TWI626530B - Electronic system and external auxiliary heat dissipation device thereof - Google Patents

Electronic system and external auxiliary heat dissipation device thereof Download PDF

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Publication number
TWI626530B
TWI626530B TW104130093A TW104130093A TWI626530B TW I626530 B TWI626530 B TW I626530B TW 104130093 A TW104130093 A TW 104130093A TW 104130093 A TW104130093 A TW 104130093A TW I626530 B TWI626530 B TW I626530B
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Taiwan
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module
fluid
disposed
carrier
heat dissipation
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TW104130093A
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Chinese (zh)
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TW201710829A (en
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蔡水發
黃世偉
陳信宏
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訊凱國際股份有限公司
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Abstract

一種電子系統包括外接式輔助散熱裝置及電子裝置。外接式輔助散熱裝置包括:一外接式連接頭模組、一流體驅動模組、一散熱模組、及多個第一管線。外接式連接頭模組包括一第一承載體、及至少兩個設置於第一承載體的第一流體連接頭。多個第一管線連接第一流體連接頭、流體驅動模組、及散熱模組,以組成一第一流體路徑。電子裝置包括一內建式連接頭模組及多個第二管線,其中多個第二管線連接內建式連接頭模組,以組成一第二流體路徑,且內建式連接頭模組可拆卸地連接於外接式連接頭模組,以使得第一流體路徑與第二流體路徑組成一封閉流體路徑。 An electronic system includes an external auxiliary heat sink and an electronic device. The external auxiliary heat sink comprises: an external connector module, a fluid drive module, a heat dissipation module, and a plurality of first pipelines. The external connector module includes a first carrier and at least two first fluid connectors disposed on the first carrier. The plurality of first pipelines connect the first fluid connector, the fluid drive module, and the heat dissipation module to form a first fluid path. The electronic device comprises a built-in connector module and a plurality of second pipelines, wherein the plurality of second pipelines are connected to the built-in connector module to form a second fluid path, and the built-in connector module can be The detachable connection to the external connector module is such that the first fluid path and the second fluid path form a closed fluid path.

Description

電子系統及其外接式輔助散熱裝置 Electronic system and its external auxiliary heat sink

本發明係有關於一種電子系統及其輔助散熱裝置,尤指一種電子系統及其外接式輔助散熱裝置。 The invention relates to an electronic system and an auxiliary heat dissipating device thereof, in particular to an electronic system and an external auxiliary heat dissipating device thereof.

隨著中央處理器(CPU)處理速度與效能的提升,使得目前CPU的產熱量增加,而較高的工作頻率,也使得工作時的瓦數相對地提昇,其所產生的高溫會使CPU減低壽命,尤其當過多的熱量未能有效排除時,容易造成系統不穩定。為解決CPU過熱的問題,一般皆採用散熱器及風扇的組合,以強制冷卻的方式將熱量排除,而達到維持CPU的正常運作的效果。惟,習知的風扇於高轉速下所產生的擾人噪音及高耗電量,常是製造業者所難以克服的問題。 With the increase in processing speed and performance of the central processing unit (CPU), the current heat generation of the CPU is increased, and the higher operating frequency also increases the wattage during operation, and the high temperature generated by the CPU reduces the CPU. Lifespan, especially when too much heat is not effectively removed, can easily cause system instability. In order to solve the problem of CPU overheating, a combination of a heat sink and a fan is generally used to remove heat by forced cooling, thereby achieving the effect of maintaining the normal operation of the CPU. However, the disturbing noise and high power consumption of conventional fans at high speeds are often difficult for manufacturers to overcome.

為了解決上述習知的困擾,一種水冷頭散熱結構因應而生。習知的水冷頭散熱結構包括一座體及一設置在座體上的蓋體,其中座體具有多個散熱片,座體的底部會直接接觸一發熱源,並且蓋體具有一進水孔及一出水孔。藉此,透過座體的底部與發熱源的接觸,以使得發熱源所產生的熱量能傳導到多個散熱片上,然後再透過冷卻液於進水孔及出水孔之間的循環流動,以將多個散熱片所吸收的熱量快速導離,以達到快速散熱的目的。然而,習知的水冷頭散熱結構所使用的管路接頭在使用上仍有其不便性。 In order to solve the above-mentioned conventional problems, a water-cooling head heat dissipation structure is born. The conventional water-cooling head heat dissipating structure comprises a body and a cover body disposed on the seat body, wherein the seat body has a plurality of heat sinks, the bottom of the seat body directly contacts a heat source, and the cover body has a water inlet hole and a drainage. Thereby, the bottom of the base body is in contact with the heat source, so that the heat generated by the heat source can be conducted to the plurality of heat sinks, and then the cooling liquid flows through the circulation between the water inlet hole and the water outlet hole to The heat absorbed by the multiple heat sinks is quickly guided away to achieve rapid heat dissipation. However, the pipe joints used in the conventional water-cooling head heat dissipating structure are still inconvenient in use.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種電子系統及其外接式輔助散熱裝置。 The technical problem to be solved by the present invention is to provide an electronic system and an external auxiliary heat sink thereof for the deficiencies of the prior art.

本發明其中一實施例所提供的一種電子系統,其包括:一外接式輔助散熱裝置及一電子裝置。所述外接式輔助散熱裝置包括:一外接式連接頭模組、一流體驅動模組、一散熱模組、及多個第一管線。所述外接式連接頭模組包括一第一承載體、及至少兩個設置於所述第一承載體的第一流體連接頭。多個所述第一管線連接所述第一流體連接頭、所述流體驅動模組、及所述散熱模組,以組成一第一流體路徑。所述電子裝置包括一內建式連接頭模組及多個第二管線,其中多個所述第二管線連接所述內建式連接頭模組,以組成一第二流體路徑,且所述內建式連接頭模組可拆卸地連接於所述外接式連接頭模組,以使得所述第一流體路徑與所述第二流體路徑組成一封閉流體路徑。 An electronic system according to an embodiment of the present invention includes: an external auxiliary heat sink and an electronic device. The external auxiliary heat sink comprises: an external connector module, a fluid drive module, a heat dissipation module, and a plurality of first pipelines. The external connector module includes a first carrier and at least two first fluid connectors disposed on the first carrier. A plurality of the first pipelines connect the first fluid connector, the fluid drive module, and the heat dissipation module to form a first fluid path. The electronic device includes a built-in connector module and a plurality of second pipelines, wherein the plurality of second pipelines are connected to the built-in connector module to form a second fluid path, and the A built-in connector module is detachably coupled to the external connector module such that the first fluid path and the second fluid path form a closed fluid path.

本發明另外一實施例所提供的一種外接式輔助散熱裝置,其包括:一外接式連接頭模組、一流體驅動模組、及一散熱模組。所述外接式連接頭模組包括一第一承載體、及至少兩個設置於所述第一承載體的第一流體連接頭,並且多個所述第一管線連接所述第一流體連接頭、所述流體驅動模組、及所述散熱模組,以組成一第一流體路徑。 An external auxiliary heat sink according to another embodiment of the present invention includes: an external connector module, a fluid drive module, and a heat dissipation module. The external connector module includes a first carrier, and at least two first fluid connectors disposed on the first carrier, and a plurality of the first pipelines connected to the first fluid connector The fluid drive module and the heat dissipation module are configured to form a first fluid path.

綜上所述,本發明的有益效果可以在於,本發明實施例所提供的電子裝置及其外接式輔助散熱裝置,其可通過“多個所述第一管線連接所述第一流體連接頭、所述流體驅動模組、及所述散熱模組,以組成一第一流體路徑”及“多個所述第二管線連接所述內建式連接頭模組,以組成一第二流體路徑”的設計,以使得當所述內建式連接頭模組可拆卸地連接於所述外接式連接頭模組時,所述第一流體路徑與所述第二流體路徑就可組成一封閉流體路徑。 In summary, the present invention may provide an electronic device and an external auxiliary heat dissipating device thereof, which may be connected to the first fluid connector by a plurality of the first pipelines. The fluid drive module and the heat dissipation module are configured to form a first fluid path" and "the plurality of the second pipelines are connected to the built-in connector module to form a second fluid path" The first fluid path and the second fluid path form a closed fluid path when the built-in connector module is detachably coupled to the external connector module .

