CN211118954U - Heat radiation structure and stage lamp - Google Patents
Heat radiation structure and stage lamp Download PDFInfo
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- CN211118954U CN211118954U CN202020067593.4U CN202020067593U CN211118954U CN 211118954 U CN211118954 U CN 211118954U CN 202020067593 U CN202020067593 U CN 202020067593U CN 211118954 U CN211118954 U CN 211118954U
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Abstract
The utility model relates to a heat dissipation that lamp was used, more specifically say, it relates to a heat radiation structure, and its technical scheme main points are: the air supply surface of the fan faces the heat dissipation water discharge, and the air suction surface of the fan faces the upper side surface of the water-cooling heat dissipation assembly; the lower side surface of the water-cooling radiating component is used for arranging lamp beads; the water cooling assembly and the cooling water discharge are provided with a water outlet and a water inlet, and a water outlet of the water cooling assembly is communicated with the water inlet of the cooling water discharge; and a water pump is also arranged in the box body and is used for pumping the water in the heat dissipation water into the water-cooling heat dissipation assembly. The effect is as follows: firstly, the heat dissipation effect is carried out by utilizing the front and the back of the fan, so that the whole heat dissipation structure is compact, and the heat dissipation effect is better. And secondly, the semiconductor refrigeration piece is arranged on the water-cooling radiating assembly, so that the water-cooling radiating assembly can radiate heat through the fan, and the heat of the water-cooling radiating assembly can be taken away through the semiconductor refrigeration piece, so that the water on the water-cooling radiating assembly can be continuously kept at the normal temperature.
Description
Technical Field
The utility model relates to a lamp cooling system, more specifically say, it relates to a heat radiation structure and stage lamp.
Background
The stage lamp is one of stage commonly-used properties, L ED lamp beads are commonly used as lighting elements and stage effect properties, the lamp beads are often set into a flat plate shape, the power of the lamp beads is higher and higher in the existing market, the service time of the stage lamp is longer, the color change is fast, the requirement on a lamp bead heat dissipation system of the stage lamp is higher and higher, the existing lamp bead heat dissipation is generally realized by pasting the lamp bead plate on heat dissipation aluminum, the heat dissipation efficiency of the heat dissipation mode is low, longer heat dissipation paths and heat dissipation components are often required to be installed for better heat dissipation, the occupied area of the whole heat dissipation system is large, and the heat dissipation effect and the size of the heat dissipation system cannot be perfectly balanced.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a heat radiation structure has compact structure, advantage that the radiating effect is good.
The above technical purpose of the present invention can be achieved by the following technical solutions: a heat dissipation structure comprises a box body, wherein a water-cooling heat dissipation assembly, a fan and a heat dissipation water drain are sequentially arranged in the box body from bottom to top; the air supply surface of the fan faces the heat dissipation water discharge, and the air suction surface of the fan faces the upper side surface of the water-cooling heat dissipation assembly; the lower side surface of the water-cooling radiating component is used for mounting the lamp beads; the water cooling assembly and the cooling water discharge are provided with a water outlet and a water inlet, and a water outlet of the water cooling assembly is communicated with the water inlet of the cooling water discharge; and a water pump is also arranged in the box body and is used for pumping the water in the heat dissipation water into the water-cooling heat dissipation assembly.
Optionally, a semiconductor refrigeration piece is arranged between the water-cooling heat dissipation assembly and the fan, and the semiconductor refrigeration piece is arranged on the upper side face of the water-cooling heat dissipation assembly.
Optionally, an annular heat sink is disposed between the semiconductor chilling plate and the fan, and the annular heat sink is disposed on an upper side surface of the semiconductor chilling plate.
Optionally, the front of the fan faces the heat dissipating water discharge, and the back of the fan faces the annular heat dissipating fin.
Optionally, a multi-section bent pipeline is arranged in the water-cooling heat dissipation assembly, one end of the multi-section bent pipeline is communicated with a water outlet of the water-cooling heat dissipation assembly, and the other end of the multi-section bent pipeline is communicated with a water inlet of the water-cooling heat dissipation assembly.
Optionally, the water pump is a waterproof pump.
Optionally, the water-cooling heat dissipation assembly is made of aluminum or red copper.
In order to achieve the above object, the utility model also provides a stage lamp, including foretell heat radiation structure.
To sum up, the utility model discloses following beneficial effect has:
firstly, the heat dissipation effect is carried out by utilizing the front and the back of the fan, so that the whole heat dissipation structure is compact, and the heat dissipation effect is better.
