CN202839588U - Radiator for semi-conductor refrigeration - Google Patents
Radiator for semi-conductor refrigeration Download PDFInfo
- Publication number
- CN202839588U CN202839588U CN 201220323889 CN201220323889U CN202839588U CN 202839588 U CN202839588 U CN 202839588U CN 201220323889 CN201220323889 CN 201220323889 CN 201220323889 U CN201220323889 U CN 201220323889U CN 202839588 U CN202839588 U CN 202839588U
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- Prior art keywords
- evaporation
- lug boss
- evaporation cavity
- radiator
- heat
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a radiator for semi-conductor refrigeration. The radiator comprises a heat absorbing body, an evaporation tube, a condensing tube, a wire net and a backflow tube. The heat absorbing body has two installation side supporting arms and a front protruding portion. A front evaporation cavity is arranged in the front protruding portion provided with an installing plane which extends forwards relative to the two installation side supporting arms in a protruding mode. The heat absorbing body is further provided with a rear protruding portion opposite to the front protruding portion, and a rear wall of the rear protruding portion extends backwards relative to the two installation side supporting arms in a protruding mode. A rear evaporation cavity communicated with the inside of the front evaporation cavity is arranged in the rear protruding portion and forms an evaporation cavity together with the front evaporation cavity. The rear protruding portion is provided with an evaporation outlet communicated with the inside of the evaporation tube and a backflow port communicated with the inside of the backflow tube. Compare with the prior art, the volume of the evaporation cavity is increased, drying phenomenon caused by few working medium is avoided, the inner surface area is increased, the heat transmission capacity is increased, and the radiating performance of a heat tube radiator is improved.
Description
Technical field
The utility model relates to heat dissipation technology, relates in particular to a kind of radiator for semiconductor refrigerating.
Background technology
The radiator that is used at present semiconductor refrigerating roughly is divided into two classes: a class is that fin type radiator adds the heat exchange of fan pressure mode; The another kind of heat pipe heat radiation mode of utilizing Working fluid phase changing to conduct heat.The first kind is widely used in the hot-side heat dissipation of semiconductor refrigerating because of the characteristics such as simple in structure, with low cost.The Equations of The Second Kind heat spreader structures is complicated, cost is high but owing to adopt phase-change heat transfer, heat transfer resistance is far below first kind radiator, heat dissipation capacity is higher than fin type radiator, need not fan and can realize noiseless, the heat transfer free convection of heat and air, the machinery-free noise, failure rate is low is used more in the high-end product of semiconductor refrigerating.This type of Natural Heat Convection heat-pipe radiator, adopt thermal source absorber and net formula pipe silk in conjunction with heat exchange mode, the evaporation cavity that contains hollow in the absorber, absorber absorbs the heat of thermal source during work, make the liquid refrigerant heat absorption evaporation in the evaporation cavity, by the evaporation outlet that communicates with evaporation cavity inside in the absorber, carry out the heat transmission along the evaporation pipeline, in condenser pipe part by being welded on silk screen and the cross-ventilation heat exchange on the pipeline, the gaseous working medium heat exchange is condensed into liquid state in the pipe, utilize self gravitation along the condenser pipe tube wall, return duct, refluxing opening comes back to the evaporation cavity in the absorber, finish once circulation, do not stop this cyclic process of repetition, will conduct to the exchange heat on the absorber, dissipate, realize heat sinking function.
