Specific embodiment
A kind of LED module calorifics interface measuring system, as shown in Figure 1, including radiator 110, radiation heat flux measuring instrument
With refrigerator 130, radiation heat flux measuring instrument includes 122 display instrument 124 of radiant heat flux sensor, radiant heat flux sensor
122 are arranged between radiator 110 and refrigerator 130, and display instrument 124 connects radiant heat flux sensor 122.
One side of the radiator 110 away from radiant heat flux sensor 122 sets the calorifics interface of LED module 200, calorifics interface
Heat conduct to radiant heat flux sensor 122, display instrument 124 is used for the LED moulds sensed according to radiant heat flux sensor 122
Temperature value and the display of preset reference point is calculated in the radiation heat flux of 200 preset reference point of block;Refrigerator 130 is used for convection current
The heat of heat flow transducer 122 cools down via radiation.
Specifically, after LED module 200 is installed on the system, LED module 200 be powered until calorifics interface
Bottom temp stablize, the calorifics interface temperature of LED module 200 can be directly obtained by display instrument 124.Radiator 110 has
Aluminium radiator can be used in body, for conduction of heat.Aluminium spreader surface passes through anodized, to increase aluminium
Wearability, weather-proof, corrosion resistance, while there is light-weight, perfect heat-dissipating, good energy-conserving effect, it is at low cost the features such as, as pair
The heat of the calorifics interface of LED module 200 carries out heat transfer, ensures contact surface even heat.
Radiation heat flux measuring instrument be measure heat radiation during radiative heat transfer amount size, evaluation heat-radiating properties
Important tool.The reaction speed of radiation heat flux measuring instrument is fast, responsiveness is high, high certainty of measurement, simple and efficient to handle.Radiant heat
Flow sensor 122 is to utilize the resistivity of thermo-sensitive material manufactured resistance element, bonding with the changed characteristic of temperature
On the high electrical insulation substrate of the capacity of heat transmission, the bonding of electrical insulation substrate is a thermal capacity is very big, heat conductivility is good
On semiconductor cooler.In order to improve the heat absorption coefficients of radiant heat flux sensor 122 in the present embodiment, carry out in its surface
Darkening process so that measurement result is more accurate.Display instrument 124 uses numerical monitor, and accuracy is high, and reading is directly perceived, uses
Reliably.
Preset reference point is the central point at 200 back side of LED module in the present embodiment, to a certain extent can be with LED junction temperature
It is corresponding, monitoring temperature is carried out so that it is guaranteed that LED module 200 is not overheated to the central point at 200 back side of LED module.Refrigerator 130 can
Using semiconductor cooler, semiconductor cooler is combined by semiconductor chilling plate and heat dissipation aluminium, is built-in with PID
(proportion-integral-derivative, proportional-integral-differential) control system.PID control system can carry out frequency conversion
It adjusts, temperature is continuously adjustable, controls 0 DEG C~135 DEG C of temperature range, and control accuracy reaches 0.1 DEG C, and control accuracy is high, current wave
It is dynamic small, and can realize the automatic conversion of refrigeration and pyrogenicity, it can show, measure and design temperature.
Semiconductor chilling plate utilizes the Peltier effects of semi-conducting material, when direct current passes through two kinds of different semiconductor materials
When expecting the galvanic couple being connected into, heat can be absorbed respectively at the both ends of galvanic couple and release heat, can realize the purpose of refrigeration.Half
Conductor refrigeration is a kind of Refrigeration Technique for generating negative thermal resistance, its main feature is that movement-less part, reliability is also higher.Semiconductor system
Cold thermal inertia is very small, and the cooling and warming time quickly, in the case of the good cold end zero load of hot-side heat dissipation, is powered less than one point
Clock, cooling piece is with regard to that can reach maximum temperature difference.Any refrigerant is not required, can continuous work, no pollution sources do not have rotary part,
Gyroscopic action will not be generated, no slide unit is a kind of solid sheet, and when work does not have vibrations, noise, long lifespan, installation appearance
Easily.
In one of the embodiments, between radiator 110 and radiant heat flux sensor 122 and radiant heat flux sensing
Heat-conducting silicone grease has been filled between device 122 and refrigerator 130.Each component contact face of the system is unfavorable there are certain gap
In heat transfer, it will cause 200 thermal parameters measurement error of LED module big, therefore scribbled in each component contact face of the system
Heat-conducting silicone grease improves their heat transfer efficiency.Heat-conducting silicone grease is a kind of white synthesized by the thickening of compound heat-conducting insulation material
Homogeneous paste matter, has the characteristics that:It is tasteless, nontoxic, have preferable heat conductivility and point insulating;Oil is low, resistance to from spending
High temperature performance is good, can the long-time service at -50~200 DEG C.
