CN107704054A - The cooling system cooled down to electronic component - Google Patents
The cooling system cooled down to electronic component Download PDFInfo
- Publication number
- CN107704054A CN107704054A CN201710792509.8A CN201710792509A CN107704054A CN 107704054 A CN107704054 A CN 107704054A CN 201710792509 A CN201710792509 A CN 201710792509A CN 107704054 A CN107704054 A CN 107704054A
- Authority
- CN
- China
- Prior art keywords
- radiator
- electronic component
- semiconductor
- cooling system
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a kind of cooling system cooled down to electronic component, cooling system includes：Semiconductor refrigerating unit, circulation cooling unit and data acquisition unit, semiconductor refrigerating unit includes semiconductor cooler and power supply, semiconductor cooler and power supply selectively electrically connect, semiconductor cooler has cold end and hot junction, circulation cooling unit has radiator, radiator is relative with the hot junction of semiconductor cooler, data acquisition unit is used for the temperature at least detecting radiator and electronic component, and data acquisition unit is suitable to control semiconductor cooler and power electric connection when the temperature of electronic component is higher than preset value.The cooperation radiating of cooling system according to embodiments of the present invention, circulation cooling unit and semiconductor refrigerating unit improves the heat-sinking capability and radiating efficiency of cooling system, and the setting of data acquisition unit enables whole cooling system intellectuality, automation radiating.
Description
Technical field
The present invention relates to technical field of heat dissipation, in particular to a kind of cooling system cooled down to electronic component.
Background technology
In correlation technique, air-cooled radiating or water cooled heat radiating are taken in the radiating to electronic components such as CPU, memory bars,
But air-cooled fan heat drop temperature limited extent, and water cooled heat radiating is if it is intended to reach preferable radiating effect needs in water cooling system
Add ice cube in system, complex operation and security is relatively low.That is, radiating mode of the prior art, air-cooled radiating
Radiating effect is poor, and the operating process of water cooled heat radiating is complicated and feasibility is low.
The content of the invention
It is contemplated that at least solves one of technical problem present in prior art.Therefore, the present invention proposes one kind certainly
The cooling system cooled down to electronic component of dynamicization, rapid heat dissipation and good heat dissipation effect.
Cooling system according to embodiments of the present invention includes：Semiconductor refrigerating unit, circulation cooling unit and data are adopted
Collect unit, the semiconductor refrigerating unit includes semiconductor cooler and power supply, and the semiconductor cooler and power supply may be selected
Ground electrically connects, and the semiconductor cooler has cold end and hot junction, and the circulation cooling unit has radiator, the radiator
Relative with the hot junction of the semiconductor cooler, the data acquisition unit is used at least detect the radiator and the electronics
The temperature of element, the data acquisition unit are suitable to control the semiconductor when the temperature of the electronic component is higher than preset value
Refrigerator and the power electric connection.
Cooling system according to embodiments of the present invention, the semiconductor refrigerating being oppositely arranged by the outer surface with electronic component
Heat absorption that the cold end of device sends electronic component is simultaneously transferred to hot junction, and hot junction will be through cold end transmission via circulation cooling unit
The caused heat absorption of next heat and hot junction itself, data acquisition unit carry out detection in real time to whole cooling system simultaneously certainly
Dynamic changes circulation cooling unit radiating efficiency and semiconductor refrigerating unit cold end and the temperature difference in hot junction.Thus, circulation cooling
The cooperation radiating and the setting of data acquisition unit of unit and semiconductor refrigerating unit, not only increase the radiating of cooling system
Ability and radiating efficiency, and enable cooling system intellectuality, automation radiating.
According to some embodiments of the present invention, the semiconductor cooler is partly led including at least multiple p-types being set up in parallel
Body and N-type semiconductor, the P-type semiconductor and the N-type semiconductor are arranged in a crossed manner, adjacent P-type semiconductor and N-type semiconductor
One end connected by the first metal joint and the other end is connected by the second metal joint, the cold end is formed described first
On the metal joint and hot junction is formed on second metal joint.
Further, the semiconductor cooler also includes the first insulating heat-conductive part and the second insulating heat-conductive part, and described
One insulating heat-conductive part is connected with multiple first metal joints, and the second insulating heat-conductive part connects with multiple second metals
Head connection, the first insulating heat-conductive part are connected with multiple first metal joints.
