CN105716342B - The air-cooled cooling control method of semiconductor refrigerating equipment - Google Patents
The air-cooled cooling control method of semiconductor refrigerating equipment Download PDFInfo
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- CN105716342B CN105716342B CN201410710922.1A CN201410710922A CN105716342B CN 105716342 B CN105716342 B CN 105716342B CN 201410710922 A CN201410710922 A CN 201410710922A CN 105716342 B CN105716342 B CN 105716342B
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Abstract
The invention discloses a kind of air-cooled cooling control methods of semiconductor refrigerating equipment, due to the design of the air-cooled radiator of semiconductor refrigerating equipment, substantially increase heat dissipation effect of the radiating module under natural windless condition, thus, the method of the present invention can improve the restrictive condition of starting fan, only in supply voltage U ＞ setting values, control starting fan, and the rotating speed of fan is adjusted according to the size of temperature difference △ T, in supply voltage U ＜ setting values, it is out of service to control fan, fan is not to be in operating condition in real time, thus, while ensureing to radiate, reduce the noise that fan rotation generates, improve the service life of fan, reduce energy consumption.
Description
Technical field
The invention belongs to refrigeration equipment technical field of heat dissipation, especially a kind of air-cooled radiating control of semiconductor refrigerating equipment
Method.
Background technology
Semiconductor refrigerating equipment generally all includes semiconductor refrigerating module, cold end radiator and hot-side heat dissipation device.Partly lead
The cold end of body refrigeration module is freezed, and is freezed to equipment compartment by cold end radiator, hot junction heating, by hot-side heat dissipation device to heat
End heat dissipation,
Existing semiconductor refrigeration system driving fan by the way of constant pressure so that rotation speed of the fan is constant.However, constant
Rotating speed it is larger to the abrasion of fan so that the short life of fan, work noise are big.Further more, due to semiconductor refrigerating module
Temperature is not constant, when the temperature of semiconductor refrigerating module reduces, only needs the low-speed running of fan that can meet heat exchange,
Meanwhile when the temperature of semiconductor refrigerating module increases, heat exchange could be met by needing fan to run at high speed, however, fan turns
Speed is constant, not only results in the waste of the energy, while also causing refrigeration effect low.
In addition, the power supply of semiconductor refrigerating equipment is to meet the refrigeration capacity requirement of semiconductor refrigerating module, only
There are one large power supplies for setting, and operating voltage is provided for fan while power supply for semiconductor refrigerating module.However, it is only necessary to
It just can ensure the normal work of fan using a small-power power, and be still powered using large power supply, then can
Cause energy consumption to increase, is unfavorable for saving electric energy.
In addition, in existing semiconductor refrigerating equipment, at the semiconductor refrigerating module both ends of semiconductor refrigerating equipment
Overtension, semiconductor refrigerating module hot junction heat dissipation it is bad when, the hot-side temperature of semiconductor refrigerating module is often
Meeting rapid increase, eventually leads to semiconductor refrigerating module damage.
Invention content
The purpose of the present invention is to provide a kind of air-cooled cooling control methods of semiconductor refrigerating equipment, reduce fan and make an uproar
Sound improves service life.
In order to solve the above technical problems, the present invention is achieved by the following scheme：
A kind of air-cooled cooling control method of semiconductor refrigerating equipment, the air-cooled radiator include fan and at least
Two radiating modules, radiating module include the heat carrier and heat pipe to link together, and groups of fins is also associated on heat pipe；Wherein
The heat pipe of one radiating module is also connected with the groups of fins of remaining one or more radiating module, fan between groups of fins,
Through-hole is offered on the cooling fin of groups of fins, each through-hole in same groups of fins forms air duct, and the control method is：
First data acquisition step：Obtain the temperature difference △ T of indoor mean temperature Tr and preset target temperature Ts；
Freeze energizing step：The supply voltage U to the semiconductor refrigerating module for power supply is determined according to temperature difference △ T；
Radiating control step：
If supply voltage U ＞ setting values, starting fan is controlled, and adjusts the rotating speed of fan according to the size of temperature difference △ T；
If supply voltage U≤setting value, control fan is out of service.
