CN102790022A - Radiator for semi-conductor refrigeration - Google Patents
Radiator for semi-conductor refrigeration Download PDFInfo
- Publication number
- CN102790022A CN102790022A CN2012102319366A CN201210231936A CN102790022A CN 102790022 A CN102790022 A CN 102790022A CN 2012102319366 A CN2012102319366 A CN 2012102319366A CN 201210231936 A CN201210231936 A CN 201210231936A CN 102790022 A CN102790022 A CN 102790022A
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- evaporation
- lug boss
- evaporation cavity
- radiator
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a radiator for semi-conductor refrigeration. The radiator comprises a heat absorbing body, an evaporation tube, a condenser pipe, a wire net and a return pipe. The heat absorbing body has two installing lateral supporting arms and a front protruding portion. A front evaporation cavity is arranged in the front protruding portion provided with an installing plane which extends forwards in protruding mode and is opposite to the two installing lateral supporting arms. The heat absorbing body is further provided with a rear protruding portion opposite to the front protruding portion, and a rear wall of the rear protruding portion extends backwards and opposite to the two installing lateral supporting arms in protruding mode. A rear evaporation cavity communicated with the inside of the front evaporation cavity is arranged in the rear protruding portion and forms an evaporation cavity together with the front evaporation cavity. The rear protruding portion is provided with an evaporation outlet communicated with the inside an evaporation tube and a backflow port communicated with the inside of a backflow tube. Compare with the prior art, the volume of the evaporation cavity is increased, a drying phenomenon caused by few working medium is avoided, inner surface area is increased, heat transmission capacity is increased, and radiating performance of a heat pipe radiator is improved.
Description
Technical field
The present invention relates to heat dissipation technology, relate in particular to a kind of radiator that is used for semiconductor refrigerating.
Background technology
The radiator that is used for semiconductor refrigerating at present roughly is divided into two types: force the mode heat exchange for fin type radiator adds fan for one type; The another kind of heat pipe heat radiation mode of utilizing Working fluid phase changing to conduct heat.The first kind is widely used in the hot-side heat dissipation of semiconductor refrigerating because of characteristics such as simple in structure, with low cost.Second type of heat spreader structures complicacy, cost is high but owing to adopt phase-change heat transfer; Heat transfer resistance is far below first kind radiator; Heat dissipation capacity is higher than fin type radiator, need not noiseless, heat transfer free convection that fan can be realized heat and air, does not have mechanical noise; Failure rate is low, in the high-end product of semiconductor refrigerating, uses more.This type of Natural Heat Convection is used heat-pipe radiator, adopts thermal source absorber and net formula pipe silk to combine heat exchange mode, contains the evaporation cavity of hollow in the absorber; Absorber absorbs the heat of thermal source during work, makes the liquid refrigerant heat absorption evaporation in the evaporation cavity, through the evaporation outlet that communicates with evaporation cavity inside in the absorber; Carry out heat transferred along the evaporation pipeline; Through being welded on silk screen and the cross-ventilation heat exchange on the pipeline, the gaseous working medium heat exchange is condensed into liquid state in the pipe, utilizes self gravitation to come back to the evaporation cavity in the absorber along condenser pipe tube wall, return duct, refluxing opening in the condenser pipe part; Accomplish once circulation; Do not stop this cyclic process of repetition,, realize heat sinking function conducting to the exchange heat on the absorber, dissipating.