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下 有關本發明的詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 In order to further understand the features and technical contents of the present invention, please refer to the following The detailed description of the present invention and the accompanying drawings are intended to

E‧‧‧電子裝置 E‧‧‧Electronic device

D‧‧‧外接式輔助散熱裝置 D‧‧‧External auxiliary heat sink

M1‧‧‧外接式連接頭模組 M1‧‧‧External connector module

1‧‧‧第一承載體 1‧‧‧First carrier

10‧‧‧第一定位部 10‧‧‧First Positioning Department

101‧‧‧第一滑動軌道 101‧‧‧First sliding track

102‧‧‧第二滑動軌道 102‧‧‧Second sliding track

103‧‧‧限位凸塊 103‧‧‧ Limit bumps

2‧‧‧第一流體連接頭 2‧‧‧First fluid connector

2A‧‧‧第一內側連接部 2A‧‧‧First inner joint

2B‧‧‧第一外側連接部 2B‧‧‧First outer joint

21‧‧‧第一組合式管體 21‧‧‧First combined tube

211‧‧‧第一外側管體 211‧‧‧First outer tube

2110‧‧‧內壁面 2110‧‧‧ inner wall

212‧‧‧第一內側管體 212‧‧‧First inner tube

2120‧‧‧第一密封套環 2120‧‧‧First sealing collar

22‧‧‧第一彈性元件 22‧‧‧First elastic element

23‧‧‧第一可移動件 23‧‧‧First movable parts

230‧‧‧第二密封套環 230‧‧‧Second sealing collar

231‧‧‧第一頂抵部 231‧‧‧First Abutment

232‧‧‧第一流體輸入口 232‧‧‧First fluid input

233‧‧‧第一流體輸出口 233‧‧‧First fluid outlet

3‧‧‧第一電源連接頭 3‧‧‧First power connector

3A‧‧‧第一內側導電連接部 3A‧‧‧First inner conductive connection

3B‧‧‧第一外側導電連接部 3B‧‧‧First outer conductive connection

4‧‧‧第一卡固體 4‧‧‧First card solid

41‧‧‧彈性件 41‧‧‧Flexible parts

411‧‧‧固定部 411‧‧‧ Fixed Department

412‧‧‧彈性臂 412‧‧‧Flexible arm

413‧‧‧活動部 413‧‧‧ Activities Department

4130‧‧‧第一結構強化肋 4130‧‧‧First structural ribs

42‧‧‧按壓件 42‧‧‧Pressing parts

421‧‧‧按壓部 421‧‧‧ Pressing Department

4210‧‧‧第二結構強化肋 4210‧‧‧Second structural ribs

422‧‧‧延伸部 422‧‧‧Extension

4220‧‧‧第三結構強化肋 4220‧‧‧ Third structural reinforcement rib

423‧‧‧夾持部 423‧‧‧ gripping department

424‧‧‧卡鉤部 424‧‧‧Cut hook

4240‧‧‧第四結構強化肋 4240‧‧‧Four structural ribs

425‧‧‧第一滑動部 425‧‧‧First sliding part

4250‧‧‧第一接觸凸點 4250‧‧‧First contact bump

426‧‧‧第二滑動部 426‧‧‧Second sliding part

4260‧‧‧第二接觸凸點 4260‧‧‧second contact bump

4261‧‧‧限位卡鉤 4261‧‧‧Limit hook

M2‧‧‧流體驅動模組 M2‧‧‧ fluid drive module

M21‧‧‧外殼體 M21‧‧‧ outer casing

M211‧‧‧第一入水口 M211‧‧‧ first water inlet

M212‧‧‧第二入水口 M212‧‧‧Second water inlet

M213‧‧‧出水口 M213‧‧‧ water outlet

M22‧‧‧泵浦 M22‧‧‧ pump

M3‧‧‧散熱模組 M3‧‧‧ Thermal Module

M31‧‧‧第一水冷式散熱結構 M31‧‧‧First water-cooled heat dissipation structure

M310‧‧‧第一水冷式散熱器 M310‧‧‧First water-cooled radiator

M3101‧‧‧第一入水口 M3101‧‧‧ first water inlet

M3102‧‧‧第一出水口 M3102‧‧‧first outlet

M311‧‧‧第一散熱風扇 M311‧‧‧First cooling fan

M32‧‧‧第二水冷式散熱結構 M32‧‧‧Second water-cooled heat dissipation structure

M320‧‧‧第二水冷式散熱器 M320‧‧‧Second water-cooled radiator

M3201‧‧‧第二入水口 M3201‧‧‧Second water inlet

M3202‧‧‧第二出水口 M3202‧‧‧Second outlet

M321‧‧‧第二散熱風扇 M321‧‧‧Second cooling fan

M4‧‧‧流體補充模組 M4‧‧‧ Fluid Supplement Module

M41‧‧‧可替換式流體補充匣 M41‧‧‧Replaceable Fluid Supplement匣

M42‧‧‧快拆接頭 M42‧‧‧ quick release joint

M5‧‧‧電源供應模組 M5‧‧‧Power supply module

M6‧‧‧殼體模組 M6‧‧‧Shell module

M600‧‧‧透明觀景窗 M600‧‧‧Transparent viewing window

M7‧‧‧發光模組 M7‧‧‧Lighting Module

M71‧‧‧第一LED發光群組 M71‧‧‧First LED lighting group

M72‧‧‧第二LED發光群組 M72‧‧‧Second LED lighting group

M8‧‧‧承載模組 M8‧‧‧ bearing module

M81‧‧‧固定承載體 M81‧‧‧Fixed carrier

M82‧‧‧可滑動件 M82‧‧‧Slidable parts

M83‧‧‧扳動件 M83‧‧‧ Pulling parts

M84‧‧‧連動件 M84‧‧‧ linkages

M9‧‧‧內建式連接頭模組 M9‧‧‧ Built-in connector module

5‧‧‧第二承載體 5‧‧‧Second carrier

50‧‧‧第二定位部 50‧‧‧Second Positioning Department

6‧‧‧第二流體連接頭 6‧‧‧Second fluid connector

6A‧‧‧第二內側連接部 6A‧‧‧Second inner joint

6B‧‧‧第二外側連接部 6B‧‧‧Second outer joint

61‧‧‧第二組合式管體 61‧‧‧Second combined body

611‧‧‧第二外側管體 611‧‧‧Second outer tube

612‧‧‧第二內側管體 612‧‧‧Second inner tube

62‧‧‧內嵌式管體 62‧‧‧In-line body

620A‧‧‧第三密封套環 620A‧‧‧ Third sealing collar

620B‧‧‧第四密封套環 620B‧‧‧4th sealing collar

621‧‧‧第二頂抵部 621‧‧‧Second top

622‧‧‧第二流體輸入口 622‧‧‧Second fluid input

623‧‧‧第二流體輸出口 623‧‧‧Second fluid outlet

624‧‧‧環繞部 624‧‧‧ Surrounding

63‧‧‧第二彈性元件 63‧‧‧Second elastic element

64‧‧‧第二可移動件 64‧‧‧Second movable parts

640‧‧‧第五密封套環 640‧‧‧ fifth sealing collar

7‧‧‧第二電源連接頭 7‧‧‧Second power connector

7A‧‧‧第二內側導電連接部 7A‧‧‧Second inner conductive connection

7B‧‧‧第二外側導電連接部 7B‧‧‧Second outer conductive connection

8‧‧‧第二卡固體 8‧‧‧Second card solid

80‧‧‧卡鉤槽 80‧‧‧ hook slot

P1‧‧‧第一外接管 P1‧‧‧First external pipe

P2‧‧‧第二外接管 P2‧‧‧second external pipe

C1‧‧‧第一外接導電線 C1‧‧‧First external conductive wire

C2‧‧‧第二外接導電線 C2‧‧‧Second external conductive wire

T1‧‧‧第一管線 T1‧‧‧ first pipeline

T2‧‧‧第二管線 T2‧‧‧Second pipeline

圖1為本發明外接式輔助散熱裝置的上視示意圖。 1 is a top plan view of an external auxiliary heat sink of the present invention.

圖2為本發明電子系統(暫時移除承載模組)的上視示意圖。 2 is a top plan view of an electronic system (temporary removal of a carrier module) of the present invention.

圖3為本發明外接式輔助散熱裝置的散熱模組的立體示意圖。 3 is a perspective view of a heat dissipation module of an external auxiliary heat sink according to the present invention.

圖4為本發明外接式輔助散熱裝置的承載模組將外接式連接頭模組向後移動至一第一預定位置的立體示意圖。 4 is a perspective view showing the load module of the external auxiliary heat sink of the present invention moving the external connector module backward to a first predetermined position.

