TWI570419B - Device and method for forcing temperature of ic - Google Patents

Description

IC heating device and method

The present invention relates to an IC warming device and method, and more particularly to an IC warming device and method suitable for IC performance testing, heating an IC and detecting temperature. In particular, on a circuit board of a portable device (such as a mobile phone), in order to increase the available space of the battery, the available space of the small-sized IC is reduced, which leads to an increase in the density of the small-sized IC, and thus is susceptible to battery heat during operation. The temperature of the CPU is affected, and it is difficult to dissipate heat, and the small-sized IC is often kept at a high temperature. Therefore, it is necessary to test whether the small-sized IC operates normally at a high temperature (for example, a gauge temperature of 85 ° C). Among them, the small-sized IC is defined as having a size of 8 mm*8 mm or less and a pin-to-pin pitch of 0.65 mm or less. Unlike traditional large-size ICs that focus on cooling, the requirements for small-sized ICs are focused on operation in high-temperature environments. The IC temperature-increasing devices and methods of the present invention can rapidly heat small-sized ICs to specific temperatures and ensure that small-sized ICs can be maintained. The temperature is constant and the temperature is accurate for testing.

In general, in the testing of packaged integrated circuit components (ICs), the final test (Final Test) and the reliability test (Reliability Test) are common. In the final test of the IC, the IC under test is warmed, and when the IC under test reaches a predetermined temperature, the test IC can be operated at a high temperature, and the test time is short. The Reliability Test is to maintain the IC under test at a high temperature. Next, continue to operate and test to understand its stability, this program is usually called Burn-in. During the burning process, it is necessary to bake the IC under test for a long time, and the IC under test needs to be maintained at a predetermined temperature for a long time (for example, two to three weeks) to operate and test.

In the current existing IC heating method, one of them is heated by a heating plate, and it is necessary to rely on manpower to heat the IC to a predetermined temperature on the heating plate, move from the heating plate to a socket, and then install it on the socket for performance test. When the IC under test leaves the heating plate, the contact between the socket and the IC under test and the air convection will be measured because the heating IC cannot continue to heat the IC under test, and the speed of moving from the heating panel to the socket. The IC temperature is lowered and the IC under test cannot be thermostated, which results in the IC under test being unable to test at the same temperature, resulting in different test results.

Another type of IC heating method uses a heat gun to heat the IC. However, it has the following disadvantages: (1) Since the heat gun is heated by a hot air for a specific range, it is unevenly heated, and the heating temperature cannot be controlled, and it is easy to overheat or If the target temperature is not reached, even if the IC under test is blocked and insulated by the heat insulation design, it is difficult to prevent the heat gun from affecting the temperature of the surrounding components. (2) Even if the IC reaches a certain temperature, when the heat gun stops heating, it is difficult to test the IC. The IC maintains a constant temperature; (3) When the heat gun is heated, the surrounding components and the PCB board are heated at the same time, so that when the performance of the IC is tested, the test result is affected by the temperature rise of the surrounding components and is inaccurate; (4) When testing the small-sized IC, It needs to be placed in the socket and covered with a hand cover to maintain electrical contact. However, when the heat gun heats the small size IC, it will be blocked by the hand cover and the socket, and the heat gun is difficult to heat the small size IC; (5) When testing, it is impossible to determine the temperature of the IC itself, and it is more difficult to know when heating is required.