Alternatively, the semiconductor cooler also includes heat shield, and mounting groove, the p-type are limited in the heat shield
Semiconductor and N-type semiconductor are respectively positioned in the mounting groove, and the opening of the mounting groove is towards the radiator.
According to some embodiments of the present invention, the radiator is micro-channel heat exchanger, and the radiator includes laterally flowing
Circulation passage and the longitudinal circulation passage being connected on horizontal circulation passage.
Alternatively, the number of longitudinal circulation passage is multiple that multiple longitudinal circulation passages laterally flow along described
The bearing of trend of circulation passage is sequentially distributed, and multiple longitudinal circulation passages are connected on the horizontal circulation passage and described half
The side that conductor refrigerator mutually deviates from.
According to some embodiments of the present invention, the circulation cooling unit also includes heat exchanger, water pump, the water being sequentially connected in series
Case, the radiator have water inlet and delivery port, and the water inlet is connected with the water tank, and the delivery port changes with described
Hot device is connected.
Specifically, it is additionally provided with surge tank between the water tank and the radiator.
Alternatively, the water tank is provided with control piper flow with the radiator by pipeline connection, the pipeline
Valve.
According to the specific embodiment of the present invention, the data acquisition unit includes being used to detect radiator and electronics
The pressure sensor of the temperature sensor of component temperature, hydraulic pressure for detecting circulation cooling unit, the pressure sensor are used
In the opening and closing that the valve is controlled according to the hydraulic pressure value detected.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 is the schematic diagram of cooling system according to embodiments of the present invention；
Fig. 2 is the semiconductor cooler of cooling system according to embodiments of the present invention and the schematic diagram of radiator.
Reference：
Cooling system 100,
Semiconductor refrigerating unit 10, semiconductor cooler 101, N-type semiconductor 1011, P-type semiconductor 1012, the first insulation
Heat-conducting piece 1013, the second insulating heat-conductive part 1014, heat shield 1015, the first metal joint 1016, the second metal joint 1017, electricity
Source 102,
Circulation cooling unit 11, radiator 111, horizontal circulation passage 1111, longitudinal circulation passage 1112, delivery port
1113, water inlet 1114, water pump 112, water tank 113, surge tank 114, valve 115, heat exchanger 116,
Cold end A, hot junction B.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
Cooling system 100 according to embodiments of the present invention is described below with reference to Fig. 1 to Fig. 2.
As shown in figure 1, cooling system 100 according to embodiments of the present invention includes：Semiconductor refrigerating unit 10, circulation cooling
Unit 11 and data acquisition unit (not shown), semiconductor refrigerating unit 10 include semiconductor cooler 101 and power supply
102, semiconductor cooler 101 and power supply 102 selectively electrically connect, and semiconductor cooler 101 has cold end A and hot junction B, follows
Ring heat-sink unit 11 has radiator 111, and radiator 111 is relative with the hot junction B of semiconductor cooler 101, data acquisition unit
For at least detecting the temperature of radiator 111 and electronic component (not shown), data acquisition unit is suitable in electronic component
Temperature when being higher than preset value control semiconductor cooler 101 electrically connected with power supply 102.
Specifically, the outer surface of electronic components of the cold end A of semiconductor refrigerating unit 10 with needing to cool is relative, hot junction B
Relative with the radiator 111 of circulation cooling unit 11, cold end A is by the heat absorption of electronic component and is delivered to hot junction B, radiator
111 will be delivered to heat absorption and via radiator 111 that heat is abundant caused by hot junction B heat and hot junction B itself
Absorption transmit free surrounding space again, and data acquisition unit can with the temperature of motor in real time element or radiator 111,
In the size of current and radiator 111 that are passed through according to the temperature of electronic component or radiator 111 to semiconductor cooler 101
Fluid flow size be controlled, and then automate, intelligentized radiating.
Wherein, the cold end A and hot junction B of semiconductor refrigerating unit 10 temperature difference maximum can reach 20 DEG C, and hot junction B is by following
Hot junction B heat absorption, the setting of circulation cooling unit 100 are made hot junction B temperature be slightly above Indoor Temperature by ring heat-sink unit 100
Degree, corresponding cold end A temperature can be less than indoor temperature, and then cause cooling system 100 to have good radiating effect, simultaneously
Cooling system 100 is processed using the material of good heat conductivity, causes cooling system 100 that there is very high radiating efficiency again.