Optionally, semiconductor refrigerating equipment includes to the power output module of semiconductor refrigerating module for power supply, the power
Output module includes that the small output voltage range of rated power is（Umin, Ubest）The first power output module and specified work(
The big output voltage range of rate is（Ubest, Umax）The second power output module；
First power output module is powered for the fan；
Wherein, the setting value is Ubest, and Ubest is so that the refrigerating efficiency of the semiconductor refrigerating module is highest
Peak efficiency voltage；
Umax >=according to the maximum cooling capacity voltage of refrigeration equipment maximum cooling capacity demand determination；
Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of refrigeration equipment.
Further, first data acquisition step further includes acquiring the hot-side temperature of the semiconductor refrigerating module；
And
The method further includes between first data acquisition step and the refrigeration energizing step：
Forbid temperature judging step in the first hot junction：Judge whether the hot-side temperature reaches or forbid temperature beyond preset
Degree；
If the hot-side temperature reaches or forbids temperature beyond described, executes following first and stop energizing step：It will be to
The supply voltage of the semiconductor refrigerating module is set as zero, stops to the semiconductor refrigerating module for power supply.
Further, the method forbid in first hot junction further include after temperature judging step：
If the hot-side temperature forbids temperature described in being less than, continues to execute following hot junction protection temperature upper limit and judge step
Suddenly：Judge whether the hot-side temperature reaches or protect temperature upper limit beyond preset hot junction, wherein temperature is protected in the hot junction
The upper limit forbids temperature described in being less than；
If the hot-side temperature reaches or protects temperature upper limit beyond the hot junction, executes following first and be down to maintenance electricity
Press step：The supply voltage is reduced to preset maintenance voltage；
If the hot-side temperature, which is less than the hot junction, protects temperature upper limit, the refrigeration energizing step is executed.
The method further includes after being down to maintenance voltage step described first：
Second data acquisition step：The temperature difference of the mean temperature and the target temperature is obtained, and acquires the hot junction
Temperature；
Forbid temperature judging step in the second hot junction：Judge whether the hot-side temperature reaches or forbid temperature beyond described；
If the hot-side temperature reaches or forbids temperature beyond described, executes following second and stop energizing step：It will be to
The supply voltage of the semiconductor refrigerating module is set as zero, stops to the semiconductor refrigerating module for power supply；
If the hot-side temperature forbids temperature described in being less than, following hot junction protection lowest temperature judgment step is executed：Sentence
Whether the hot-side temperature that breaks is at or below preset hot junction protection lowest temperature, wherein hot junction protection lowest temperature is small
The upper limit is protected in the hot-side temperature；
If the hot-side temperature protects lowest temperature at or below the hot junction, the refrigeration energizing step is executed；
If the hot-side temperature, which is more than the hot junction, protects lowest temperature, executes following second and be down to maintenance voltage step
Suddenly：Reduce or keep the supply voltage to the maintenance voltage.
Optionally, after executing the second stopping energizing step, the method is recycled back to the second data acquisition step
Suddenly it continues to execute.
Optionally, after maintenance voltage step is down in execution described second, the method is recycled back to second data acquisition
Step continues to execute.
Optionally, the maintenance voltage is the minimum refrigerating capacity voltage determined according to the minimum refrigeration demand of refrigeration equipment.
Optionally, after executing the radiating control step, the method be recycled back to first data acquisition step after
It is continuous to execute.
Optionally, first data acquisition step and second data acquisition step respectively include：
The preset target temperature is obtained, and acquires the mean temperature of refrigeration equipment compartment；
Calculate the temperature difference between the mean temperature and the pre-set target temperature Ts.
Compared with prior art, the advantages and positive effects of the present invention are：
The present invention substantially increases radiating module in nature due to the design of the air-cooled radiator of semiconductor refrigerating equipment
Heat dissipation effect under windless condition, thus, method of the invention can improve the restrictive condition of starting fan, only in power supply electricity
U ＞ setting values are pressed, starting fan is controlled, and adjust the rotating speed of fan according to the size of temperature difference △ T, are set in supply voltage U ＜
When value, control fan is out of service, and fan is not to be in operating condition in real time, thus, while ensureing to radiate, reduce wind
The noise that fan rotation generates, improves the service life of fan, reduces energy consumption.
The method of the present invention uses the power output module of different rated power for semiconductor refrigerating module for power supply, using volume
Determine the first small power output module of power to power for fan, energy consumption can be further decreased.