Another type of IC heating method is a mobile type of thermal stream device. However, this device is expensive, bulky, and consumes a large amount of electricity. It needs to be operated with a compressed gas and a compressor. The temperature sensor is often disposed at The flow path of the cold and warm air, therefore, the temperature sensor is difficult to accurately respond The temperature of individual ICs. In addition, although the flow heating and cooling system can be connected to the thermal couple of the IC under test to obtain the temperature of the IC under test, most of the ICs in the test phase do not have a thermocouple. To obtain the temperature of the IC under test, It is extremely inconvenient to connect the temperature sensor to the temperature sensor and then contact or attach it to the IC under test to measure the temperature. The temperature obtained is not accurate. Since the flow type cold air heating is similar to the heat air gun, the air flow is used to heat and maintain the constant temperature of the IC. However, it is also difficult to heat and thermostat the small size IC by the above-mentioned hand cover and socket blocking, and similarly, The above problems arising from the use of the heat gun are generated. Even if individual temperature sensors are provided for multiple ICs, this method still needs to set individual temperature sensors again in other IC temperature rising tests, which is seriously inconvenient and affects the testing efficiency of the IC.

In order to solve the above problems, an object of the present invention is to provide an IC temperature increasing device for testing a device under test to a specific temperature, which comprises a briquetting block, a thermal sensing element, a heating sheet, an insulating sheet, and an input/output. Terminal and temperature controller. Wherein, the pressure block has a base and a surface for directly contacting the device under test. The heat sensing element is disposed inside the pressing block, the heating piece is disposed on the pressing block and contacting the substrate, the insulating sheet is disposed on the heating sheet, and the input/output end is disposed on the insulating sheet, at least including the power line and the signal line, and the power line and the power line The heating plate is electrically connected, and the signal line is electrically connected to the thermal sensing element. The temperature controller is connected to the power line and the signal line, and is used for supplying power to the power line and controlling the temperature of the heating piece, and measuring the electrical property of the thermal sensing element through the signal line to calculate the temperature of the device under test, wherein the voltage is obtained. The block is used to conduct the thermal energy of the heater chip to the device under test.

Preferably, the temperature controller can include a user interface for the user to control the temperature of the heater chip and display the temperature of the device under test.

Preferably, the insulating sheet may include a base and a plurality of insulating walls disposed on the base, wherein the plurality of insulating walls may be configured in an annular configuration, a sheet configuration, and a block configuration.

Preferably, the insulating sheet further comprises a through hole for connecting the power line and the signal line to the heating piece and the heat sensing element, respectively.

According to another aspect of the present invention, an IC temperature increasing device for heating a device under test (DUT) and testing the temperature of the device under test includes a compact, a thermal sensing element, and a heating sheet. , insulation sheet and input / output. The pressing block has a base and a surface, the surface is for directly contacting the device under test; the thermal sensing element is disposed inside the pressing block; the heating piece is disposed on the pressing block and contacting the substrate; the insulating sheet is disposed on the heating sheet; and the input/output end is disposed on the insulating layer The chip includes at least a power line and a signal line, and the power line is electrically connected to the heating piece. The signal line is electrically connected to the thermal element, and is configured to supply power through the power line to heat the heating piece and detect the heat through the signal line. The electrical properties of the component.

Preferably, the method further comprises a temperature controller connected to the power line and the signal line for supplying power to the power line and controlling the temperature of the heating piece, and measuring the electrical property of the thermal element through the signal line to calculate the obtained The temperature of the device, wherein the compact is used to conduct thermal energy from the heater chip to the device under test.

Preferably, the temperature controller can include a user interface for the user to control the temperature of the heater chip and display the temperature of the device under test.

Preferably, the insulating sheet may comprise a base and a plurality of insulating walls disposed on the base, wherein the plurality of insulating walls are disposed in an annular configuration, a sheet configuration and a block configuration.

Preferably, the insulating sheet further comprises a through hole for connecting the power line and the signal line to the heating piece and the heat sensing element, respectively.

According to still another aspect of the present invention, an IC heating method is provided, which is applicable to the above IC temperature increasing device, and includes the following steps: connecting a temperature controller to an input/output power line and a signal line The heating piece and the thermal sensing element are electrically connected respectively; the heating device is used to control the heating piece heating through the power line; the pressing block contacts the device under test, and the thermal energy of the heating piece is transmitted to the device under test; and the temperature controller is controlled to pass through the signal line. Detecting the electrical properties of the thermal sensing component; using a temperature controller to calculate the temperature of the device under test based on the resistance value.