The radiator absorber that is used for semiconductor refrigerating at present is a benchmark with mounting plane 100 (side of left installation side support arm 101 and right installation side support arm 102); The basic single face bulge-structure (as shown in Figure 1) that adopts; For preventing hot short circuit; Bossing 200 cross sections of laminated semiconductor chip part are close to the semiconductor chip size and equate; Take into account mounting structure and reliability, the radially a size of absorber is usually at 2cm～4cm, through with absorber in evaporation cavity 110 evaporation tube 120, condenser pipe 130, the return duct 140 that are communicated with and be welded on conduction and the exchange that silk screen 150 on the condenser pipe is accomplished heats.Because composite factors such as absorber employing single face bulge-structure and aforesaid installation, reliability; Absorber is at horizontal b, radially a direction all is restricted; Absorber need guarantee that its certain wall thickness bears the pressure that liquid refrigerant produces in the evaporation cavity when maximum temperature is evaporated simultaneously; Thereby cause evaporation cavity 110 volumes actual in the absorber very limited; Consider the adopting heat pipes for heat transfer performance, the liquid storage amount in the evaporation cavity is limited, and the perfusion precision to the liquid refrigerant amount that is filled into heat pipe has proposed requirements at the higher level in actual heat pipe is made on the one hand.On the other hand, in radiator absorber evaporation cavity the liquid refrigerant evaporation capacity greater than the condensing reflux amount, bigger for radiator area; Evaporation, condenser pipe is longer, when the liquid refrigerant of a large amount of condensations remains in the condenser pipe internal face, the situation that no liquid working medium is evaporated in the evaporation cavity will occur; Phenomenon promptly " dries up "; Cause the absorber endothermic heat to reduce, thermal resistance increases, and heat radiation is unstable.The heat pipe that name is called the semiconductor electronic refrigerator improves structure, Granted publication and number be the utility model patent of CN201255534Y, in order to replenish the liquid working substance in the evaporation cavity, connect at refluxing opening 170 places one be similar to U-shaped the liquid storage bend pipe; The lowermost end level height of liquid storage bend pipe is lower than the level height of refluxing opening; Utilize liquid storage bend pipe tube chamber storing liquid working medium, as the buffering of working medium in the evaporation cavity, the design return duct is lower than the absorber minimum point; This scheme has been alleviated evaporation cavity to a certain extent and " has been dried up "; But, under the same area of dissipation condition, the efficiently radiates heat area proportion of radiator is reduced because the liquid storage bend pipe is lower than absorber 1.In addition, because of absorber adopts the single face bulge-structure, and the actual mounting structure restriction of using heat-pipe radiator, evaporation outlet 160 can only be arranged on the back side of bossing 200, and when causing heat pipe work equally, the working medium evaporation resistance increases.How to guarantee that high-power screen type heat-pipe radiator is in varying environment temperature (different rings temperature; Liquid refrigerant is different at the tension force of pipeline inner wall in the heat-pipe radiator; The speed that is back to evaporation cavity is all different with the time) descend higher heat-transfer capability and stable heat dispersion, be present problem demanding prompt solution.
Summary of the invention
The present invention provides a kind of radiator that is used for semiconductor refrigerating; Be used to overcome defective of the prior art; Realize high-power screen type heat-pipe radiator higher heat-transfer capability and stable heat dispersion under the varying environment temperature, effectively alleviate " drying up " phenomenon of evaporation cavity.
The radiator that is used for semiconductor refrigerating provided by the invention; This radiator comprises absorber, evaporation tube, condenser pipe, silk screen and return duct; Absorber has the preceding lug boss of two installation side support arms and between these two installation side support arms; Should before be provided with the front evaporator chamber of hollow in lug boss, preceding lug boss have one be used for the laminated semiconductor refrigerating chip mounting plane, be equipped with the installation through holes that is used for the mechanical engagement semiconductor chip on the said installation side support arm; This absorber also have one with said before the back lug boss that is oppositely arranged of lug boss; The said relatively two installation side support arms of rear wall of said back lug boss protrude out backward, are provided with the back evaporation cavity of hollow in the back lug boss, and this back evaporation cavity and front evaporator chamber internal communication form evaporation cavity jointly; Said back lug boss be provided with the evaporation tube internal communication be used for the evaporation of evaporation cavity liquid refrigerant the evaporation outlet, be used for the refluxing opening that liquid condensed working medium is back to evaporation cavity with the return duct internal communication.
