CN109323482A - Semiconductor cooler and its refrigeration control method - Google Patents
Semiconductor cooler and its refrigeration control method Download PDFInfo
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- CN109323482A CN109323482A CN201811241833.1A CN201811241833A CN109323482A CN 109323482 A CN109323482 A CN 109323482A CN 201811241833 A CN201811241833 A CN 201811241833A CN 109323482 A CN109323482 A CN 109323482A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of semiconductor cooler and its refrigeration control methods, semiconductor cooler includes semiconductor refrigerating module, temperature measurement module, power module and microcontroller, the temperature data of temperature measurement module acquisition semiconductor refrigerating module, microcontroller is according to temperature data, output electric current based on sluggish relatively temperature control control power module, semiconductor refrigerating module freezes to the circuit board of downhole electronics according to output electric current, the cabin bottom of the underground pipe nipple equipped with the circuit board is arranged in semiconductor refrigerating module, close to circuit board.In embodiments of the present invention, semiconductor cooler structure is simple, is freezed using semiconductor refrigerating module to circuit board, and refrigeration cost is effectively reduced.Microcontroller is according to temperature data, and based on the output electric current of sluggish relatively temperature control control power module, semiconductor refrigerating module freezes to circuit board according to the output electric current of power module, effectively improves the reliability of refrigeration.
Description
Technical field
The present invention relates to oil gas drilling technical field more particularly to semiconductor coolers and its refrigeration control method.
Background technique
This part intends to provides background or context for the embodiment of the present invention stated in claims.Description herein
Recognize it is the prior art not because not being included in this section.
In petroleum, gas drilling or well logging, formation temperature increases with the increase of depth of stratum, i.e. layer depth
Degree is deeper, and formation temperature is higher.Some researches show that Average geothermal gradient is 3 DEG C/100m.For the oil/gas well of well depth 5000m,
Environment temperature at its 5000m can achieve 175 DEG C or so.However it is widely used in the electronics of conventional drilling or well logging
The body silicon device of device, the upper limit of reliable operating temperature are generally 125 DEG C or so.It means that conventional drilling well or survey
The electronic instrument of well will be unable to use in the oil/gas well of well depth 5000m.It is carried out in the oil/gas well of well depth 5000m or more
Drilling well or logging operation, if selecting high temperature resistant is more than 175 DEG C of high temperature resistant device, cost will be conventional electronics
10 times or more, this will will lead to drilling well, and perhaps the cost of well logging increases sharply and seriously affects the efficiency of drilling well or well logging, is unfavorable for dropping
This synergy.
In manufacturing and designing high temperature resistant instrument, there are the cooling technology of a variety of electronic components, as coldplate, heat insulation packed,
Sealing etc. between refrigerant and metal, but consider the specific condition of drilling well downhole tool, above-mentioned Refrigeration Technique is not able to satisfy work
Industry application.Current most of downhole drills survey logger almost without cooling system, usually utilize attemperator, example
Completely cut off outside heat such as vacuum flask and pass to inside, while placing heat absorbent in vacuum flask, slows down internal heating.But above-mentioned side
Method can not be such that the heat inside element is dispersed into environment.In addition, before the spectrometer tool based on Bgo crystal is by going into the well
The mode for being filled with liquid nitrogen realizes cooling and refrigeration, but the above method involves great expense, poor reliability, and promotional value is not high.
Therefore, existing oil/gas drilling or logger have that refrigeration is at high cost, poor reliability of freezing.
Summary of the invention
The embodiment of the present invention provides a kind of semiconductor cooler, deposits to solve existing oil/gas drilling or logger
Refrigeration it is at high cost, refrigeration poor reliability the problem of, which includes:
Semiconductor refrigerating module, temperature measurement module, power module and microcontroller；
The temperature measurement module is separately connected the semiconductor refrigerating module and the microcontroller, the power module difference
Connect the semiconductor refrigerating module and the microcontroller；
The temperature measurement module is used to obtain the temperature data of the semiconductor refrigerating module, and the microcontroller is used for basis
The temperature data, the output electric current of the power module is controlled based on sluggish relatively temperature control, and the semiconductor refrigerating module is used
Freeze according to the output electric current of the power module to the circuit board of downhole electronics；
Wherein, the cabin bottom of the underground pipe nipple equipped with the circuit board is arranged in the semiconductor refrigerating module, close
The circuit board of the downhole electronics.
The embodiment of the present invention also provides a kind of refrigeration control method of semiconductor cooler, bores to solve existing oil gas
The problem of existing refrigeration of well or logger is at high cost, refrigeration poor reliability, this method comprises:
The temperature data of temperature measurement module acquisition semiconductor refrigerating module；
Microcontroller is according to the temperature data, the output electric current based on sluggish relatively temperature control control power module；
Semiconductor refrigerating module exports electric current to the circuit board system of downhole electronics according to the power module
It is cold；
Wherein, the cabin bottom of the underground pipe nipple equipped with the circuit board is arranged in the semiconductor refrigerating module, close
The circuit board of the downhole electronics.
