CN217901039U - Temperature measuring device and temperature measuring system - Google Patents
Temperature measuring device and temperature measuring system Download PDFInfo
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- CN217901039U CN217901039U CN202222325115.0U CN202222325115U CN217901039U CN 217901039 U CN217901039 U CN 217901039U CN 202222325115 U CN202222325115 U CN 202222325115U CN 217901039 U CN217901039 U CN 217901039U
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Abstract
The application provides a temperature measuring device and a temperature measuring system, wherein the temperature measuring device comprises a heat conducting block, and the heat conducting block is used for being in contact with a device to be measured so as to conduct heat of the device to be measured; temperature measurement subassembly, temperature measurement subassembly set up inside the heat conduction piece to heat generation temperature signal and output according to the heat conduction of heat conduction piece conduction can detect more accurate temperature signal.
Description
Technical Field
The application relates to the technical field of semiconductor detection, in particular to a temperature measuring device and a temperature measuring system.
Background
In the prior art, the usage of TEC (thermo electric cooler) is very wide, and the performance of TEC is an increasingly interesting issue. In the TEC performance test, physical parameters such as seebeck coefficient, heat conductivity coefficient, and resistance of the TEC need to be measured to calculate the cooling capacity of the TEC. The existing test platform usually carries out measurement on the surface of the TEC directly, but the problem of contact thermal resistance caused by the surface roughness of the TEC can cause inaccurate measurement of temperature and heat flow.
SUMMERY OF THE UTILITY MODEL
In view of the inaccurate problem of current TEC temperature measurement mode, this application provides a temperature measuring device and temperature measurement system.
In a first aspect, a temperature measuring device is provided, which includes a heat conducting block, the heat conducting block is used for contacting with a device to be measured to conduct heat of the device to be measured; the temperature measuring component is arranged inside the heat conducting block and used for generating and outputting a temperature signal according to heat conducted by the heat conducting block.
Preferably, the preset surface of the heat conduction block is used for being attached to the measured surface of the measured temperature device, and the preset surface is the side surface, closest to the temperature measurement assembly, of the heat conduction block.
Preferably, the temperature measuring component comprises a plurality of temperature measuring elements which are arranged side by side and are positioned on one side, close to the preset surface, in the heat conducting block.
Preferably, the temperature measuring device further comprises a plurality of signal output parts, each signal output part comprises a signal output line and an interface, one end of each signal output line is connected with a corresponding temperature measuring element in the plurality of temperature measuring elements, the other end of each signal output line extends out of the target surface of the heat conducting block and is reserved with a preset length outside the target surface, the other end of each signal output line is connected with a corresponding interface, the target surface is any one surface of the heat conducting block except the preset surface, and the interface is used for being connected with the data acquisition equipment so as to send the temperature signal generated by the temperature measuring component to the data acquisition equipment.
Preferably, the temperature measuring device further comprises a prompt mark, and the prompt mark is arranged on the preset surface of the heat conducting block.
In a second aspect, a temperature measuring system is provided, which includes the temperature measuring device as described above; and the data acquisition equipment is connected with the temperature measurement component to receive and display the temperature signal output by the temperature measurement component.
Preferably, the temperature-measured device is a semiconductor refrigerator, the number of the temperature measuring devices is two, the refrigerating surface of the semiconductor refrigerator is attached to the preset surface of one heat conducting block, and the radiating surface of the semiconductor refrigerator is attached to the preset surface of the other heat conducting block.
Preferably, the temperature measurement system further comprises a jacket reaction kettle, the jacket reaction kettle comprises an isolation chamber and a reaction chamber arranged in the isolation chamber, and the reaction chamber is used for placing the semiconductor refrigerator and the two temperature measurement devices which are attached to each other.
Preferably, a first reserved port is formed on the reaction chamber, a second reserved port and a third reserved port are formed on the isolation chamber, the temperature measuring system further comprises a vacuum pump, and an air suction port of the vacuum pump is communicated with the first reserved port through an air connecting pipe so as to pump air to the reaction chamber to form a vacuum environment; and the water outlet of the water-cooling high-temperature circulator is connected with the second reserved port through a first water connecting pipe, and the water inlet of the water-cooling high-temperature circulator is connected with the third reserved port through a second water connecting pipe.
Preferably, the temperature measurement system further comprises an electric heating plate, the heating surface of the electric heating plate is attached to the designated surface of the target heat conduction block, the target heat conduction block is a heat conduction block attached to the refrigerating surface of the semiconductor refrigerator, and the designated surface is the surface, opposite to the preset surface, of the heat conduction block.