According to the above, the IC heating device and method provided by the present invention can adopt direct contact heating and temperature for the IC in the IC heating performance test process compared with the prior art, wherein the contact heat conduction pressing block is used. Compared with the conventional technology, the method of heat convection by a fan is fast, convenient, simple, inexpensive, power-saving and environmentally friendly. In addition, a plurality of insulated air walls formed by the heat insulating sheets having a plurality of heat insulating walls can effectively prevent unnecessary loss of heat energy during heating, thereby increasing the speed of heating the heat sensing elements. Furthermore, the temperature measuring device of the invention can accurately measure the temperature of the device under test through the closed loop of the power line and the signal line, and can accurately measure the temperature of the device under test while being used for the small-sized device under test. Different settings enable a high degree of adaptability and speed up measurement efficiency.

10‧‧‧Clamps

100‧‧‧Base

102‧‧‧ surface

104‧‧‧Protruding

12‧‧‧Thermal components

122, 142‧‧‧ electrodes

14‧‧‧ heating film

142‧‧‧electrode

146‧‧‧through hole

16, 16', 16" ‧ ‧ insulating sheets

162‧‧‧Base

164, 164', 164" ‧ ‧ insulation wall

166‧‧‧through hole

18, 72a, 72b‧‧‧ temperature controller

181‧‧‧User interface

182‧‧‧display screen

I/O‧‧‧Input/Output

PLUG‧‧‧ socket

DUT‧‧‧Device under test

PL‧‧‧Power cord

SL‧‧‧ signal line

20‧‧‧shell

6, 71a, 71b‧‧‧IC heating performance test equipment

61‧‧‧Lock construction

62‧‧‧IC socket cover

63‧‧‧Connection interface

64‧‧‧IC socket

65‧‧‧Clamping structure

66, 73‧‧‧ Printed circuit boards

67‧‧‧Protruding structures

68‧‧‧Keyhole

DUT1, DUTa, DUTb, DUTc‧‧‧Measured IC devices

The above and other features and advantages of the present invention will become more apparent from the detailed description of the embodiments illustrated in the appended claims.

Fig. 2 is a schematic plan view showing a compact of an IC warming device according to the present invention.

Fig. 3A is a top plan view showing the first embodiment of the insulating sheet of the IC temperature increasing device according to the present invention.

Fig. 3B is a top plan view showing a second embodiment of the insulating sheet of the IC temperature increasing device according to the present invention.

Fig. 3C is a top plan view showing a third embodiment of the insulating sheet of the IC temperature increasing device according to the present invention.

Figure 4 is a schematic illustration of a temperature controller of an IC warming device in accordance with the present invention.

Fig. 5 is a flow chart showing an embodiment of an IC heating method according to the present invention.

6A and 6B are schematic views showing the operation of an embodiment of the IC temperature raising method according to the present invention.

Fig. 7 is a schematic view showing the operation of another embodiment of the IC temperature raising method according to the present invention.

The technical features, contents, and advantages of the present invention, as well as the advantages thereof, can be understood by the present inventors, and the present invention will be described in detail with reference to the accompanying drawings. The subject matter is only for the purpose of illustration and description. It is not intended to be a true proportion and precise configuration after the implementation of the present invention. Therefore, the scope and configuration relationship of the attached drawings should not be interpreted or limited. First described.

As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. When the phrase "at least one of" is preceded by a list of elements, the entire list of elements is modified instead of the individual elements in the list.

Fig. 1 is a cross-sectional view showing an embodiment of an IC temperature increasing apparatus according to the present invention. As shown in FIG. 1, the IC temperature increasing device 1 of the present invention is for heating a device under test DUT and testing the temperature of the device under test DUT, comprising a compact 10, a thermal sensing element 12, a heating sheet 14, and an insulating sheet. 16. Input/Output I/O, Temperature Controller 18.

