CN216118683U - Liquid metal cooling device for server - Google Patents
Liquid metal cooling device for server Download PDFInfo
- Publication number
- CN216118683U CN216118683U CN202122867480.XU CN202122867480U CN216118683U CN 216118683 U CN216118683 U CN 216118683U CN 202122867480 U CN202122867480 U CN 202122867480U CN 216118683 U CN216118683 U CN 216118683U
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- Prior art keywords
- liquid
- copper
- heat
- heat absorption
- server
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- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 90
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 69
- 229910052802 copper Inorganic materials 0.000 claims abstract description 68
- 239000010949 copper Substances 0.000 claims abstract description 68
- 238000010521 absorption reaction Methods 0.000 claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 13
- 229910052733 gallium Inorganic materials 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 229910000846 In alloy Inorganic materials 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000007664 blowing Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- WGCXSIWGFOQDEG-UHFFFAOYSA-N [Zn].[Sn].[In] Chemical compound [Zn].[Sn].[In] WGCXSIWGFOQDEG-UHFFFAOYSA-N 0.000 description 3
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000030279 gene silencing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of thermal management, and provides a liquid metal cooling device for a server, which comprises a CPU chip, a heat absorption copper plate, a liquid inlet pipeline, a circulating pump and a liquid outlet pipeline, wherein the heat absorption copper plate is fixedly arranged above the CPU chip; through being provided with heat absorption copper and serpentine channel, absorb heat to the CPU chip through the heat absorption copper, and in directly entering into the serpentine channel in the heat absorption copper through the metal liquid, absorb the heat on the heat absorption copper, reduce thermal transmission number of times, increase the radiating effect, through being provided with heat dissipation mechanism, through the setting of the first fan and the second fan on the heat dissipation mechanism, make first fan transversely blow to the copper pipe, through the second fan to the vertical blowing of copper pipe, increase the heat on the copper pipe and give off, guarantee that the heat in the metal liquid gives off.
Description
Technical Field
The utility model relates to the technical field of heat management, in particular to a liquid metal cooling device for a server.
Background
The server is one of important infrastructures for supporting cloud computing, and as the frequency of the CPU used by the server is usually higher, some servers are also provided with double CPUs or even multiple CPUs, and a high-speed hard disk and a high-power supply are added, a system can generate a large amount of heat, and the use safety and the service life of the server are seriously threatened;
at present, the heat dissipation of a server is realized by adopting an indoor cooling heat dissipation mode, and the heat dissipation problem is very troublesome in winter or cold zones and in summer or hot zones. Foreign countries have the application of oil cooling heat dissipation to servers, and the mode can realize silencing and cooling, but the cost is not low, and the risk coefficient is very high, so that the method is not suitable for large-area popularization. In recent years, a water-cooling heat dissipation mode is gradually popularized and applied to server heat dissipation, but a certain liquid leakage risk exists in the use of a water-cooling heat radiator, and once a mechanical pump for driving liquid to flow is damaged, great harm is caused to a CPU;
as in the prior art, patent No. ZL202021198167.0, a liquid metal cooling device for servers is provided, which is convenient for quick heat exchange due to the provision of micro flow channels in the heat absorption unit; because the liquid metal circulating working medium is adopted, the cooling device can quickly take away the heat absorbed by the heat absorption unit and transmit the heat to the remote heat dissipation unit for dissipation; the cooling device has the advantages of high response speed and high heat dissipation efficiency, and has good application prospect in the application field of servers with high heat power;
but the research shows that;
the device is arranged on a heat absorption unit through a micro-channel, and then the CPU is cooled through the heat absorption unit, wherein the device comprises the heat absorption of the heat absorption unit to the CPU, the heat absorption of the heat absorption unit is performed through the micro-channel, and the circulating metal liquid is subjected to heat transfer through the micro-channel, wherein the heat transfer comprises 3 times of heat transfer, and the transfer quantity between the heat is influenced by the contact area and the material, so that the heat transfer can be influenced;
and the heat dissipation unit of the device is only provided with the fan on one side surface, which can influence the heat dissipation of the heat dissipation unit and the heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving the above-mentioned problems of the prior art, and provides a liquid metal cooling device for a server.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a liquid metal cooling device for a server comprises a CPU chip, a heat absorption copper plate, a liquid inlet pipeline, a circulating pump and a liquid outlet pipeline, wherein the heat absorption copper plate is fixedly arranged above the CPU chip, the liquid inlet pipeline penetrates through the outer end of the right side surface of the heat absorption copper plate, the circulating pump is fixedly arranged at the right end of the liquid inlet pipeline, the circulating pump is an electromagnetic pump, and the liquid outlet pipeline penetrates through the inner end of the right side surface of the heat absorption copper plate;
and a heat dissipation mechanism is installed at the right end of the circulating pump.