圖5為本發明外接式輔助散熱裝置的承載模組將外接式連接頭模組向前移動至一第二預定位置的立體示意圖。 FIG. 5 is a perspective view showing the carrier module of the external auxiliary heat sink of the present invention moving the external connector module forward to a second predetermined position.

圖6為本發明連接頭組合結構的外接式連接頭模組的其中一觀看視角的立體分解示意圖。 FIG. 6 is a perspective exploded view of one of the viewing angles of the external connector module of the connector assembly of the present invention.

圖7為本發明連接頭組合結構的外接式連接頭模組的其中一觀看視角的立體組合示意圖。 FIG. 7 is a perspective view of a perspective view of one of the viewing angles of the external connector module of the connector assembly of the present invention.

圖8為本發明連接頭組合結構的外接式連接頭模組的另外一觀看視角的立體分解示意圖。 FIG. 8 is a perspective exploded view of another perspective view of the external connector module of the connector assembly of the present invention.

圖9為本發明連接頭組合結構的外接式連接頭模組的另外一觀看視角的立體組合示意圖。 FIG. 9 is a perspective assembled view of another perspective view of the external connector module of the connector assembly of the present invention.

圖10為圖9的A-A割面線的部分剖面示意圖。 Figure 10 is a partial cross-sectional view showing the A-A cut line of Figure 9;

圖11為本發明連接頭組合結構的外接式連接頭模組的其中一觀看視角的立體分解示意圖。 11 is a perspective exploded view of one of the viewing angles of the external connector module of the connector assembly of the present invention.

圖12為本發明連接頭組合結構的外接式連接頭模組的其中一觀看視角的立體組合示意圖。 12 is a perspective assembled view of one of the viewing angles of the external connector module of the connector assembly of the present invention.

圖13為本發明連接頭組合結構的外接式連接頭模組的另外一觀看視角的立體分解示意圖。 FIG. 13 is a perspective exploded view of another perspective view of the external connector module of the connector assembly of the present invention.

圖14為本發明連接頭組合結構的外接式連接頭模組的另外一觀看視角的立體組合示意圖。 FIG. 14 is a perspective view showing a perspective view of another perspective view of the external connector module of the connector assembly of the present invention.

圖15為圖14的B-B割面線的部分剖面示意圖。 Figure 15 is a partial cross-sectional view showing the line B-B of Figure 14;

圖16為本發明電子系統及其外接式輔助散熱裝置的上視組合示意圖。 Figure 16 is a top plan view of the electronic system of the present invention and its external auxiliary heat sink.

圖17為本發明連接頭組合結構的立體組合示意圖。 Figure 17 is a perspective view showing the assembled structure of the joint structure of the joint of the present invention.

圖18為圖17的C-C割面線的部分剖面示意圖。 Figure 18 is a partial cross-sectional view showing the C-C cut line of Figure 17;

圖19為圖17的D-D割面線的剖面示意圖。 Fig. 19 is a schematic cross-sectional view showing the D-D cut line of Fig. 17;

圖20為圖17的E-E割面線的剖面示意圖。 Fig. 20 is a schematic cross-sectional view showing the E-E cut line of Fig. 17;

以下是通過特定的具體實例來說明本發明所揭露有關“電子系統及其外接式輔助散熱裝置”的實施方式,本領域技術人員可由本說明書所揭示的內容瞭解本發明的優點與功效。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。另外,本發明的圖式僅為簡單示意說明,並非依實際尺寸的描繪,先予敘明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所揭示的內容並非用以限制本發明的技術範疇。 The following is a specific example to illustrate the implementation of the "electronic system and its external auxiliary heat sink" disclosed by the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in the present specification. The present invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

請參閱圖1至圖5所示,本發明提供一種電子系統S,其包括:一外接式輔助散熱裝置D及一電子裝置E,其中圖2所示的箭頭代表流體流動的方向。 Referring to FIG. 1 to FIG. 5, the present invention provides an electronic system S comprising: an external auxiliary heat sink D and an electronic device E, wherein the arrows shown in FIG. 2 represent the direction of fluid flow.

首先,配合圖1及圖2所示,外接式輔助散熱裝置D包括:一外接式連接頭模組M1、一流體驅動模組M2、一散熱模組M3、及多個第一管線T1。其中,外接式連接頭模組M1包括一第一承載體1、及至少兩個設置於第一承載體1的第一流體連接頭2,並且多個第一管線T1連接第一流體連接頭2、流體驅動模組M2、及散熱模組M3,以組成一第一流體路徑。 First, as shown in FIG. 1 and FIG. 2, the external auxiliary heat sink D includes an external connector module M1, a fluid drive module M2, a heat dissipation module M3, and a plurality of first pipelines T1. The external connector module M1 includes a first carrier 1 and at least two first fluid connectors 2 disposed on the first carrier 1 , and the plurality of first conduits T1 are connected to the first fluid connector 2 . The fluid drive module M2 and the heat dissipation module M3 form a first fluid path.

更進一步來說,至少兩個第一流體連接頭2設置於(例如貫穿)第一承載體1,並且外接式連接頭模組M1還包括一設置於(例如貫穿)第一承載體1的第一電源連接頭3、及一設置在第一承載體 1上的第一卡固體4。另外,流體驅動模組M2通過第一管線T1以流體連通於(in fluid communication with)其中一第一流體連接頭2,並且散熱模組M3通過第一管線T1以流體連通於另外一第一流體連接頭2及流體驅動模組M2之間。 Further, at least two first fluid connectors 2 are disposed (eg, through) the first carrier 1 , and the external connector module M1 further includes a first (eg, through) first carrier 1 a power connector 3, and a first carrier The first card solid on the 1 is 4. In addition, the fluid drive module M2 is in fluid communication with one of the first fluid connectors 2 through the first line T1, and the heat dissipation module M3 is in fluid communication with the other first fluid through the first line T1. Between the connector 2 and the fluid drive module M2.

承上所言,配合圖2及圖3所示,散熱模組M3包括一通過第一管線T1以流體連通於其中一第一流體連接頭2的第一水冷式散熱結構M31及一通過第一管線T1以流體連通於第一水冷式散熱結構M31的第二水冷式散熱結構M32,並且第一水冷式散熱結構M31及第二水冷式散熱結構M32相對於流體驅動模組M2可以呈現對稱設置的佈局設計。舉例來說,第一水冷式散熱結構M31可由一第一水冷式散熱器M310及一設置在第一水冷式散熱器M310的底端上的第一散熱風扇M311,並且第一水冷式散熱器M310具有一第一入水口M3101及一第一出水口M3102。另外,第二水冷式散熱結構M32可由一第二水冷式散熱器M320及一設置在第二水冷式散熱器M320的底端上的第二散熱風扇M321,並且第二水冷式散熱器M320具有一第二入水口M3201及一第二出水口M3202。 As shown in FIG. 2 and FIG. 3, the heat dissipation module M3 includes a first water-cooling heat dissipation structure M31 that is in fluid communication with one of the first fluid connectors 2 through the first line T1, and a first through the first The pipeline T1 is in fluid communication with the second water-cooling heat dissipation structure M32 of the first water-cooling heat dissipation structure M31, and the first water-cooling heat dissipation structure M31 and the second water-cooling heat dissipation structure M32 can be symmetrically arranged with respect to the fluid drive module M2. Layout design. For example, the first water-cooled heat dissipation structure M31 may be a first water-cooled heat sink M310 and a first heat-dissipating fan M311 disposed on the bottom end of the first water-cooled heat sink M310, and the first water-cooled heat sink M310 There is a first water inlet M3101 and a first water outlet M3102. In addition, the second water-cooling heat dissipation structure M32 may include a second water-cooling heat sink M320 and a second heat-dissipating fan M321 disposed on the bottom end of the second water-cooling heat sink M320, and the second water-cooling heat sink M320 has a The second water inlet M3201 and the second water outlet M3202.