Wherein, the compact 10 has a substrate 100 and a surface 102 for directly contacting the device under test DUT. Surface 102 may be raised by substrate 100 and includes a plurality of protrusions 104 that may be used When contacting the device under test DUT, the gap is reserved to prevent the device under test DUT from being excessively adhered to the pressure block 10, and after the measurement is completed, when the device under test DUT is separated from the pressure block 10, the device under test DUT is adsorbed by the compact 10. . Here, the compact 10 can be made, for example, of a thermally conductive material such as copper or the like, and has a rapid thermal conductivity as a design orientation. The device under test DUT can be electrically contacted with a printed circuit board (PCB) in advance and connected to the IC performance detecting device. This is a technique well known to those skilled in the art, and therefore will not be described herein.

Please refer to FIG. 2, which shows a top view of the compact of the IC warming device according to the present invention. As shown in FIG. 2, the press block 10 includes four protrusions 104 with gaps therebetween, but not limited thereto. When the IC is of a very small size, the protrusions 104 may not be provided. Preferably, the compact 10 can be tested for ICs in a Wafer-Level Chip Scale Packaging manner, and can be used for wafers of less than 8 mm×8 mm in size. .

Furthermore, the thermal sensing element 12 is disposed inside the compact 10, and the thermal sensing element 12 has two electrodes 122. Preferably, the electrode 122 can be disposed at one end of the thermal sensing element 12 to facilitate subsequent connection with the signal line. Generally, the thermal sensing component 12 can be an active or passive component, including a resistor, a capacitor, and an inductor. The thermal sensing component 12 can also be composed of multiple layers of materials having different thermal expansion coefficients, or can be a thermal IC, a transistor, or a diode. . Preferably, the temperature change causes an electrical change in the thermal sensing element 12, and the thermal sensing element 12 is capable of rapidly achieving thermal equilibrium with the device under test DUT and the compact 10. Here, the thermal sensing element 12 can be an inductor resistance, the resistance value changes with temperature, and the degree of deformation varies greatly with temperature compared to a general fixed resistance, and is generally widely used in various electronic components, for example, Inrush current limiter, temperature sensor, double fuse, and self-regulating heater. The thermal element 12 can be a pure metal, ceramic or polymer and is suitable for different temperature response ranges and has different temperature response properties.

The heater chip 14 is disposed above the substrate 102 of the compact 10 and directly contacts the compact 10. The heating sheet 14 is also provided with an electrode 142 for subsequent connection with the power line for heating purposes. heating The arrangement of the sheet 14 can be performed by attaching an electric resistance wire to the PCB and adopting an insulation design. Preferably, the heater chip 14 can be heated to at least 85 ° C or higher, and may include a through hole for allowing the power line PL connected to the thermal sensing element 12 to pass.

An insulating sheet 16 is disposed above the heater chip 14 for blocking heat conduction between the heater chip 14 and the upper member. Please refer to FIG. 3A, which is a plan view of a first embodiment of an insulating sheet according to an embodiment of an IC temperature increasing device according to the present invention. As shown in FIG. 3A, the insulating sheet 16 may include a susceptor 162 and a plurality of insulating walls 164 disposed on the pedestal, in addition to insulating the heating sheet 14 from other upper elements, wherein the insulating wall 164 In order to prevent the heat convection of the air, the plurality of air walls generated through the heat insulating wall 164 can utilize the characteristics of poor heat conduction of the air, thereby reducing the heat loss caused by the heat convection when the heating piece 14 heats the compact block 10, Therefore, the heat insulating wall 164 can further reduce the heating time so that the device under test DUT quickly reaches a predetermined temperature. Preferably, the heat insulating wall 164 can be disposed by using an annular heat insulating wall as shown in FIG. 3A, but is not limited thereto. In addition to preventing thermal convection of air between the plurality of insulating walls 164, the annular insulating wall can evenly distribute the pressure when the pressing block 10 is pressed to the DUT of the device under test, and the insulating sheet 16 can be, for example, industrial plastic. Made of thermal insulation. In addition, the insulating sheet 16 further includes a through hole 166 for allowing the power line PL and the signal line SL to pass through to be electrically connected to the heating sheet 14 and the thermal sensing element 12, respectively, thereby avoiding the cost and space required for additional wiring. .

Please refer to FIG. 3B, which is a plan view of a second embodiment of an insulating sheet according to an embodiment of an IC temperature increasing device according to the present invention. As shown in FIG. 3B, the plurality of insulating walls 164' of the insulating sheet 16' are different from the previous embodiment in that a plurality of parallel-plate insulating walls are provided, thereby preventing a plurality of parallel insulating layers. The air between the walls 164' is thermally convected while equally distributing the pressure at which the pressure block 10 is pressed against the device under test DUT.

Please refer to FIG. 3C, which is a plan view of a third embodiment of an insulating sheet according to an embodiment of an IC temperature increasing device according to the present invention. As shown in FIG. 3B, the plurality of insulating walls 164" of the insulating sheet 16" are different from the previous embodiment in that a plurality of block-shaped insulating walls are provided, and a plurality of block-shaped insulating walls are provided. In addition to reducing the thermal convection of the air therebetween, the pressure at which the compact 10 is pressed against the DUT of the device under test can be equally distributed. However, the insulating wall of the present invention is not limited to the configuration of the 3A-3C, and may be annular. Any combination of configuration, tile configuration, and block configuration.

Referring to FIG. 1, the IC temperature increasing device 1 of the present invention further includes input/output I/Os which are disposed on the insulating sheet 16 and can be further disposed in the housing 20. The input/output I/O includes at least a power line PL and a signal line SL, and the power line PL is electrically connected to the heater chip 14, and the signal line SL is electrically connected to the thermal element 12. That is, the power line PL can be connected to the electrode 142 of the heater chip 14 through the through hole 166, and the signal line SL can be electrically connected to the electrode 122 of the thermal sensor 12 through the through hole 166 and the through hole 144. Preferably, the input/output I/O can be a universal serial bus (USB) socket PLUG, and the power line PL and the signal line SL can pass through a USB specification socket. The description of the USB socket here is only an example, and the actual application is not limited thereto.

Further, the temperature controller 18 is connected to the power line PL and the signal line SL to form a close loop for supplying power to the power line PL to control the temperature of the heater chip 14. The temperature controller 18 also measures the electrical properties of the thermal sensing element 12 through the signal line SL. Specifically, the temperature controller 18 measures the voltage and current of the device under test DUT and calculates it to obtain the temperature of the device under test DUT. Specifically, the temperature controller 18 may include a control unit, such as a Central Processing Unit (CPU) or a Micro Controlling Unit (MCU), or a firmware, hardware, or software that implements the above control and calculation. It can be supplied with an external power source or by the internal battery to supply the electric energy required for the IC temperature increasing device of the present invention.

Please refer to FIG. 4, which is a schematic diagram of a temperature controller of an IC warming device according to the present invention. Preferably, the temperature controller 18 further includes a user interface 181 and a display screen 182 for displaying the temperature of the heater chip 14 and displaying the temperature sensed by the calculated thermal sensor element 12.

In addition, according to a preferred embodiment of the present invention, the temperature controller 18 can have a feedback control function, and the user can set the test temperature of the device under test DUT through the user interface, when the device under test DUT Upon reaching the predetermined test temperature, the temperature controller 18 automatically stops controlling the heater chip 14 for temperature rise. Conversely, when the temperature of the IC exceeds a threshold, the temperature controller 18 can also detect that the device under test DUT has not reached the predetermined temperature, and control the heating sheet 14 to continue heating to make the IC reach the test temperature. In addition, the threshold is configurable. For example, the threshold can be set to 1 ° C. When the device under test DUT cools down by more than 1 ° C, the temperature controller 18 controls the heating sheet 14 to continue heating. This setting eliminates the user's inconvenience of monitoring the temperature at any time and allows the DUT of the device under test to maintain a stable test temperature.

