CN203689187U - Temperature control device for detecting semiconductor device - Google Patents

Temperature control device for detecting semiconductor device Download PDF

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Publication number
CN203689187U
CN203689187U CN201420015876.9U CN201420015876U CN203689187U CN 203689187 U CN203689187 U CN 203689187U CN 201420015876 U CN201420015876 U CN 201420015876U CN 203689187 U CN203689187 U CN 203689187U
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China
Prior art keywords
heat
temperature
semiconductor devices
detected
generating component
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CN201420015876.9U
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Chinese (zh)
Inventor
闫稳玉
马乃峰
成涛
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KEDA SEMICONDUCTOR CO Ltd
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KEDA SEMICONDUCTOR CO Ltd
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Abstract

The utility model discloses a temperature control device for detecting a semiconductor device. The temperature control device comprises a heating assembly, a heat conducting plate disposed on the heating assembly and in joint sealing with the heating assembly, an insulation heat conducting membrane disposed above the heat conductive plate and in joint sealing with the heat conductive plate, and a control module. The control module is used for controlling the heating assembly to heat the semiconductor device to the detection temperature, collecting the temperature value of the to-be-detected semiconductor device in the detection stage, and controlling the heat production of the heating assembly according to the temperature value, so as to ensure the temperature of the to-be-detected semiconductor device to keep the detection temperature. The temperature control device can control the temperature of the semiconductor device in the detection process, so that the temperature of the to-be-detected semiconductor device to be stabilized within the detection temperature range, and then measuring results are ensured to be accurate.