In short, cooling system 100 according to embodiments of the present invention, circulation cooling unit 11 and semiconductor refrigerating unit
10 cooperation radiating and the setting of data acquisition unit, the heat-sinking capability and radiating efficiency of cooling system 100 are not only increased,
And enable the radiating that cooling system 100 is intelligent, automates.
As shown in Fig. 2 semiconductor cooler 101 comprises at least multiple P-type semiconductors 1012 being set up in parallel and N-type is partly led
Body 1011, P-type semiconductor 1012 and N-type semiconductor 1011 are arranged in a crossed manner, adjacent P-type semiconductor 1012 and N-type semiconductor
1011 one end is connected by the first metal joint 1016 and the other end is connected by the second metal joint 1017, and cold end A is formed
On the first metal joint 1016 and hot junction B is formed on the second metal joint 1017.
Specifically, in the circuit that semiconductor and metal joint form, the electric current in semiconductor cooler 101 is by N
One end absorption heat that type semiconductor 1011 flows to P-type semiconductor 1012 is formed as cold end A, and the corresponding other end is formed as hot junction
B.The multiple P-type semiconductors 1012 being set up in parallel and the arranged in a crossed manner of N-type semiconductor 1011 refer to each two P-type semiconductor
A N-type semiconductor 1011 is provided between 1012, and a P-type semiconductor 1012 is provided between each two N-type semiconductor 1011.
Thus, semiconductor refrigerating unit 10 has larger refrigerated area and heat dissipation region, is suitably mounted to different faces
On the outer surface of the electronic component of product size, and then corresponding electronic component is cooled down, at the same bigger refrigerated area and
Heat dissipation region makes the refrigeration of semiconductor refrigerating unit 10 more preferable.
Further, together with multiple N-type semiconductors 1011 are sequentially connected in series with multiple P-type semiconductors 1012 and formed
Stable circuit, one end of N-type semiconductor 1011 pass through the first metal joint 1016 with the P-type semiconductor 1012 positioned at its side
Connection, and the other end of N-type semiconductor 1011 passes through the second metal with another P-type semiconductor 1012 positioned at its opposite side
Joint 1017 connects.
Specifically, the first metal joint 1016 and the second metal joint 1017 using the heat conduction such as copper, iron, conduct electricity very well and
The stable metallic conductor of chemical property.So, not only make the stable work in work of semiconductor refrigerating unit 10, also make semiconductor system
The circuit of cold unit 10 has the heat-sinking capability that certain heat sinking function improves cooling system 100.
Reference picture 2, semiconductor cooler 101 also include the first insulating heat-conductive part 1013 and the second insulating heat-conductive part 1014,
First insulating heat-conductive part 1013 is connected with multiple first metal joints 1016, the second insulating heat-conductive part 1014 and multiple second metals
Joint 1017 is connected, and the first insulating heat-conductive part 1013 is connected with multiple first metal joints 1016.
Specifically, multiple first metal joints 1016 are closely connected with the first insulating heat-conductive part 1013, multiple second gold medals
Category joint 1017 is closely connected with the second insulating heat-conductive part 1014, and the first insulating heat-conductive part 1013 is formed in cold end A and electronics member
The relative side of part, the second insulating heat-conductive part 1014 are formed in side relative with radiator 111 hot junction B.So, the of insulation
One insulating heat-conductive part 1013 and the second insulating heat-conductive part 1014 can prevent electronic component table on the premise of can heat be shifted
Damage of the electrostatic in face to semiconductor refrigeration unit 10, additionally it is possible to prevent semiconductor refrigerating unit 10 caused by leaking electricity to electronics member
The setting of the damage of part, the first insulating heat-conductive part 1013 and the second insulating heat-conductive part 1014 improves the safety of cooling system 100
Property.
Alternatively, the first insulating heat-conductive part 1013 and the second insulating heat-conductive part 1014 can use good heat conductivity, production
Cost is relatively low and has the thermal conductive ceramic plate production of water resistance, insulating properties.
In a specific embodiment shown in Fig. 2, semiconductor cooler 101 also includes heat shield 1015, heat shield
Mounting groove is limited in 1015, P-type semiconductor 1012 and N-type semiconductor 1011 are respectively positioned in mounting groove, the opening court of mounting groove
To radiator 111.
In other words, it is enclosed on the cold end A outer surfaces relative with electronic component outside heat shield 1015 and is closely pasted with the outer surface
Merging electronic component is spaced apart with cold end A, heat shield 1015 using good heat conductivity and stable chemical performance material.