Compared with the prior art, the IC temperature increasing device of the present invention adopts a contact heat conduction pressing block, and can adopt direct contact heating and temperature measurement on the wafer during the IC heating performance test, and the power consumption is low (about 6W). Compared with the prior art, the technology of heat convection by a hot air gun (1500W) or a warm air heater (4-5000W) is fast, convenient, simple, inexpensive, power-saving, environmentally friendly, and does not require compressed gas. In addition, through the heat insulation sheet with a plurality of heat insulation walls, the unnecessary loss of heat energy can be effectively prevented, so as to reduce the time when the heat sensitive element reaches the predetermined temperature, thereby improving the test efficiency. Furthermore, in the specific embodiment of the present invention, the temperature measuring device can accurately measure the temperature of the device under test through the power line and the signal line, and achieve a high degree of adaptability and acceleration while achieving a thermal balance between the pressure block and the device under test. Measurement efficiency.

The flow of the IC heating method according to the present invention will now be described in further detail with reference to the accompanying drawings. Fig. 5 is a flow chart showing an embodiment of an IC heating method according to the present invention. The IC heating method of the present invention is for heating a device under test and testing the temperature of the device under test, which is applicable to the above-mentioned IC temperature increasing device, and includes the following steps:

S401: Connect the temperature controller to the power line and the signal line of the input/output terminal to electrically connect the heating piece and the thermal sensing element respectively. As mentioned in the foregoing embodiments, the temperature controller can be connected to the socket through the USB cable for the subsequent measurement steps, and the power line and the signal line can pass through the through holes of the insulating sheet, respectively, with the heating sheet and the heat. The sensing elements are connected. In addition, the temperature controller can also be replaced by a chip containing a processor, connected to a computer device, and measured by the software end and the temperature control of the heater chip. In addition, the temperature controller 18 may have a hardware, a soft body or a firmware that implements the aforementioned feedback control function, and the user The test temperature of the device under test DUT can be set through the user interface. When the device under test DUT reaches a predetermined test temperature, the temperature controller 18 automatically stops heating the heater chip 14. Conversely, when the temperature of the IC exceeds a threshold, the temperature controller 18 can also detect that the device under test DUT has not reached the predetermined temperature, and control the heating sheet 14 to continue heating to make the IC reach the test temperature. This setting eliminates the user's inconvenience of monitoring the temperature at any time and allows the DUT of the device under test to maintain a stable test temperature.

S402: Control the heating piece heating through the power line by using a temperature controller. In this step, the temperature controller is controlled through the user interface such that the heater chip reaches the predetermined temperature to be tested.

S403: contacting the device under test with a pressure block to conduct thermal energy of the heating piece to the device under test. And the plurality of protrusions correspondingly contact the device under test, so that the device under test, the thermal sensing element, the pressure block and the heating piece in the foregoing embodiment reach a thermal equilibrium state. Furthermore, in the step of controlling the heating of the heater chip through the power supply line using the temperature controller, the plurality of heat insulating walls using the insulating sheet are further insulated.

S404: Control the temperature controller to detect the resistance value of the thermal sensing element through the signal line;

S405: Calculate the temperature of the device under test according to the resistance value using a temperature controller.