Above-mentioned LED module calorifics interface measuring system, radiator 110 conduct the heat of the calorifics interface of LED module 200 extremely
Radiant heat flux sensor 122.200 preset reference point of LED module that display instrument 124 senses according to radiant heat flux sensor 122
Radiation heat flux temperature value is calculated and shows, the heat of 130 convection current of refrigerator heat flow transducer 122 via radiation is dropped
Temperature.By conducting the heat of calorifics interface to radiant heat flux sensor 122, directly according to the default ginseng of the LED module 200 of sensing
The radiation heat flux of examination point calculates the temperature value of preset reference point, Electrothermal Properties that will not be by LED module 200 itself, encapsulation shape
The influence of formula or test equipment sampling precision, improves accuracy of measurement.
In one of the embodiments, as described in Figure 2, LED module calorifics interface measuring system further includes 140 He of heater
First DC source 150, heater 140 are arranged at radiator 110, the first DC source 150 connection heater 140, for heating
Device 140 is powered.First DC source 150 to heater 140 provide operating current I when, heater 140 will generate electrical power P=
I2* R heats radiator 110, for being calibrated to radiation heat flux measuring instrument, reduces heat losses to measurement
It influences, improves measurement accuracy.
In the present embodiment heater 140 specifically can be used PTC (Positive Temperature Coefficient, just
Temperature coefficient) heater, the first DC source 150 be High-accuracy direct current source, measurement accuracy 0.012%.High-accuracy direct current source is not
But operating current can be provided, but also electric current, voltage and power can be measured.Since the voltage sampling for being connected to circuit exists
Certain by-pass current is serially connected with the current sampling of circuit there are certain voltage drop, therefore the first DC source in the present embodiment
150 are attached using four-wire system connection, are avoided circuit is long or electric current is larger from bringing electrical measurement error, are improved electrical measurement
Accuracy.
Ptc heater is built-in with PTC thermistor, and PTC thermistor is that a kind of typical case has partly leading for temperature sensitivity
Bulk resistor, during more than certain temperature (Curie temperature), increasing for step evolution is presented with the rise of temperature in resistance value.PTC
Thermistor has high sensitivity, the spy that operating temperature range is wide, small, easy to use, stability is good, overload capacity is strong
Point.Self-heating heating makes resistance value enter transition area after PTC thermistor power-up, and heated at constant temperature PTC thermistor surface temperature will protect
Steady state value is held, the temperature is only related with the Curie temperature and applied voltage of PTC thermistor, and substantially unrelated with environment temperature,
Therefore with constant temperature warming characteristic.Ptc heater utilizes the heater of heated at constant temperature PTC thermistor constant temperature warming characteristic design
Part.Occasion is heated in middle low power, ptc heater has constant temperature warming, the flames of anger, thermal conversion rate is high, is influenced by supply voltage
The incomparable advantages of conventional heating elements such as minimum, natural life-span length meet the technical need of the system.
In one of the embodiments, with continued reference to Fig. 2, LED module calorifics interface measuring system further includes the second direct current
Source 160, processor 170, integrating sphere 180 and spectrometer 190, the second DC source 160 connection LED module 200, processor 170 connect
Connect 124 and second DC source 160 of display instrument.Integrating sphere 180 is arranged at radiator 110 away from radiant heat flux sensor 122
One side, and the joint of integrating sphere 180 and radiator 110 is used to place LED module 200, spectrometer 190 connects integrating sphere 180
With processor 170.Spectrometer 190 is connected by optical fiber with integrating sphere 180 in the present embodiment, and the second DC source 160 is similarly high
Precision DC source is attached using four-wire system connection.
Second DC source 160 is used to LED module 200 is powered and be measured the electricity power of LED module 200 and send
To processor 170.Spectrometer 190 is used to measure the spectral radiant power of LED module 200 and is sent to processor 170.Display instrument
Table 124 is additionally operable in 200 no power of LED module, and the first DC source 150 is carried out with predetermined power control heater 140
During heating, electricity is calculated in the radiation heat flux of 200 preset reference point of LED module sensed according to radiant heat flux sensor 122
Pressure value is shown, and is sent to processor 170;And be powered in LED module 200, the first DC source 150, which is adjusted, to be added
When the power of hot device 140 makes the maximum temperature of 200 preset reference point of LED module, sensed according to radiant heat flux sensor 122
The radiation heat flux of 200 preset reference point of LED module is calculated voltage value and is shown, and is sent to processor 170.