Thus, the cold end A of semiconductor cooler 101 is protected, prevented when electronic component from working caused by electronical elements surface
The temperature of electrostatic and electronical elements surface it is too high may caused by damage to cold end A, and heat conductivility is preferably heat-insulated
The setting of cover 1015 has no effect on the heat dispersion of semiconductor refrigerating unit 10.
It should be noted that in the first metal joint 1016 and the first insulating heat-conductive part 1013, the first insulating heat-conductive part
One layer of heat conduction can be smeared between 1013 and heat shield 1015, the second metal joint 1017 and the second insulating heat-conductive part 1014
Silica gel, the setting of heat conductive silica gel can make the heat dispersion of whole cooling system 100 more preferable, at the same can Homogeneouslly-radiating prevent from dissipating
The hot-spot of hot systems 100.
According to some embodiments of the present invention, radiator 111 is micro-channel heat exchanger, and radiator 111 includes laterally circulating
Passage 1111 and the longitudinal circulation passage 1112 being connected on horizontal circulation passage 1111.So, the relatively low water of temperature (
Can be other liquid with higher specific heat capacity) flowed into from the right-hand member of radiator 111, heat is absorbed in radiator 111,
The water of higher temperature flows out from the left end of radiator 111, so as to reduce the temperature of radiator 111, wherein horizontal circulation passage
1111 times for making water be circulated in radiator 111 with the setting of longitudinal circulation passage 1112 are longer, and then more fully inhale
The heat of radiator 111 is received, improves the heat-sinking capability of circulation cooling unit 11.
Specifically, the number of longitudinal circulation passage 1112 is multiple that multiple longitudinal circulation passages 1112 transversely circulate logical
The bearing of trend in road 1111 is sequentially distributed, and multiple longitudinal circulation passages 1112 are connected on horizontal circulation passage 1111 and semiconductor
The side that the phase of refrigerator 101 deviates from, what is set in the side deviated from radiator 111 and the phase of semiconductor cooler 101 is multiple vertical
Make the area of dissipation of radiator 111 bigger to circulation passage 1112, more greatly microchannel is changed with the contact area of surrounding environment
Hot device has preferably service behaviour, can fully radiate, improve the radiating efficiency of radiator 111.
According to some embodiments of the present invention, circulation cooling unit 11 also includes heat exchanger 116, the water pump being sequentially connected in series
112nd, water tank 113, radiator 111 have water inlet 1114 and delivery port 1113, and water inlet 1114 is connected with water tank 113, gone out
The mouth of a river 1113 is connected with heat exchanger 116.
To circulation cooling unit 11, your workflow is described in detail below, and the temperature flowed out in water tank 113 is relatively low
Water by the inflow radiator 111 of water inlet 1114 and in radiator 111 circulation absorb heat, then flowed out by delivery port 1113,
And then inflow heat exchanger 116, water temperature is lowered in heat exchanger 116, and water pump 112 sucks the water in heat exchanger 116 and discharge
Into water tank 113.So, the relatively low water of temperature is constantly injected radiator by circulation cooling unit 11 by above-mentioned cyclic process
111 make the whole heat-sinking capability of circulation cooling unit 11 more stable.
Specifically, surge tank 114 is additionally provided between water tank 113 and radiator 111, the setting of surge tank 114 can reduce
The pressure of the current of inflow radiator 111, so that current are detained longer time in radiator 111, and then current are made to exist
Absorption in radiator 111 to heat is more abundant.Thus, the exchange capability of heat of circulation cooling unit 11 is not only increased, is also made
Circulation cooling unit 11 has higher job stability.
Alternatively, water tank 113 is provided with the valve of control piper flow with radiator 111 by pipeline connection, pipeline
115, when data acquisition unit collects dilutional hyponatremia or excessive system pressure in surge tank 114, meeting control valve 115 is closed
Close.So, the setting of valve 115 enables the safe and stable work of circulation cooling unit 11.
According to the specific embodiment of the present invention, data acquisition unit includes being used to detect radiator 111 and electronics
The temperature sensor (not shown) of component temperature, for detecting the pressure sensor of the hydraulic pressure of circulation cooling unit 11 (in figure
It is not shown), pressure sensor is used for the opening and closing according to the hydraulic pressure value control valve 115 detected.