The method of the present invention due to can reach in hot-side temperature or protect temperature upper limit beyond hot junction, reduce or keep to
The supply voltage of the semiconductor refrigerating module for power supply is preset maintenance voltage, therefore can be taken into account to semiconductor refrigeration module
Protection and refrigeration effect, i.e., can continue when being protected to semiconductor refrigeration module to semiconductor refrigerating equipment power, keep away
Exempt to bring excessive negative effect to the refrigeration effect of semiconductor refrigerating equipment.
In the method for the invention, when hot-side temperature reaches or beyond temperature is forbidden, then stops to semiconductor refrigeration module
Power supply, thus avoid hot-side temperature it is excessively high when burn out semiconductor refrigerating module.
In the method for the invention, supply voltage is made to be equal to maximum make when the temperature difference is more than or equal to preset temperature difference threshold
Cold voltage, therefore temperature can be reduced rapidly with higher refrigerating efficiency when the temperature difference is larger so that the temperature difference tends to rapidly one
Smaller value；Make supply voltage start to decline from maximum cooling capacity voltage when the temperature difference is reduced to temperature difference threshold, therefore can keep away
Exempt to cool down too fast, in order to avoid being reduced to the temperature far below preset value, causes bad refrigeration effect.
After the detailed description of embodiment of the present invention is read in conjunction with the figure, the other features and advantages of the invention will become more
Add clear.
Description of the drawings
Fig. 1 is the structural schematic diagram of semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 2 is the structural schematic diagram one of hot-side heat dissipation device in semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 3 is the structural schematic diagram two of hot-side heat dissipation device in semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 4 is flow principles figure of Fig. 3 apoplexy in groups of fins.
Fig. 5 is the flow chart of the air-cooled heat dissipating method of semiconductor refrigerating equipment according to an embodiment of the invention.
Fig. 6 be supply voltage control method according to an embodiment of the invention semiconductor refrigerating module hot-side temperature compared with
The example graph that its supply voltage is controlled when high.
Fig. 7 is that supply voltage control method according to an embodiment of the invention is quickly obtained maximum with higher refrigerating efficiency
Refrigerating capacity and the mean temperature of semiconductor refrigerating equipment compartment is accurately controlled setting target temperature example graph.
Fig. 8 is the supply voltage and refrigerating efficiency and refrigerating capacity of semiconductor refrigerating module according to an embodiment of the invention
The example graph of relationship.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with the accompanying drawings.
Due to the existing equipment generally use fan using semiconductor refrigerating to the hot junction of semiconductor refrigeration module into sector-style
Cold heat dissipation, need to consume a large amount of electric energy and fan operating noise is more serious always, picture 1-4, the hot junction in the present embodiment
Radiator 400 includes the second heat carrier 41, more second heat pipes 42 and groups of fins 43, and second heat pipe 42 is connected to described
On second heat carrier 41, the groups of fins 43 is connected on second heat pipe 42.Specifically, the second heat carrier 41 is attached to half
The hot junction of conductor refrigeration module, and groups of fins 43 is attached on shell 101, the heat that the hot junction of semiconductor refrigerating module generates is logical
It crosses the second heat carrier 41 and passes to the second heat pipe 42, the second heat pipe 42 can quickly transfer heat in groups of fins 43,
And the radiator of larger area can be made in groups of fins 43 as needed, groups of fins 43 can utilize itself larger heat dissipation
The second heat pipe of area pair 42 transmit heat carry out rapid cooling, without by fan directly to semiconductor refrigeration module
It radiates in hot junction.Wherein, it in order to adequately be radiated using each groups of fins 43, is also associated on the second heat carrier 41
Third heat pipe 44, the third heat pipe 44 in any hot-side heat dissipation device 400 also in hot-side heat dissipation device 400 described in remaining
The groups of fins 43 connect.In actual use, when the heat of each semiconductor refrigerating module work generation is identical
When, each semiconductor refrigerating module is radiated by respective groups of fins 43, and when some semiconductor refrigerating module
When heat dissipation capacity is larger, the second heat carrier 41 of the semiconductor refrigerating module heat is connected to by third heat pipe 44 by heat transfer
