CN208940265U - A kind of circuit board with high thermal conductivity double-face aluminium substrate - Google Patents
A kind of circuit board with high thermal conductivity double-face aluminium substrate Download PDFInfo
- Publication number
- CN208940265U CN208940265U CN201821383747.XU CN201821383747U CN208940265U CN 208940265 U CN208940265 U CN 208940265U CN 201821383747 U CN201821383747 U CN 201821383747U CN 208940265 U CN208940265 U CN 208940265U
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- Prior art keywords
- circuit board
- thermally conductive
- fixedly connected
- board body
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 64
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 239000004411 aluminium Substances 0.000 title claims abstract description 21
- NBGBEUITCPENLJ-UHFFFAOYSA-N Bunazosin hydrochloride Chemical compound Cl.C1CN(C(=O)CCC)CCCN1C1=NC(N)=C(C=C(OC)C(OC)=C2)C2=N1 NBGBEUITCPENLJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 230000035699 permeability Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of circuit board with high thermal conductivity double-face aluminium substrate, including circuit board body and aluminum substrate, circuit board body is located at the top of aluminum substrate, is fixedly connected between circuit board body and aluminum substrate there are two thermally conductive fixed block.The circuit board with high thermal conductivity double-face aluminium substrate, by small-sized exhaust fan to the principle of air-breathing inside its heat conducting pipe, the air-flow inside its heat conducting pipe is set to accelerate flowing velocity, and by thermally conductive fixed block and thermally conductive andante by the heat transfer of circuit board body to aluminum substrate during, by the mobility for accelerating hot gas molecule, cooling is achieved the effect that, then fast transfer is carried out to the heat inside its circuit board body and aluminum substrate by heat-dissipating pipe again, reduce the temperature of itself, while to reach thermally conductive andante and aluminum substrate high thermal conductivity, more preferably to its circuit board body heating conduction, and meet the effect quickly integrally to cool down to its double-face aluminium substrate simultaneously.
Description
Technical field
It is specially a kind of with high thermal conductivity double-face aluminium substrate the utility model relates to double-side aluminum circuit board technology field
Circuit board.
Background technique
Double-side aluminum circuit board is divided into three layers, this three layers effect is respectively；First layer does circuit and uses (conduction), the second layer
It is key, it, which is played, can quickly be transmitted to the LED heat generated aluminium sheet, and the speed of heat transfer depends on this heat-conducting insulation material
Thermal resistance, then the effect of third layer be heat-conducting insulation material export come heat be transmitted to Lamp cup again.
Currently, existing double-side aluminum circuit board is all the thermally conductive cooling of carry out by aluminum substrate, it is by the heat of circuit board
Amount is transferred to aluminum substrate, to have achieved the effect that the circuit board that cools down, since the heat of circuit board is by heat-conducting insulation material, then its
In the process, without targetedly design quickening heat transfer efficiency while, and meet the device to radiate to its circuit board height.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of circuit board with high thermal conductivity double-face aluminium substrate,
While existing double-side aluminum circuit board is solved without targetedly design quickening heat transfer efficiency, and meet to its electricity
The problem of road plate height radiates.
(2) technical solution
To achieve the above object, the utility model provides the following technical solutions: a kind of with high thermal conductivity double-face aluminium substrate
Circuit board, including circuit board body and aluminum substrate, the circuit board body are located at the top of aluminum substrate, the circuit board body and
Thermally conductive fixed block there are two being fixedly connected between aluminum substrate, the middle part between the circuit board body and aluminum substrate is fixedly connected with
Thermally conductive andante is fixedly installed with small-sized exhaust fan on the right side of the circuit board body, and the blast pipe of the small-sized exhaust fan is fixed
It is connected with heat conducting pipe, the surface of the heat conducting pipe sequentially passes through the side of thermally conductive fixed block and thermally conductive andante, and extends to circuit
The left of plate ontology and aluminum substrate, the surface of the heat conducting pipe are fixedly connected with the inner wall of thermally conductive fixed block and thermally conductive andante, institute
It states and is fixedly connected to support rod on the left of circuit board body and aluminum substrate, be fixedly connected with hack lever on the left of the support rod,
It is fixedly connected with bearing between two hack levers, thermally conductive fan, the circuit board are fixedly connected on the right side of the bearing inner race
The inner wall of ontology and aluminum substrate is fixedly installed there are two heat-dissipating pipe, one end of four heat-dissipating pipes with the inside of heat conducting pipe
Connection, the inner cavity of the heat-dissipating pipe are provided with rotating bar, and there are two collar, the collars for the surface pivots socket of the rotating bar
Two sides be fixedly connected to support rod, the other end of the support rod is fixedly connected with the inner wall of heat-dissipating pipe, the rotating bar
Surface be fixedly attached there are two fixed sleeving, the two sides of the fixed sleeving are fixedly connected to cooling fin.