Specifically, in one end that surge tank 114 is connected with radiator 111 and one end that water pump 112 is connected with water tank 113
Pressure sensor can be provided with, can be set on one end relative with electronic component cold end A and the surface of radiator 111
There is temperature sensor, data acquisition unit is open big according to the temperature data control valve 115 of temperature sensor Real-time Feedback
It is small so control the water that is circulated in circulation cooling unit 11 number, controlled according to the temperature data of temperature sensor Real-time Feedback
The size of current of semiconductor refrigerating unit 10 and then change the cold end A and hot junction B temperature difference to ensure at the temperature of cooling system 100
In a stationary value, make electronic component stabilization, efficient operation.
Meanwhile pressure sensor by system pressure data Real-time Feedback to data acquisition unit, when system pressure is excessive,
Valve 115 is closed, prevents system overload from causing to damage to electronic component.That is, the setting of data acquisition unit can not only
Enough automate cooling system 100, intelligentized work, moreover it is possible to make the safe and reliable work of cooling system 100.
The cooling system 100 of the embodiment of the present invention, in addition to preferable heat dispersion and radiating efficiency, workability
Can be stable, without using refrigerant in whole process of refrigerastion, environment will not be polluted, the manufacture letter of semiconductor refrigerating unit 10
It list, can be made into various shapes and to the adaptable of environment, there is higher versatility.
Below according to the specific embodiment shown in Fig. 1 and Fig. 2, detailed retouch is carried out to the cooling system 100 of the present invention
State.
In the specific embodiment of the present invention, cooling system 100 is by semiconductor refrigerating unit 10, circulation cooling unit
11 and data acquisition unit composition.
Wherein, power supply 102 and semiconductor cooler 101 form complete circuit to be formed as semiconductor refrigerating unit
10；Radiator 111, heat exchanger 116, water pump 112, water tank 113, valve 115 and trimmer valve 114 are sequentially connected in series into water flow pipes
Road, and then form circulation cooling unit 11；It is arranged on the pressure sensor between water pump 112 and water tank 113, is arranged on surge tank
Pressure sensor between 114 and radiator 111 and it is arranged on temperature on electronic component outer surface or on radiator 111
Sensor group is into data acquisition unit.
In whole work process, the data acquisition unit outer surface to electronic component and the surface of radiator 111 in real time
Temperature be monitored.When the temperature of electronic component outer surface or the surface of radiator 111 is too high, cooling system 100 starts
Work, the power supply 102 of semiconductor refrigerating unit 10 close, and semiconductor cooler 101 starts to freeze, interior in circulation cooling unit 11
There is circular passage radiator 111 to be fitted in heat caused by the hot junction B absorptions hot junction B of semiconductor refrigerating unit 10 in portion, and then
Whole system is radiated, at this moment, data acquisition unit is according to the hydraulic pressure data adjust automatically valve of circulation cooling unit 11
The sizes of 115 openings, so the water-carrying capacity of circulation cooling unit 11 is adjusted, data acquisition unit is according to outside electronic component
The temperature data on surface or the surface of radiator 111 is adjusted to the size of current in semiconductor refrigeration unit 10, works as electronics
When the temperature of the outer surface of element or the relatively low surface temperature of radiator 111, cooling system 100 is stopped.
Thus, cooling system 100 is not only stablized, is reliable, efficiently working, and is radiated when electronic component temperature is relatively low
System 100 is automatically stopped work, and cooling system 100 is intelligent, automates, the work of energy-saving.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumference " be based on orientation shown in the drawings or
Position relationship, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified structure or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, limit
Surely there is " first ", one or more this feature can be expressed or be implicitly included to the feature of " second ".The present invention's
In description, unless otherwise indicated, " multiple " are meant that two or more.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means to combine specific features, the knot that the embodiment or example describe
Structure, material or feature are contained at least one embodiment or example of the present invention.In this manual, to above-mentioned term
Schematic representation is not necessarily referring to identical embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can combine in an appropriate manner in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of departing from the principle and objective of the present invention a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The scope of invention is limited by claim and its equivalent.
Claims (10)
- A kind of 1. cooling system cooled down to electronic component, it is characterised in that including：Semiconductor refrigerating unit, the semiconductor refrigerating unit include semiconductor cooler and power supply, the semiconductor cooler Selectively electrically connected with power supply, the semiconductor cooler has cold end and hot junction；Circulation cooling unit, the circulation cooling unit have radiator, the heat of the radiator and the semiconductor cooler End is relative；AndData acquisition unit, the data acquisition unit are used for the temperature at least detecting the radiator and the electronic component, The data acquisition unit is suitable to control the semiconductor cooler and institute when the temperature of the electronic component is higher than preset value State power electric connection.