再者,配合圖1及圖2所示,電子裝置E包括一內建式連接頭模組M9,內建式連接頭模組M9可拆卸地連接於外接式連接頭模組M1。更進一步來說,內建式連接頭模組M9包括一可拆卸地連接於第一承載體1的第二承載體5、至少兩個設置於(例如貫穿)第二承載體5且分別可拆卸地連接於至少兩個第一流體連接頭2的第二流體連接頭6、一設置於(例如貫穿)第二承載體5且可拆卸地電性連接於第一電源連接頭3與電子裝置E之間的第二電源連接頭7、及一設置在第二承載體5上且與第一卡固體4可拆卸地相互卡固配合的第二卡固體8。 Furthermore, as shown in FIG. 1 and FIG. 2, the electronic device E includes a built-in connector module M9, and the built-in connector module M9 is detachably connected to the external connector module M1. Further, the built-in connector module M9 includes a second carrier 5 detachably coupled to the first carrier 1 , and at least two are disposed (eg, through) the second carrier 5 and are respectively detachable The second fluid connection head 6 is connected to the at least two first fluid connection heads 2 , is disposed (eg, penetrates) the second carrier body 5 , and is detachably electrically connected to the first power connection connector 3 and the electronic device E A second power connector 7 is disposed between the second power connector 7 and a second card body 8 disposed on the second carrier 5 and detachably engaging with the first card body 4.

更進一步來說,如圖2所示,電子裝置E更進一步包括多個在電子裝置E內佈局的第二管線T2,並且兩個第二管線T2分別 連接於兩個第二流體連接頭6。其中,多個第二管線T2連接內建式連接頭模組M9,以組成一第二流體路徑。藉此,由於內建式連接頭模組M9可拆卸地連接於外接式連接頭模組M1,以使得第一流體路徑與第二流體路徑組成一封閉流體路徑。換言之,藉由流體驅動模組M2的驅動,本發明可通過由“多個第二管線T2連接內建式連接頭模組M9”所組成的第二流體路徑來將電子裝置E所產生的熱傳送至由“多個第一管線T1連接第一流體連接頭2、流體驅動模組M2、及散熱模組M3”所組成的第一流體路徑,藉此以利用由“第一流體路徑與第二流體路徑”所組成的封閉流體路徑來進行散熱。 Further, as shown in FIG. 2, the electronic device E further includes a plurality of second pipelines T2 disposed in the electronic device E, and the two second pipelines T2 respectively Connected to two second fluid connectors 6. Wherein, the plurality of second pipelines T2 are connected to the built-in connector module M9 to form a second fluid path. Thereby, the built-in connector module M9 is detachably connected to the external connector module M1 such that the first fluid path and the second fluid path form a closed fluid path. In other words, by driving the fluid drive module M2, the present invention can heat the electronic device E through a second fluid path composed of "a plurality of second pipelines T2 connected to the built-in connector module M9". Transmitting to a first fluid path composed of "a plurality of first pipelines T1 connecting the first fluid connector 2, the fluid drive module M2, and the heat dissipation module M3", thereby utilizing the "first fluid path and the first A closed fluid path consisting of a two-fluid path for heat dissipation.

更進一步來說,配合圖1及圖2所示,外接式輔助散熱裝置D還進一步包括一流體補充模組M4,並且流體補充模組M4包括一可替換式流體補充匣M41及一通過第一管線T1以流體連通於可替換式流體補充匣M41的快拆接頭M42。藉此,當針偵到外接式輔助散熱裝置D內部的散熱液體量不足時,本發明可通過可替換式流體補充匣M41來進行散熱液體的補充。值得一提的是,配合圖2及圖3所示,流體驅動模組M2包括一外殼體M21及一設置在外殼M21內的泵浦M22,並且外殼體M21具有一通過第一管線T1以流體連通於第二水冷式散熱結構M32的第一入水口M211、一通過第一管線T1以流體連通於快拆接頭M42的第二入水口M212、及一通過第一管線T1以流體連接於另外一第一流體連接頭2的出水口M213。 Furthermore, as shown in FIG. 1 and FIG. 2, the external auxiliary heat sink D further includes a fluid replenishing module M4, and the fluid replenishing module M4 includes a replaceable fluid supplement 匣M41 and a first pass Line T1 is in fluid communication with the quick release joint M42 of the replaceable fluid supply 匣M41. Thereby, when the needle detects that the amount of heat-dissipating liquid inside the external auxiliary heat sink D is insufficient, the present invention can supplement the heat-dissipating liquid by the replaceable fluid supplement 匣M41. It is worth mentioning that, as shown in FIG. 2 and FIG. 3, the fluid drive module M2 includes an outer casing M21 and a pump M22 disposed in the outer casing M21. The outer casing M21 has a fluid through the first pipeline T1. a first water inlet M211 communicating with the second water-cooling heat dissipation structure M32, a second water inlet M212 that is in fluid communication with the quick release joint M42 through the first line T1, and a fluid connection to the other through the first line T1 The water outlet M213 of the first fluid connection head 2.

更進一步來說,如圖2所示,外接式輔助散熱裝置D還進一步包括一電源供應模組M5,並且電源供應模組M5電性連接於第一電源連接頭3,所以電源供應模組M5(例如可充電電池)就可做為電子裝置E的供電來源。然而,額外增設的電源供應模組M5並非用以限定本發明,例如第一電源連接頭3亦可通過電源線以連接至一市電插座。 Further, as shown in FIG. 2, the external auxiliary heat sink D further includes a power supply module M5, and the power supply module M5 is electrically connected to the first power connector 3, so the power supply module M5 (for example, a rechargeable battery) can be used as a power source for the electronic device E. However, the additional power supply module M5 is not intended to limit the present invention. For example, the first power connector 3 can also be connected to a mains socket through a power line.

更進一步來說,如圖2所示,外接式輔助散熱裝置D還進一步包括一殼體模組M6及一發光模組M7。其中,殼體模組M6具有一透明觀景窗M600。另外,發光模組M7包括分別設置在散熱模組M3的第一水冷式散熱結構M31的第二水冷式散熱結構M32上的一第一LED發光群組M71及第二LED發光群組M72,並且發光模組M7所產生的光源會從透明觀景窗M600穿透而出。 Furthermore, as shown in FIG. 2, the external auxiliary heat sink D further includes a housing module M6 and a lighting module M7. The housing module M6 has a transparent viewing window M600. In addition, the light emitting module M7 includes a first LED lighting group M71 and a second LED lighting group M72 respectively disposed on the second water-cooling heat dissipation structure M32 of the first water-cooling heat dissipation structure M31 of the heat dissipation module M3, and The light source generated by the light-emitting module M7 is penetrated from the transparent viewing window M600.

更進一步來說,配合圖1、圖4、及圖5所示,外接式輔助散熱裝置D還進一步包括一承載模組M8,並且承載模組M8包括一固定承載體M81、一可滑動地設置在固定承載體M81上且承載外接式連接頭模組M1的可滑動件M82、一樞接設置在固定承載體M81上的扳動件M83、及一樞接在可滑動件M82及扳動件M83之間的連動件M84。再者,如圖4所示,當扳動件M83向下扳動時(如向下的箭頭所示),可滑動件M82會通過連動件M84的帶動而向後移動(如向後的箭頭所示),此時外接式連接頭模組M1就會跟著可滑動件M82一起向後移動,藉此以脫離內建式連接頭模組M9。如圖5所示,當扳動件M83向上扳動時(如向上的箭頭所示),可滑動件M82會通過連動件M84的帶動而向前移動(如向前的箭頭所示),此時外接式連接頭模組M1就會跟著可滑動件M82一起向前移動,藉此以與內建式連接頭模組M9彼此卡扣結合。 Further, as shown in FIG. 1 , FIG. 4 , and FIG. 5 , the external auxiliary heat sink D further includes a carrying module M8 , and the carrying module M8 includes a fixed carrier M81 and a slidably disposed a slidable member M82 on the fixed carrier M81 and carrying the external connector module M1, a triggering member M83 pivotally disposed on the fixed carrier M81, and a pivoting member 401 and a slidable member Linkage M84 between M83. Furthermore, as shown in FIG. 4, when the trigger member M83 is pulled downward (as indicated by the downward arrow), the slidable member M82 is moved backward by the linkage M84 (as indicated by the backward arrow). At this time, the external connector module M1 moves backward along with the slidable member M82, thereby disengaging the built-in connector module M9. As shown in FIG. 5, when the trigger member M83 is pulled upward (as indicated by the upward arrow), the slidable member M82 is moved forward by the linkage M84 (as indicated by the forward arrow). When the external connector module M1 moves forward together with the slidable member M82, it is snap-fitted to the built-in connector module M9.