Preferably, two thermally conductive fixed blocks are described thermally conductive respectively with distribution symmetrical in the middle part of circuit board body
The two sides of fixed block are provided with air hole.
Preferably, air uniform plate is fixedly connected on the left of the heat conducting pipe.
Preferably, the side in the separate heat conducting pipe axle center of the heat-dissipating pipe is fixedly connected with supplying air bin.
Preferably, the two sides of the heat-dissipating pipe are fixedly connected with multiple permeability cells.
(3) beneficial effect
The utility model provides a kind of circuit board with high thermal conductivity double-face aluminium substrate.Have it is following the utility model has the advantages that
(1), the circuit board with high thermal conductivity double-face aluminium substrate passes through the setting of thermally conductive fixed block, and thermally conductive row
Plate, small-sized exhaust fan, heat conducting pipe, support rod, hack lever, bearing, thermally conductive fan, heat-dissipating pipe, rotating bar, collar, support rod, fixing sleeve
Pipe is used cooperatively with cooling fin, to play the principle by small-sized exhaust fan to air-breathing inside its heat conducting pipe, leads it
The air-flow of inside heat pipe accelerates flowing velocity, and by thermally conductive fixed block and thermally conductive andante by the heat transfer of circuit board body
During to aluminum substrate, by accelerating the mobility of hot gas molecule, cooling is achieved the effect that, has then passed through heat-dissipating pipe pair again
Heat inside its circuit board body and aluminum substrate carries out fast transfer, the temperature of itself is reduced, to reach thermally conductive andante
While with aluminum substrate high thermal conductivity, more preferably to its circuit board body heating conduction, and meet simultaneously quickly to its double-side aluminum
The effect that plate integrally cools down.
Detailed description of the invention
Fig. 1 is the utility model structure front schematic cross-section；
Fig. 2 is enlarged diagram at the A of the utility model structure chart 1；
Fig. 3 is enlarged diagram at the B of the utility model structure chart 1；
Fig. 4 is enlarged diagram at the C of the utility model structure chart 3.
In figure: 1, circuit board body；2, aluminum substrate；3, thermally conductive fixed block；4, thermally conductive andante；5, air hole；6, small-sized pumping
Blower；7, heat conducting pipe；8, air uniform plate；9, support rod；10, hack lever；11, bearing；12, thermally conductive fan；13, heat-dissipating pipe；14, it enters the wind
Storehouse；15, rotating bar；16, collar；17, support rod；18, permeability cell；19, fixed sleeving；20, cooling fin.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figs 1-4, the utility model provides a kind of technical solution: a kind of circuit with high thermal conductivity double-face aluminium substrate
Plate, including circuit board body 1 and aluminum substrate 2, circuit board body 1 are located at the top of aluminum substrate 2, circuit board body 1 and aluminum substrate 2
Between be fixedly connected there are two thermally conductive fixed block 3, two thermally conductive fixed blocks 3 are symmetrical with 1 middle part of circuit board body respectively
Distribution, the two sides of thermally conductive fixed block 3 are provided with air hole 5, by the setting of air hole 5, so that it is thermally conductive solid to play quickening
Determine the effect of the heat dissipation of block 3, and meet and continue best thermally conductive state, the middle part between circuit board body 1 and aluminum substrate 2 is fixed to be connected