Preferably, the inside of heat absorption copper runs through and is provided with serpentine channel, liquid inlet pipe and liquid outlet pipe run through respectively in serpentine channel's both ends.
Preferably, heat dissipation mechanism is including advancing liquid case, bracing piece, collection wind fill, first fan, mounting panel, second fan, copper tube, annular fin and play liquid tank, it runs through the input that sets up in the circulating pump to advance the liquid case, the last fixed surface of advancing liquid case is provided with the bracing piece, the wind fill is installed at the top of bracing piece, the top of collecting wind fill is run through and is provided with a plurality of first fans, the right side fixed surface of advancing liquid case is provided with the mounting panel, the right side surface of mounting panel runs through and is provided with a plurality of second fans, the inboard surface of advancing liquid case runs through and is provided with many copper tubes, the outside fixed surface of copper tube is provided with a plurality of annular fins, the inner of copper tube runs through and is provided with out the liquid tank.
Preferably, the copper tubes are located on the same horizontal plane, and planes formed by the copper tubes are parallel to the horizontal plane.
Preferably, the annular fin is made of copper material, and the thickness of the annular fin is 1-3 mm.
Preferably, the liquid outlet pipeline penetrates through the left side surface of the liquid outlet box.
Preferably, the liquid inlet pipeline, the liquid outlet pipeline, the serpentine channel, the liquid inlet box, the copper tube and the liquid outlet box are all filled with metal liquid, and the metal liquid is gallium, gallium indium alloy, gallium indium tin alloy or gallium indium tin zinc alloy.
Has the advantages that:
1. through being provided with heat absorption copper and serpentine channel, absorb heat to the CPU chip through the heat absorption copper, and through in the serpentine channel in the metal liquid directly enters into the heat absorption copper, adsorb the heat on the heat absorption copper, reduce thermal transfer number of times, increase the radiating effect.
2. Through being provided with heat dissipation mechanism, through the setting of the first fan on the heat dissipation mechanism and second fan for first fan transversely bloies to the copper pipe, through the second fan to the vertical blowing of copper pipe, increases the heat on the copper pipe and gives off, guarantees that the heat in the metal liquid gives off.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic sectional view showing a top view of a heat absorbing copper plate according to the present invention;
FIG. 3 is a schematic view of the overall structure of the heat dissipation mechanism of the present invention;
fig. 4 is a partial structural schematic diagram of the heat dissipation mechanism of the present invention.