And secondly, the semiconductor refrigeration piece is arranged on the water-cooling radiating assembly, so that the water-cooling radiating assembly can radiate heat through the fan, and the heat of the water-cooling radiating assembly can be taken away through the semiconductor refrigeration piece, so that the water on the water-cooling radiating assembly can be continuously kept at the normal temperature.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure in this embodiment;
fig. 2 is a schematic structural view of the heat-dissipating water discharge in the present embodiment.
In the figure: 1. a water-cooling heat dissipation component; 2. a water pump; 3. a fan; 4. discharging the heat-dissipating water; 401. a radiating pipe; 5. a lamp bead; 6. a semiconductor refrigeration sheet; 7. an annular heat sink; 8. and (4) a box body.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
The application provides a heat radiation structure, as shown in fig. 1, including box 8, water-cooling radiating component 1, water pump 2, fan 3 and heat radiation water 4. The water-cooling heat dissipation assembly 1, the water pump 2, the fan 3 and the heat dissipation water discharge device 4 are all fixedly arranged in the box body 8.
The water-cooling heat dissipation component 1 is set to be solid aluminum or red copper according to requirements, the aluminum is relatively low in price, and the red copper is relatively good in heat dissipation effect. The water-cooling radiating assembly 1 comprises a water outlet and a water inlet, a multi-section bending pipeline is arranged inside the water-cooling radiating assembly 1, two end openings of the multi-section bending pipeline are communicated with the water outlet and the water inlet of the water-cooling radiating assembly 1, and the lamp beads 5 are arranged on the lower side surface of the water-cooling radiating assembly 1. When lamp pearl 5 generates heat, can take away the heat through water-cooling module 1, then water-cooling module 1's heat can take away the most heat of water-cooling module 1 internal water through inside rivers through the multistage pipeline of bending to the realization is to the cooling effect of lamp pearl 5.
As shown in fig. 1, the cooling water bank 4 includes a water outlet and a water inlet, and the cooling water bank 4 includes a plurality of rows of heat pipes 401 connected end to end, so that the heat pipes 401 can be fully contacted with air, and the cooling effect of the cooling water bank 4 is better.
The water outlet of the water-cooling radiating assembly 1 is connected with the water inlet of the radiating water discharge 4, the water inlet of the water-cooling radiating assembly 1 is connected with the water outlet of the radiating water discharge 4, the water outlet of the water-cooling radiating assembly 1 and the water inlet of the radiating water discharge 4 can be connected through welding by using an aluminum pipe, the water inlet of the water-cooling radiating assembly 1 and the water outlet of the radiating water discharge 4 enable hot water which takes away heat of the lamp beads 5 in the water-cooling radiating assembly 1 to flow into the radiating water discharge 4 through the water outlet of the water-cooling radiating assembly 1, then the hot water is radiated by the radiating water discharge 4 and then flows back to the water-cooling radiating assembly 1 through the water inlet of the water-cooling radiating assembly 1, the water which flows into the water-cooling radiating assembly achieves.
As shown in fig. 1, water pump 2 adopts waterproof water pump 2, water pump 2 is used for taking cold water out from heat dissipation log raft 4, and get into water-cooling heat dissipation assembly 1 through the outlet of heat dissipation log raft 4, because water pump 2 is the wearing parts, when setting up water pump 2 between the delivery port of water-cooling heat dissipation assembly 1 and the water inlet of heat dissipation log raft 4, the water that flows into water pump 2 is hot water, cause permanent damage to water pump 2 easily, so this application sets up water pump 2 between the delivery port of heat dissipation log raft 4 and the water inlet of water-cooling heat dissipation assembly 1, the water that makes flow through water pump 2 is water after the cooling, make water pump 2's life increase.
Further, this application still includes semiconductor refrigeration piece 6, and semiconductor refrigeration piece 6 sets up side on water-cooling radiating component 1 to set up in two sides that water-cooling radiating component 1 is right with lamp pearl 5 branch, semiconductor refrigeration piece 6 is used for effectively dispelling the heat to water-cooling radiating component 1, makes the partial heat of taking away water-cooling radiating component 1. And the upper side of the semiconductor refrigeration sheet 6 is provided with the annular cooling sheet 7, and the annular cooling sheet 7 can increase the heat dissipation area and the heat exchange coefficient through the built-in fins, so that the heat dissipation speed is higher. Make the water-cooling radiating component 1 of this application both can through the water cycle initiative heat dissipation, through the passive heat dissipation of semiconductor refrigeration 6 and annular fin 7 again, make the heat radiation structure of this application can deal with the 5 calorific capacities of lamp pearl more than 1200W.