It is connected to thermally conductive andante 4, the right side of circuit board body 1 is fixedly installed with small-sized exhaust fan 6, and the blast pipe of small-sized exhaust fan 6 is fixed
It is connected with heat conducting pipe 7, the surface of heat conducting pipe 7 sequentially passes through the side of thermally conductive fixed block 3 and thermally conductive andante 4, and extends to circuit
The left of plate ontology 1 and aluminum substrate 2, the surface of heat conducting pipe 7 are fixedly connected with the inner wall of thermally conductive fixed block 3 and thermally conductive andante 4, lead
The left side of heat pipe 7 is fixedly connected with air uniform plate 8, by the setting of air uniform plate 8, leads to play and uniformly enter its gas
The left side of the inside of heat pipe 7, circuit board body 1 and aluminum substrate 2 is fixedly connected to support rod 9, and the left side of support rod 9 is fixed to be connected
It is connected to hack lever 10, bearing 11 is fixedly connected between two hack levers 10, thermally conductive fan 12 is fixedly connected on the right side of 11 inner ring of bearing,
The inner wall of circuit board body 1 and aluminum substrate 2 is fixedly installed there are two heat-dissipating pipe 13, one end of four heat-dissipating pipes 13 with it is thermally conductive
The inside of pipe 7 is connected to, and the side in 7 axle center of separate heat conducting pipe of heat-dissipating pipe 13 is fixedly connected with supplying air bin 14, passes through supplying air bin 14
Setting, to play the effect of protection heat-dissipating pipe 13, the two sides of heat-dissipating pipe 13 are fixedly connected with multiple permeability cells 18, dissipate
The inner cavity of heat pipe 13 is provided with rotating bar 15, and there are two collar 16, the two sides of collar 16 are equal for the surface pivots socket of rotating bar 15
It is fixedly connected with support rod 17, the other end of support rod 17 is fixedly connected with the inner wall of heat-dissipating pipe 13, and the surface of rotating bar 15 is solid
There are two fixed sleevings 19 for fixed socket, and the two sides of fixed sleeving 19 are fixedly connected to cooling fin 20, pass through setting for cooling fin 20
It sets, to play the effect for accelerating the mobility of hot gas.
In use, making it using air pressure principle to its 7 inside air-breathing of heat conducting pipe by small-sized exhaust fan 6 first
Air-flow inside heat conducting pipe 7 accelerates flowing velocity, and by driving thermally conductive 12 rotation of fan, rapidly enters its normal temperature air thermally conductive
The inside of pipe 7, and simultaneously by thermally conductive fixed block 3 and thermally conductive andante 4 by the heat transfer of circuit board body 1 to aluminum substrate 2
In the process, using the mobility for accelerating hot gas molecule, itself ontology that cools down has been achieved the effect that, while air pressure passes through cooling fin 20
It drives rotating bar 15 to rotate, and the heat inside its circuit board body 1 and aluminum substrate 2 is carried out quickly by heat-dissipating pipe 13 again
Transfer, reduces the temperature of itself, to reach while make its thermally conductive andante 4 and 2 high thermal conductivity of aluminum substrate, to its circuit board sheet
1 heating conduction of body more preferably purpose, and meet the effect quickly integrally to cool down to its double-face aluminium substrate simultaneously, while this specification
In the content that is not described in detail belong to the prior art well known to professional and technical personnel in the field.