The application provides a pair of temperature measuring device and temperature measurement system, temperature measuring device includes heat conduction piece and temperature measurement subassembly, the heat conduction piece be used for with by the contact of temperature measurement device, with the conduction by the heat of temperature measurement device, the temperature measurement subassembly sets up inside the heat conduction piece, with heat generation temperature signal and output according to the heat conduction of heat conduction piece, compare with the temperature measurement sensor direct with by the coarse surface contact during the temperature measurement with prior art, the temperature measurement subassembly is bigger with the contact surface of heat conduction piece, can detect more accurate temperature signal.
In order to make the aforementioned objects, features and advantages of the present application comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a cross-sectional view of a temperature measuring device according to an embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of another temperature measuring device provided in an embodiment of the present application;
fig. 3 is a schematic diagram of a temperature measurement system according to an embodiment of the present disclosure.
Reference numerals:
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. Every other embodiment that can be obtained by a person skilled in the art without making creative efforts based on the embodiments of the present application falls within the protection scope of the present application.
It should be noted that in the embodiments of the present application, the term "comprising" is used to indicate the presence of the features stated hereinafter, but does not exclude the addition of further features.
In the existing TEC refrigerating capacity and refrigerating temperature difference tests, on one hand, an existing thermoelectric property test board is utilized to measure physical property parameters such as a Seebeck coefficient, a heat transfer coefficient, a resistor and the like of a semiconductor refrigerating sheet, the maximum refrigerating capacity of the semiconductor refrigerating sheet is calculated, and a curve graph of the refrigerating capacity and the refrigerating efficiency along with the change of current is drawn. On the other hand, the existing thermoelectric refrigeration performance test bed is utilized, a heat flow method is adopted, the thermal load is regulated and controlled to test the refrigeration temperature difference, and the refrigeration capacity is directly obtained through temperature test.
However, in the existing test, the temperature measurement is carried out by directly measuring on the surface of the semiconductor refrigerator. Temperature and heat flow measurements are inaccurate due to thermal contact resistance problems caused by semiconductor cooler surface roughness.
Based on the above problem, the present application provides a temperature measuring device, and the device has adopted the metal heat conduction piece that has standard thermal conductivity, through arranging a plurality of temperature measurement component in heat conduction piece inside, can accurately calculate the temperature and the thermal current on thermoelectric refrigerator surface.
As shown in fig. 1, fig. 1 is a cross-sectional view of a temperature measuring device provided in an embodiment of the present application. In one embodiment of the present application, a temperature measuring device is provided, which includes a heat conducting block 101 and a temperature measuring assembly. The heat conduction block 101 is used for contacting with the temperature-measured device to conduct heat of the temperature-measured device. The temperature measurement component is arranged inside the heat conduction block 101 so as to generate and output a temperature signal according to heat conducted by the heat conduction block 101.
The temperature measuring device that this application embodiment provided, heat conduction piece 101 be used for with by the contact of temperature measurement device, with the heat of conduction by the temperature measurement device, temperature measurement component sets up inside heat conduction piece 101, with according to the heat generation temperature signal of heat conduction piece 101 conduction and output, compare with the temperature measurement sensor directly with by the surface contact of temperature measurement period roughness in prior art, temperature measurement component is bigger with the contact surface of heat conduction piece 101, can detect more accurate temperature signal.
The heat conducting block 101 is made of metal, and may be made of copper, aluminum, or other alloy material having high thermal conductivity.
Specifically, the preset surface of the heat conduction block 101 is used for being attached to the measured surface of the measured temperature device, and the preset surface is the side surface of the heat conduction block 101 closest to the temperature measurement component.
The temperature measuring component comprises a plurality of temperature measuring elements 102, the temperature measuring elements 102 are arranged side by side, and the temperature measuring elements 102 are all located on one side, close to the preset surface, of the heat conducting block 101.
The temperature sensing element 102 in the thermally conductive block 101 can be one or more. The temperature sensing element 102 is here a temperature sensor, such as a thin film thermocouple, a thick film thermistor. Taking the device to be measured as a semiconductor refrigerator as an example, the specification of the cold end or the hot end of the semiconductor refrigerator is 40 × 40 × 4mm, and here, a heat conducting block 101 with the specification of 40 × 40 × 20mm can be adopted. The preset surface size of the heat conduction block 101 is 40 x 40mm, and the heat conduction block can be completely attached to a refrigerating surface at a cold end or a heat dissipation surface at a hot end. Therein, the temperature measuring device shown in FIG. 1 is provided with two temperature measuring elements 102.
Fig. 2 is a cross-sectional view of another temperature measuring device provided in the embodiment of the present application, as shown in fig. 2. Specifically, the temperature measuring device further comprises a plurality of signal output parts. Each signal output part comprises a signal output line 103 and an interface 104, one end of each signal output line 103 is respectively connected with a corresponding temperature measuring element 102 in the plurality of temperature measuring elements 102, the other end of each signal output line 103 extends out of the target surface of the heat conduction block 101 and is a preset length away from the target surface, the other end of each signal output line 103 is respectively connected with the corresponding interface 104, the target surface is any surface of the heat conduction block 101 except the preset surface, and the interface 104 is used for being connected with the data acquisition equipment 20 so as to send the temperature signal generated by the temperature measuring component to the data acquisition equipment 20.