Processor 170 is used to obtain the calorifics power of LED module 200 according to spectral radiant power and electricity power calculation,
Power coefficient is calculated and according to calorifics work(in the voltage value and corresponding predetermined power sent according to display instrument 124
Corresponding voltage value and heating power are calculated during the maximum temperature of 200 preset reference point of rate, power coefficient and LED module
The backward heat radiation power and forward direction heat radiation power of LED module 200 are shown.
Traditional backward heat radiation power Pth,rearCalculation is that all fevers are assumed that as backward heat radiation power, and true
Truth condition is that have partial heat be to dissipate forward, forward heat radiation power Pth,frontIt can cause large error.Heat radiation power is backward
Design heat sink important indicator, i.e., it is heat sink to have the ability that LED module 200 gives off heat backward that handle.
Specifically, LED module 200 is installed on 180 side of integrating sphere in the present embodiment, be powered to LED module 200
Until the bottom temp of calorifics interface is stablized.LED module is measured using integrating sphere 180, spectrometer 190, the second DC source 160
200 spectral radiant power PvisWith electricity power Pel, and turn off LED module 200.Processor 170 calculates LED module 200
Calorifics power Pth=Pth,rear+Pth,front=Pel-Pvis。
In 200 no power of LED module, the heating power of heater 140 is set respectively by the first DC source 150
10W, 20W, 30W, 40W, 50W are set to, and records the voltage readings of display instrument 124.Due to heater 140 heating power with
Voltage readings are linearly related, and power coefficient β can be calculated.It is powered in LED module 200, adjusts adding for heater 140
Thermal power PthCH so that the temperature of preset reference point is maximum trmax, and the voltage readings of display instrument 124 are recorded with adding
The heating power of hot device 140.The backward heat radiation power of LED module 200 is:
PTh, rear=VHFSXβ-PthCH
Wherein, Pth,rearFor backward heat radiation power, β is power coefficient, VHFSAnd PthCHRespectively LED module preset reference point
Maximum temperature when, the voltage readings of corresponding display instrument 124 and the heating power of heater 140.
Further, the forward direction heat radiation power of LED module 200 is:
Pth,front=Pel-Pvis-Pth,rear=Pth-Pth,rear
Wherein, Pth,frontFor the forward direction heat radiation power of LED module 200, PthFor the calorifics power of LED module 200, Pth,rear
For the backward heat radiation power of LED module 200.
After computation to heat radiation power P in the present embodimentth,rearWhen avoid before to heat radiation power to measurement interfere,
Improve accuracy of measurement.
In one of the embodiments, display instrument 124 is additionally operable to the LED moulds sensed according to radiant heat flux sensor 122
The radiation heat flux of 200 preset temperature measurement point of block is calculated temperature value and is sent to processor 170;Processor 170 is also used
Maximum difference is calculated in the preset reference point and the temperature value of preset temperature measurement point sent according to display instrument 124, and
The diffusion thermal resistance that LED module 200 is calculated according to maximum difference and backward heat radiation power is shown.
As shown in figure 3, with preset reference point trIt is corresponded to for the central point at 200 back side of LED module, temperature is preset in the present embodiment
The quantity of measurement point is spent for four, and with preset reference point trFor the center of circle, preset length is spaced set on the circle of radius.
Preset temperature measurement point specifically includes measurement point ts1, measurement point ts2, measurement point ts3With measurement point ts4。
Spread thermal resistance Rth,spIt is the parameter for reflecting optical assembly center and peripheral temperature difference, if the center and peripheral temperature difference is too
Greatly, then the too early light decay in center, color drift or even the state burnt are susceptible to.Specifically, it is installed on by LED module 200
After the system, it is powered to LED module 200 until the bottom temp of calorifics interface is stablized.Measure the calorifics interface of LED module 200
Preset reference point temperature trWith preset temperature measurement point temperature tsxMaximum difference, calculate diffusion heat using thermal resistance formula is spread
Resistance, specially:
RTh, sp=max [(tr-tSx)/PTh, rear]
Wherein, Rth,spTo spread thermal resistance, trFor preset reference point temperature, tsxFor preset temperature measurement point temperature, Pth,rear
For backward heat radiation power.The diffusion thermal resistance of LED module 200 is measured by the system, in order to LED module 200
Quality is assessed.