In the embodiment of the present invention, semiconductor cooler includes semiconductor refrigerating module, temperature measurement module, power module and micro-
Controller, temperature measurement module are separately connected semiconductor refrigerating module and microcontroller, and power module is separately connected semiconductor refrigerating mould
Block and microcontroller, temperature measurement module are used to obtain the temperature data of semiconductor refrigerating module, and microcontroller is used for according to temperature number
According to based on the output electric current of sluggish relatively temperature control control power module, semiconductor refrigerating module is used for according to the defeated of power module
Electric current freezes to the circuit board of downhole electronics out, and the underground equipped with the circuit board is arranged in semiconductor refrigerating module
The cabin bottom of pipe nipple, close to the circuit board of downhole electronics.In embodiments of the present invention, the semiconductor cooler structure letter
It is single, small in size, light-weight, freezed using circuit board of the semiconductor refrigerating module to downhole electronics, can effectively be dropped
Low refrigeration cost, so that downhole electronics can work normally at higher ambient temperatures.In addition, in the embodiment of the present invention
The temperature data of semiconductor refrigerating module that is obtained according to temperature measurement module of microcontroller, power supply is controlled based on sluggish relatively temperature control
The output electric current of module, semiconductor refrigerating module is in turn according to the output electric current of power module to the circuit board of downhole electronics
Freeze, can effectively improve the reliability of refrigeration.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.In the accompanying drawings:
Fig. 1 is the function structure chart of semiconductor cooler provided in an embodiment of the present invention；
Fig. 2 is that the positional relationship of the cabin of semiconductor refrigerating module provided in an embodiment of the present invention and underground pipe nipple is illustrated
Figure；
Fig. 3 is that coefficient of refrigerating performance of the semiconductor chilling plate provided in an embodiment of the present invention under the different temperature difference, current condition shows
It is intended to；
Fig. 4 is semiconductor chilling plate provided in an embodiment of the present invention refrigerating capacity and temperature difference under maximum refrigeration coefficient operating condition
Relation schematic diagram；
Fig. 5 is semiconductor chilling plate provided in an embodiment of the present invention current strength and temperature under maximum refrigeration coefficient operating condition
The relation schematic diagram of difference；
Fig. 6 is the implementation flow chart of the refrigeration control method of semiconductor cooler provided in an embodiment of the present invention；
Fig. 7 is the implementation process of step 602 in the refrigeration control method of semiconductor cooler provided in an embodiment of the present invention
Figure；
Fig. 8 is another implementation flow chart of the refrigeration control method of semiconductor cooler provided in an embodiment of the present invention.
Specific embodiment
Understand in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, with reference to the accompanying drawing to this hair
Bright embodiment is described in further details.Here, the illustrative embodiments of the present invention and their descriptions are used to explain the present invention, but simultaneously
It is not as a limitation of the invention.
Fig. 1 shows the modular structure of semiconductor cooler provided in an embodiment of the present invention, and Fig. 2 shows implementations of the present invention
Example provide semiconductor refrigerating module 101 with equipped with circuit board 201 underground pipe nipple 202 cabin 2021 positional relationship, be
Convenient for description, only parts related to embodiments of the present invention are shown, and details are as follows:
As depicted in figs. 1 and 2, semiconductor cooler comprising semiconductor refrigerating module 101, temperature measurement module 102, power supply
Module 103 and microcontroller 104.The temperature measurement module 102 is separately connected the semiconductor refrigerating module 101 and the micro-control
Device 104 processed, the power module 103 are separately connected the semiconductor refrigerating module 101 and the microcontroller 104.The survey
Warm module 102 is used to obtain the temperature data of the semiconductor refrigerating module 101, and the microcontroller 104 is used for according to
Temperature data controls the output electric current of the power module 103, the semiconductor refrigerating module 101 based on sluggish relatively temperature control
For being freezed according to the output electric current of the power module 103 to the circuit board 201 of downhole electronics, wherein described
2021 bottom of cabin of the underground pipe nipple 202 equipped with the circuit board 201 is arranged in semiconductor refrigerating module 101, close to described
The circuit board 201 of downhole electronics.Wherein, the circuit board 201 of downhole electronics refers to the institutes such as downhole drill or well logging
Various electronic instruments, equipment use, freezing etc., i.e. downhole electronics.
In embodiments of the present invention, semiconductor cooler includes semiconductor refrigerating module 101, temperature measurement module 102, power supply mould
Block 103 and microcontroller 104, temperature measurement module 102 are separately connected semiconductor refrigerating module 101 and microcontroller 104, power supply mould
Block 103 is separately connected semiconductor refrigerating module 101 and microcontroller 104, and temperature measurement module 102 is for obtaining semiconductor refrigerating module
101 temperature data, microcontroller 104 is used for according to temperature data, based on the defeated of sluggish relatively temperature control control power module 103
Electric current out, semiconductor refrigerating module 101 are used to export electric current to the circuit board of downhole electronics according to power module 103
201 freeze, and 2021 bottom of cabin of the underground pipe nipple 202 equipped with the circuit board 201 is arranged in semiconductor refrigerating module 101
Portion, close to the circuit board 201 of downhole electronics.In embodiments of the present invention, the semiconductor cooler structure is simple, volume
It is small, light-weight, freezed using circuit board 201 of the semiconductor refrigerating module 101 to downhole electronics, be can be effectively reduced
Refrigeration cost, so that downhole electronics can work normally at higher ambient temperatures.In addition, in the embodiment of the present invention
The temperature data for the semiconductor refrigerating module 101 that microcontroller 104 is obtained according to temperature measurement module 102, based on sluggish relatively temperature control
The output electric current of power module 103 is controlled, semiconductor refrigerating module 101 is in turn according to the output electric current of power module 103 to well
The circuit board 201 of lower electronic instrument freezes, and can effectively improve the reliability of refrigeration.
In a further embodiment, the semiconductor refrigerating module 101 includes cold and hot end, the temperature data packet
Include the temperature difference in semiconductor refrigerating module 101 hot end and cold end.101 benefit of semiconductor refrigerating module in the embodiment of the present invention
Freezed with paltie effect.Paltie effect is that French scientist Peltier in 1834 has found that thermoelectric cooling and heating are existing
As i.e. thermoelectric effect.A pair of of the thermocouple being made of N, P-type material, after thermocouple is passed through DC current, because of direct current
It circulates into the difference in direction, heat absorption will be generated at galvanic couple node and exothermic phenomenon, this phenomenon are referred to as paltie effect.This hair
For semiconductor cooler in bright embodiment during being freezed using paltie effect, the thermodynamics according to atom diffusion is former
The chemical potential variation of reason, metal material constituent element will drive atom that diffusion motion occurs, and make to extend what atom was reduced along chemical potential
Direction is diffused.Wherein, the high one end of heat is the hot end (general temperature is higher) of semiconductor refrigerating module 101, and heat is low
One end be known as cold end (general temperature is lower), have a temperature gradient between hot end and cold end, carry out the migration of energy.Wherein
Temperature data be semiconductor refrigerating module 101 hot end and cold end between temperature difference.
In a further embodiment, the underground pipe nipple 202 includes measurement while drilling pipe nipple (full name in English: Measure
While Drilling, abbreviation MWD), well logging pipe nipple (full name in English: Logging While Drilling, abbreviation LWD)
Or rotary steering pipe nipple etc..
In a further embodiment, as shown in Fig. 2, the hot end of the semiconductor refrigerating module 101 (is schemed close to hydrophthalmia
The position below of inner arc shown in 2), it is lower in view of hydrophthalmia temperature, it can achieve the purpose convenient for heat dissipation；The semiconductor system
Circuit board 201 of the cold end of cold module 101 close to downhole electronics.In addition, to further increase refrigeration effect, further
Embodiment in, other spaces of cabin are adiabatic material 203 and fill.
In a further embodiment, it is made using circuit board 201 of the semiconductor cooler to downhole electronics
When cold control, the microcontroller 104 is used for according to the temperature data, controls the power module based on sluggish relatively temperature control
103 output electric current includes:
If it is poor that the temperature difference of 101 hot end of semiconductor refrigerating module and cold end is less than preset temperature, microcontroller 104 is controlled
The output electric current for making the power module 103 makes the semiconductor cooler be in maximum refrigeration coefficient operating condition；
If it is poor that the temperature difference of 101 hot end of semiconductor refrigerating module and cold end is more than or equal to preset temperature, micro-control
The output electric current that device 104 processed controls the power module 103 linearly increases to maximum output current, makes the semiconductor cooler
In maximum cooling capacity operating condition.
Following formula can be obtained according to thermodynamics and semiconductor refrigerating basic theories:
Q=α ITc-0.5I2R-KΔT (1)
W=α I Δ T+I2R (2)
ε=Q/W (3)
Wherein, Q is refrigerating capacity, and W is consumption of electric power, and ε is coefficient of refrigerating performance, and α is thermoelectromotive force, and I is current strength, Tc
For cold junction temperature, R is semiconductor chilling plate internal resistance, and K is thermal coefficient, and Δ T is the temperature difference in hot end and cold end.
As shown from the above formula, the main temperature difference Δ T and confession with hot end and cold end of the coefficient of refrigerating performance ε of semiconductor chilling plate
Electric current strength I is related.Fig. 3 show semiconductor chilling plate provided in an embodiment of the present invention coefficient of refrigerating performance ε and temperature difference T,
The relationship of electric current I is illustrated.From figure 3, it can be seen that the temperature difference Δ T of hot end and cold end is bigger, reach needed for maximum refrigeration coefficient
Current strength I it is bigger.
Fig. 4 shows semiconductor chilling plate provided in an embodiment of the present invention refrigerating capacity and temperature under maximum refrigeration coefficient operating condition
The relationship signal of degree difference.From fig. 4, it can be seen that refrigerating capacity Q and the temperature difference Δ T of hot end and cold end are inversely proportional.Dotted line in Fig. 4
When to depict hot-side temperature be 75 DEG C, the pass of the temperature difference Δ T of refrigerating capacity Q and hot end and cold end under maximum refrigeration coefficient operating condition
System.When section of the temperature difference Δ T of hot end and cold end less than 40 DEG C, refrigerating capacity Q is with temperature difference Δ T monotone increasing, about 40
DEG C when reach maximum cooling capacity, current strength I is about 0.4A at this time, when the temperature difference is more than maximum refrigeration coefficient operating condition after 40 DEG C
Under refrigerating capacity decline with the increase of hot end and the temperature difference Δ T of cold end.
Fig. 5 show semiconductor chilling plate provided in an embodiment of the present invention under maximum refrigeration coefficient operating condition current strength with
The relationship of temperature difference is illustrated.From figure 5 it can be seen that under maximum refrigeration coefficient operating condition, current strength I and hot end and cold end
Temperature difference Δ T is substantially in a linear relationship, and the straight line fitting of origin can be used.In this way, measurement hot end and cold end can be passed through
Temperature difference Δ T, so that it may current strength I needed for maximum refrigeration coefficient operating condition is calculated.
In practical applications, the factor for influencing coefficient of refrigerating performance is relatively more, and the temperature difference Δ T of hot end and cold end is at 20 DEG C -30
Between DEG C, higher refrigerating efficiency and preferable heat-conducting effect can achieve, the heat dissipation for improving hot end and cold end helps to improve
Refrigeration performance.
Wherein, the preset temperature difference is that predetermined temperature is poor, and user can according to the actual situation or demand is pre-
First set.In a preferably embodiment, the preset temperature difference is 40 DEG C.
Temperature control algorithm when in view of semiconductor chilling plate work, High Accuracy Constant Temperature control can be used linear PID and adjusts
Algorithm, and nonlinear PID controller is conducive to quick temperature control.For primary complete conventional drilling process, bored in normal drilling
Well liquid keeps circulation, and drill string temperature is lower than formation temperature；When termination of pumping, closing well or drilling fluid stops circulation, drill string temperature when making a trip
Degree can gradually rise.All temperature changing processes are all slow processes；Secondly, the environment of the circuit board 201 of downhole electronics
As long as temperature is no more than heatproof, accurate temperature controlling is not needed；Again, section cooling piece work is lowered in maximum refrigeration coefficient operating condition
Electric current is also difficult point, can generate thermal shock damage semiconductor chilling plate using pulsewidth modulation (PWM), influence reliability.It is final true
It is fixed not use PID control, and simple sluggish comparison temperature is used to adjust algorithm.
When adjusting algorithm progress refrigeration control using sluggish comparison temperature, if the temperature difference Δ T of hot end and cold end is less than
Preset temperature is poor, controls the output electric current of power module 103, semiconductor cooler is made to be in maximum refrigeration coefficient operating condition.At this point,
The temperature difference Δ T of the output electric current of power module 103 and hot end and cold end meets following relationship:
I=k Δ T (4)
Wherein, k is determined by way of experiment.
If it is poor more than or equal to preset temperature that the temperature difference Δ T of hot end and cold end is less than preset temperature, maximum system is kept
Cold coefficient operating condition will will lead to refrigerating capacity in decline drive trend (please referring to shown in Fig. 4 dotted line).At this point, if exporting the strong of electric current
Degree is more than (maximum output current I i.e. hereafter to a certain degreeQmax), the heat that Joule effect generates will offset paltie effect
Refrigerating capacity, and then the refrigerating capacity of semiconductor cooler is caused to reduce.Therefore, microcontroller 104 passes through control power module 103
Output electric current linearly increase to maximum output current IQmax, in maximum output current IQmaxIn the case where, control semiconductor refrigerating
Device is in maximum cooling capacity operating condition.Wherein, semiconductor cooler is made to be in the maximum output current I of maximum cooling capacity operating conditionQmax
It is determined by way of experiment.
In a further embodiment, if the temperature of the circuit board 201 of the downhole electronics is less than or equal in advance
If temperature, the output electric current that microcontroller 104 controls the power module 103 is zero, is in the semiconductor cooler not
Working condition.
In this embodiment, preset temperature is predetermined temperature, can according to actual needs or drilling well, well logging ring
Border and requirement determine.When the temperature of the circuit board 201 of downhole electronics is less than or equal to preset temperature, illustrate at this time partly
Conductor refrigerator can effectively freeze, and reach scheduled refrigeration effect, and therefore, microcontroller 104 controls the power supply mould
The output electric current of block 103 is zero, so that the semiconductor cooler is in off position, with energy saving.
This sluggishness comparison temperature adjusts algorithm refrigerating efficiency with higher, and the temperature control method of sluggishness relatively can be to avoid
Semiconductor chilling plate frequently acts, and reduces thermal shock；In addition, linearly slowly increasing power module by the way of soft start
103 output electric current, can extend the service life of semiconductor chilling plate.
In a further embodiment, semiconductor refrigerating module 101 includes the semiconductor chilling plate of TEC1 series.For example,
The semiconductor chilling plate of TEC1 series includes TEC1-12703T125, TEC1- of TEC1-12703~TEC1-12710 series
The semiconductor chilling plates such as 12704T125TEC1-12709T125 and TEC1-12710T125；Can also include
The semiconductor chilling plate of TEC1-03103~TEC1-03115 series.Certainly, it will be appreciated by persons skilled in the art that partly leading
System module can also include the cooling piece of other types or series, not do special limitation herein.The embodiment of the present invention
Using semiconductor chilling plate, refrigeration cost can be effectively reduced, realize the reliable system to the circuit board 201 of downhole electronics
It is cold.In a further embodiment, the semiconductor chilling plate in semiconductor refrigerating module 101 be multiple semiconductor chilling plate groups at
Semiconductor chilling plate group.Such as the semiconductor chilling plate group being made of 8 chip semiconductor cooling pieces.
In one embodiment, select the APHM-065-05-15 of European Thermodynamics production is miniature partly to lead
Body cooling piece, the semiconductor chilling plate small volume (12mm × 11mm), monolithic maximum cooling capacity are 4.2w, maximum temperature difference 74
DEG C, the hot-side temperature of long-term work can achieve 150 DEG C.
In a further embodiment, the temperature measurement module 102 includes digital temperature sensor.Digital temperature sensor is
A temperature physical quantity is referred to by temperature-sensing element (device) and corresponding circuit conversion at facilitating computer, intelligence instrument or can
The temperature data acquisitions equipment such as programmed logic controller directly reads the sensor of digital quantity.In embodiments of the present invention, digital
Temperature sensor includes TMP464 digital temperature sensor.Using digital temperature sensor, temperature data sensing can be improved
Accuracy, and then improve the reliability of semiconductor cooler.
Microcontroller refers to the microcomputer of the integrated single chip on a single die of the major part of microcomputer
Calculation machine.It is widely used in motor control, barcode reader/scanner, electronic equipment for consumption, mobile terminal, access control,
The fields such as industrial automatic control and white domestic appliances (washing machine, micro-wave oven).It can be carried out according to different classification standards
Different classification.According to data-bus width, 8 8-digit microcontrollers can be divided into, 16 be microcontroller and 32 8-digit microcontrollers
Deng.The microcontroller of Harvard structure and the microcontroller of Von Neumann structure can be divided into according to memory construction.Root
The microcontroller of OTP (full name in English: One Time Programmable) can be divided into according to the classification of embedded program memory, covered
Film microcontroller and EPROM/EEPROM and flash memory Flash microcontroller；CISC micro-control can be divided into again according to order structure
Device and RISC controller processed.Microcontroller can be the microcontroller of STM32 series or the microcontroller of Cortex-M series
Device, also or be STR7 series microcontroller.The embodiment of the present invention does not do special limit to the type of microcontroller 104
System.
In a further embodiment, it in order to guarantee that semiconductor chilling plate is in maximum refrigeration coefficient operating condition, needs accurate
Control the size that power module 103 exports electric current.Therefore, the power module 103 in the embodiment of the present invention uses the OPA569 of T1
Accurate voltage-current converter of the power operational amplifier composition of model is semiconductor cooler power supply.OPA569 model function
Rate amplifier includes that one ± 3% high-precision exports current indicator.The current indicator is big with load output electric current 1/475
Small replica current is simultaneously drawn from the 19th foot of device, can not only be improved the working efficiency of amplifier, can also be increased the voltage in load
The amplitude of oscillation.Essence is designed based on the TINA-TI circuit simulating software of SPICE technology using T1 and Design Soft joint development
Close voltage-current converter.
In a further embodiment, the microcontroller 104 includes timer, and the microcontroller 104 is also used to
When detecting the interrupt requests that the timer generates, controls the semiconductor cooler and reset.The embodiment of the present invention, which increases, to be used
In the timer for generating interrupt requests, prevent semiconductor cooler from crashing, and other abnormal conditions.In microcontroller
104 detect timer generate interrupt requests when, according to timer generate interrupt requests control semiconductor cooler in time
It is resetted, to improve the reliability of semiconductor cooler.
In a further embodiment, the radiating mode of the semiconductor cooler includes any of the following: dissipating naturally
Heat, filling liquid heat dissipation, forced air cooling heat dissipation and the heat dissipation of vacuum latent heat.
Natural heat dissipation refers in the case where no external driving force, by radiating surface transfer heat to ambient temperature compared with
In low substance (such as air).In natural heat dissipation mode, thermally conductive preferable material, such as red copper aluminum material can be used to do
At various cooling fins, heat is freely distributed in static air.Filling liquid heat dissipation, which refers to, is made into water with preferable heat sink material
Case, with logical liquid or the method radiating and cooling of water flowing.Forced air cooling heat dissipation refers to is radiated using blower, and this mode is held
Easily there is noise.The most commonly used is " heat pipe " cooling fins for the heat dissipation of vacuum latent heat, it is quickly to transmit thermal capacity using evaporative heat loss.
Semiconductor cooler structure in the embodiment of the present invention is simple, small in size, light-weight, high reliablity；Secondly, partly leading
System it is cold without wear, facilitate maintenance, control flexibly, operation have invertibity；In addition, the semiconductor refrigerating in the embodiment of the present invention
Starting is fast, self-heat generation amount is low, meets the circuit board 201 of underground downhole electronics and the refrigeration demand of electrical component；Most
Afterwards, cost is relatively low, the purpose of cost efficiency may be implemented for the semiconductor cooler in the present invention.
Fig. 6 shows the implementation process of the refrigeration control method of semiconductor cooler provided in an embodiment of the present invention, for just
In description, only parts related to embodiments of the present invention are shown, and details are as follows:
As shown in fig. 6, the refrigeration control method of semiconductor cooler comprising:
Step 601, temperature measurement module 102 obtains the temperature data of semiconductor refrigerating module 101；
Step 602, microcontroller 104 is according to the temperature data, based on sluggish relatively temperature control control power module 103
Export electric current；
Step 603, semiconductor refrigerating module 101 is according to the output electric current of the power module 103 to downhole electronics
Circuit board 201 freeze；
Wherein, the cabin 2021 of the underground pipe nipple 202 equipped with circuit board 201 is arranged in the semiconductor refrigerating module 101
Bottom, close to the circuit board 201 of the downhole electronics.
In embodiments of the present invention, temperature measurement module 102 obtains the temperature data of semiconductor refrigerating module 101, microcontroller
104 according to the temperature data, based on the output electric current of sluggish relatively temperature control control power module 103, semiconductor refrigerating module
101 freeze to the circuit board 201 of downhole electronics according to the output electric current of the power module 103, semiconductor refrigerating
2021 bottom of cabin of the underground pipe nipple 202 equipped with circuit board 201 is arranged in module 101, close to the downhole electronics
Circuit board 201.Semiconductor cooler structure in the embodiment of the present invention is simple, small in size, light-weight, utilizes semiconductor refrigerating mould
Block 101 freezes to the circuit board 201 of downhole electronics, and refrigeration cost can be effectively reduced, so that downhole electronics
It can work normally at higher ambient temperatures.In addition, the microcontroller 104 in the embodiment of the present invention is according to temperature measurement module
The temperature data of the 102 semiconductor refrigerating modules 101 obtained, the output electricity based on sluggish relatively temperature control control power module 103
Stream, semiconductor refrigerating module 101 so that according to the output electric current of power module 103 to the circuit boards 201 of downhole electronics into
Row refrigeration, can effectively improve the reliability of refrigeration.
In a further embodiment, the semiconductor refrigerating module 101 includes cold and hot end, the temperature data packet
Include the temperature difference in semiconductor refrigerating module 101 hot end and cold end.
Fig. 7 shows the realization of step 602 in the refrigeration control method of semiconductor cooler provided in an embodiment of the present invention
Process, for ease of description, only parts related to embodiments of the present invention are shown, details are as follows:
In a further embodiment, as shown in fig. 7, step 602, micro-control in the refrigeration control method of semiconductor cooler
Device 104 processed is according to the temperature data, the output electric current based on sluggish relatively temperature control control power module 103, comprising:
Step 701, if the temperature difference of 101 hot end of semiconductor refrigerating module and cold end is poor less than preset temperature, micro-control
Device 104 processed controls the output electric current of the power module 103, and the semiconductor cooler is made to be in maximum refrigeration coefficient operating condition
Step 702, if the temperature difference of 101 hot end of semiconductor refrigerating module and cold end is more than or equal to preset temperature
Difference, the output electric current that microcontroller 104 controls the power module 103 linearly increase to maximum output current, make described partly to lead
Chiller is in maximum cooling capacity operating condition.
In embodiments of the present invention, the preset temperature difference is that predetermined temperature is poor, and user can be according to practical feelings
Condition or demand are set in advance.In a preferably embodiment, the preset temperature difference is 40 DEG C.Using sluggish warmer
When degree adjusts algorithm progress refrigeration control, if the temperature difference Δ T of hot end and cold end is poor less than preset temperature, power module is controlled
103 output electric current makes semiconductor cooler be in maximum refrigeration coefficient operating condition.At this point, the output electric current of power module 103 with
The temperature difference Δ T of hot end and cold end meets following relationship:
I=k Δ T (4)
Wherein, k is determined by way of experiment.If the temperature difference Δ T of hot end and cold end be less than preset temperature be greater than or
It is poor equal to preset temperature, it keeps maximum refrigeration coefficient operating condition that will will lead to refrigerating capacity and (please refers to Fig. 4 dotted line institute in decline drive trend
Show).At this point, if the intensity of output electric current is more than (maximum output current I i.e. hereafter to a certain degreeQmax), Joule effect produces
Raw heat will offset the refrigerating capacity of paltie effect, and then the refrigerating capacity of semiconductor cooler is caused to reduce.Therefore, micro-control
Device 104 processed linearly increases to maximum output current I by the output electric current of control power module 103Qmax, in maximum output current
IQmaxIn the case where, control semiconductor cooler is in maximum cooling capacity operating condition.Wherein, semiconductor cooler is made to be in maximum system
The maximum output current I of cooling capacity operating conditionQmaxIt is determined by way of experiment.
Fig. 8 shows another implementation process of the refrigeration control method of semiconductor cooler provided in an embodiment of the present invention,
The sequence of step can change in the flow chart according to different requirements, and certain steps can be omitted, for ease of description, only showing
Go out part related to the embodiment of the present invention, details are as follows:
In a further embodiment, in order to further increase the reliability of semiconductor cooler, as shown in figure 8, described
The refrigeration control method of semiconductor cooler further include:
Step 801, if the temperature of the circuit board 201 of the downhole electronics is less than or equal to preset temperature, micro-control
The output electric current that device 104 processed controls the power module 103 is zero, and the semiconductor cooler is made to be in off position.
Preset temperature is predetermined temperature, can according to actual needs or drilling well, logging environment and require determine.
When the temperature of the circuit board 201 of downhole electronics is less than or equal to preset temperature, illustrate that semiconductor cooler can at this time
Effectively to freeze, and scheduled refrigeration effect is reached, therefore, microcontroller 104 controls the output electricity of the power module 103
Stream is zero, so that the semiconductor cooler is in off position, with energy saving.
In a further embodiment, in order to further increase the reliability of semiconductor cooler, as shown in figure 8, described
The refrigeration control method of semiconductor cooler further include:
Step 802, the microcontroller 104 is controlled when detecting the interrupt requests that the timer generates described partly leads
Chiller resets.
The embodiment of the present invention increases the timer for generating interrupt requests, prevents semiconductor cooler from crashing, with
And other abnormal conditions.When microcontroller 104 detects the interrupt requests that timer generates, according in timer generation
Control semiconductor cooler is resetted in time for disconnected request, to improve the reliability of semiconductor cooler.
Wherein, it should be noted that can only include step 801 in an embodiment, can only include in another embodiment
Step 802, it can simultaneously include step 801 and step 802 in another embodiment, and not limit step 801 and step 802
Sequentially.
In conclusion the semiconductor cooler in the embodiment of the present invention includes semiconductor refrigerating module 101, temperature measurement module
102, power module 103 and microcontroller 104, temperature measurement module 102 are separately connected semiconductor refrigerating module 101 and microcontroller
104, power module 103 is separately connected semiconductor refrigerating module 101 and microcontroller 104, and temperature measurement module 102 is partly led for obtaining
The temperature data of body refrigeration module 101, microcontroller 104 are used for according to temperature data, control power supply based on sluggish relatively temperature control
The output electric current of module 103, semiconductor refrigerating module 101 are used for the output electric current according to power module 103 to underground electronics
The circuit board 201 of device freezes, wherein the underground pipe nipple 202 equipped with circuit board 201 is arranged in semiconductor refrigerating module 101
2021 bottom of cabin, close to downhole electronics circuit board 201.In embodiments of the present invention, the semiconductor cooler knot
Structure is simple, small in size, light-weight, is freezed using circuit board 201 of the semiconductor refrigerating module 101 to downhole electronics,
Refrigeration cost can be effectively reduced, so that downhole electronics can work normally at higher ambient temperatures.In addition, this hair
The temperature data for the semiconductor refrigerating module 101 that microcontroller 104 in bright embodiment is obtained according to temperature measurement module 102, is based on
The output electric current of sluggishness relatively temperature control control power module 103, semiconductor refrigerating module 101 is in turn according to power module 103
Output electric current freezes to the circuit board 201 of downhole electronics, can effectively improve the reliability of refrigeration.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects
Describe in detail it is bright, it should be understood that the above is only a specific embodiment of the present invention, the guarantor being not intended to limit the present invention
Range is protected, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should be included in this
Within the protection scope of invention.
Claims (12)
1. a kind of semiconductor cooler characterized by comprising
Semiconductor refrigerating module, temperature measurement module, power module and microcontroller；
The temperature measurement module is separately connected the semiconductor refrigerating module and the microcontroller, and the power module is separately connected
The semiconductor refrigerating module and the microcontroller；
The temperature measurement module is used to obtain the temperature data of the semiconductor refrigerating module, and the microcontroller is used for according to
Temperature data, the output electric current of the power module is controlled based on sluggish relatively temperature control, and the semiconductor refrigerating module is used for root
Freeze according to the output electric current of the power module to the circuit board of downhole electronics；
Wherein, the cabin bottom of the underground pipe nipple equipped with the circuit board is arranged in the semiconductor refrigerating module, close to described
The circuit board of downhole electronics.
2. semiconductor cooler as described in claim 1, which is characterized in that the semiconductor refrigerating module includes cold end and heat
End, the temperature data includes the temperature difference of semiconductor refrigerating module hot end and cold end.
3. semiconductor cooler as claimed in claim 2, which is characterized in that the microcontroller is used for according to the temperature number
According to the output electric current for controlling the power module based on sluggish relatively temperature control includes:
If it is poor that the temperature difference of semiconductor refrigerating module hot end and cold end is less than preset temperature, microcontroller controls the power supply
The output electric current of module makes the semiconductor cooler be in maximum refrigeration coefficient operating condition；
If it is poor that the temperature difference of semiconductor refrigerating module hot end and cold end is more than or equal to preset temperature, microcontroller control
The output electric current of the power module linearly increases to maximum output current, and the semiconductor cooler is made to be in maximum cooling capacity
Operating condition.
4. semiconductor cooler as described in any one of claims 1 to 3, which is characterized in that if the downhole electronics
The temperature of circuit board is less than or equal to preset temperature, and the output electric current that microcontroller controls the power module is zero, makes institute
It states semiconductor cooler and is in off position.
5. semiconductor cooler as described in claim 1, which is characterized in that semiconductor refrigerating module includes the half of TEC1 series
Conductor cooling piece.
6. semiconductor cooler as described in claim 1, which is characterized in that the temperature measurement module includes digital temperature sensing
Device.
7. semiconductor cooler as described in claim 1, which is characterized in that the microcontroller includes timer, described micro-
Controller is also used to when detecting the interrupt requests that the timer generates, and is controlled the semiconductor cooler and is resetted.
8. a kind of refrigeration control method of semiconductor cooler characterized by comprising
The temperature data of temperature measurement module acquisition semiconductor refrigerating module；
Microcontroller is according to the temperature data, the output electric current based on sluggish relatively temperature control control power module；
Semiconductor refrigerating module freezes to the circuit board of downhole electronics according to the output electric current of the power module；
Wherein, the cabin bottom of the underground pipe nipple equipped with the circuit board is arranged in the semiconductor refrigerating module, close to described
The circuit board of downhole electronics.
9. method according to claim 8, which is characterized in that the semiconductor refrigerating module includes cold and hot end, described
Temperature data includes the temperature difference of semiconductor refrigerating module hot end and cold end.
10. method as claimed in claim 9, which is characterized in that microcontroller is compared according to the temperature data based on sluggish
Temperature control control power module output electric current include:
If it is poor that the temperature difference of semiconductor refrigerating module hot end and cold end is less than preset temperature, microcontroller controls the power supply
The output electric current of module makes the semiconductor cooler be in maximum refrigeration coefficient operating condition；
If it is poor that the temperature difference of semiconductor refrigerating module hot end and cold end is more than or equal to preset temperature, microcontroller control
The output electric current of the power module linearly increases to maximum output current, and the semiconductor cooler is made to be in maximum cooling capacity
Operating condition.
11. such as the described in any item methods of claim 8 to 10, which is characterized in that further include:
If the temperature of the circuit board of the downhole electronics is less than or equal to preset temperature, microcontroller controls the power supply
The output electric current of module is zero, and the semiconductor cooler is made to be in off position.
12. method according to claim 8, which is characterized in that the microcontroller includes timer, and the method is also wrapped
It includes:
The microcontroller controls the semiconductor cooler when detecting the interrupt requests that the timer generates and resets.
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| CN109323482B (en) | 2020-08-11 |
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