claim 3, is characterized in that, described evaporation cavity madial wall is provided with many conduits or reinforcement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210231936.6A CN102790022B (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210231936.6A CN102790022B (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102790022A CN102790022A (en) | 2012-11-21 |
| CN102790022B true CN102790022B (en) | 2015-04-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210231936.6A Expired - Fee Related CN102790022B (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102790022B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329829B (en) * | 2014-03-28 | 2017-04-26 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN111623655B (en) * | 2019-02-27 | 2022-03-25 | 泽鸿(广州)电子科技有限公司 | Heat exchange device |
| CN111190472A (en) * | 2020-02-24 | 2020-05-22 | 大连理工大学 | High-power separated heat pipe radiator for server |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2610255Y (en) * | 2003-01-23 | 2004-04-07 | 罗文龙 | Radiator made of heat pipe and radiating wire |
| CN201038191Y (en) * | 2007-04-30 | 2008-03-19 | 嘉兴市永信电子有限公司 | Semiconductor refrigeration chip radiating device |
| CN201074970Y (en) * | 2007-04-23 | 2008-06-18 | 齐媛 | Heat pipe radiator for electric wine chest thermoelectricity refrigerator hot end |
| CN202839588U (en) * | 2012-07-05 | 2013-03-27 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2834122Y (en) * | 2005-09-07 | 2006-11-01 | 中国科学院工程热物理研究所 | Remote wind-cooled micro-grooves phase change heat radiation system |
| US20070217152A1 (en) * | 2006-03-16 | 2007-09-20 | Kloeppel Gregg M | Integrated liquid cooled heatsink system |
| CN2906522Y (en) * | 2006-05-27 | 2007-05-30 | 广东新宝电器股份有限公司 | Heat pipe device of electronic refrigerator |
-
2012
- 2012-07-05 CN CN201210231936.6A patent/CN102790022B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2610255Y (en) * | 2003-01-23 | 2004-04-07 | 罗文龙 | Radiator made of heat pipe and radiating wire |
| CN201074970Y (en) * | 2007-04-23 | 2008-06-18 | 齐媛 | Heat pipe radiator for electric wine chest thermoelectricity refrigerator hot end |
| CN201038191Y (en) * | 2007-04-30 | 2008-03-19 | 嘉兴市永信电子有限公司 | Semiconductor refrigeration chip radiating device |
| CN202839588U (en) * | 2012-07-05 | 2013-03-27 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
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| Publication number | Publication date |
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| CN102790022A (en) | 2012-11-21 |
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Granted publication date: 20150408 |