Illustration of the drawings: 1. a CPU chip; 2. a heat absorbing copper plate; 201. a serpentine channel; 3. a liquid inlet pipeline; 4. a circulation pump; 5. a liquid outlet pipeline; 6. a liquid inlet tank; 601. a support bar; 602. a wind collecting hopper; 603. a first fan; 604. mounting a plate; 605. a second fan; 606. a red copper tube; 607. an annular fin; 608. and a liquid outlet box.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
Referring to fig. 1-4, a liquid metal cooling device for a server comprises a CPU chip 1, a heat absorption copper plate 2, a liquid inlet pipeline 3, a circulating pump 4 and a liquid outlet pipeline 5, wherein the heat absorption copper plate 2 is fixedly arranged above the CPU chip 1, the liquid inlet pipeline 3 is arranged at the outer end of the right side surface of the heat absorption copper plate 2 in a penetrating manner, the circulating pump 4 is fixedly arranged at the right end of the liquid inlet pipeline 3, the circulating pump 4 is an electromagnetic pump, and the liquid outlet pipeline 5 is arranged at the inner end of the right side surface of the heat absorption copper plate 2 in a penetrating manner;
the right end of the circulating pump 4 is provided with a heat dissipation mechanism.
In this embodiment, the inside of heat absorption copper 2 is run through and is provided with serpentine channel 201, and inlet channel 3 and outlet channel 5 run through respectively in serpentine channel 201's both ends for metal liquid enters into serpentine channel 201 and takes away the heat on the heat absorption copper 2.
In this embodiment, the heat dissipation mechanism includes liquid inlet box 6, bracing piece 601, wind collecting hopper 602, first fan 603, mounting panel 604, second fan 605, copper tube 606, annular fin 607 and play liquid tank 608, liquid inlet box 6 runs through and sets up in the input of circulating pump 4, the last fixed surface of liquid inlet box 6 is provided with bracing piece 601, wind collecting hopper 602 is installed at the top of bracing piece 601, the top of wind collecting hopper 602 runs through and is provided with a plurality of first fans 603, the right side fixed surface of liquid inlet box 6 is provided with mounting panel 604, the right side surface of mounting panel 604 runs through and is provided with a plurality of second fans 605, the inboard surface of liquid inlet box 6 runs through and is provided with a plurality of copper tubes 606, the outside fixed surface of copper tube 606 is provided with a plurality of annular fin 607, the inner of copper tube 606 runs through and is provided with play liquid tank 608.
In this embodiment, the copper tubes 606 are located on the same horizontal plane, and the plane formed by the copper tubes 606 is parallel to the horizontal plane, which facilitates the installation of the heat dissipation mechanism.
In this embodiment, the annular fins 607 are made of copper, and the thickness of the annular fins 607 is 1-3mm, so as to increase the contact area between the copper tube 606 and the air and increase the heat dissipation effect.
In this embodiment, the liquid outlet pipe 5 penetrates the left side surface of the liquid outlet tank 608, so that the liquid in the liquid outlet pipe 5 flows into the liquid outlet tank 608.
In this embodiment, the liquid inlet pipe 3, the liquid outlet pipe 5, the serpentine channel 201, the liquid inlet tank 6, the copper tube 606 and the liquid outlet tank 608 are all filled with metal liquid, and the metal liquid is gallium, gallium indium alloy, gallium indium tin alloy or gallium indium tin zinc alloy, and the gallium, gallium indium alloy, gallium indium tin alloy and gallium indium tin zinc alloy are all liquid metals at room temperature, and have a low melting point; of course, other types of liquid metals may be used as desired.
The working principle is as follows:
when the heat-absorbing liquid heat dissipation device is used, the heat-absorbing copper plate 2 absorbs heat on the CPU chip 1, the circulating pump 4 is started, the circulating pump 4 pumps metal liquid in the liquid inlet tank 6 into the liquid inlet pipeline 3 and then enters the serpentine channel 201, the metal liquid takes away the heat on the heat-absorbing copper plate 2, and the metal liquid flows into the liquid outlet tank 608 through the liquid outlet pipeline 5, so that the heat dissipation effect on the CPU chip 1 is achieved;
liquid in the liquid outlet box 608 is through flowing into copper tubing 606, vertically blows to copper tubing 606 through first fan 603, and second fan 605 transversely blows to copper tubing 606, and increases the area of contact in the air on copper tubing 606 through annular fin 607, guarantees that the heat on the copper tubing 606 gives off to reach the effect to the metal liquid cooling in the copper tubing 606, guarantees radiating continuation.