- 2. the cooling system according to claim 1 cooled down to electronic component, it is characterised in that the semiconductor system Cooler comprises at least multiple P-type semiconductors and N-type semiconductor being set up in parallel, and the P-type semiconductor is handed over the N-type semiconductor Fork is set, and adjacent P-type semiconductor is connected with one end of N-type semiconductor by the first metal joint and the other end passes through the second gold medal Belong to joint connection, the cold end is formed on first metal joint and the hot junction is formed in second metal joint On.
- 3. the cooling system according to claim 2 cooled down to electronic component, it is characterised in that the semiconductor system Cooler also includes the first insulating heat-conductive part and the second insulating heat-conductive part, the first insulating heat-conductive part and multiple first metals Joint connects, and the second insulating heat-conductive part is connected with multiple second metal joints, the first insulating heat-conductive part and more The individual first metal joint connection.
- 4. the cooling system according to claim 2 cooled down to electronic component, it is characterised in that the semiconductor system Cooler also includes heat shield, and mounting groove is limited in the heat shield, and the P-type semiconductor and N-type semiconductor are respectively positioned on described In mounting groove, the opening of the mounting groove is towards the radiator.
- 5. the cooling system according to claim 1 cooled down to electronic component, it is characterised in that the radiator is Micro-channel heat exchanger, the longitudinal direction circulation that the radiator includes horizontal circulation passage and is connected on horizontal circulation passage are logical Road.
- 6. the cooling system according to claim 5 cooled down to electronic component, it is characterised in that the longitudinal direction circulation The number of passage is multiple, and bearing of trend of multiple longitudinal circulation passages along the horizontal circulation passage is sequentially distributed, more Individual longitudinal circulation passage is connected to the side mutually deviated from the semiconductor cooler on the horizontal circulation passage.
- 7. the cooling system according to claim 1 cooled down to electronic component, it is characterised in that the circulation cooling Unit also includes heat exchanger, water pump, the water tank being sequentially connected in series, and the radiator has water inlet and delivery port, the water inlet It is connected with the water tank, the delivery port is connected with the heat exchanger.
- 8. the cooling system according to claim 7 cooled down to electronic component, it is characterised in that the water tank and institute State and be additionally provided with surge tank between radiator.
- 9. the cooling system according to claim 7 cooled down to electronic component, it is characterised in that the water tank and institute State radiator and the valve of control piper flow is provided with by pipeline connection, the pipeline.
- 10. the cooling system according to claim 9 cooled down to electronic component, it is characterised in that the data are adopted Collection unit includes being used to detect the temperature sensor of radiator and electronic component temperature, the hydraulic pressure for detecting circulation cooling unit Pressure sensor, the pressure sensor is used for the opening and closing that the valve is controlled according to the hydraulic pressure value that detects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792509.8A CN107704054A (en) | 2017-09-05 | 2017-09-05 | The cooling system cooled down to electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792509.8A CN107704054A (en) | 2017-09-05 | 2017-09-05 | The cooling system cooled down to electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107704054A true CN107704054A (en) | 2018-02-16 |
Family
ID=61172077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710792509.8A Pending CN107704054A (en) | 2017-09-05 | 2017-09-05 | The cooling system cooled down to electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107704054A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109542151A (en) * | 2018-12-18 | 2019-03-29 | 中国电子科技集团公司第十六研究所 | A kind of ring control equipment and control method |