Be used at present the radiator absorber of semiconductor refrigerating take the side of the left installation side support arm 101 of mounting plane 100(and right installation side support arm 102) as benchmark, the basic single face bulge-structure (as shown in Figure 1) that adopts, for preventing hot short circuit, bossing 200 cross sections of laminated semiconductor chip part are close to the semiconductor chip size and equate, take into account mounting structure and reliability, the radially a size of absorber is usually at 2cm～4cm, by the evaporation tube 120 that is communicated with evaporation cavity 110 in the absorber, condenser pipe 130, return duct 140 and be welded on conduction and the exchange that silk screen 150 on the condenser pipe is finished heat.Because the composite factors such as absorber employing single face bulge-structure and aforesaid installation, reliability, absorber is at horizontal b, radially a direction all is restricted, absorber need guarantee that its certain wall thickness bears the pressure that liquid refrigerant produces in the evaporation cavity when maximum temperature is evaporated simultaneously, thereby cause evaporation cavity 110 volumes actual in the absorber very limited, consider the adopting heat pipes for heat transfer performance, liquid storage amount in the evaporation cavity is limited, and on the one hand the perfusion precision to the liquid refrigerant amount that is filled into heat pipe has proposed requirements at the higher level in actual heat pipe is made.On the other hand, the liquid refrigerant evaporation capacity is greater than the condensing reflux amount in radiator absorber evaporation cavity, larger for radiator area, evaporation, condenser pipe is longer, when the liquid refrigerant of a large amount of condensations remains in the condenser pipe internal face, the situation of evaporating without liquid working medium in the evaporation cavity will occur, phenomenon namely " dries up ", cause the absorber endothermic heat to reduce, thermal resistance increases, and it is unstable to dispel the heat.The heat pipe that name is called semi-conductor electronic refrigerator improves structure, Granted publication number is the utility model patent of CN201255534Y, in order to replenish the liquid working substance in the evaporation cavity, the liquid storage bend pipe that connects an approximate U-shaped at refluxing opening 170 places, the lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening, utilize liquid storage bend pipe tube chamber storing liquid working medium, buffering as working medium in the evaporation cavity, the design return duct is lower than the absorber minimum point, this scheme has been alleviated to a certain extent evaporation cavity and " has been dried up ", but because the liquid storage bend pipe is lower than absorber 1, under the same area of dissipation condition, the efficiently radiates heat area proportion of radiator is reduced.In addition, because absorber adopts the single face bulge-structure, and the actual mounting structure restriction of using heat-pipe radiator, evaporation outlet 160 can only be arranged on the back side of bossing 200, and when causing equally heat pipe work, the working medium evaporation resistance increases.How to guarantee that high-power silk screen type heat-pipe radiator is in varying environment temperature (different rings temperature, liquid refrigerant is different at the tension force of pipeline inner wall in the heat-pipe radiator, the speed that is back to evaporation cavity is all different from the time) under higher heat-transfer capability and stable heat dispersion, be present problem demanding prompt solution.
The utility model content
The utility model provides a kind of radiator for semiconductor refrigerating, be used for overcoming defective of the prior art, realize high-power silk screen type heat-pipe radiator higher heat-transfer capability and stable heat dispersion under the varying environment temperature, effectively alleviate " drying up " phenomenon of evaporation cavity.
The radiator that is used for semiconductor refrigerating that the utility model provides, this radiator comprises absorber, evaporation tube, condenser pipe, silk screen and return duct, absorber has the front lug boss of two installation side support arms and between these two installation side support arms, be provided with the front evaporator chamber of hollow before being somebody's turn to do in the lug boss, front lug boss has a mounting plane for the laminated semiconductor refrigerating chip, be equipped with the installation through hole for the mechanical engagement semiconductor chip on the described installation side support arm, this absorber also has a rear lug boss that is oppositely arranged with described front lug boss, the relatively described two installation side support arms of the rear wall of described rear lug boss protrude out backward, be provided with the rear evaporation cavity of hollow in the rear lug boss, evaporation cavity and front evaporator chamber internal communication form evaporation cavity jointly after this; Described rear lug boss is provided with the evaporation of evaporation tube internal communication for the evaporation of evaporation cavity liquid refrigerant and exports, is used for the refluxing opening that liquid condensed working medium is back to evaporation cavity with the return duct internal communication.
Further, the cross section of described rear lug boss is rectangle, trapezoidal, semicircle.
Further, the cross section of described evaporation cavity is rectangle or ellipse.
Wherein, described evaporation cavity madial wall is provided with many conduits or reinforcement.
Particularly, the evaporation of described absorber outlet is arranged on the top of roof or the rear wall of rear lug boss; Described refluxing opening is arranged on the bottom of rear lug boss sidewall or the bottom of rear wall.
The radiator that is used for semiconductor refrigerating that the utility model provides, can make the mounting plane laminated semiconductor chip of front lug boss to absorb the heat of semiconductor chip generation during installation, by the through hole on the two installation side support arms absorber is fixed on the semiconductor chip, rear lug boss convex is stretched in the outside of semiconductor chip, be not subjected to the restriction of semiconductor chip installing space, thereby greatly increase the volume of evaporation cavity by in rear lug boss, establishing the rear evaporation cavity that is communicated with the front evaporator chamber, and then the reserves of the interior liquid refrigerant of increase evaporation cavity, working medium in the evaporation cavity is subjected to the liquid refrigerant evaporation capacity, the influence of fluctuations less of condensing reflux amount, larger to area of dissipation, when long heat-pipe radiator of condenser pipe has solved heat-pipe radiator work, " drying up " phenomenon that causes less because of the working medium amount; Because the evaporation cavity volume increases, then the inner surface volume increases.Behind the absorber absorbing heat, finish heat to the transmission of liquid refrigerant by the evaporation cavity inwall, increase with the working medium contact area, so that the liquid refrigerant evaporation capacity increases, heat output improves, and has promoted the heat dispersion of heat-pipe radiator; Because storage liquid refrigerant total amount increases in the evaporation cavity, guarantee under the condition of same heat dispersion that the liquid refrigerant amount perfusion absolute error required precision in the opposite heat tube manufacture process reduces, the product qualified rate that heat-pipe radiator is made improves cost.