值得注意的是,外接式連接頭模組M1、流體驅動模組M2、散熱模組M3、流體補充模組M4、電源供應模組M5、發光模組M7、及承載模組M8都會設置在殼體模組M6的內部。 It is worth noting that the external connector module M1, the fluid drive module M2, the heat dissipation module M3, the fluid supplement module M4, the power supply module M5, the illumination module M7, and the carrier module M8 are all disposed in the shell. The inside of the body module M6.

請參閱圖6至圖20所示,外接式連接頭模組M1及內建式連接頭模組M9可以組合成一種多功能整合式連接頭組合結構,其中多功能整合式連接頭組合結構可視為一種將流體通路與電性通路進行整合的快拆接頭。 Referring to FIG. 6 to FIG. 20, the external connector module M1 and the built-in connector module M9 can be combined into a multi-functional integrated connector assembly structure, wherein the multifunctional integrated connector assembly structure can be regarded as A quick release joint that integrates a fluid pathway with an electrical pathway.

首先,配合圖6至圖10、及圖16至圖18所示,外接式連接頭模組M1包括一第一承載體1、至少兩個設置於(例如貫穿)第一 承載體1的第一流體連接頭2、一設置於(例如貫穿)第一承載體1的第一電源連接頭3、及一設置在第一承載體1上的第一卡固體4。更進一步來說,每一個第一流體連接頭2具有一第一內側連接部2A及一相對於第一內側連接部2A且連接於一第一外接管P1(例如軟性接管)的第一外側連接部2B,並且第一電源連接頭3具有一第一內側導電連接部3A及一相對於第一內側導電連接部3A且電性連接於一第一外接導電線C1的第一外側導電連接部3B。 First, as shown in FIG. 6 to FIG. 10 and FIG. 16 to FIG. 18, the external connector module M1 includes a first carrier 1 and at least two are disposed (eg, through). The first fluid connection head 2 of the carrier 1 , a first power connector 3 disposed on the first carrier 1 , for example, and a first card body 4 disposed on the first carrier 1 . Furthermore, each of the first fluid connectors 2 has a first inner connecting portion 2A and a first outer connecting portion connected to the first inner connecting portion 2A and connected to a first outer connecting tube P1 (for example, a flexible connecting tube). The first power connection connector 3 has a first inner conductive connection portion 3A and a first outer conductive connection portion 3B that is electrically connected to the first outer conductive connection portion 3A and electrically connected to a first external conductive line C1. .

舉例來說,第一承載體1具有至少兩個第一定位部10。每一個第一流體連接頭2包括一設置於(例如貫穿)第一承載體1的第一組合式管體21、一設置在第一組合式管體21內的第一彈性元件22(例如彈簧)、及一可移動地設置在第一組合式管體21內且頂抵第一彈性元件22的第一可移動件23。更進一步來說,第一組合式管體21包括一連接於第一外接管P1的第一外側管體211及一連接於第一外側管體211的第一內側管體212,其中第一外側連接部2B設置在第一外側管體211上且裸露在第一承載體1的外部,第一內側連接部2A設置在第一內側管體212上且裸露在第一承載體1的外部,並且第一內側管體212具有一套設在第一內側連接部2A上的第一密封套環2120。另外,第一彈性元件22連接於第一外側管體211的一內壁面2110與第一可移動件23之間。此外,第一可移動件23具有一第一頂抵部231、至少一連通於第一內側管體212的第一流體輸入口232、及至少一連通於至少一第一流體輸入口232的第一流體輸出口233,並且第一可移動件23具有一套設其上的第二密封套環230。 For example, the first carrier 1 has at least two first positioning portions 10. Each of the first fluid connectors 2 includes a first combined tubular body 21 disposed (eg, penetrating) through the first carrier 1 and a first resilient member 22 disposed within the first modular tubular body 21 (eg, a spring) And a first movable member 23 movably disposed in the first combined tubular body 21 and abutting against the first elastic member 22. Furthermore, the first combined tubular body 21 includes a first outer tubular body 211 coupled to the first outer tubular body P1 and a first inner tubular body 212 coupled to the first outer tubular body 211, wherein the first outer tubular body 212 The connecting portion 2B is disposed on the first outer tube body 211 and exposed outside the first carrier body 1 , and the first inner connecting portion 2A is disposed on the first inner tube body 212 and exposed outside the first carrier body 1 , and The first inner tube body 212 has a first sealing collar 2120 disposed on the first inner connecting portion 2A. In addition, the first elastic member 22 is coupled between an inner wall surface 2110 of the first outer tubular body 211 and the first movable member 23. In addition, the first movable member 23 has a first abutting portion 231 , at least one first fluid input port 232 communicating with the first inner tubular body 212 , and at least one communicating with the at least one first fluid input port 232 . A fluid outlet port 233, and the first movable member 23 has a second set of collars 230 disposed thereon.

再者,配合圖11至圖15、及圖16至圖18所示,內建式連接頭模組M9可拆卸地連接於外接式連接頭模組M1,其中內建式連接頭模組M9包括一可拆卸地連接於第一承載體1的第二承載體5、至少兩個設置於(例如貫穿)第二承載體5且分別可拆卸地連接 於至少兩個第一流體連接頭2的第二流體連接頭6、一設置於(例如貫穿)第二承載體5且可拆卸地電性連接於第一電源連接頭3的第二電源連接頭7、及一設置在第二承載體5上且與第一卡固體4可拆卸地相互卡固配合的第二卡固體8。更進一步來說,每一個第二流體連接頭6具有一連接於相對應的第一內側連接部2A的第二內側連接部6A及一相對於第二內側連接部6A且連接於一第二外接管P2(例如軟性接管)的第二外側連接部6B,並且第二電源連接頭7具有一電性連接於第一內側導電連接部3A的第二內側導電連接部7A及一相對於第二內側導電連接部7A且電性連接於一第二外接導電線C2的第二外側導電連接部7B。 Furthermore, as shown in FIG. 11 to FIG. 15 and FIG. 16 to FIG. 18, the built-in connector module M9 is detachably connected to the external connector module M1, wherein the built-in connector module M9 includes a second carrier 5 detachably connected to the first carrier 1 , at least two disposed (eg, penetrating) the second carrier 5 and detachably connected a second fluid connector 6 of the at least two first fluid connectors 2, a second power connector disposed on the second carrier 5 and detachably electrically connected to the first power connector 3 7. A second card solid 8 disposed on the second carrier 5 and detachably engaging with the first card solid 4. Further, each of the second fluid connectors 6 has a second inner connecting portion 6A connected to the corresponding first inner connecting portion 2A and a second inner connecting portion 6A and connected to a second outer portion. The second outer connecting portion 6B of the P2 (for example, the flexible connecting tube) is connected, and the second power connecting connector 7 has a second inner conductive connecting portion 7A electrically connected to the first inner conductive connecting portion 3A and a second inner side. The conductive connecting portion 7A is electrically connected to the second outer conductive connecting portion 7B of the second external conductive line C2.

舉例來說,第二承載體5具有至少兩個分別用於容置至少兩個第一定位部10的第二定位部50。每一個第二流體連接頭6包括一設置於(例如貫穿)第二承載體5的第二組合式管體61、一被定位在第二組合式管體61內的內嵌式管體62、一套設在內嵌式管體62上的第二彈性元件63、及一可移動地套設在內嵌式管體62上且頂抵第二彈性元件63的第二可移動件64。更進一步來說,第二組合式管體61包括一連接於第二外接管P2的第二外側管體611及一連接於第二外側管體611的第二內側管體612,其中第二外側連接部6B設置在第二外側管體611上且裸露在第二承載體5的外部,第二內側連接部6A設置在第二內側管體612的內部,以容置第一內側連接部2A。此外,內嵌式管體62具有一頂抵於第一頂抵部231的第二頂抵部621、至少一連通於第二內側管體612的第二流體輸入口622、及至少一連通於第二外側管體611的第二流體輸出口623,其中內嵌式管體62具有套設其上的一第三密封套環620A及一第四密封套環620B。另外,第二彈性元件63連接於內嵌式管體62的一環繞部624與第二可移動件64之間。再者,第二可移動件64可在內嵌式管體62上滑動,以選擇性開啟或封閉至少一第二流體輸入口622,並且第二可移動件64具有套設其上 的一第四密封套環640。 For example, the second carrier 5 has at least two second positioning portions 50 for accommodating at least two first positioning portions 10, respectively. Each of the second fluid connectors 6 includes a second combined tubular body 61 disposed (eg, penetrating) through the second carrier 5, and an embedded tubular body 62 positioned within the second combined tubular body 61. A second elastic member 63 is disposed on the inner tubular body 62, and a second movable member 64 is movably sleeved on the inner tubular body 62 and abuts against the second elastic member 63. Furthermore, the second combined tubular body 61 includes a second outer tubular body 611 connected to the second outer tubular body P2 and a second inner tubular body 612 connected to the second outer tubular body 611, wherein the second outer tubular body 612 The connecting portion 6B is disposed on the second outer tube body 611 and exposed to the outside of the second carrier body 5, and the second inner connecting portion 6A is disposed inside the second inner tube body 612 to accommodate the first inner connecting portion 2A. In addition, the in-line tubular body 62 has a second abutting portion 621 that abuts against the first abutting portion 231, at least one second fluid input port 622 that communicates with the second inner tubular body 612, and at least one communication The second fluid outlet 623 of the second outer tubular body 611, wherein the inner tubular body 62 has a third sealing collar 620A and a fourth sealing collar 620B disposed thereon. In addition, the second elastic member 63 is coupled between a surrounding portion 624 of the in-line tubular body 62 and the second movable member 64. Furthermore, the second movable member 64 is slidable on the inner tubular body 62 to selectively open or close the at least one second fluid input port 622, and the second movable member 64 has a sleeve thereon A fourth sealing collar 640.