The radiator that is used for semiconductor refrigerating provided by the invention; The mounting plane laminated semiconductor chip of lug boss is to absorb the heat that semiconductor chip produces before can making during installation; Through hole through on the two installation side support arms is fixed on absorber on the semiconductor chip; Back lug boss outwards convexedly stretches in the outside of semiconductor chip, does not receive the restriction of semiconductor chip installing space, thereby through in the lug boss of back, establishing the volume that the back evaporation cavity that is communicated with the front evaporator chamber increases evaporation cavity greatly; And then the reserves of the interior liquid refrigerant of increase evaporation cavity; Working medium in the evaporation cavity receives the influence of fluctuations of liquid refrigerant evaporation capacity, condensing reflux amount less relatively, when heat-pipe radiator big to area of dissipation, that condenser pipe is long has solved heat-pipe radiator work, and " drying up " phenomenon that causes less because of the working medium amount; Because of the evaporation cavity volume increases, then the inner surface volume increases.After absorber absorbs heat, accomplish the transmission of heat to liquid refrigerant through the evaporation cavity inwall, increase with the working medium contact area, make the liquid refrigerant evaporation capacity increase, heat output improves, and has promoted the heat dispersion of heat-pipe radiator; Because storage liquid refrigerant total amount increases in the evaporation cavity, guarantee under the condition of same heat dispersion that the liquid refrigerant amount perfusion absolute error required precision in the opposite heat tube manufacture process reduces, the product qualified rate that heat-pipe radiator is made improves, and cost reduces.
Description of drawings
Fig. 1 is the prior art constructions sketch map;
Fig. 2 is the cross sectional representation of absorber among Fig. 1;
Fig. 3 is the structural representation of embodiment one provided by the invention;
Fig. 4 is the stereogram of absorber among Fig. 1;
Fig. 5 is the cross sectional representation of Fig. 4 absorber;
Fig. 6 is the concrete structure sketch map one of absorber among the embodiment one;
Fig. 7 is the concrete structure sketch map two of absorber among the embodiment one;
Fig. 8 is the concrete structure sketch map three of absorber among the embodiment one;
Fig. 9 is the cross sectional representation of Fig. 6;
Figure 10 is the cross sectional representation of Fig. 7;
Figure 11 is the cross sectional representation of Fig. 8;
Figure 12 is evaporation tube and the structural representation one of condenser pipe among the embodiment one provided by the invention;
Figure 13 is evaporation tube and the structural representation two of condenser pipe among the embodiment one provided by the invention;
Figure 14 is evaporation tube and the structural representation three of condenser pipe among the embodiment one provided by the invention.
Figure 15 is the cross sectional representation of the absorber among the embodiment two provided by the invention;
Figure 16 is the stereogram one of the absorber among the embodiment three provided by the invention;
Figure 17 is the stereogram two of the absorber among the embodiment three provided by the invention;
Figure 18 is the stereogram three of the absorber among the embodiment three provided by the invention;
Figure 19 is the decomposing schematic representation of a kind of absorber of embodiment provided by the invention.
Embodiment
Embodiment one
Shown in Fig. 3-5; The radiator for semiconductor that the embodiment of the invention provides; This radiator comprises absorber 1, evaporation tube 2, condenser pipe 3, silk screen 4 and return duct 5; Absorber 1 has left installation side support arm 11, the preceding lug boss 13 of right installation side support arm 12 and between this left side installation side support arm 11 and right installation side support arm 12; Should before be provided with the front evaporator chamber 131 of hollow in lug boss, preceding lug boss have one be used for the laminated semiconductor refrigerating chip mounting plane 132, be equipped with the installation through holes 10 that is used for the mechanical engagement semiconductor chip on left installation side support arm 11, the right installation side support arm 12; This absorber 1 also has the back lug boss 14 that is oppositely arranged with preceding lug boss 11; The left relatively installation side support arm 11 of the rear wall 141 of back lug boss 14 protrudes out with right installation side support arm 12 backward, is provided with the back evaporation cavity 40 of hollow in the back lug boss 14, and this back evaporation cavity 40 forms evaporation cavity 20 (shown in Fig. 9-11) jointly with front evaporator chamber 30 internal communication; Back lug boss 14 be provided with evaporation tube 2 internal communication be used for evaporation cavity liquid refrigerant evaporation evaporation outlet 142, be used for the refluxing opening 143 that liquid condensed working medium is back to evaporation cavity with return duct 5 internal communication.