Please refer to FIGS. 6A-6B, which are schematic diagrams showing the operation of an embodiment of the IC heating method according to the present invention. As shown in FIG. 6A, before the IC temperature rise performance test step, the IC device DUT1 under test has been placed on the IC socket 64 of the IC temperature rise performance test device 6, and the IC temperature increase device 1 described in FIG. 1 is disposed at The inside of the semi-opening movable IC socket cover 62 is connected to the temperature controller through the connection interface 63. The IC socket 64 is externally connected to the IC performance detecting device through the printed circuit board 66. Preferably, the IC socket cover 62 is secured to the printed circuit board 66 through a locking hole 68 around the IC socket 64. In addition, the IC socket cover 62 can include a locking structure 61 located above the IC temperature increasing device 1 to be locked when the IC temperature increasing device 1 is in contact with the IC device under test DUT1 to ensure the clamping of the IC heating device 1. Can be closely attached to the IC device DUT1 under test. The opening and closing portion of the IC socket cover 62 may further include a protruding structure 67 for the engaging structure 65 on the side of the IC socket cover 62 to hook the protruding structure 57 to enable the IC socket cover 52 to be tightly fitted. Next, the IC temperature rise performance test is performed, as shown in FIG. 6B, while the IC temperature rise performance test step is performed, the pressure is simultaneously performed. The plurality of protrusions of the block directly contact the IC device DUT1 under test. At this time, steps S401 to S405 in the embodiment of the IC temperature raising method of the present invention can quickly detect the temperature of the IC device DUT1 under test, and simultaneously test the performance of the tested IC device DUT1 through the performance detecting device, and the detection is completed. After that, only the replacement of the IC device DUT1 to be tested can enter the detection process of the second round.

Please refer to FIG. 7, which is a schematic diagram of the operation of another embodiment of the IC heating method according to the present invention. In FIG. 7, a plurality of IC devices under test DUTa, DUTb, and DUTc are mounted on the printed circuit board 73. In the present embodiment, an embodiment in which the IC temperature rise performance test devices 71a and 71b are used for selective temperature rise will be described in detail, wherein the IC devices to be tested DUTa and DUTc are targets for temperature rise, and the IC device under test DUTb is used. Maintain at normal temperature or normal operating temperature. As shown in the figure, the IC heating performance test devices 71a and 71b can be respectively mounted on the target to be warmed up, that is, above the IC devices DUTa and DUTc to be tested. Here, the details of the IC warming performance test devices 71a and 71b are similar to those of the IC warming performance test device 6 described in Figs. 6A-6B, and a repetitive description thereof will be omitted. The IC warming performance test devices 71a and 71b are respectively connected to the individual temperature controllers 72a and 72b, and set different test temperatures. For example, the temperature controller 72a is set to 85 degrees Celsius as shown in the figure, and the temperature is set. The controller 72a is set to 95 degrees Celsius. In this way, before the IC device DUTb under test is maintained at normal temperature or normal operating temperature, the IC devices DUTa and DUTc are individually warmed at different temperatures, and the working efficiency is tested. In this way, the selective heating of the test target can be further achieved without affecting the temperature of the components around the tested IC device DUTa and DUTc or the printed circuit board 73, so as to further improve the accuracy and reliability of the test.

In summary, the IC temperature-increasing device and method of the present invention adopts a direct contact type heat conduction clamp, and adopts contact heating and temperature measurement for the IC, and is applicable to a small-sized IC, compared with the conventional technology. The technology of fan convection is more fast, convenient, simple, cheap, energy-saving and environmentally friendly. In addition, through the heat insulation sheet with a plurality of heat insulation walls, the unnecessary loss of heat energy can be effectively prevented, the heating time can be reduced, the device under test can reach the predetermined temperature quickly, and the heat insulation sheet can be looped. The shape, sheet or block distribution is evenly distributed. Furthermore, in the specific embodiment of the present invention, the temperature measuring device can accurately detect the temperature of the device under test through the power line and the signal line, and achieve a high degree of adaptability and acceleration while achieving a thermal balance between the pressure block and the device under test. Measurement efficiency.