It can to sum up obtain, this has the circuit board of high thermal conductivity double-face aluminium substrate, by the setting of thermally conductive fixed block 3, and leads
Hot andante 4, small-sized exhaust fan 6, heat conducting pipe 7, support rod 9, hack lever 10, bearing 11, it is thermally conductive fan 12, heat-dissipating pipe 13, rotating bar 15,
Collar 16, support rod 17, fixed sleeving 19 and cooling fin 20 are used cooperatively, to play through small-sized exhaust fan 6 to it
The principle of 7 inside air-breathing of heat conducting pipe makes the air-flow inside its heat conducting pipe 7 accelerate flowing velocity, and passes through thermally conductive 3 He of fixed block
Thermally conductive andante 4 by the heat transfer of circuit board body 1 to aluminum substrate 2 during, by accelerate hot gas molecule mobility, reach
The effect of cooling has been arrived, then the heat inside its circuit board body 1 and aluminum substrate 2 has quickly been turned by heat-dissipating pipe 13 again
It moves, the temperature of itself is reduced, to lead while having reached thermally conductive andante 4 and 2 high thermal conductivity of aluminum substrate to its circuit board body 1
Hot property more preferably, and meets the effect quickly integrally to cool down to its double-face aluminium substrate simultaneously.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of circuit board with high thermal conductivity double-face aluminium substrate, including circuit board body (1) and aluminum substrate (2), feature exists
In: the circuit board body (1) is located at the top of aluminum substrate (2), fixed between the circuit board body (1) and aluminum substrate (2)
There are two thermally conductive fixed block (3) for connection, and the middle part between the circuit board body (1) and aluminum substrate (2) is fixedly connected with thermally conductive
Andante (4) is fixedly installed with small-sized exhaust fan (6) on the right side of the circuit board body (1), the small-sized exhaust fan (6) into
Air hose is fixedly connected with heat conducting pipe (7), and the surface of the heat conducting pipe (7) sequentially passes through thermally conductive fixed block (3) and thermally conductive andante (4)
Side, and extend to the left of circuit board body (1) and aluminum substrate (2), the surface of the heat conducting pipe (7) and thermally conductive fixed block
(3) it is fixedly connected with the inner wall of thermally conductive andante (4), is fixedly connected on the left of the circuit board body (1) and aluminum substrate (2)
Support rod (9) is fixedly connected with hack lever (10) on the left of the support rod (9), is fixedly connected between two hack levers (10)
Have bearing (11), thermally conductive fan (12), the circuit board body (1) and aluminium base are fixedly connected on the right side of bearing (11) inner ring
The inner wall of plate (2) is fixedly installed there are two heat-dissipating pipe (13), one end of four heat-dissipating pipes (13) with heat conducting pipe (7)
Inside connection, the inner cavity of the heat-dissipating pipe (13) are provided with rotating bar (15), and the surface pivots of the rotating bar (15) are socketed with
The two sides of two collars (16), the collar (16) are fixedly connected to support rod (17), the other end of the support rod (17)
It is fixedly connected with the inner wall of heat-dissipating pipe (13), the surface of the rotating bar (15) is fixedly attached there are two fixed sleeving (19), institute
The two sides for stating fixed sleeving (19) are fixedly connected to cooling fin (20).
2. a kind of circuit board with high thermal conductivity double-face aluminium substrate according to claim 1, it is characterised in that: described in two
For thermally conductive fixed block (3) respectively with distribution symmetrical in the middle part of circuit board body (1), the two sides of the thermally conductive fixed block (3) are equal
It is provided with air hole (5).
3. a kind of circuit board with high thermal conductivity double-face aluminium substrate according to claim 1, it is characterised in that: described thermally conductive
Air uniform plate (8) are fixedly connected on the left of pipe (7).
4. a kind of circuit board with high thermal conductivity double-face aluminium substrate according to claim 1, it is characterised in that: the heat dissipation
The side for managing separate heat conducting pipe (7) axle center of (13) is fixedly connected with supplying air bin (14).
5. a kind of circuit board with high thermal conductivity double-face aluminium substrate according to claim 1, it is characterised in that: the heat dissipation
The two sides of pipe (13) are fixedly connected with multiple permeability cells (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821383747.XU CN208940265U (en) | 2018-08-24 | 2018-08-24 | A kind of circuit board with high thermal conductivity double-face aluminium substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821383747.XU CN208940265U (en) | 2018-08-24 | 2018-08-24 | A kind of circuit board with high thermal conductivity double-face aluminium substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208940265U true CN208940265U (en) | 2019-06-04 |
Family
ID=66718774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821383747.XU Expired - Fee Related CN208940265U (en) | 2018-08-24 | 2018-08-24 | A kind of circuit board with high thermal conductivity double-face aluminium substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208940265U (en) |
-
2018
- 2018-08-24 CN CN201821383747.XU patent/CN208940265U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220818 Address after: No. 1, North Industrial Park, Guangfu Town, Jiaoling County, Meizhou City, Guangdong Province, 514165 Patentee after: Meizhou Xindeguan Electronic Technology Co., Ltd. Address before: B6, Moon Bay Community, Gangzishang Road, Meizhou City, Guangdong Province, 514000 Patentee before: MEIZHOU HONGZHAN ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190604 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |