CN109195419A - Air conditioner electrical box and heat abstractor thereof - Google Patents
Air conditioner electrical box and heat abstractor thereof Download PDFInfo
- Publication number
- CN109195419A CN109195419A CN201811265139.3A CN201811265139A CN109195419A CN 109195419 A CN109195419 A CN 109195419A CN 201811265139 A CN201811265139 A CN 201811265139A CN 109195419 A CN109195419 A CN 109195419A
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- chilling plate
- semiconductor chilling
- semiconductor
- mainboard
- heat dissipation
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- 239000004065 semiconductor Substances 0.000 claims abstract description 117
- 238000005057 refrigeration Methods 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims description 42
- 238000002955 isolation Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000006071 cream Substances 0.000 claims 2
- 230000006698 induction Effects 0.000 claims 1
- 238000004378 air conditioning Methods 0.000 abstract description 12
- 238000009413 insulation Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 6
- 239000004519 grease Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to an air-conditioning electric appliance box and a heat radiating device thereof, the device comprises a semiconductor refrigerating piece, a heat insulation film and a heat radiating fin, wherein the semiconductor refrigerating piece is embedded in the heat radiating fin, the refrigerating end of the semiconductor refrigerating piece is used for being attached to a main board of the air-conditioning electric appliance box, the heat radiating end of the semiconductor refrigerating piece is attached to the heat radiating fin, and the heat insulation film is arranged between the refrigerating end and the heat radiating end of the semiconductor refrigerating piece. When the semiconductor refrigeration piece of the heat dissipation device is powered on, the refrigeration end of the semiconductor refrigeration piece can be used for generating a cold source to dissipate heat for the mainboard, the heat dissipation end of the semiconductor refrigeration piece is attached to the heat dissipation sheet to dissipate heat, and a user can also control the cold quantity of the semiconductor refrigeration piece by adjusting the circulating current of the semiconductor refrigeration piece, so that the mainboard is controlled to work within a reasonable temperature range. The semiconductor refrigeration principle can be utilized to realize heat dissipation of the mainboard at normal temperature and under working conditions, the problem that the air conditioner mainboard fails due to high temperature under high temperature and high load can be solved, and the heat dissipation reliability is improved.
Description
Technical field
This application involves air conditioner technical fields, more particularly to a kind of air conditioner electrical box and its radiator.
Background technique
It is constantly progressive with the development of science and technology with social, from household products to commercial product in air conditioner industry, direct current becomes
Frequency has become the mainstream of unit capacity adjusting, can change turning for compressor by changing the supply frequency into compressor
Speed, to adjust the capacity of compressor, compressor capacity changes therewith.It can fundamentally be played using DC frequency-changeable compressor
It adjusts refrigerant circulation and reduces the purpose of energy consumption.
The operation process of DC frequency-changeable compressor be really pass through the AC to DC circuit of electric current, current rectifying and wave filtering circuit,
Direct current delivers current circuit realization.And IPM (Intelligent Power Module, intelligent power module) carries direct current and turns
Change a most important ring for alternating current supply three-phase compressor operating, IPM operating status determines the frequency state of compressor, IPM
Operating temperature it is limited, so the highest frequency that compressor can be run is limited, the operation of air-conditioning high frequency because of IPM heat dissipation limitation problem still
It is not solved effectively, becomes industry problems.
Traditional air-conditioning mainboard radiating mode is wind-cooling heat dissipating, is realized using air-cooled radiator, to dissipate to the IPM on mainboard
For heat, pass through the operating drive radiator reinforcing heat dissipation of outer machine blower by the way that radiator is arranged in position on the downside of outer machine electric appliance box
Ability, but IPM heat-sinking capability is limited when high-temperature high-load refrigerating operaton, and it is reliable to there is heat dissipation in traditional air-conditioning mainboard radiating mode
The low disadvantage of property.
Summary of the invention
Based on this, it is necessary to there is a problem of that heat dissipation reliability is low for traditional air-conditioning mainboard radiating mode, provide one
The air conditioner electrical box and its radiator of heat dissipation reliability can be improved in kind.
A kind of radiator of air conditioner electrical box, including semiconductor chilling plate, thermal isolation film and cooling fin, the semiconductor system
Cold is embedded at the cooling fin, and the refrigeration end of the semiconductor chilling plate is set for being bonded with the mainboard of air conditioner electrical box
It sets, the radiating end of the semiconductor chilling plate is bonded setting with the cooling fin, and the thermal isolation film is set to the semiconductor system
Between cold refrigeration end and radiating end.
A kind of air conditioner electrical box, including mainboard and above-mentioned radiator, the refrigeration end and air-conditioning of the semiconductor chilling plate
The mainboard of electrical appliance kit is bonded setting.
Radiator is arranged on the mainboard of air conditioner electrical box, to heat dissipation in above-mentioned air conditioner electrical box and its radiator
When the semiconductor chilling plate of device is powered, cold source is generated using the refrigeration end of semiconductor chilling plate and is radiated to mainboard, half
The radiating end fitting cooling fin of conductor cooling piece radiates, and user can also pass through the circulating current of adjusting semiconductor chilling plate
Size controls the cooling capacity of semiconductor chilling plate, and mainboard control is made to work within the scope of reasonable temperature.Utilize semiconductor refrigerating principle
It can be realized the heat dissipation combined under mainboard room temperature and operating condition, air-conditioning mainboard under high-temperature high-load can be solved and occurred because of high temperature
The problem of failure, improves heat dissipation reliability.
Detailed description of the invention
Fig. 1 is the structure chart of the radiator of air conditioner electrical box in an embodiment；
Fig. 2 is the main view of the radiator of air conditioner electrical box in an embodiment；
Fig. 3 is the top view of the radiator of air conditioner electrical box in an embodiment；
Fig. 4 is the side view of the radiator of air conditioner electrical box in an embodiment；
Fig. 5 is the structural schematic diagram of air conditioner electrical box in an embodiment.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, not
For limiting the application.
In one embodiment, a kind of radiator of air conditioner electrical box is provided, suitable for the IPM mould to convertible frequency air-conditioner
Block heat dissipation.As shown in Figure 1, the device includes semiconductor chilling plate 110, thermal isolation film 120 and cooling fin 130, semiconductor chilling plate
110 are embedded at cooling fin 130, and the refrigeration end of semiconductor chilling plate 110 is used to be bonded setting with the mainboard of air conditioner electrical box, and half
The radiating end of conductor cooling piece 110 is bonded setting with cooling fin 130, and thermal isolation film 120 is set to the refrigeration of semiconductor chilling plate 110
Between end and radiating end.
Specifically, it is provided with P-N junction in semiconductor chilling plate 110, in the case where there is circulation electric load in inside upper and lower
The case where both ends will form one end refrigeration heat absorption, and one end heats heat release, semiconductor chilling plate 110 is by a variety of P-N lines pressures
Thin slice made of system.Wherein, the refrigeration end of semiconductor chilling plate 110 can be the IPM module abutted directly on mainboard, utilize half
Conductor refrigeration principle generates refrigeration effect in the refrigeration end of semiconductor chilling plate 110 and radiates to IPM module.Semiconductor refrigerating
The refrigeration end of piece 110 is also possible to bind with the heat dissipation circuit board of mainboard, and heat dissipation circuit board is by all heating devices on mainboard
Heat put together, then by being bonded heat dissipation with the refrigeration end of semiconductor chilling plate 110, finally by semiconductor chilling plate
The cooling fin 130 of 110 radiating end is spread out of.Between the refrigeration end and radiating end of semiconductor chilling plate 110 be arranged thermal isolation film 120 into
Row is heat-insulated, is radiated, can be combined under mainboard room temperature and operating condition using the semiconductor refrigerating principle of semiconductor chilling plate 110
Heat dissipation, solve the problems, such as that air-conditioning mainboard breaks down because of high temperature under high-temperature high-load.
In one embodiment, the refrigeration end of semiconductor chilling plate 110 is bonded setting with the IPM module on mainboard.IPM mould
Block integrates device for power switching and driving circuit, has been internally integrated the fault detections such as overvoltage, overcurrent and overheat
Circuit, and signal can be will test and be sent to controller.Specifically, can by the refrigeration end of semiconductor chilling plate 110 by thermal grease with
The fitting of IPM module, improves heat dissipation effect.Under the operating condition of high-temperature high-load, by by 110 turn-on current of semiconductor chilling plate,
It can control the refrigerating capacity size of the refrigeration end of semiconductor chilling plate 110 by control size of current, and then the control of IPM module made to exist
It works within the scope of reasonable temperature, the semiconductor chilling plate 110 of use is simple to manufacture, and lower cost, IPM temperature control is accurate, movement
Time delay substantially reduces.When complete machine works, the refrigeration end of semiconductor chilling plate 110 generates cold source and gives IPM module radiator
It radiates, the radiating end of semiconductor chilling plate 110 is close to cooling fin 130 and carries out heat spreader, reasonable in design, assembling life
The production used time is short, and IPM module heat dissipating is good, realizes effective temperature control of IPM module.
In another embodiment, the refrigeration end of semiconductor chilling plate 110 is bonded setting with the heat dissipation circuit board on mainboard.Tool
Body, various automatically controlled components are installed, other than IPM module is as main heating device, other devices are for example each on mainboard
Kind diode, integrated circuit etc. can also generate heat, and the heat dissipation circuit board on mainboard is one of all heating devices heat dissipation on mainboard
A set first puts together heat again by being bonded heat dissipation with the refrigeration end of semiconductor chilling plate 110, finally by semiconductor
The cooling fin 130 of the radiating end fitting of cooling piece 110 is spread out of.Further, in one embodiment, semiconductor chilling plate 110
Refrigeration end cohered by thermal grease with the heat dissipation circuit board on mainboard and be bonded setting, it is fixed reliable, heat dissipation effect also can be improved.
Accordingly, in one embodiment, the radiating end of semiconductor chilling plate 110 is glutinous by thermal grease and cooling fin 130
Knot fitting.The radiating end and cooling fin 130 that semiconductor chilling plate 110 is cohered by thermal grease, equally can be improved fixed reliability
And heat dissipation effect.
In one embodiment, as depicted in figs. 1 and 2, cooling fin 130 is additionally provided with for drawing semiconductor chilling plate
The conduit 132 of 110 positive and negative anodes connecting terminal.Specifically semiconductor chilling plate 110 can be connected by the way that conducting wire is arranged in conduit 132
Positive and negative anodes connecting terminal conveys electric current progress refrigeration control will pass through conducting wire to semiconductor chilling plate 110.To air-conditioning
For IPM module heat dissipating, under room temperature operating condition, IPM module heating amount is not especially greatly, to pass through semiconductor chilling plate 110 and IPM
Module, which carries out natural heat dissipation with the position that cooling fin 130 directly contacts, can meet the radiating requirements of IPM module.In high temperature height
Under the operating condition of load, to turn-on current in semiconductor chilling plate 110, by controlling size of current, to control semiconductor refrigerating
The refrigerating capacity size of the refrigeration end of piece 110, and then IPM control is made to work within the scope of reasonable temperature.
The concrete type of cooling fin 130 is not unique, and in the present embodiment, cooling fin 130 is aluminum thermal fin, heat dissipation effect
It is good and at low cost.The specific structure of cooling fin 130 is not unique, in one embodiment, as shown in Figure 3 and Figure 4, cooling fin
130 include body part and radiating part, and body part is embedded semiconductor chilling plate 110 on one side, and body part is relative to semiconductor refrigerating
The another side of piece 110 is provided with multiple radiating parts separately, and laminated structure, the area of each radiating part specifically can be used in radiating part
Size may be the same or different.
In one embodiment, radiator further includes controller, and controller is connected by being set to the conducting wire of conduit 132
The positive and negative anodes connecting terminal of semiconductor chilling plate 110, controller are partly led for outputing current to semiconductor chilling plate 110, control
Body cooling piece 110 carries out refrigeration radiating.Specifically, external power supply can be accessed by controller, and outputs current to connection and partly leads
The positive and negative anodes connecting terminal of body cooling piece 110 makes semiconductor chilling plate 110 be powered and carries out refrigeration radiating,
Further, radiator further includes the temperature sensor for being set to mainboard, and temperature sensor connects controller, control
Device processed is also used to adjust the output to the electric current of semiconductor chilling plate 110 according to the temperature sensor data that temperature sensor conveys.Tool
Body, temperature sensor may be disposed at the IPM module on mainboard, by detecting the Current Temperatures of IPM module, and adjust semiconductor
The circulating current of cooling piece 110 controls the cooling capacity of semiconductor chilling plate 110, so that the temperature for controlling IPM module is in one always
A lower temperature makes IPM module that can normally and efficiently work.
The temperature sensor data that controller is conveyed according to temperature sensor adjust the output to the electric current of semiconductor chilling plate 110
Concrete mode be not it is unique, specifically, equally with the temperature that detects IPM module and to the electricity of semiconductor chilling plate 110
For stream is adjusted, in one embodiment, the temperature for the IPM module that controller detects in preset duration is greater than or waits
In preset lower limit temperature, and be less than or equal to preset ceiling temperature between when, then keep output voltage constant；When default
When the temperature of the IPM module detected in length is less than lower limit temperature, stop output voltage to semiconductor chilling plate 110.When default
Long specific value is not unique, can be 0-30s, in the present embodiment, preset duration 5S.
In one embodiment, the temperature for the IPM module that controller detects in preset duration be greater than ceiling temperature and
Less than preset frequency limit temperature, then output voltage is increased according to the first predetermined amplitude, to increase the system of semiconductor chilling plate 110
Cold energy power.The value of first predetermined amplitude is not also unique, is 0.2v in the present embodiment.
Further, the temperature for the IPM module that controller detects in preset duration be greater than or equal to frequency limit temperature and
When less than or equal to preset frequency reducing temperature, output voltage is increased according to the second predetermined amplitude, the second predetermined amplitude is greater than first
Predetermined amplitude.In the present embodiment, the second predetermined amplitude is 0.5v.When the temperature of IPM module is greater than frequency limit temperature, fast lifting
Output voltage increases the refrigerating capacity of semiconductor chilling plate 110 to improve heat dissipation effect.
In one embodiment, the temperature for the IPM module that controller detects in preset duration be greater than frequency reducing temperature and
When less than preset protection shutdown temperature, output voltage is increased according to third predetermined amplitude, it is pre- that third predetermined amplitude is greater than second
If amplitude.In the present embodiment, third predetermined amplitude is 2v.When the temperature of IPM module is greater than frequency reducing temperature, the bigger width of use
The amplitude of fast lifting output end is spent, the refrigerating capacity of semiconductor chilling plate 110 is increased.In addition, if controller is when default
The temperature of the IPM module detected in length is greater than or equal to protection shutdown temperature, then executes protection shutdown operation, and output failure mentions
Show information, user is reminded to overhaul.
For ease of understanding, below for radiating to IPM module, to the temperature sensor conveyed according to temperature sensor
The electric current that data adjust the output to semiconductor chilling plate 110 carries out detailed explanation.Specific control method is described as follows:
Parameter description:
【ISemiconductor] describe to pass through the total current size at cooling piece the two poles of the earth；
【USemiconductor calculates target voltage] the conveying voltage that control panel supplies cooling piece both ends is described；
【TSemiconductor] the description current real-time working temperature of IPM；
【TIPM frequency limit] description IPM frequency limit temperature；
【TIPM frequency reducing] description IPM frequency reducing temperature；
【TIPM protection] description IPM protection shutdown temperature；
【Tmin] lower limit temperature that IPM can normally and efficiently work is described；
【Tmax] ceiling temperature that IPM can normally and efficiently work is described；
Note: numerically perseverance has [Tmin] < [Tmax] < [TIPM frequency limit] < [TIPM protection】。
If 1, continuous 5s detects [Tmin】≤【TSemiconductor】≤【Tmax], then control parameter [USemiconductor calculates target voltage] stablize in current value
It is constant.
If 2, continuous 5s detects [TSemiconductor] < [Tmin], then control [USemiconductor calculates target voltage]=0v, i.e. closing semiconductor refrigerating work
Make.
If 3, continuous 5s detects [Tmax] < [TSemiconductor] < [TIPM frequency limit], then promote [USemiconductor calculates target voltage] value, increase cooling piece
Refrigerating capacity, [USemiconductor calculates target voltage]=[USemiconductor calculates target voltage】+0.2v。
If 4, continuous 5s detects [TIPM frequency limit】≤【TSemiconductor】≤【TIPM frequency reducing], then fast lifting U value, increases cooling piece refrigeration energy
Power, [USemiconductor calculates target voltage]=[USemiconductor calculates target voltage】+0.5v。
If 5, continuous 5s detects [TIPM frequency reducing] < [TSemiconductor] < [TIPM protection], then fast lifting U value, increases cooling piece refrigeration energy
Power, [USemiconductor calculates target voltage]=[USemiconductor calculates target voltage】+2v。
If 6, continuous 5s detects [TIPM protection】≤【TSemiconductor], then it executes protection and shuts down, prompt current failure.
Above-mentioned all detection parameters of logic are real-time detection, and unit s, executing the above-mentioned logic judgment action cycle is 5s,
Target voltage [USemiconductor calculates target voltage] calculating update cycle [TSemiconductor calculates target voltage] range be 0-30s, factory defaults 5s.
Radiator is arranged on the mainboard of air conditioner electrical box in the radiator of above-mentioned air conditioner electrical box, fills to heat dissipation
When the semiconductor chilling plate set is powered, cold source is generated using the refrigeration end of semiconductor chilling plate and is radiated to mainboard, is partly led
The radiating end fitting cooling fin of body cooling piece radiates, and user can also pass through the big of the circulating current of adjusting semiconductor chilling plate
The cooling capacity of small control semiconductor chilling plate, makes mainboard control work within the scope of reasonable temperature.Utilize semiconductor refrigerating principle energy
It is enough to realize the heat dissipation combined under mainboard room temperature and operating condition, can solve air-conditioning mainboard under high-temperature high-load occur because of high temperature therefore
The problem of barrier, improves heat dissipation reliability.
In one embodiment, a kind of air conditioner electrical box, including mainboard and above-mentioned radiator, semiconductor refrigerating are provided
The refrigeration end of piece is bonded setting with the mainboard of air conditioner electrical box, is illustrated in figure 2 radiator 100 and air conditioner electrical box is arranged in
Structural schematic diagram on mainboard.In addition, air conditioner electrical box may also include shell, mainboard and radiator are set in shell.
Above-mentioned air conditioner electrical box, is arranged radiator on mainboard, when the semiconductor chilling plate to radiator is powered,
It generates cold source using the refrigeration end of semiconductor chilling plate to radiate to mainboard, the radiating end of semiconductor chilling plate is bonded heat dissipation
Piece radiates, and user can also control the cold of semiconductor chilling plate by adjusting the size of the circulating current of semiconductor chilling plate
Amount makes mainboard control work within the scope of reasonable temperature.It can be realized using semiconductor refrigerating principle and combine mainboard room temperature
With the heat dissipation under operating condition, it can solve the problems, such as that air-conditioning mainboard breaks down because of high temperature under high-temperature high-load, improving heat dissipation can
By property.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the concept of this application, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.
Claims (10)
1. a kind of radiator of air conditioner electrical box, which is characterized in that including semiconductor chilling plate, thermal isolation film and cooling fin, institute
It states semiconductor chilling plate and is embedded at the cooling fin, and the refrigeration end of the semiconductor chilling plate is for the master with air conditioner electrical box
Plate fitting setting, the radiating end of the semiconductor chilling plate are bonded setting with the cooling fin, and the thermal isolation film is set to described
Between the refrigeration end and radiating end of semiconductor chilling plate.
2. radiator according to claim 1, which is characterized in that the refrigeration end of the semiconductor chilling plate and the master
IPM module on plate is bonded setting.
3. radiator according to claim 1, which is characterized in that the refrigeration end of the semiconductor chilling plate and the master
Heat dissipation circuit board on plate is bonded setting.
4. radiator according to claim 3, which is characterized in that the refrigeration end of the semiconductor chilling plate passes through heat dissipation
Cream is cohered with the heat dissipation circuit board on the mainboard is bonded setting.
5. radiator according to claim 1, which is characterized in that the cooling fin is aluminum thermal fin.
6. radiator according to claim 1, which is characterized in that the radiating end of the semiconductor chilling plate passes through heat dissipation
Cream is cohered with the cooling fin to be bonded.
7. radiator according to claim 1, which is characterized in that the cooling fin is additionally provided with for drawing described half
The conduit of the positive and negative anodes connecting terminal of conductor cooling piece.
8. radiator according to claim 7, which is characterized in that further include controller, the controller passes through setting
The positive and negative anodes connecting terminal of the semiconductor chilling plate is connected in the conducting wire of the conduit, the controller is for outputing current to
The semiconductor chilling plate controls the semiconductor chilling plate and carries out refrigeration radiating.
9. radiator according to claim 8, which is characterized in that further include the temperature sensing for being set to the mainboard
Device, the temperature sensor connect the controller；The controller is also used to the induction conveyed according to the temperature sensor
Temperature data adjusts the output to the electric current of the semiconductor chilling plate.
10. a kind of air conditioner electrical box, which is characterized in that filled including mainboard and heat dissipation as described in any one of claims 1-9
It sets, the refrigeration end of the semiconductor chilling plate is bonded setting with the mainboard of air conditioner electrical box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811265139.3A CN109195419B (en) | 2018-10-29 | 2018-10-29 | Air conditioner electrical box and heat radiating device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811265139.3A CN109195419B (en) | 2018-10-29 | 2018-10-29 | Air conditioner electrical box and heat radiating device thereof |
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| Publication Number | Publication Date |
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| CN109195419A true CN109195419A (en) | 2019-01-11 |
| CN109195419B CN109195419B (en) | 2024-03-19 |
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| CN201811265139.3A Active CN109195419B (en) | 2018-10-29 | 2018-10-29 | Air conditioner electrical box and heat radiating device thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109951133A (en) * | 2017-12-19 | 2019-06-28 | 日本电产三协株式会社 | Control device of electric motor |
| CN110131796A (en) * | 2019-05-20 | 2019-08-16 | 广东美的暖通设备有限公司 | Radiator, air conditioner and its control method, computer readable storage medium |
| CN110364938A (en) * | 2019-07-24 | 2019-10-22 | 扬州利家科技有限公司 | A kind of explosion-proof power distribution cabinet convenient for safeguarding |
| CN111902017A (en) * | 2020-07-10 | 2020-11-06 | 青岛海日高科模型有限公司 | Control board assembly and electrical equipment |
| CN112333992A (en) * | 2020-11-23 | 2021-02-05 | Oppo广东移动通信有限公司 | Electronic device |
| CN112594895A (en) * | 2020-11-19 | 2021-04-02 | 珠海格力电器股份有限公司 | Intelligent regulation and control method and system for temperature of outdoor unit |
| CN113513821A (en) * | 2021-05-11 | 2021-10-19 | 宁波奥克斯电气股份有限公司 | Air conditioner heat dissipation control method and device and air conditioner |
| CN113865054A (en) * | 2021-10-09 | 2021-12-31 | 广东美的制冷设备有限公司 | Heat dissipation control method and device of air conditioner and air conditioner |
| CN115164303A (en) * | 2022-07-06 | 2022-10-11 | 武汉理工大学 | Method for reducing energy consumption of air conditioner based on thermoelectric refrigeration technology |
| CN115226353A (en) * | 2022-07-26 | 2022-10-21 | 珠海格力电器股份有限公司 | Electrical box, control method and air conditioner |
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| CN113865054A (en) * | 2021-10-09 | 2021-12-31 | 广东美的制冷设备有限公司 | Heat dissipation control method and device of air conditioner and air conditioner |
| CN115164303A (en) * | 2022-07-06 | 2022-10-11 | 武汉理工大学 | Method for reducing energy consumption of air conditioner based on thermoelectric refrigeration technology |
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