更進一步來說,配合圖6、圖8、圖13、及圖16至圖20所示,第一卡固體4包括一設置在第一承載體1的頂端上的彈性件41(例如彈片)及一可拆卸地連接於彈性件41的按壓件42。其中,彈性件41具有一固定設置在第一承載體1的頂端上的固定部411、至少兩個從固定部411延伸而出的彈性臂412、及一連接於彈性臂412的活動部413。另外,按壓件42具有一設置在第一承載體1的底端的下方且相距第一承載體1一預定距離的按壓部421、兩個分別從按壓部421的兩相反側端向上延伸而出且插入第一承載體1內的延伸部422、兩個分別從兩個延伸部422向上延伸而出且分別夾住活動部413的夾持部423、兩個分別從兩個延伸部422向前延伸而出的卡鉤部424、兩個分別從兩個延伸部422向內延伸而出的第一滑動部425、及兩個分別從兩個延伸部422向內延伸而出的第二滑動部426。再者,第二卡固體8具有兩個分別容置兩個卡鉤部424的卡鉤槽80。值得注意的是,當使用者按壓按壓件42的按壓部421時,兩個卡鉤部424就會分別脫離兩個卡鉤槽80,以使得外接式連接頭模組M1可通過第一彈性元件22及第二彈性元件63所提供的彈力作用,以分離內建式連接頭模組M9。 Furthermore, as shown in FIG. 6, FIG. 8, FIG. 13, and FIG. 16 to FIG. 20, the first card solid 4 includes an elastic member 41 (for example, a spring piece) disposed on the top end of the first carrier 1 and A pressing member 42 that is detachably coupled to the elastic member 41. The elastic member 41 has a fixing portion 411 fixedly disposed on the top end of the first carrier 1, at least two elastic arms 412 extending from the fixing portion 411, and a movable portion 413 connected to the elastic arm 412. In addition, the pressing member 42 has a pressing portion 421 disposed under the bottom end of the first carrier 1 and at a predetermined distance from the first carrier 1, and two extending upward from opposite end sides of the pressing portion 421, respectively. An extending portion 422 inserted into the first carrier 1 and two clamping portions 423 extending upward from the two extending portions 422 and respectively sandwiching the movable portion 413, and two extending forward from the two extending portions 422 respectively The hook portion 424 and the first sliding portion 425 extending inwardly from the two extending portions 422 and the second sliding portion 426 extending inwardly from the two extending portions 422 respectively . Furthermore, the second card solid 8 has two hook slots 80 that respectively receive the two hook portions 424. It should be noted that when the user presses the pressing portion 421 of the pressing member 42, the two hook portions 424 are respectively separated from the two hook grooves 80, so that the external connector module M1 can pass the first elastic member. 22 and the elastic force provided by the second elastic member 63 to separate the built-in connector module M9.

舉例來說,彈性件41具有至少一設置在活動部413上的第一結構強化肋4130,並且按壓件42具有至少一設置在按壓部421上的第二結構強化肋4210、至少兩個分別設置在兩個延伸部422上的第三結構強化肋4220、及至少兩個分別設置在兩個卡鉤部424上的第四結構強化肋4240。另外,第一承載體1具有兩個分別容置兩個第一滑動部425的第一滑動軌道101、兩個分別容置兩個第二滑動部426的第二滑動軌道102、及兩個分別鄰近兩個第二滑動軌道102的限位凸塊103。此外,每一個第一滑動部425具有多個接觸相對應的第一滑動軌道101的第一接觸凸點4250,並且每一個第二滑動部426具有多個接觸相對應的第二滑動軌道102的第 二接觸凸點4260及一接觸相對應的限位凸塊103的限位卡鉤4261。 For example, the elastic member 41 has at least one first structural reinforcing rib 4130 disposed on the movable portion 413, and the pressing member 42 has at least one second structural reinforcing rib 4210 disposed on the pressing portion 421, at least two separately disposed A third structural reinforcing rib 4220 on the two extensions 422 and at least two fourth structural reinforcing ribs 4240 respectively disposed on the two hook portions 424. In addition, the first carrier 1 has two first sliding rails 101 respectively accommodating the two first sliding portions 425, two second sliding rails 102 respectively accommodating the two second sliding portions 426, and two respectively The limiting bumps 103 of the two second sliding tracks 102 are adjacent to each other. In addition, each of the first sliding portions 425 has a plurality of first contact bumps 4250 contacting the corresponding first sliding rails 101, and each of the second sliding portions 426 has a plurality of second sliding rails 102 corresponding to the contacts. First The two contact bumps 4260 and a limit hook 4261 contacting the corresponding limit bumps 103.

值得一提的是,如圖16所示,本發明所提供的多功能整合式連接頭組合結構可以被應用在任何電子裝置E(例如電腦主機)上,其中內建式連接頭模組M9可以被嵌設在電子裝置E的內部,而外接式連接頭模組M1可以被放置在電子裝置E的外部。當然,電子裝置E亦可替換成任何的散熱承載板。舉例來說,散熱承載板可以是散熱板,並且內建式連接頭模組M9可固定在散熱板上。 It is worth mentioning that, as shown in FIG. 16 , the multifunctional integrated connector assembly structure provided by the present invention can be applied to any electronic device E (for example, a computer host), wherein the built-in connector module M9 can be It is embedded inside the electronic device E, and the external connector module M1 can be placed outside the electronic device E. Of course, the electronic device E can also be replaced with any heat dissipation carrier. For example, the heat dissipation carrier board may be a heat dissipation board, and the built-in connector module M9 may be fixed on the heat dissipation board.

〔實施例的可行功效〕 [Effective effect of the embodiment]

綜上所述,本發明的有益效果可以在於,本發明實施例所提供的電子裝置E及其外接式輔助散熱裝置D,其可通過“多個第一管線T1連接第一流體連接頭2、流體驅動模組M2、及散熱模組M3,以組成一第一流體路徑”及“多個第二管線T2連接內建式連接頭模組M9,以組成一第二流體路徑”的設計,以使得當內建式連接頭模組M9可拆卸地連接於外接式連接頭模組M1時,第一流體路徑與第二流體路徑就可以組成一封閉流體路徑。 In summary, the electronic device E and the external auxiliary heat dissipating device D provided by the embodiments of the present invention can be connected to the first fluid connector 2 through a plurality of first pipelines T1. The fluid drive module M2 and the heat dissipation module M3 are configured to form a first fluid path and the plurality of second pipelines T2 are connected to the built-in connector module M9 to form a second fluid path. When the built-in connector module M9 is detachably connected to the external connector module M1, the first fluid path and the second fluid path can form a closed fluid path.