Description of drawings
Fig. 1 is the structural representation of prior art;
Fig. 2 is the cross sectional representation of absorber among Fig. 1;
The structural representation of the embodiment one that Fig. 3 provides for the utility model;
Fig. 4 is the stereogram of absorber among Fig. 1;
Fig. 5 is the cross sectional representation of Fig. 4 absorber;
Fig. 6 is the concrete structure schematic diagram one of absorber among the embodiment one;
Fig. 7 is the concrete structure schematic diagram two of absorber among the embodiment one;
Fig. 8 is the concrete structure schematic diagram three of absorber among the embodiment one;
Fig. 9 is the cross sectional representation of Fig. 6;
Figure 10 is the cross sectional representation of Fig. 7;
Figure 11 is the cross sectional representation of Fig. 8;
Evaporation tube among the embodiment one that Figure 12 provides for the utility model and the structural representation one of condenser pipe;
Evaporation tube among the embodiment one that Figure 13 provides for the utility model and the structural representation two of condenser pipe;
Evaporation tube among the embodiment one that Figure 14 provides for the utility model and the structural representation three of condenser pipe.
The cross sectional representation of the absorber among the embodiment two that Figure 15 provides for the utility model;
The stereogram one of the absorber among the embodiment three that Figure 16 provides for the utility model;
The stereogram two of the absorber among the embodiment three that Figure 17 provides for the utility model;
The stereogram three of the absorber among the embodiment three that Figure 18 provides for the utility model;
The decomposing schematic representation of the absorber that the embodiment that Figure 19 provides for the utility model is a kind of.
Embodiment
Embodiment one
Shown in Fig. 3-5, the radiator for semiconductor that the utility model embodiment provides, this radiator comprises absorber 1, evaporation tube 2, condenser pipe 3, silk screen 4 and return duct 5, absorber 1 has left installation side support arm 11, the front lug boss 13 of right installation side support arm 12 and between this left installation side support arm 11 and right installation side support arm 12, be provided with the front evaporator chamber 131 of hollow before being somebody's turn to do in the lug boss, front lug boss has a mounting plane 132 for the laminated semiconductor refrigerating chip, left installation side support arm 11, be equipped with the installation through hole 10 for the mechanical engagement semiconductor chip on the right installation side support arm 12, this absorber 1 also has a rear lug boss 14 that is oppositely arranged with front lug boss 11, the relatively left installation side support arm 11 of the rear wall 141 of rear lug boss 14 and right installation side support arm 12 protrude out backward, be provided with the rear evaporation cavity 40 of hollow in the rear lug boss 14, evaporation cavity 40 forms evaporation cavity 20(shown in Fig. 9-11 jointly with front evaporator chamber 30 internal communication after this); Rear lug boss 14 is provided with the evaporation of evaporation tube 2 internal communication for the evaporation of evaporation cavity liquid refrigerant and exports 142, is used for the refluxing opening 143 that liquid condensed working medium is back to evaporation cavity with return duct 5 internal communication.
The radiator that is used for semiconductor refrigerating that the utility model provides, can make the mounting plane laminated semiconductor chip of front lug boss to absorb the heat of semiconductor chip generation during installation, by the through hole on the two installation side support arms absorber is fixed on the semiconductor chip, rear lug boss convex is stretched in the outside of semiconductor chip, be not subjected to the restriction of semiconductor chip installing space, thereby greatly increase the volume of evaporation cavity by in rear lug boss, establishing the rear evaporation cavity that is communicated with the front evaporator chamber, and then the reserves of the interior liquid refrigerant of increase evaporation cavity, working medium in the evaporation cavity is subjected to the liquid refrigerant evaporation capacity, the influence of fluctuations less of condensing reflux amount, larger to area of dissipation, when long heat-pipe radiator of condenser pipe has solved heat-pipe radiator work, " drying up " phenomenon that causes less because of the working medium amount; Because the evaporation cavity volume increases, then the inner surface volume increases.Behind the absorber absorbing heat, finish heat to the transmission of liquid refrigerant by the evaporation cavity inwall, increase with the working medium contact area, so that the liquid refrigerant evaporation capacity increases, heat output improves, and has promoted the heat dispersion of heat-pipe radiator; Because storage liquid refrigerant total amount increases in the evaporation cavity, guarantee under the condition of same heat dispersion that the liquid refrigerant amount perfusion absolute error required precision in the opposite heat tube manufacture process reduces, the product qualified rate that heat-pipe radiator is made improves cost.Because the evaporation cavity internal volume increases, overcome " drying up " phenomenon, then the minimum point of return duct can arrange the extreme lower position that is higher than absorber, like this design, the efficiently radiates heat area of heat-pipe radiator increases on the one hand; Utilize on the other hand gravity, it is more smooth and easy that the liquid refrigerant of condensation is back to evaporation cavity, guaranteed the Efficient Cycle of evaporation of working medium evaporation-condensation in the evaporation cavity-again.