The radiator that is used for semiconductor refrigerating provided by the invention; The mounting plane laminated semiconductor chip of lug boss is to absorb the heat that semiconductor chip produces before can making during installation; Through hole through on the two installation side support arms is fixed on absorber on the semiconductor chip; Back lug boss outwards convexedly stretches in the outside of semiconductor chip, does not receive the restriction of semiconductor chip installing space, thereby through in the lug boss of back, establishing the volume that the back evaporation cavity that is communicated with the front evaporator chamber increases evaporation cavity greatly; And then the reserves of the interior liquid refrigerant of increase evaporation cavity; Working medium in the evaporation cavity receives the influence of fluctuations of liquid refrigerant evaporation capacity, condensing reflux amount less relatively, when heat-pipe radiator big to area of dissipation, that condenser pipe is long has solved heat-pipe radiator work, and " drying up " phenomenon that causes less because of the working medium amount; Because of the evaporation cavity volume increases, then the inner surface volume increases.After absorber absorbs heat, accomplish the transmission of heat to liquid refrigerant through the evaporation cavity inwall, increase with the working medium contact area, make the liquid refrigerant evaporation capacity increase, heat output improves, and has promoted the heat dispersion of heat-pipe radiator; Because storage liquid refrigerant total amount increases in the evaporation cavity, guarantee under the condition of same heat dispersion that the liquid refrigerant amount perfusion absolute error required precision in the opposite heat tube manufacture process reduces, the product qualified rate that heat-pipe radiator is made improves, and cost reduces.Because the evaporation cavity internal volume increases, overcome " drying up " phenomenon, then the minimum point of return duct can be provided with the extreme lower position that is higher than absorber, design like this, the efficiently radiates heat area of heat-pipe radiator increases on the one hand; Utilize gravity on the other hand, it is more smooth and easy that the liquid refrigerant of condensation is back to evaporation cavity, guaranteed working medium evaporation-condensation in the evaporation cavity-effective circulation of evaporation again.
As the concrete way of realization of embodiment one, shown in Fig. 6-8, the cross section of back lug boss 14 is a rectangle, trapezoidal, semicircle.Shown in Fig. 9-11, the cross section of evaporation cavity 20 is rectangle or ellipse.
Embodiment two
Shown in figure 15, for enhanced heat exchange and increase evaporation body mechanical strength, be provided with many conduits 144 and/or reinforcement 145 at the evaporation cavity madial wall.
Embodiment three
Shown in Figure 16-18; Lug boss 14 cross sections are that the absorber of rectangle is that example exports its evaporation and the particular location of refluxing opening describes later on, and the evaporation outlet 142 of absorber is arranged on the roof 146 (shown in figure 16) of back lug boss 14 or the top (like Figure 17, shown in Figure 180) of rear wall 141; Refluxing opening 143 is arranged on the bottom (like Figure 16, shown in Figure 17) of back lug boss sidewall 147 or the bottom (shown in figure 18) of rear wall 141.
Since the mounting structure of the actual use of heat pipe radiator and the restriction of installation reliability, the absorber that single face is protruding, and the evaporation cavity outlet can only be on datum clamp face; And after changing the absorber of two-sided bulge-structure into; The evaporation cavity outlet can be arranged at the roof of newly-increased back bossing, and is shown in figure 16, and liquid refrigerant evaporation path is more smooth and easy; Evaporation resistance reduces, and heat output increases.
What should explain at last is: above each embodiment is only in order to explaining technical scheme of the present invention, but not to its restriction; Although the present invention has been carried out detailed explanation with reference to aforementioned each embodiment; Those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, perhaps to wherein part or all technical characteristic are equal to replacement; And these are revised or replacement, do not make the scope of the essence disengaging various embodiments of the present invention technical scheme of relevant art scheme.
Claims (5)
1. radiator that is used for semiconductor refrigerating; This device comprises absorber, evaporation tube, condenser pipe, silk screen and return duct, and absorber has the preceding lug boss of two installation side support arms and between these two installation side support arms, is provided with the front evaporator chamber of hollow in this preceding lug boss; Before lug boss have one be used for the laminated semiconductor refrigerating chip mounting plane; The relative two installation side support arms of this mounting plane protrude out forward, are equipped with the installation through holes that is used for the mechanical engagement semiconductor chip on the said installation side support arm, it is characterized in that; This absorber also have one with said before the back lug boss that is oppositely arranged of lug boss; The said relatively two installation side support arms of rear wall of said back lug boss protrude out backward, are provided with the back evaporation cavity of hollow in the back lug boss, and this back evaporation cavity and front evaporator chamber internal communication form evaporation cavity jointly; Said back lug boss be provided with the evaporation tube internal communication be used for the evaporation of evaporation cavity liquid refrigerant the evaporation outlet, be used for the refluxing opening that liquid condensed working medium is back to evaporation cavity with the return duct internal communication.