Into the corresponding groups of fins of other semiconductor refrigerating modules 43, so as to using whole groups of fins 43 more efficiently into
Row heat dissipation；In the design process, each second heat carrier 41 can be carried out by third heat pipe 44 and remaining groups of fins 43
It is thermally connected, for the heat-sinking capability of whole groups of fins 43, to realize natural cooling.And in order to enhance the logical of groups of fins 43
Wind energy power, groups of fins 43 include multi-disc radiating fin 431, and ventilation hole 432 is provided on the radiating fin 431, are located at same
Multiple ventilation holes 432 on one axis form air duct, groups of fins 43 in addition to using the interval between radiating fin 431 into
Row ventilation is outer, and also forming air duct using ventilation hole 432 is aerated, so as to effectively enhance the ventilation energy of groups of fins 43
Power.And run when each semiconductor refrigerating module is under relatively high power, in order to meet the requirement of high-power heat-dissipation, the one of air duct
Side is provided with fan 45, and fan 45 can accelerate the flowing of air duct apoplexy, and since hot-air is gentlier easy to flow upward, logical
The wind to flow in air holes 432 will be so that hot-air vortex flow between two radiating fins 431, utilizes heat dissipation to the greatest extent
The area of fin 431 radiates.As shown in Figure 3 and Figure 4, in order to more fully be radiated using radiating fin 431, in addition to
Outside the radiating fin 431 in outside, remaining radiating fin 431 opens up jagged 433, the notch being located on sustained height position
433 form auxiliary air ducts, and cover body 46 is additionally provided in groups of fins 43, and the fan 45 is also located at the inside in auxiliary air duct and consolidates
It is scheduled on cover body 46, cover body 46 covers in groups of fins 43, the lower end formation air inlet of cover body 46, and the upper end of cover body 46
Portion forms air outlet, and fan 45 is dried after starting into auxiliary air duct, and the air flowing between radiating fin 431 is accelerated, and hot
Air, which rises from air outlet, to be exported so that extraneous cold air is entered from the air inlet of bottom between radiating fin 431 so that
Cold wind can be from bottom to up in motion process, by the whole surface of radiating fin 431, to make full use of radiating fin 431
Heat-sinking capability；And it is further opened with ventilation opening 461 for installing the position of fan 45 on cover body 46, fan 45 passes through ventilation opening 461
Extraneous wind is further introduced into radiating fin 431.Wherein, the both sides of each second heat carrier 41 are respectively arranged with scattered
Backing group 43, and fan 45 is located between two groups of fins 43 simultaneously.
Fig. 5 is the cooling control method of the air-cooled radiator of semiconductor refrigerating equipment according to an embodiment of the invention
Flow chart.In the embodiment shown in fig. 1, which may include：
First data acquisition step 101 acquires the hot-side temperature Thot of semiconductor refrigerating module；Obtain refrigeration equipment compartment
Mean temperature Tr and preset target temperature Ts temperature difference △ T.Its detailed process may include：Obtain preset target temperature
Ts, and acquire the mean temperature Tr of refrigeration equipment compartment；Calculate the temperature difference △ T between mean temperature Tr and preset value Ts.
Temperature judging step 102 is forbidden in first hot junction, judges whether hot-side temperature Thot reaches or forbid beyond preset
Temperature；If hot-side temperature Thot reaches or beyond temperature is forbidden, executes first and stop energizing step 103：It will be to semiconductor system
The supply voltage U of chill block is set as zero, stops powering to semiconductor refrigeration module；
Temperature upper limit judgment step 104 is protected in hot junction, is executed less than when forbidding temperature in hot-side temperature Thot, is judged hot junction
Whether temperature Thot reaches or protects temperature upper limit beyond preset hot junction, and wherein protection temperature upper limit in hot junction, which is less than, forbids temperature
Degree；If hot-side temperature Thot, which is less than hot junction, protects temperature upper limit, refrigeration energizing step 105 is executed：To the semiconductor refrigerating
Module provides the supply voltage U.
In this embodiment, in the energizing step 105 that freezes, can according to preset PID adjust rule, by formula U=
For the supply voltage U that UPID (△ T)+Ubest is determined to the semiconductor refrigerating module for power supply of refrigeration equipment, wherein U is to described half
The supply voltage of conductor refrigeration module power supply, Ubest are the highest highest of refrigerating efficiency so that the semiconductor refrigerating module
Efficiency-voltage, △ T are the temperature difference of the mean temperature and preset target temperature of refrigeration equipment compartment, and UPID (△ T) is according to institute
It states PID and adjusts the numerical value that rule obtains temperature difference progress operation.