| CN109813750A (en) * | 2019-01-08 | 2019-05-28 | 佛山市京木测控科技有限公司 | Profile heat-proof quality demonstration equipment and profile heat-proof quality Determination method |
| CN110044950A (en) * | 2019-04-30 | 2019-07-23 | 西南交通大学 | Freezing-thawing test system |
| CN112704446A (en) * | 2019-10-09 | 2021-04-27 | 青岛海尔洗碗机有限公司 | Washing equipment and control method thereof |
| CN113342091A (en) * | 2021-07-13 | 2021-09-03 | 深圳市微特精密科技股份有限公司 | Intelligent temperature control device suitable for chip thermal management |
| CN113814110A (en) * | 2020-09-03 | 2021-12-21 | 常州铭赛机器人科技股份有限公司 | Refrigeration system and control method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201638139U (en) * | 2010-04-27 | 2010-11-17 | 上海市七宝中学 | PC chip cooling device |
| CN203203290U (en) * | 2013-02-27 | 2013-09-18 | 宝鸡兴业空调设备（集团）有限公司 | Semiconductor refrigeration module |
| CN204145970U (en) * | 2014-08-28 | 2015-02-04 | 广东威创视讯科技股份有限公司 | A kind of cooling system |
| CN106383560A (en) * | 2016-09-12 | 2017-02-08 | 芜湖能盟信息技术有限公司 | Computer semiconductor cooling apparatus |
| CN106383562A (en) * | 2016-11-09 | 2017-02-08 | 娄晓东 | Chilling plate water-cooling radiating device |
-
2017
- 2017-09-05 CN CN201710792509.8A patent/CN107704054A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201638139U (en) * | 2010-04-27 | 2010-11-17 | 上海市七宝中学 | PC chip cooling device |
| CN203203290U (en) * | 2013-02-27 | 2013-09-18 | 宝鸡兴业空调设备（集团）有限公司 | Semiconductor refrigeration module |
| CN204145970U (en) * | 2014-08-28 | 2015-02-04 | 广东威创视讯科技股份有限公司 | A kind of cooling system |
| CN106383560A (en) * | 2016-09-12 | 2017-02-08 | 芜湖能盟信息技术有限公司 | Computer semiconductor cooling apparatus |
| CN106383562A (en) * | 2016-11-09 | 2017-02-08 | 娄晓东 | Chilling plate water-cooling radiating device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109542151A (en) * | 2018-12-18 | 2019-03-29 | 中国电子科技集团公司第十六研究所 | A kind of ring control equipment and control method |
| CN109813750A (en) * | 2019-01-08 | 2019-05-28 | 佛山市京木测控科技有限公司 | Profile heat-proof quality demonstration equipment and profile heat-proof quality Determination method |
| CN110044950A (en) * | 2019-04-30 | 2019-07-23 | 西南交通大学 | Freezing-thawing test system |
| CN112704446A (en) * | 2019-10-09 | 2021-04-27 | 青岛海尔洗碗机有限公司 | Washing equipment and control method thereof |
| CN113814110A (en) * | 2020-09-03 | 2021-12-21 | 常州铭赛机器人科技股份有限公司 | Refrigeration system and control method thereof |
| CN113342091A (en) * | 2021-07-13 | 2021-09-03 | 深圳市微特精密科技股份有限公司 | Intelligent temperature control device suitable for chip thermal management |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107704054A (en) | The cooling system cooled down to electronic component | |
| US8001794B2 (en) | Thermoelectric fluid heat exchange system | |
| US20040025516A1 (en) | Double closed loop thermoelectric heat exchanger | |
| US20060162342A1 (en) | Thermoelectric heat transfer system | |
| KR102023220B1 (en) | On-demand beverage cooler | |
| CN101346058B (en) | Waste heat driven two-phase loop cooling system | |
| CN101922778B (en) | Semiconductor refrigerating air conditioning device | |
| CN106058372A (en) | Heat management system and method for power battery | |
| CN105281198A (en) | Semiconductor laser device heat management device | |
| CN207936540U (en) | A kind of liquid constant temperature circulator of semiconductor temperature | |
| CN106440599A (en) | Liquid cooling temperature control system allowing wide temperature range natural cooling | |
| CN109959081A (en) | Air handling system and conditioner | |
| CN201615648U (en) | Novel practical semiconductor refrigeration and heat preservation box | |
| CN210463644U (en) | Refrigerating system and air conditioner | |
| CN209857252U (en) | Air conditioning system and air conditioning apparatus | |
| CN210441468U (en) | Refrigerating system and air conditioner | |
| CN105246301A (en) | Reinforced heat dissipation liquid-cooled radiator | |
| CN104851855A (en) | Semiconductor liquid-cooling radiator | |
| TWI411390B (en) | Devices in series for continuous cooling/ heating | |
| Nandini | Peltier based cabinet cooling system using heat pipe and liquid based heat sink | |
| CN209857251U (en) | Air conditioning system and air conditioning apparatus | |
| CN209857250U (en) | Air conditioning system and air conditioning apparatus | |
| CN208172720U (en) | Liquid cooling system for server | |
| CN102655130A (en) | Compressor type chip temperature reducing system | |
| CN201973955U (en) | Novel structure semiconductor refrigerating and heating box |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180216 |