As the specific implementation form of embodiment one, shown in Fig. 6-8, the cross section of rear lug boss 14 is rectangle, trapezoidal, semicircle.Shown in Fig. 9-11, the cross section of evaporation cavity 20 is rectangle or ellipse.
Embodiment two
As shown in figure 15, for enhanced heat exchange and increase evaporation body mechanical strength, be provided with many conduits 144 and/or reinforcement 145 at the evaporation cavity madial wall.
Embodiment three
Shown in Figure 16-18, later on lug boss 14 cross sections be the absorber of rectangle to be example describe the particular location of its evaporation outlet and refluxing opening, the evaporation of absorber exports the 142 roof 146(that are arranged on rear lug boss 14 as shown in figure 16) or the top (such as Figure 17, shown in Figure 180) of rear wall 141; Refluxing opening 143 is arranged on the bottom (such as Figure 16, shown in Figure 17) of rear lug boss sidewall 147 or the bottom (as shown in figure 18) of rear wall 141.
Because the mounting structure of the actual use procedure of heat pipe radiator and the restriction of installation reliability, the absorber of single face projection, the evaporation cavity outlet can only be on datum clamp face, and after changing the absorber of two-sided bulge-structure into, the evaporation cavity outlet can be arranged at the roof of newly-increased rear bossing, and as shown in figure 16, liquid refrigerant evaporation path is more smooth and easy, evaporation resistance reduces, and heat output increases.
It should be noted that at last: above each embodiment is not intended to limit only in order to the technical solution of the utility model to be described; Although with reference to aforementioned each embodiment the utility model is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps some or all of technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of each embodiment technical scheme of the utility model.
Claims (5)
1. radiator that is used for semiconductor refrigerating, this device comprises absorber, evaporation tube, condenser pipe, silk screen and return duct, absorber has the front lug boss of two installation side support arms and between these two installation side support arms, be provided with the front evaporator chamber of hollow before being somebody's turn to do in the lug boss, front lug boss has a mounting plane for the laminated semiconductor refrigerating chip, the relative two installation side support arms of this mounting plane protrude out forward, be equipped with the installation through hole for the mechanical engagement semiconductor chip on the described installation side support arm, it is characterized in that, this absorber also has a rear lug boss that is oppositely arranged with described front lug boss, the relatively described two installation side support arms of the rear wall of described rear lug boss protrude out backward, be provided with the rear evaporation cavity of hollow in the rear lug boss, evaporation cavity and front evaporator chamber internal communication form evaporation cavity jointly after this; Described rear lug boss is provided with the evaporation of evaporation tube internal communication for the evaporation of evaporation cavity liquid refrigerant and exports, is used for the refluxing opening that liquid condensed working medium is back to evaporation cavity with the return duct internal communication.
2. the radiator for semiconductor refrigerating according to claim 1 is characterized in that, the cross section of described rear lug boss is rectangle, trapezoidal, semicircle.
3. the radiator for semiconductor refrigerating according to claim 1 and 2 is characterized in that, the cross section of described evaporation cavity is rectangle or ellipse.
4. the radiator for semiconductor refrigerating according to claim 3 is characterized in that, described evaporation cavity madial wall is provided with many conduits or reinforcement.
5. according to claim 1,2 or 4 described radiators for semiconductor refrigerating, it is characterized in that the evaporation of described absorber outlet is arranged on the top of roof or the rear wall of rear lug boss; Described refluxing opening is arranged on the bottom of rear lug boss sidewall or the bottom of rear wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220323889 CN202839588U (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220323889 CN202839588U (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202839588U true CN202839588U (en) | 2013-03-27 |
Family
ID=47951228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220323889 Expired - Fee Related CN202839588U (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202839588U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790022A (en) * | 2012-07-05 | 2012-11-21 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| WO2023236698A1 (en) * | 2022-06-10 | 2023-12-14 | 青岛海尔空调电子有限公司 | Heat dissipator and air conditioner outdoor unit |
-
2012
- 2012-07-05 CN CN 201220323889 patent/CN202839588U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102790022A (en) * | 2012-07-05 | 2012-11-21 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| CN102790022B (en) * | 2012-07-05 | 2015-04-08 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| WO2023236698A1 (en) * | 2022-06-10 | 2023-12-14 | 青岛海尔空调电子有限公司 | Heat dissipator and air conditioner outdoor unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20140705 |
|
| EXPY | Termination of patent right or utility model |