Power output module from the present embodiment to semiconductor refrigerating module for power supply, including rated power it is small the first power it is defeated
Go out the second power output module of module and rated power greatly, the voltage range of the first power output module output is（Umin,
Ubest）, the second power output module output voltage range be（Ubest, Umax）；
Wherein, the first power output module is powered for the fan；
Ubest is the highest peak efficiency voltage of refrigerating efficiency so that the semiconductor refrigerating module；
Umax >=according to the maximum cooling capacity voltage of refrigeration equipment maximum cooling capacity demand determination；
Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of refrigeration equipment.
After executing refrigeration energizing step 105, the present embodiment will also carry out radiating control step 112：
If supply voltage U ＞ Ubest, wind is adjusted into control starting fan step 113, and according to the size of temperature difference △ T
The rotating speed of fan；If supply voltage U≤Ubest, into control fan step 114 out of service.
The control mode of the present embodiment fan can be pulsewidth modulation（PWM）, fan is adjusted by adjusting duty ratio
Voltage, to change its rotating speed.
It should be noted that in some other embodiment of supply voltage control method of the present invention, the first hot junction is forbidden
Temperature judging step 102 to hot junction protection temperature upper limit judgment step 104 it is not necessary to.In such embodiments, exist
Temperature difference △ T can be only acquired in first data acquisition step 101, without acquiring hot-side temperature Thot；It is obtained in the first data
After taking step 101 to be finished, refrigeration energizing step 105 is directly executed.
In one embodiment of the invention, it if hot-side temperature Thot reaches or protects temperature upper limit beyond hot junction, holds
Row first is down to maintenance voltage step 106：Reduce or keep supply voltage U to preset maintenance voltage Ukeep.The maintenance electricity
Pressure Ukeep is that can maintain to freeze under the extreme cases such as environment temperature is excessively high, air circulation is poor, humidity is excessive, the temperature difference is larger
The voltage that the mean temperature Tr of equipment compartment slowly rises or declines, a purpose be to ensure the temperature in hot junction as possible
Lowest temperature is protected no more than preset hot junction.
In another embodiment of the present invention, after first is down to maintenance voltage step 106, the second number is executed successively
Forbid temperature judging step 108 according to obtaining step 107, the second hot junction.Second data acquisition step 107 is：Acquire hot-side temperature
Thot, in some embodiments of the invention, the second data acquisition step 107, which may also include, obtains temperature difference △ T.Prohibit in the second hot junction
Only temperature judging step 108 is：Judge whether hot-side temperature Thot reaches or beyond forbidding temperature.
After above-mentioned second hot junction forbids temperature judging step 108 to be finished, if hot-side temperature Thot reaches or beyond taboo
Only temperature then executes second and stops energizing step 109：Zero will be set as to the supply voltage U of semiconductor refrigerating module, stopping pair
Semiconductor refrigerating module for power supply；If hot-side temperature Thot, which is less than, forbids temperature, hot junction protection lowest temperature judgment step is executed
110：Whether hot-side temperature Thot is judged at or below preset hot junction protection lowest temperature, and lowest temperature is protected in wherein hot junction
The upper limit is protected less than hot-side temperature.Execute second stop energizing step 109 after, supply voltage control method of the invention can be with
The second data acquisition step 107 is recycled back to continue to execute.
After above-mentioned hot junction protection lowest temperature judgment step 110 is finished, if hot-side temperature Thot is at or below warm
End protection lowest temperature, then execute refrigeration energizing step 105, radiating control step 112；If hot-side temperature Thot is protected more than hot junction
Lowest temperature is protected, then executes second and is down to maintenance voltage step 111：Reduce or keep supply voltage U to maintenance voltage Ukeep.
It is higher in hot-side temperature in this way, but when not yet sufficiently achieving the condition for stopping powering to semiconductor refrigeration module, with lower confession
Piezoelectric voltage U meets the refrigerating capacity of refrigeration equipment, but also the hot-side temperature of semiconductor refrigerating module declines, to not stop making
Semiconductor refrigerating module is protected in the case of cold.After maintenance voltage step 111 is down in execution second, supply voltage of the invention
Control method is recycled into the second data acquisition step 107 and continues to execute.