The signal output line 103 here may be an electric wire. The signal output line 103 is a lead line of the temperature measuring element 102 such as a thin film thermocouple or a thick film thermistor.
Specifically, the temperature measuring device further comprises a prompt mark, and the prompt mark is arranged on the preset surface of the heat conducting block 101.
The prompt mark is used for indicating a preset surface in the heat conducting block 101, so that an experimenter can conveniently attach the preset surface to a measured surface of a measured temperature device.
As shown in fig. 3, fig. 3 is a schematic diagram of a temperature measuring system according to an embodiment of the present disclosure. In an embodiment of the present application, there is also provided a thermometry system, including the thermometry device and the data acquisition apparatus 20 as described above. The data acquisition equipment 20 is connected with the temperature measurement component to receive and display the temperature signal output by the temperature measurement component.
The data acquisition device 20 is a data acquisition instrument having a display screen for displaying the temperature signal generated by each temperature measuring element 102. The input of the data acquisition instrument can be connected to the corresponding interface 104 of the temperature measuring element 102. The output end of the data acquisition instrument is connected with the experimental computer.
The temperature measuring system also comprises a jacket reaction kettle, a vacuum pump and a water-cooling high-temperature circulator. The jacket reaction kettle comprises an isolation chamber and a reaction chamber arranged in the isolation chamber, wherein the reaction chamber is used for placing a semiconductor refrigerator and two temperature measuring devices which are attached to each other. The reaction chamber is provided with a first reserved opening, and the isolation chamber is provided with a second reserved opening and a third reserved opening. The air suction port of the vacuum pump is communicated with the first reserved port through an air connecting pipe so as to exhaust the reaction chamber to form a vacuum environment. The water outlet of the water-cooling high-temperature circulator is connected with the second reserved port through a first water connecting pipe, and the water inlet of the water-cooling high-temperature circulator is connected with the third reserved port through a second water connecting pipe.
Specifically, the temperature-measured device is a semiconductor refrigerator, the number of the temperature measuring devices is two, the refrigerating surface of the semiconductor refrigerator is attached to the preset surface of one heat-conducting block 101, and the radiating surface of the semiconductor refrigerator is attached to the preset surface of the other heat-conducting block 101.
The temperature measuring system also comprises an electric hot plate. The heating surface of electric plate and the appointed surface laminating of target heat conduction piece 101, target heat conduction piece 101 is the heat conduction piece 101 of the refrigeration face of laminating semiconductor cooler, and appointed surface is in the heat conduction piece 101 with predetermineeing the one side that the surface is relative.
Further, based on the temperature measurement system, the TEC can be tested by the following steps:
1. respectively attaching the semiconductor refrigerator to the two temperature measuring devices, connecting the temperature measuring devices with the data acquisition instrument, opening the data acquisition instrument, and checking the data acquisition system;
2. arranging the temperature measuring device and the semiconductor refrigerator which are mutually attached in a jacket reaction kettle, starting a vacuum pump, pumping a reaction chamber into a vacuum state, and keeping the vacuum degree below 100 pa;
3. opening the water-cooling high-temperature circulator, setting a preset temperature to circularly convey water with the preset temperature into the isolation chamber, wherein the water flows in from the third reserved opening and flows out from the second reserved opening;
4. carrying out heat insulation treatment on the cold end of the semiconductor refrigerator, turning on a driving power supply of the semiconductor refrigerator, and regulating and controlling input current to enable the temperature difference between the cold end and the hot end of the semiconductor refrigerator to be maximum, namely the maximum refrigerating temperature difference of the TEC;
5. and (3) turning on a driving power supply of the electric heating plate, and adjusting the power of the electric heating plate to maintain the cold end of the semiconductor refrigerator at a set temperature, wherein the heat flow at the moment is the maximum heat flow.
Further, reliability tests were conducted with reference to GJB150-1986 and TelcordiaGR-468 standards, based on testing whether changes in refrigerator resistance values exceeded 5%. And (4) carrying out high-temperature reliability analysis based on a temperature measurement system.
Before the high temperature test, the resistance of the semiconductor refrigerator was measured. Then, the semiconductor refrigerator was placed in a 150 ℃ storage box (in a non-operating mode), the semiconductor refrigerator was taken out every 50 hours to measure the resistance, and after 2 times, the resistance was measured every 100 hours until 1000 hours of storage, and the resistance value of the thermoelectric refrigerator was measured and recorded.