In one of the embodiments, with continued reference to Fig. 2, LED module calorifics interface measuring system further includes radiator fan
192, radiator fan 192 is arranged at one side of the refrigerator 130 away from radiant heat flux sensor 122.
Radiator fan 192 use thermal convection current cool principle, quickly by the heat of refrigerator 130 transfer out come, blow near
Air in, there is quickly and efficiently cooling-down effect.192 performance of radiator fan is good, and exhaust air rate is big, and rotating speed is high, and low noise makes
Very long with the service life, anti-aging property is good, and the system is suitble to use for a long time, is 200 thermal parameters of LED module securely and reliably
Detection improves work efficiency, without specially waiting refrigerator natural heat dissipation.
In one of the embodiments, LED module calorifics interface measuring system further includes heat-barrier coating 194, heat-insulated guarantor
Sheath 194 is coated on radiator 110, radiant heat flux sensor 122 and refrigerator 130, and heat-barrier coating 194 is in radiator 110
One side away from radiant heat flux sensor 122 offers test mouth, and LED module 200 is arranged at test mouth, heat-barrier coating 194
Thermovent is offered in one side of the refrigerator 130 away from radiant heat flux sensor 122.
If radiator 110 and 130 surface of refrigerator are all contacted directly with outside ambient air, heat transfer can occur,
Cause the measurement of 200 thermal parameters of LED module inaccurate.With external environment heat exchange occurs for the system internal heat in order to prevent,
Therefore in the system exterior design heat-barrier coating 194,200 thermal parameters accuracy of measurement of LED module is improved.Heat-barrier coating
194 have high-temperature stability, nontoxic, fire prevention, low heat conductivity, low specific heat, light-weight, elastic good, heat shock resistance, corrosion resistance
High, good effect of heat insulation.
The present invention also provides a kind of test method of LED module calorifics interface measuring system, based on above-mentioned LED module heat
It learns interface measuring system to realize, as shown in figure 4, comprising the following steps:
Step S110:The heat of the calorifics interface of radiator conduction LED module is to radiant heat flux sensor.
After LED module is installed on radiator, LED module be powered until the bottom temp of calorifics interface is steady
It is fixed, the heat of the calorifics interface of radiator conduction LED module to radiant heat flux sensor.Aluminium heat dissipation can be used in heat dissipation implement body
Device, for conduction of heat.Aluminium spreader surface passes through anodized, to increase the wearability of aluminium, weather-proof, anti-corrosion
Property, while there is light-weight, perfect heat-dissipating, good energy-conserving effect, it is at low cost the features such as, as the calorifics interface to LED module
Heat carry out heat transfer, ensure contact surface even heat.
Step S120:Display instrument is led to according to the radiant heat of the LED module preset reference point of radiant heat flux sensor sensing
Temperature value and the display of preset reference point is calculated in amount.The calorifics interface temperature of LED module can be directly obtained by display instrument
Degree.Preset reference point is the central point at the LED module back side in the present embodiment, to a certain extent can be corresponding with LED junction temperature, right
The central point at the LED module back side carries out monitoring temperature so that it is guaranteed that LED module does not overheat.
Step S130:The heat of refrigerator convection current heat flow transducer via radiation cools down.Semiconductor can be used in refrigerator
Refrigerator, semiconductor cooler are combined by semiconductor chilling plate and heat dissipation aluminium, are built-in with PID control system.PID control
System can carry out variable frequency adjustment, and temperature is continuously adjustable, control 0 DEG C~135 DEG C of temperature range, and control accuracy reaches 0.1 DEG C, control
Precision is high, and current fluctuation is small, and can realize the automatic conversion of refrigeration and pyrogenicity, can show, measure and design temperature.
The measuring method of above-mentioned LED module calorifics interface measuring system, the heat of the calorifics interface of radiator conduction LED module
It measures to radiant heat flux sensor.Display instrument is according to the radiant heat of the LED module preset reference point of radiant heat flux sensor sensing
Flux is calculated temperature value and shows, the heat of refrigerator convection current heat flow transducer via radiation cools down.By by calorifics
The heat of interface is conducted to radiant heat flux sensor, directly according to the radiation heat flux meter of the LED module preset reference point of sensing
The temperature value of preset reference point is calculated, it will not be by the Electrothermal Properties of LED module in itself, packing forms or test equipment sampling precision
Influence, improve accuracy of measurement.