Fig. 6 be supply voltage control method according to an embodiment of the invention semiconductor refrigerating module hot-side temperature compared with
The example graph that its supply voltage is controlled when high.In the embodiment shown in fig. 7, in such as environment temperature mistake
Height, air circulation is poor, humidity is excessive, temperature difference △ T are more than or equal to the refrigeration equipments such as preset temperature difference threshold △ Tthd and need greatly
Refrigerating capacity in the case of, using maximum cooling capacity voltage Umax-cold as supply voltage so that the cold end of semiconductor refrigerating module
Very fast refrigeration, hot-side temperature Thot are gradually increased to hot-side temperature by a low value and protect the upper limit.In the process, it constantly carries out
Protect temperature upper limit judgment step 104 in hot junction.In hot junction, the judgement of protection temperature upper limit judgment step 104 is to reach or beyond heat
When the protection temperature upper limit of end, as shown in fig. 6, executing first is down to maintenance voltage step 106 so that supply voltage U is reduced to dimension
Hold voltage Ukeep.Since supply voltage U has dropped, hot-side temperature Thot also declines, and in the process, executes the second number successively
Forbid temperature judging step 108 according to obtaining step 107, the second hot junction.As shown in fig. 6, hot-side temperature Thot is not above taboo
Only temperature, therefore it is always no that the judgement of temperature judging step 108 is forbidden in the second hot junction, according to preceding method, executes hot junction and protects
Protect lowest temperature judgment step 110.Lowest temperature is protected when hot-side temperature Thot reaches hot junction, then executes refrigeration energizing step
105.As seen from Figure 7, if temperature difference △ T are more than temperature difference threshold △ Tthd at this time, the power supply that rule obtains is adjusted according to PID
Voltage U can be maximum cooling capacity voltage Umax-cold.It repeats the above process, until the mean temperature △ T of refrigeration equipment compartment are small
Start to adjust rule reduction voltage by PID after temperature difference threshold △ Tthd.
Fig. 7 is that supply voltage control method according to an embodiment of the invention is quickly obtained maximum with higher refrigerating efficiency
Refrigerating capacity and the mean temperature of semiconductor refrigerating equipment compartment is accurately controlled setting target temperature example graph.
It can be configured to as shown in fig. 7, PID adjusts rule：When temperature difference △ T are more than or equal to preset temperature difference threshold △ Tthd, make
It obtains supply voltage U and is equal to maximum cooling capacity voltage Umax-cold, can rapidly be cooled down to compartment in this way；When temperature difference △ T are reduced
When to temperature difference threshold △ Tthd so that supply voltage U start from maximum cooling capacity voltage Umax-cold decline, so no longer with
Larger supply voltage is powered semiconductor refrigeration module, and the temperature in refrigeration equipment can be avoided to be reduced to far below pre-
The temperature of setting value and cause bad refrigeration effect.It, can be by this rule to semiconductor refrigerating mould in the energizing step 105 that freezes
Block is powered.
In one embodiment of the invention, as shown in fig. 7, PID adjustings rule can be configured to：When temperature difference △ T for the first time
After being reduced to zero so that supply voltage U undergoes fluctuating change so that temperature difference △ T be equal to or tend to the supply voltage U of zero to
Semiconductor refrigerating module for power supply.In the energizing step 105 that freezes, semiconductor refrigeration module can be powered by this rule.This
Sample enables to supply voltage U finally to stablize near peak efficiency voltage Ubest.In conjunction with Fig. 7 and Fig. 6 it is found that in the figure 7,
When temperature difference △ T are reduced in preset temperature difference threshold △ Tthd, supply voltage can be less than maximum cooling capacity voltage Umax-
Some value of cold；Then, after temperature difference △ T are reduced to zero for the first time so that supply voltage undergoes fluctuating change, so that the temperature difference
△ T are equal to or tend to the supply voltage of zero to the semiconductor refrigerating module for power supply.
Fig. 8 is the supply voltage and refrigerating efficiency and refrigerating capacity of semiconductor refrigerating module according to an embodiment of the invention
The example graph of relationship.As shown in figure 8, according to the relationship of supply voltage U and refrigerating efficiency, supply voltage U can be divided
For 4 regions：First non-economy area 401, high efficient district 402, high refrigerating capacity area 403, the second non-economy area 404.First non-economy
The refrigerating capacity in area 401 is very small, cannot substantially meet the minimum refrigeration demand of refrigeration equipment；Though in the second non-economy area 404
The refrigerating capacity of right semiconductor itself may meet the minimum refrigeration demand of refrigeration equipment, but due to the power supply electricity needed for this region
Press U high, power consumption more much higher than high efficient district 402 and high refrigerating capacity area 403；Therefore in an embodiment of the present invention, without using the
The supply voltage U in one non-economy area 401 and the second non-economy area 404 is semiconductor refrigerating module for power supply, but makes semiconductor system
The supply voltage U of chill block is located at high efficient district 402 and high refrigerating capacity area 403.That is, in an embodiment of the present invention, it will
According to the requirement to semiconductor refrigerating device refrigeration efficiency, semiconductor refrigerating module for power supply voltage used is determined most according to experiment
Big value（That is maximum supply voltage Umax）And minimum value（I.e. minimum supply voltage Umin）, make the work electricity of semiconductor refrigerating module
Pressure is located in high efficient district 402 and high refrigerating capacity area 403 defined by the two values.