值得一提的是,本發明實施例所提供的電子裝置E及其外接式輔助散熱裝置D,其可通過“每一個第一流體連接頭2具有一第一內側連接部2A及一相對於第一內側連接部2A且連接於一第一外接管P1的第一外側連接部2B,且每一個第二流體連接頭6具有一連接於相對應的第一內側連接部2A的第二內側連接部6A及一相對於第二內側連接部6A且連接於一第二外接管P2的第二外側連接部6B”及“第一電源連接頭3具有一第一內側導電連接部3A及一相對於第一內側導電連接部3A且電性連接於一第一外接導電線C1的第一外側導電連接部3B,且第二電源連接頭7具有一電性連接於第一內側導電連接部3A的第二內測導電連接部7A及一相對於第二內側導電連接部7A且電性連接於一第二外接導電線C2的第二外側導電連接部7B”的設計,以達到“第一流 體連接頭2與第二流體連接頭6彼此相連通所產生的流體通路”及“第一電源連接頭3與第二電源連接頭7彼此電性連接所產生的電性通路”雙通路功能的整合。 It is to be noted that the electronic device E and the external auxiliary heat dissipating device D provided by the embodiments of the present invention can pass the “each first fluid connection head 2 has a first inner connecting portion 2A and a relative to the first An inner connecting portion 2A is connected to the first outer connecting portion 2B of the first outer connecting tube P1, and each of the second fluid connecting heads 6 has a second inner connecting portion connected to the corresponding first inner connecting portion 2A. 6A and a second outer connecting portion 6B" and a first power connecting connector 3 connected to a second outer connecting portion 6A and a second outer connecting portion 3A have a first inner conductive connecting portion 3A and a relative to the first An inner conductive connecting portion 3A is electrically connected to the first outer conductive connecting portion 3B of the first external conductive line C1, and the second power connecting connector 7 has a second electrical connection to the first inner conductive connecting portion 3A. The inner conductive connection portion 7A and a second outer conductive connection portion 7B" of the second outer conductive connection portion 7A and the second outer conductive line C2 are electrically connected to each other to achieve the "first flow" Integration of a fluid path created by the body connector 2 and the second fluid connector 6 in communication with each other and an electrical path generated by electrically connecting the first power connector 3 and the second power connector 7 to each other .

以上所述僅為本發明的較佳可行實施例,非因此侷限本發明的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

Claims (17)