The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make several variations and modifications without departing from the concept of the present invention, and these should be considered as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the utility of the patent.
Claims (7)
1. A liquid metal cooling apparatus for a server, characterized by; comprises that
The heat absorption copper plate (2), the heat absorption copper plate (2) is arranged above the CPU chip (1);
the liquid inlet pipeline (3) penetrates through the outer end of the right side surface of the heat absorption copper plate (2);
the circulating pump (4), the said circulating pump (4) is fixedly set up in the right end of the liquid inlet pipeline (3), the said circulating pump (4) is an electromagnetic pump;
the liquid outlet pipeline (5) penetrates through the inner end of the right side surface of the heat absorption copper plate (2);
and a heat dissipation mechanism is arranged at the right end of the circulating pump (4).
2. A liquid metal cooling apparatus for a server as claimed in claim 1, wherein: the inside of heat absorption copper (2) is run through and is provided with serpentine channel (201), liquid inlet pipe (3) and liquid outlet pipe (5) run through respectively in the both ends of serpentine channel (201).
3. A liquid metal cooling apparatus for a server as claimed in claim 1, wherein: the heat dissipation mechanism comprises a liquid inlet box (6), a support rod (601), an air collecting hopper (602), a first fan (603), a mounting plate (604), a second fan (605), a copper tube (606), annular fins (607) and a liquid outlet box (608), wherein the liquid inlet box (6) is arranged at the input end of the circulating pump (4) in a penetrating manner, the support rod (601) is fixedly arranged on the upper surface of the liquid inlet box (6), the air collecting hopper (602) is arranged at the top of the support rod (601), a plurality of first fans (603) are arranged above the air collecting hopper (602) in a penetrating manner, the mounting plate (604) is fixedly arranged on the right side surface of the liquid inlet box (6), a plurality of second fans (605) are arranged on the right side surface of the mounting plate (604) in a penetrating manner, a plurality of copper tubes (606) are arranged on the inner side surface of the liquid inlet box (6), and a plurality of annular fins (607) are fixedly arranged on the outer side surface of the copper tubes (606), the inner end of the copper tube (606) is provided with a liquid outlet box (608) in a penetrating way.
4. A liquid metal cooling apparatus for a server as claimed in claim 3, wherein: the copper tubes (606) are located on the same horizontal plane, and planes formed by the copper tubes (606) are parallel to the horizontal plane.
5. A liquid metal cooling apparatus for a server as claimed in claim 3, wherein: the annular fins (607) are made of copper materials, and the thickness of the annular fins (607) is 1-3 mm.
6. A liquid metal cooling apparatus for a server as claimed in claim 3, wherein: the liquid outlet pipeline (5) penetrates through the left side surface of the liquid outlet box (608).
7. A liquid metal cooling apparatus for a server according to claim 2 or 3, characterized in that: the liquid inlet pipeline (3), the liquid outlet pipeline (5), the snake-shaped channel (201), the liquid inlet box (6), the copper tube (606) and the liquid outlet box (608) are all filled with metal liquid, and the metal liquid is gallium, gallium-indium alloy, gallium-indium-tin alloy or gallium-indium-tin-zinc alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122867480.XU CN216118683U (en) | 2021-11-22 | 2021-11-22 | Liquid metal cooling device for server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122867480.XU CN216118683U (en) | 2021-11-22 | 2021-11-22 | Liquid metal cooling device for server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216118683U true CN216118683U (en) | 2022-03-22 |
Family
ID=80718187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122867480.XU Expired - Fee Related CN216118683U (en) | 2021-11-22 | 2021-11-22 | Liquid metal cooling device for server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216118683U (en) |
-
2021
- 2021-11-22 CN CN202122867480.XU patent/CN216118683U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220322 |