As shown in figure 8, maximum supply voltage Umax can be chosen for maximum cooling capacity voltage Umax-cold by experiment, i.e.,：
PID in the present invention can be adjusted to rule setting into the maximum value quilt for making it make supply voltage U in previously described formula
It is determined as maximum cooling capacity voltage Umax-cold, that is to say, that UPID (△ T) is assigned when △ T are more than temperature difference threshold △ Tthd
Value is limited to maximum cooling capacity voltage Umax-cold and subtracts peak efficiency voltage Ubest.
Also as shown in figure 8, minimum supply voltage Umin can be chosen for the first economic zone 401 and high efficient district 402 by experiment
The supply voltage U of description, i.e., minimum refrigerating capacity voltage Umin-cold.Similarly, the PID in the embodiment of the present invention can be adjusted
Rule setting is at making it in previously described formula so that the minimum value of supply voltage U is confirmed as minimum refrigerating capacity voltage
Umin-cold.That is, UPID (△ T) can be assigned when △ T are less than certain threshold value is limited to minimum refrigerating capacity voltage
Umin-cold subtracts peak efficiency voltage Ubest（Calculated voltage value is a negative value at this time）.In some replacements of the present invention
Property embodiment in, minimum supply voltage Umin also can slightly below meet refrigeration equipment minimum refrigerating capacity voltage Umin-cold.
In addition, as those skilled in the art can be appreciated that according to Fig. 8, peak efficiency voltage Ubest can be obtained through experiment,
Its value is obviously between maximum cooling capacity voltage Umax-cold and minimum refrigerating capacity voltage Umin-cold.
It is to be appreciated that maintenance voltage Ukeep usually can be in minimum supply voltage Umin and peak efficiency voltage Ubest
Between value.The selection principle of maintenance voltage Ukeep be consider at refrigeration equipment environment temperature is excessively high, air circulation is poor,
When under the extreme cases such as humidity is excessive, the temperature difference is larger, make the temperature in refrigeration equipment that can also be preferably minimized setting temperature quickly
Degree.The value for the maintenance voltage Ukeep being selected is obtained by simulated experiment under these extreme cases, this value and Umax-
The difference of cold is not very big.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
With technical scheme described in the above embodiments is modified or equivalent replacement of some of the technical features；
And these modifications or replacements, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (8)
1. a kind of air-cooled cooling control method of semiconductor refrigerating equipment, which is characterized in that the air-cooled radiator includes
Fan and at least two radiating modules, radiating module include the heat carrier and heat pipe to link together, are also associated on heat pipe scattered
Backing group；The heat pipe of a wherein radiating module is also connected with the groups of fins of remaining one or more radiating module, and fan, which is located at, to be dissipated
Between backing group, through-hole is offered on the cooling fin of groups of fins, each through-hole in same groups of fins forms air duct, described
Control method is：
First data acquisition step：Obtain the temperature difference △ T of indoor mean temperature Tr and preset target temperature Ts；
Freeze energizing step：The supply voltage U to the semiconductor refrigerating module for power supply is determined according to temperature difference △ T；
Radiating control step：
If supply voltage U ＞ setting values, starting fan is controlled, and adjusts the rotating speed of fan according to the size of temperature difference △ T；
If supply voltage U≤setting value, control fan is out of service;
First data acquisition step further includes acquiring the hot-side temperature of the semiconductor refrigerating module；And
The method further includes between first data acquisition step and the refrigeration energizing step：
Forbid temperature judging step in the first hot junction：Judge whether the hot-side temperature reaches or forbid temperature beyond preset；
If the hot-side temperature reaches or forbids temperature beyond described, executes following first and stop energizing step：It will be to described
The supply voltage of semiconductor refrigerating module is set as zero, stops to the semiconductor refrigerating module for power supply;
The method is forbidden in first hot junction：
If the hot-side temperature forbids temperature described in being less than, following hot junction protection temperature upper limit judgment step is continued to execute：Sentence
Whether the hot-side temperature that breaks reaches or protects temperature upper limit beyond preset hot junction, wherein hot junction protection temperature upper limit is small
Forbid temperature in described；
If the hot-side temperature reaches or protects temperature upper limit beyond the hot junction, executes following first and be down to maintenance voltage step
Suddenly：The supply voltage is reduced to preset maintenance voltage；
If the hot-side temperature, which is less than the hot junction, protects temperature upper limit, the refrigeration energizing step is executed.