2. the radiator that is used for semiconductor refrigerating according to claim 1 is characterized in that, the cross section of said back lug boss is a rectangle, trapezoidal, semicircle.
3. the radiator that is used for semiconductor refrigerating according to claim 1 and 2 is characterized in that, the cross section of said evaporation cavity is rectangle or ellipse.
4. the radiator that is used for semiconductor refrigerating according to claim 3 is characterized in that, said evaporation cavity madial wall is provided with many conduits or reinforcement.
5. according to claim 1, the 2 or 4 described radiators that are used for semiconductor refrigerating, it is characterized in that the evaporation outlet of said absorber is arranged on the roof of back lug boss or the top of rear wall; Said refluxing opening is arranged on the bottom of back lug boss sidewall or the bottom of rear wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210231936.6A CN102790022B (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210231936.6A CN102790022B (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102790022A true CN102790022A (en) | 2012-11-21 |
| CN102790022B CN102790022B (en) | 2015-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210231936.6A Active CN102790022B (en) | 2012-07-05 | 2012-07-05 | Radiator for semi-conductor refrigeration |
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| Country | Link |
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| CN (1) | CN102790022B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329829A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN111190472A (en) * | 2020-02-24 | 2020-05-22 | 大连理工大学 | High-power separated heat pipe radiator for server |
| CN111623655A (en) * | 2019-02-27 | 2020-09-04 | 泽鸿(广州)电子科技有限公司 | Heat exchange device |
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| CN2610255Y (en) * | 2003-01-23 | 2004-04-07 | 罗文龙 | Radiator made of heat pipe and radiating wire |
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| CN2906522Y (en) * | 2006-05-27 | 2007-05-30 | 广东新宝电器股份有限公司 | Heat pipe apparatus of electronic refrigerator |
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| CN201038191Y (en) * | 2007-04-30 | 2008-03-19 | 嘉兴市永信电子有限公司 | Semiconductor refrigeration chip radiating device |
| CN201074970Y (en) * | 2007-04-23 | 2008-06-18 | 齐媛 | Heat pipe radiator for electric wine chest thermoelectricity refrigerator hot end |
| CN202839588U (en) * | 2012-07-05 | 2013-03-27 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
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2012
- 2012-07-05 CN CN201210231936.6A patent/CN102790022B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2610255Y (en) * | 2003-01-23 | 2004-04-07 | 罗文龙 | Radiator made of heat pipe and radiating wire |
| CN2834122Y (en) * | 2005-09-07 | 2006-11-01 | 中国科学院工程热物理研究所 | Remote wind-cooled micro-grooves phase change heat radiation system |
| US20070217152A1 (en) * | 2006-03-16 | 2007-09-20 | Kloeppel Gregg M | Integrated liquid cooled heatsink system |
| CN2906522Y (en) * | 2006-05-27 | 2007-05-30 | 广东新宝电器股份有限公司 | Heat pipe apparatus of electronic refrigerator |
| CN201074970Y (en) * | 2007-04-23 | 2008-06-18 | 齐媛 | Heat pipe radiator for electric wine chest thermoelectricity refrigerator hot end |
| CN201038191Y (en) * | 2007-04-30 | 2008-03-19 | 嘉兴市永信电子有限公司 | Semiconductor refrigeration chip radiating device |
| CN202839588U (en) * | 2012-07-05 | 2013-03-27 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329829A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN111623655A (en) * | 2019-02-27 | 2020-09-04 | 泽鸿(广州)电子科技有限公司 | Heat exchange device |
| CN111190472A (en) * | 2020-02-24 | 2020-05-22 | 大连理工大学 | High-power separated heat pipe radiator for server |
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| Publication number | Publication date |
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| CN102790022B (en) | 2015-04-08 |
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