While the embodiments of the present invention have been particularly shown and described with reference to the exemplary embodiments thereof, Various changes in form and detail may be made in the spirit and scope of the invention.

10‧‧‧Clamps

100‧‧‧Base

102‧‧‧ surface

104‧‧‧Protruding

12‧‧‧Thermal components

122‧‧‧ electrodes

14‧‧‧ heating film

142‧‧‧electrode

146‧‧‧through hole

16‧‧‧Insulation sheet

162‧‧‧Base

164‧‧‧Insulation wall

166‧‧‧through hole

18‧‧‧ Temperature Controller

I/O‧‧‧Input/Output

PLUG‧‧‧ socket

DUT‧‧‧Device under test

PL‧‧‧Power cord

SL‧‧‧ signal line

20‧‧‧shell

Claims (8)

An IC temperature increasing device for heating a device under test (DUT) to a specific temperature for testing comprises: a pressing block having a base and a surface for directly contacting the quilt a heat sensing element disposed inside the pressure block; a heating piece disposed on the pressing block and contacting the substrate; an insulating sheet disposed on the heating piece, the insulating piece comprising a base and a plurality of insulating walls disposed on the base, wherein the plurality of insulating walls are disposed in an annular configuration, a sheet configuration, and a block configuration, and generate a plurality of air walls; an input/output terminal is provided The power strip is electrically connected to the heating element, and the signal line is electrically connected to the thermal sensing element; and a temperature controller is connected to the power line and the power line and the power line The signal line is connected to supply power to the power line and control the temperature of the heater chip, and measure the electrical property of the heat sensing element through the signal line to calculate the temperature of the device under test, wherein the pressure block For the heating sheet The heat conducted to the device under test. The IC temperature increasing device according to claim 1, wherein the temperature controller comprises a user interface for the user to control the temperature of the heating chip and display the temperature of the device under test. The IC temperature-increasing device of claim 1, wherein the insulating sheet further comprises a through hole, wherein the power line and the signal line are respectively connected to the heating piece and the thermal sensing element. An IC temperature increasing device for heating a device under test (DUT) to a specific temperature for testing comprises: a pressing block having a base and a surface for directly contacting the quilt a heat sensing element disposed inside the pressure block; a heating piece disposed on the pressing block and contacting the substrate; an insulating sheet disposed on the heating piece, the insulating piece comprising a base and a plurality of insulating walls disposed on the base, wherein the plurality of insulating walls are disposed in an annular configuration, a sheet configuration, and a block configuration, and generate a plurality of air walls; and an input/output terminal The power supply line is electrically connected to the heating element, and the signal line is electrically connected to the thermal sensing element and configured to supply power through the power line. The heater chip is heated and the electrical conductivity of the thermal sensing element is detected through the signal line. The IC temperature increasing device according to claim 4, further comprising a temperature controller connected to the power line and the signal line for supplying power to the power line and controlling the temperature of the heating piece, and transmitting The signal line measures the electrical properties of the thermal sensing element to calculate the temperature of the device under test, wherein the compact is used to conduct thermal energy of the heating pad to the device under test. The IC temperature increasing device of claim 4, wherein the temperature controller comprises a user interface for the user to control the temperature of the heating chip and display the temperature of the device under test. The IC temperature-increasing device of claim 4, wherein the insulating sheet further comprises a through hole for the power line and the signal line respectively, the heating piece and the thermal sensor Piece connection. An IC heating method is applicable to the IC temperature increasing device according to any one of claims 1 to 7, which comprises the steps of: connecting the temperature controller to the input/output terminal of the power line and the signal line to be separately charged. Connecting the heating piece and the thermal sensing element; using the temperature controller to control heating of the heating piece through the power line; contacting the device under test with the pressing piece, and transmitting thermal energy of the heating piece to the device under test; The temperature controller detects the electrical conductivity of the thermal sensing element through the signal line; and uses the temperature controller to obtain the temperature of the device under test according to the electrical calculation.