2. according to the method described in claim 1, it is characterized in that, the semiconductor refrigerating equipment includes to semiconductor refrigerating mould
The power output module of block power supply, the power output module includes that the small output voltage range of rated power is（Umin,
Ubest）The first power output module and the big output voltage range of rated power be（Ubest, Umax）The second power output
Module；
First power output module is powered for the fan；
Wherein, the setting value is Ubest, and Ubest is the highest highest of refrigerating efficiency so that the semiconductor refrigerating module
Efficiency-voltage；
Umax >=according to the maximum cooling capacity voltage of refrigeration equipment maximum cooling capacity demand determination；
Umin≤according to the minimum refrigerating capacity voltage of the minimum refrigeration demand determination of refrigeration equipment.
3. according to the method described in claim 1, it is characterized in that,
The method further includes after being down to maintenance voltage step described first：
Second data acquisition step：The temperature difference of the mean temperature and the target temperature is obtained, and acquires the hot-side temperature；
Forbid temperature judging step in the second hot junction：Judge whether the hot-side temperature reaches or forbid temperature beyond described；
If the hot-side temperature reaches or forbids temperature beyond described, executes following second and stop energizing step：It will be to described
The supply voltage of semiconductor refrigerating module is set as zero, stops to the semiconductor refrigerating module for power supply；
If the hot-side temperature forbids temperature described in being less than, following hot junction protection lowest temperature judgment step is executed：Judge institute
Hot-side temperature is stated whether at or below preset hot junction protection lowest temperature, wherein hot junction protection lowest temperature is less than institute
State the hot-side temperature protection upper limit；
If the hot-side temperature protects lowest temperature at or below the hot junction, the refrigeration energizing step is executed；
If the hot-side temperature, which is more than the hot junction, protects lowest temperature, executes following second and be down to maintenance voltage step：Drop
It is low or keep the supply voltage to the maintenance voltage.
4. according to the method described in claim 3, it is characterized in that,
After executing the second stopping energizing step, the method is recycled back to second data acquisition step and continues to execute.
5. according to the method described in claim 3, it is characterized in that,
Execute described second be down to maintenance voltage step after, the method is recycled back to second data acquisition step and continues to hold
Row.
6. according to the method described in claim 1, it is characterized in that,
The maintenance voltage is the minimum refrigerating capacity voltage determined according to the minimum refrigeration demand of refrigeration equipment.
7. according to claim 1-6 any one of them methods, which is characterized in that
After executing the radiating control step, the method is recycled back to first data acquisition step and continues to execute.
8. according to the method described in claim 3, it is characterized in that, first data acquisition step and second data obtain
Step is taken to respectively include：
The preset target temperature is obtained, and acquires the mean temperature of refrigeration equipment compartment；
Calculate the temperature difference between the mean temperature and the pre-set target temperature Ts.
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| CN106253769B (en) * | 2016-08-08 | 2018-12-04 | 珠海格力电器股份有限公司 | Direct current fan motor control circuit and control method applying same |
| CN110749120B (en) * | 2019-10-10 | 2024-05-14 | 青岛海尔智能技术研发有限公司 | Method and device for controlling operation of semiconductor refrigeration equipment and refrigeration equipment |
| CN111503934B (en) * | 2020-04-27 | 2021-11-30 | 合肥美菱物联科技有限公司 | Refrigeration control method |
| CN114111197A (en) * | 2020-08-28 | 2022-03-01 | 青岛海尔特种电冰柜有限公司 | Control method of refrigeration appliance and refrigeration appliance |
| CN114251867B (en) * | 2020-09-25 | 2023-09-29 | 青岛海尔特种电冰柜有限公司 | Control method of semiconductor refrigeration device |
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