一種電子系統,其包括:一外接式輔助散熱裝置,所述外接式輔助散熱裝置包括:一外接式連接頭模組,所述外接式連接頭模組包括一第一承載體、及至少兩個設置於所述第一承載體的第一流體連接頭;一流體驅動模組;一散熱模組;多個第一管線,多個所述第一管線連接所述第一流體連接頭、所述流體驅動模組、及所述散熱模組,以組成一第一流體路徑;以及一流體補充模組,且所述流體補充模組包括一可替換式流體補充匣;以及一電子裝置,所述電子裝置包括一內建式連接頭模組及多個第二管線,其中多個所述第二管線連接所述內建式連接頭模組,以組成一第二流體路徑,且所述內建式連接頭模組可拆卸地連接於所述外接式連接頭模組,以使得所述第一流體路徑與所述第二流體路徑組成一封閉流體路徑。 An electronic system comprising: an external auxiliary heat sink, the external auxiliary heat sink comprising: an external connector module, the external connector module comprising a first carrier, and at least two a first fluid connection head disposed on the first carrier; a fluid drive module; a heat dissipation module; a plurality of first pipelines, a plurality of the first pipelines connecting the first fluid connector, the a fluid drive module and the heat dissipation module to form a first fluid path; and a fluid supplement module, wherein the fluid supplement module includes a replaceable fluid supplement cartridge; and an electronic device, The electronic device includes a built-in connector module and a plurality of second pipelines, wherein the plurality of second pipelines are connected to the built-in connector module to form a second fluid path, and the built-in The connector module is detachably coupled to the external connector module such that the first fluid path and the second fluid path form a closed fluid path. 如請求項1所述的電子系統,其中至少一所述第一流體連接頭包括一貫穿所述第一承載體的第一組合式管體、一設置在所述第一組合式管體內的第一彈性元件、及一可移動地設置在所述第一組合式管體內且頂抵所述第一彈性元件的第一可移動件。 The electronic system of claim 1, wherein at least one of the first fluid connectors comprises a first combined tubular body extending through the first carrier, and a first disposed in the first combined tubular body An elastic member, and a first movable member movably disposed in the first combined tubular body and abutting against the first elastic member. 如請求項1所述的電子系統,其中所述外接式連接頭模組包括一設置於所述第一承載體的第一電源連接頭、及至少一設置在所述第一承載體上的第一卡固體。 The electronic system of claim 1, wherein the external connector module includes a first power connector disposed on the first carrier, and at least one disposed on the first carrier One card solid. 如請求項3所述的電子系統,其中至少一所述第一卡固體包括一設置在所述第一承載體的頂端上的彈性件及一可拆卸地連 接於所述彈性件的按壓件,所述彈性件具有一固定設置在所述第一承載體的頂端上的固定部、至少兩個從所述固定部延伸而出的彈性臂、及一連接於所述彈性臂的活動部,且所述按壓件具有一設置在所述第一承載體的底端的下方且相距所述第一承載體一預定距離的按壓部、兩個分別從所述按壓部的兩相反側端向上延伸而出且插入所述第一承載體內的延伸部、兩個分別從兩個所述延伸部向上延伸而出且分別夾住所述活動部的夾持部、兩個分別從兩個所述延伸部向前延伸而出的卡鉤部、兩個分別從兩個所述延伸部向內延伸而出的第一滑動部、及兩個分別從兩個所述延伸部向內延伸而出的第二滑動部。 The electronic system of claim 3, wherein at least one of the first card solids comprises an elastic member disposed on a top end of the first carrier and a detachably connected a pressing member connected to the elastic member, the elastic member having a fixing portion fixedly disposed on a top end of the first carrier, at least two elastic arms extending from the fixing portion, and a connection The movable portion of the elastic arm, and the pressing member has a pressing portion disposed under the bottom end of the first carrier and at a predetermined distance from the first carrier, and two of the pressing portions are respectively pressed from the pressing portion Two opposite side ends of the portion extending upwardly and inserted into the first carrier body, two clamping portions extending upward from the two extending portions and respectively clamping the movable portion, and two clamping portions a hook portion extending forward from the two extending portions, two first sliding portions extending inwardly from the two extending portions, and two extending from the two a second sliding portion that extends inwardly. 如請求項4所述的電子系統,其中所述彈性件具有至少一設置在所述活動部上的第一結構強化肋,且所述按壓件具有至少一設置在所述按壓部上的第二結構強化肋、至少兩個分別設置在兩個所述延伸部上的第三結構強化肋、及至少兩個分別設置在兩個所述卡鉤部上的第四結構強化肋,其中所述第一承載體具有兩個分別容置兩個所述第一滑動部的第一滑動軌道、兩個分別容置兩個所述第二滑動部的第二滑動軌道、及兩個分別鄰近兩個所述第二滑動軌道的限位凸塊,每一個所述第一滑動部具有多個接觸相對應的所述第一滑動軌道的第一接觸凸點,且每一個所述第二滑動部具有多個接觸相對應的所述第二滑動軌道的第二接觸凸點及一接觸相對應的所述限位凸塊的限位卡鉤。 The electronic system of claim 4, wherein the elastic member has at least one first structural reinforcing rib disposed on the movable portion, and the pressing member has at least one second disposed on the pressing portion a structural reinforcing rib, at least two third structural reinforcing ribs respectively disposed on the two extending portions, and at least two fourth structural reinforcing ribs respectively disposed on the two hook portions, wherein the a carrier has two first sliding tracks respectively accommodating the two first sliding portions, two second sliding tracks respectively accommodating the two sliding portions, and two adjacent two a limiting bump of the second sliding track, each of the first sliding portions having a plurality of first contact bumps corresponding to the first sliding track, and each of the second sliding portions has a plurality of And a second contact bump corresponding to the second sliding track and a corresponding limit hook of the limiting bump. 如請求項1所述的電子系統,其中所述流體補充模組包括一流體連通於所述可替換式流體補充匣的快拆接頭,其中所述散熱模組包括一流體連通於其中一所述第一流體連接頭的第一水冷式散熱結構及一流體連通於所述第一水冷式散熱結構的第二水冷式散熱結構,且所述第一水冷式散熱結構及所述第二水冷式散熱結構相對於所述流體驅動模組呈對稱設置,其中所述 流體驅動模組包括一外殼體及一設置在所述外殼內的泵浦,且所述外殼體具有一流體連通於所述第二水冷式散熱結構的第一入水口、一流體連通於所述快拆接頭的第二入水口、及一流體連接於另外一所述第一流體連接頭的出水口。 The electronic system of claim 1, wherein the fluid replenishing module comprises a quick release coupling fluidly connected to the replaceable fluid refilling cartridge, wherein the thermal module comprises a fluid communication to one of the a first water-cooling heat dissipation structure of the first fluid connection head and a second water-cooling heat dissipation structure fluidly connected to the first water-cooling heat dissipation structure, and the first water-cooling heat dissipation structure and the second water-cooled heat dissipation The structure is symmetrically disposed relative to the fluid drive module, wherein The fluid drive module includes an outer casing and a pump disposed in the outer casing, and the outer casing has a first water inlet fluidly connected to the second water-cooling heat dissipation structure, and is fluidly connected to the a second water inlet of the quick release joint and a water outlet connected to the other first fluid connection head. 如請求項3所述的電子系統,其中所述外接式輔助散熱裝置包括一電源供應模組,所述電源供應模組電性連接於所述第一電源連接頭。 The electronic system of claim 3, wherein the external auxiliary heat sink comprises a power supply module, and the power supply module is electrically connected to the first power connector. 如請求項1所述的電子系統,其中所述外接式輔助散熱裝置包括一殼體模組,所述殼體模組具有一透明觀景窗,且所述外接式連接頭模組、所述流體驅動模組、及所述散熱模組都設置在所述殼體模組的內部。 The electronic system of claim 1, wherein the external auxiliary heat sink comprises a housing module, the housing module has a transparent viewing window, and the external connector module, the The fluid drive module and the heat dissipation module are both disposed inside the housing module. 如請求項8所述的電子系統,其中所述外接式輔助散熱裝置包括一發光模組,所述發光模組設置在所述散熱模組上,且所述發光模組所產生的光源從所述透明觀景窗穿透而出。 The electronic system of claim 8, wherein the external auxiliary heat sink comprises a light emitting module, the light emitting module is disposed on the heat dissipation module, and the light source generated by the light emitting module is The transparent viewing window penetrates. 如請求項1所述的電子系統,其中所述外接式輔助散熱裝置包括一承載模組,所述承載模組包括一固定承載體、一可滑動地設置在所述固定承載體上且承載所述外接式連接頭模組的可滑動件、一樞接設置在所述固定承載體上的扳動件、及一樞接在所述可滑動件及所述扳動件之間的連動件。 The electronic system of claim 1, wherein the external auxiliary heat sink comprises a carrying module, the carrying module comprises a fixed carrier, a slidably disposed on the fixed carrier and a carrier The slidable member of the external connector module, a pivoting member pivotally disposed on the fixed carrier, and a linkage pivotally connected between the slidable member and the trigger member. 一種外接式輔助散熱裝置,其包括:一外接式連接頭模組,所述外接式連接頭模組包括一第一承載體、及至少兩個設置於所述第一承載體的第一流體連接頭;一流體驅動模組;一散熱模組;多個第一管線,多個所述第一管線連接所述第一流體連接頭、所述流體驅動模組、及所述散熱模組,以組成一第一流體路徑;以及一流體補充模組,且所述流體補充模組包括一可替換式流體補 充匣。 An external auxiliary heat dissipating device includes: an external connector module, the external connector module includes a first carrier, and at least two first fluid connections disposed on the first carrier a fluid drive module; a heat dissipation module; a plurality of first pipelines, wherein the plurality of first pipelines connect the first fluid connector, the fluid drive module, and the heat dissipation module to Forming a first fluid path; and a fluid supplement module, and the fluid supplement module includes a replaceable fluid supplement Full of charge. 如請求項11所述的外接式輔助散熱裝置,其中所述外接式連接頭模組包括一設置於所述第一承載體的第一電源連接頭、及至少一設置在所述第一承載體上的第一卡固體。 The external auxiliary heat sink according to claim 11, wherein the external connector module includes a first power connector disposed on the first carrier, and at least one disposed on the first carrier The first card on the solid. 如請求項11所述的外接式輔助散熱裝置,其中所述流體補充模組包括一流體連通於所述可替換式流體補充匣的快拆接頭,其中所述散熱模組包括一流體連通於其中一所述第一流體連接頭的第一水冷式散熱結構及一流體連通於所述第一水冷式散熱結構的第二水冷式散熱結構,且所述第一水冷式散熱結構及所述第二水冷式散熱結構相對於所述流體驅動模組呈對稱設置,其中所述流體驅動模組包括一外殼體及一設置在所述外殼內的泵浦,且所述外殼體具有一流體連通於所述第二水冷式散熱結構的第一入水口、一流體連通於所述快拆接頭的第二入水口、及一流體連接於另外一所述第一流體連接頭的出水口。 The external auxiliary heat dissipating device of claim 11, wherein the fluid replenishing module comprises a quick release joint fluidly connected to the replaceable fluid replenishing port, wherein the heat dissipating module comprises a fluid communication medium a first water-cooling heat dissipation structure of the first fluid connection head and a second water-cooling heat dissipation structure fluidly connected to the first water-cooling heat dissipation structure, and the first water-cooling heat dissipation structure and the second The water-cooling heat dissipation structure is symmetrically disposed with respect to the fluid drive module, wherein the fluid drive module includes an outer casing and a pump disposed in the outer casing, and the outer casing has a fluid communication connection a first water inlet of the second water-cooling heat dissipation structure, a second water inlet fluidly connected to the quick release joint, and a water outlet connected to the other first fluid connection head. 如請求項12所述的外接式輔助散熱裝置,其中所述外接式輔助散熱裝置包括一電源供應模組,所述電源供應模組電性連接於所述第一電源連接頭。 The external auxiliary heat sink of claim 12, wherein the external auxiliary heat sink comprises a power supply module, and the power supply module is electrically connected to the first power connector. 如請求項11所述的外接式輔助散熱裝置,其中所述外接式輔助散熱裝置包括一殼體模組,所述殼體模組具有一透明觀景窗,且所述外接式連接頭模組、所述流體驅動模組、及所述散熱模組都設置在所述殼體模組的內部。 The external auxiliary heat sink of claim 11, wherein the external auxiliary heat sink comprises a housing module, the housing module has a transparent viewing window, and the external connector module The fluid drive module and the heat dissipation module are all disposed inside the housing module. 如請求項15所述的外接式輔助散熱裝置,其中所述外接式輔助散熱裝置包括一發光模組,所述發光模組設置在所述散熱模組上,且所述發光模組所產生的光源從所述透明觀景窗穿透而出。 The external auxiliary heat sink of claim 15 , wherein the external auxiliary heat sink comprises a light emitting module, the light emitting module is disposed on the heat dissipation module, and the light emitting module generates A light source penetrates through the transparent viewing window. 如請求項11所述的外接式輔助散熱裝置,其中所述外接式輔助散熱裝置包括一承載模組,所述承載模組包括一固定承載 體、一可滑動地設置在所述固定承載體上且承載所述外接式連接頭模組的可滑動件、一樞接設置在所述固定承載體上的扳動件、及一樞接在所述可滑動件及所述扳動件之間的連動件。 The external auxiliary heat sink of claim 11, wherein the external auxiliary heat sink comprises a load bearing module, and the load bearing module comprises a fixed load a slidable member slidably disposed on the fixed carrier and carrying the external connector module, a pivoting member pivotally disposed on the fixed carrier, and a pivoting member a linkage between the slidable member and the trigger member.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069737B2 (en) * 2004-04-20 2006-07-04 Waffer Technology Corp. Water-cooling heat dissipation system
TWI411390B (en) * 2010-07-26 2013-10-01 I-Ming Lin Devices in series for continuous cooling/ heating
US8631860B2 (en) * 2009-09-29 2014-01-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Water-cooled heat dissipation system and water tank thereof
TWI431737B (en) * 2011-08-26 2014-03-21 Microjet Technology Co Ltd Led lamp and water-cooling module thereof
TWM508055U (en) * 2015-03-25 2015-09-01 Cooler Master Co Ltd Electronic device and multifunctional integrated type connector assembly structure thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069737B2 (en) * 2004-04-20 2006-07-04 Waffer Technology Corp. Water-cooling heat dissipation system
US8631860B2 (en) * 2009-09-29 2014-01-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Water-cooled heat dissipation system and water tank thereof
TWI411390B (en) * 2010-07-26 2013-10-01 I-Ming Lin Devices in series for continuous cooling/ heating
TWI431737B (en) * 2011-08-26 2014-03-21 Microjet Technology Co Ltd Led lamp and water-cooling module thereof
TWM508055U (en) * 2015-03-25 2015-09-01 Cooler Master Co Ltd Electronic device and multifunctional integrated type connector assembly structure thereof

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