Further, as shown in fig. 1, the side of the water-cooling heat dissipation assembly 1 provided with the semiconductor cooling fins 6 is opposite to the heat dissipation surface of the heat dissipation water drainage 4, and the fan 3 is fixedly arranged between the heat dissipation water drainage 4 and the water-cooling heat dissipation assembly 1, and the fan 3 supplies air towards the heat dissipation water drainage 4 and sucks air towards the side of the water-cooling heat dissipation assembly 1 provided with the semiconductor cooling fins 6. Because the fan 3 has the function of induced drafting when supplying air, so this application induced drafts the side with the fan 3 and just faces semiconductor refrigeration piece 6, just faces the cooling water log 4 with the fan 3 air supply side, make the fan 3 can take away the temperature of semiconductor refrigeration piece 6 and water-cooling radiating component 1 by a small amount at the in-process that induced drafts, and can accelerate the cooling tube 401 air flow of cooling water log 4 in the fan 3 air supply process, make the fan 3 can blow the heat dissipation to the water that flows through cooling water log 4, make the fan 3 can reach dual radiating effect.
Because 5 heat radiation structure of lamp pearl in the past need reach good radiating effect, need set up heat radiation structure comparatively complicatedly because need set up multiunit fan 3 and multistage water pipe and dispel the heat. Compare in 5 heat radiation structure of lamp pearl in the past, this application sets up the radiating part at heat dissipation log raft 4, and will utilize the air supply of the positive and negative of fan 3 and induced draft, make a fan 3 both can dispel the heat to water-cooling subassembly 1, can dispel the heat to heat dissipation log raft 4 again, and can be with fan 3 fixed setting between water-cooling subassembly 1 and heat dissipation log raft 4 again, make the utility model discloses an overall structure is compacter, can directly accept whole heat radiation structure in a box, the area occupied greatly reduced, when being suitable for all operational environment, can reach better radiating effect again, realize keeping steady heat dissipation to heat dissipation lamp pearl 5.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A heat dissipation structure comprises a box body, and is characterized in that a water-cooling heat dissipation assembly, a fan and a heat dissipation water drain are sequentially arranged in the box body from bottom to top; the air supply surface of the fan faces the heat dissipation water discharge, and the air suction surface of the fan faces the upper side surface of the water-cooling heat dissipation assembly; the lower side surface of the water-cooling radiating component is used for mounting the lamp beads; the water cooling assembly and the cooling water discharge are provided with a water outlet and a water inlet, and a water outlet of the water cooling assembly is communicated with the water inlet of the cooling water discharge; and a water pump is also arranged in the box body and is used for pumping the water in the heat dissipation water into the water-cooling heat dissipation assembly.
2. The heat dissipation structure according to claim 1, wherein: the semiconductor refrigeration piece is arranged between the water-cooling radiating assembly and the fan and arranged on the upper side face of the water-cooling radiating assembly.
3. The heat dissipation structure according to claim 2, wherein: an annular radiating fin is arranged between the semiconductor refrigerating piece and the fan, and the annular radiating fin is arranged on the upper side face of the semiconductor refrigerating piece.
4. The heat dissipation structure according to claim 3, wherein: the front side of the fan is opposite to the radiating water discharge, and the back side of the fan is opposite to the annular radiating fin.
5. The heat dissipation structure according to claim 1, wherein: and a multi-section bent pipeline is arranged in the water-cooling radiating assembly, one end of the multi-section bent pipeline is communicated with a water outlet of the water-cooling radiating assembly, and the other end of the multi-section bent pipeline is communicated with a water inlet of the water-cooling radiating assembly.
6. The heat dissipation structure according to claim 1, wherein: the water pump is a waterproof pump.
7. The heat dissipation structure according to claim 1, wherein: the water-cooling heat dissipation component is made of aluminum or red copper.
8. A stage lamp comprising the heat dissipating structure of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020067593.4U CN211118954U (en) | 2020-01-14 | 2020-01-14 | Heat radiation structure and stage lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020067593.4U CN211118954U (en) | 2020-01-14 | 2020-01-14 | Heat radiation structure and stage lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211118954U true CN211118954U (en) | 2020-07-28 |
Family
ID=71716044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020067593.4U Active CN211118954U (en) | 2020-01-14 | 2020-01-14 | Heat radiation structure and stage lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211118954U (en) |
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2020
- 2020-01-14 CN CN202020067593.4U patent/CN211118954U/en active Active
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