In one of the embodiments, as shown in figure 5, after step S120, further comprising the steps of S140 to step
S190。
Step S140:First DC source simultaneously sends heating installation power supply, the electricity power of the second DC source measurement LED module
To processor, the spectral radiant power of spectrometer measurement LED module is simultaneously sent to processor.First DC source provides heater
During operating current I, heater will generate electrical power P=I2* R heats radiator, reduces heat losses to measurement
It influences, improves measurement accuracy.The spectral radiant power P of LED module is measured using spectrometer, the second DC sourcevisAnd electricity
Power Pel。
Step S150:Display instrument controls heater in LED module no power, the first DC source with predetermined power
When being heated, voltage is calculated according to the radiation heat flux of the LED module preset reference point of radiant heat flux sensor sensing
Value is shown, and is sent to processor.Specifically, in LED module no power, by the first DC source by heater
Heating power be respectively set to 10W, 20W, 30W, 40W, 50W, and record the voltage readings of display instrument.
Step S160:Display instrument is powered in LED module, and the power that the first DC source adjusts heater makes LED
During the maximum temperature of module preset reference point, according to the radiant heat of the LED module preset reference point of radiant heat flux sensor sensing
Flux is calculated voltage value and is shown, and is sent to processor.Specifically, it is powered in LED module, adjusts heating
The heating power of device so that the temperature of preset reference point is maximum, and records the voltage readings and heater of display instrument
Heating power.
Step S170:Processor obtains the calorifics power of LED module according to spectral radiant power and electricity power calculation.
The calorifics power P of LED moduleth=Pth,rear+Pth,front=Pel-Pvis。
Step S180:Power is calculated in the voltage value and corresponding predetermined power that processor is sent according to display instrument
Coefficient.Since the heating power of heater is linearly related with voltage readings, power coefficient β can be calculated.
Step S190:When processor is according to the maximum temperature of calorifics power, power coefficient and LED module preset reference point
The backward heat radiation power of LED module is calculated with heating power for corresponding voltage value and forward direction heat radiation power is shown.LED
The backward heat radiation power of module 200 is:
pTh, rear=VHFSXβ-PthCH
Wherein, Pth,rearFor backward heat radiation power, β is power coefficient, VHFSAnd PthCHRespectively LED module preset reference point
Maximum temperature when, the voltage readings of corresponding display instrument 124 and the heating power of heater 140.
Further, the forward direction heat radiation power of LED module 200 is:
Pth,front=Pel-Pvis-Pth,rear=Pth-Pth,rear
Wherein, Pth,frontFor the forward direction heat radiation power of LED module 200, PthFor the calorifics power of LED module 200, Pth,rear
For the backward heat radiation power of LED module 200.
After computation to heat radiation power P in the present embodimentth,rearWhen avoid before to heat radiation power caused by measurement do
It disturbs, improves accuracy of measurement.
In one of the embodiments, with continued reference to Fig. 5, after step S190, step S200 is further included to step S220.
Step S200:Display instrument is according to the radiation of the LED module preset temperature measurement point of radiant heat flux sensor sensing
Heat flux is calculated temperature value and is sent to processor.It is corresponding with the central point that preset reference point is the LED module back side, this reality
The quantity of preset temperature measurement point in example is applied as four, and positioned at using preset reference point as the center of circle, preset length is the circle of radius
Upper spaced set.
Step S210:The preset reference point and the temperature value meter of preset temperature measurement point that processor is sent according to display instrument
Calculation obtains maximum difference.Specifically, after LED module is installed on the system, it is powered to LED module until the bottom of calorifics interface
Portion's temperature stabilization.Measure the calorifics interface preset reference point temperature of LED module and the maximum difference of preset temperature measurement point temperature.
Step S220:Processor according to maximum difference and backward heat radiation power be calculated the diffusion thermal resistance of LED module into
Row display.Diffusion thermal resistance is calculated using thermal resistance formula is spread, is specially:
RTh, sp=max [(tr-tSx)/PTh, rear]
Wherein, Rth,spTo spread thermal resistance, trFor preset reference point temperature, tsxFor preset temperature measurement point temperature, Pth,rear
For backward heat radiation power.The diffusion thermal resistance of LED module is measured by the system, in order to the quality of LED module into
Row assessment.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.