The resistance testing step of the reliability test comprises the following steps:
1. installing a semiconductor refrigerating sheet, connecting a test circuit, opening a data acquisition instrument and checking a data acquisition system;
2. opening a water-cooling high-temperature circulator, and adjusting the temperature to ensure that the temperature of the cold end and the hot end of the semiconductor refrigerator is stabilized at 27 ℃;
3. turning on a driving power supply of a test circuit, and testing a total voltage value Vt;
4. turning off the driving power supply, and testing the residual voltage Vr on the semiconductor refrigerating sheet;
5. closing the water-cooling high-temperature circulator, the vacuum pump and the data acquisition system in sequence;
6. the semiconductor refrigeration chip resistance R can be calculated through measured data.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
The above description is only a preferred embodiment of the present application, and does not limit the scope of the present application, and all the modifications and equivalents made by the contents of the specification and the drawings of the present application, or directly/indirectly applied to other related technical fields, are included in the scope of the present application.
Claims (10)
1. A temperature measuring device, characterized in that the temperature measuring device comprises:
the heat conducting block is used for contacting with the temperature-measured device so as to conduct heat of the temperature-measured device;
and the temperature measuring assembly is arranged inside the heat conducting block and used for generating and outputting a temperature signal according to the heat conducted by the heat conducting block.
2. The temperature measuring device of claim 1, wherein the predetermined surface of the heat conducting block is configured to be attached to a measured surface of a device to be measured, and the predetermined surface is a side surface of the heat conducting block closest to the temperature measuring assembly.
3. The temperature measuring device of claim 2, wherein the temperature measuring assembly comprises a plurality of temperature measuring elements arranged side by side, and the plurality of temperature measuring elements are located on one side of the heat conducting block close to the predetermined surface.
4. The thermometric device of claim 3, further comprising:
the temperature measuring device comprises a plurality of signal output parts, each signal output part comprises a signal output line and an interface, one end of each signal output line is connected with a corresponding temperature measuring element in the plurality of temperature measuring elements, the other end of each signal output line extends out of the target surface of the heat conducting block and is reserved with a preset length outside the target surface, the other end of each signal output line is connected with the corresponding interface, the target surface is any surface except the preset surface in the heat conducting block, and the interface is used for being connected with data acquisition equipment to send a temperature signal generated by the temperature measuring component to the data acquisition equipment.
5. The thermometric device of claim 4, wherein said thermometric device further comprises:
and the prompt mark is arranged on the preset surface of the heat conduction block.
6. A temperature measurement system, characterized in that, the temperature measurement system includes:
the temperature measuring device according to any one of claims 1 to 5;
and the data acquisition equipment is connected with the temperature measurement component to receive and display the temperature signal output by the temperature measurement component.
7. The temperature measuring system according to claim 6, wherein the device to be measured is a semiconductor refrigerator, the number of the temperature measuring devices is two, the refrigerating surface of the semiconductor refrigerator is attached to the predetermined surface of one heat conducting block, and the heat dissipating surface of the semiconductor refrigerator is attached to the predetermined surface of the other heat conducting block.
8. The thermometry system of claim 7, wherein the thermometry system further comprises:
the jacket reaction kettle comprises an isolation chamber and a reaction chamber arranged in the isolation chamber, and the reaction chamber is used for placing the semiconductor refrigerator and the two temperature measuring devices which are attached to each other.
9. The thermometric system of claim 8, wherein said reaction chamber has a first pre-determined opening formed therein, said isolation chamber has a second pre-determined opening and a third pre-determined opening formed therein,
wherein, temperature measurement system still includes:
the air suction port of the vacuum pump is communicated with the first reserved port through an air connecting pipe so as to pump the reaction chamber to form a vacuum environment;
and the water outlet of the water-cooling high-temperature circulator is connected with the second reserved port through a first water connecting pipe, and the water inlet of the water-cooling high-temperature circulator is connected with the third reserved port through a second water connecting pipe.
10. The thermometry system of claim 9, wherein the thermometry system further comprises:
the heating surface of the electric heating plate is attached to the appointed surface of the target heat conducting block, the target heat conducting block is attached to the refrigerating surface of the semiconductor refrigerator, and the appointed surface is one surface, opposite to the preset surface, of the heat conducting block.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222325115.0U CN217901039U (en) | 2022-08-29 | 2022-08-29 | Temperature measuring device and temperature measuring system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222325115.0U CN217901039U (en) | 2022-08-29 | 2022-08-29 | Temperature measuring device and temperature measuring system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116183064A (en) * | 2023-04-27 | 2023-05-30 | 南京谷贝电气科技有限公司 | Temperature difference energy-taking sensor detection device |
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- 2022-08-29 CN CN202222325115.0U patent/CN217901039U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116183064A (en) * | 2023-04-27 | 2023-05-30 | 南京谷贝电气科技有限公司 | Temperature difference energy-taking sensor detection device |
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