Description

A kind of semiconductor devices detection temperature control equipment
Technical field
The utility model relates to semiconductor device fabrication process technical field, more particularly, relates to a kind of semiconductor devices detection temperature control equipment.
Background technology
Semiconductor devices is due to its good calorifics, electricity, mechanics and chemical characteristic, and the advantage such as volume is little, lightweight and low in energy consumption, be widely used in the fields such as computing machine, communication and Electronic Control, for people's daily productive life has been brought huge facility.Semiconductor devices need to be operated under different temperature conditions according to its purposes, in order to judge the working condition of semiconductor devices in the temperature environment of its regulation, need under its corresponding working temperature, detect its output characteristics.
For many semiconductor devices, generally need to be operated in (room temperature~260 DEG C) under higher temperature, so need to heat semiconductor devices to be measured in the time semiconductor devices being carried out to output characteristics detection.Therefore, in order to ensure that test result comparatively accurately need to control semiconductor devices in its specific working temperature, to test its performance at this temperature.But at present a lot of testing apparatuss do not have temperature controlling function.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of semiconductor devices detection temperature control equipment, temperature when this device can be controlled semiconductor devices detection, make the temperature of semiconductor devices to be detected within the scope of its detected temperatures, keep stable, thereby ensure the accuracy of measurement result.
For achieving the above object, the utility model provides following technical scheme:
Heat generating component;
The heat-conducting plate that is arranged on described heat generating component top, described heat-conducting plate and described heat generating component connect airtight;
Be attached at the insulating heat-conductive film of described heat-conducting plate top;
Control module, described control module is used for controlling described heat generating component described semiconductor devices to be detected is heated to detected temperatures, and gather the temperature value of described semiconductor devices to be detected at detection-phase, and according to the heat production of heat generating component described in described temperature value control, with the temperature stabilization that ensures described semiconductor devices to be detected in described detected temperatures.
Preferably, in said apparatus, described control module comprises:
Temperature sensor, described temperature sensor connects airtight in described insulating heat-conductive film upper surface for gathering the temperature value of described insulating heat-conductive film, and then obtains the temperature value of described semiconductor devices to be detected;
Temperature controller, described temperature controller is according to described temperature value output control signal;
Relay, described relay provides power supply to described heat generating component according to described control signal, to control the heat production of described heat generating component.
Preferably, in said apparatus, described temperature sensor is for mounting thermistor.
Preferably, in said apparatus, described heat generating component is PTC electric hot plate.
Preferably, in said apparatus, described heat-conducting plate is aluminum heat-conducting plate.
Preferably, in said apparatus, described heat generating component and described heat-conducting plate connect airtight by set bolt.
Preferably, in said apparatus, described device, in the time described semiconductor devices to be detected being heated to detection, connects airtight semiconductor devices to be measured on described insulating heat-conductive film by set bolt.
Preferably, in said apparatus, described device, in the time described semiconductor devices to be detected being heated to detection, connects airtight semiconductor devices to be measured on described insulating heat-conductive film by shell fragment.
Preferably, in said apparatus, described insulating heat-conductive film is epoxy resin glued membrane.
Can find out from technique scheme, semiconductor devices detection provided by the utility model comprises with temperature control equipment: heat generating component; The heat-conducting plate that is arranged on described heat generating component top, described heat-conducting plate and described heat generating component connect airtight; The insulating heat-conductive film that is arranged on described heat-conducting plate top, described insulating heat-conductive film and described heat-conducting plate connect airtight; Control module, described control module is used for controlling described heat generating component described semiconductor devices to be detected is heated to detected temperatures, and gather the temperature value of described semiconductor devices to be detected at detection-phase, and according to the heat production of heat generating component described in described temperature value control, to ensure that the temperature of described semiconductor devices to be detected keeps stable within the scope of its detected temperatures.
In the time carrying out semiconductor devices detection, first by heat generating component described in described control module control, described semiconductor devices to be detected is heated to detected temperatures, be that described semiconductor devices to be detected is switched on test when its output characteristics at detection-phase, measure at any time the temperature value of described semiconductor devices to be detected by described control module, and according to the heat production of heat generating component described in described temperature value control, with the temperature stabilization that ensures described semiconductor devices to be detected in described detected temperatures.Therefore, temperature when this device can be controlled semiconductor devices detection, makes the temperature of semiconductor devices to be detected within the scope of its detected temperatures, keep stable, thereby ensures the accurate of measurement result.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is that a kind of semiconductor devices provided by the utility model detects the structural representation with temperature control equipment;
Fig. 2 is that another kind of semiconductor devices provided by the utility model detects the structural representation with temperature control equipment.
Embodiment
Just as described in the background section, existing semiconductor device testing apparatus does not have temperature controlling function, thereby causes semi-conductive actual temperature and its detected temperatures (temperature that should have when detection), differs larger, causes the out of true of measurement result.
Inventor studies discovery, can gather at any time by specific control module the temperature value of described semiconductor devices to be detected, according to the heating of described temperature value control heat generating component, thereby the temperature that can control described semiconductor devices to be detected keeps steady within the scope of its detected temperatures.
Based on above-mentioned research, the utility model provides a kind of semiconductor devices detection temperature control equipment, and this device comprises:
Heat generating component;
The heat-conducting plate that is arranged on described heat generating component top, described heat-conducting plate and described heat generating component connect airtight;
Be attached at the insulating heat-conductive film of described heat-conducting plate top;
Control module, described control module is used for controlling described heat generating component described semiconductor devices to be detected is heated to detected temperatures, and gather the temperature value of described semiconductor devices to be detected at detection-phase, and according to the heat production of heat generating component described in described temperature value control, with the temperature stabilization that ensures described semiconductor devices to be detected in described detected temperatures.
Adopt described temperature control equipment in the time carrying out semiconductor devices detection, first by heat generating component described in described control module control, described semiconductor devices to be detected is heated to detected temperatures, be that described semiconductor devices to be detected is switched on test when its output characteristics at detection-phase, measure at any time the temperature value of described semiconductor devices to be detected by described control module, and according to the heat production of heat generating component described in described temperature value control, with the temperature stabilization that ensures described semiconductor devices to be detected in described detected temperatures.Therefore, temperature when this device can accurately be controlled semiconductor devices detection, makes the temperature of semiconductor devices to be detected remain on its detected temperatures, thereby ensures the accurate of measurement result.
It is more than the application's core concept, below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
A lot of details are set forth in the following description so that fully understand the utility model, but the utility model can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization without prejudice to the utility model intension in the situation that, and therefore the utility model is not subject to the restriction of following public specific embodiment.
Secondly; the utility model is described in detail in conjunction with schematic diagram; in the time that the utility model embodiment is described in detail in detail; for ease of explanation; the sectional view of indication device part structure can be disobeyed general ratio and be done local amplification; and described schematic diagram is example, it should not limit the scope of the utility model protection at this.In addition in actual fabrication, should comprise, the three-dimensional space of length, width and height.
Based on above-mentioned thought, the present embodiment provides a kind of above-mentioned semiconductor device detection temperature control equipment, and with reference to figure 1, this device comprises:
PTC heating plate 1, its principle be PTC thermistor to power up that rear self-heating heats up be that resistance enters transition district, its temperature is only relevant with its Curie temperature and impressed voltage, and substantially irrelevant with environment temperature, so adopt PTC heating plate as heat generating component, it is less that device is subject to the impact of external environment;
Be arranged on the aluminum heat-conducting plate 2 of described PTC heating plate 1 top, described aluminum heat-conducting plate 2 is support components of whole device, simultaneously for thermal field is evenly distributed, to reach homogeneous heating semiconductor devices to be detected;
Wherein, described PTC heating plate 1 can connect airtight by set bolt or by leading transcalent cementing agent with aluminum heat-conducting plate 2.Described in preferred the present embodiment, PTC heating plate 1 connects airtight by multiple lower set bolts 3 with aluminum heat-conducting plate 2, so that the replacing of parts.
While detection for semiconductor devices to be detected is switched on, with device electrical isolation, with the accuracy of guaranteeing to measure, described device also comprises the insulating heat-conductive film 4 being arranged on described aluminum heat-conducting plate 2.While entering semiconductor devices detection, semiconductor devices 5 to be detected is by one or multiple upper set bolt 6 is fixed on described insulating heat-conductive film 4 tops.
Concrete, the directly upper surface with described aluminum heat-conducting plate 2 epoxide-resin glue coating, forms described insulating heat-conductive film 4.
Described device is heated to detected temperatures by PTC heating plate 1 described in control module control by described semiconductor devices 5 to be detected, and gather the temperature value of described semiconductor devices 5 to be detected at detection-phase, and according to the heat production of PTC heating plate 1 described in described temperature value control, with the temperature stabilization that ensures described semiconductor devices to be detected 5 in described detected temperatures.
Described control module comprises:
Connect airtight the temperature sensor 7 on described insulating heat-conductive film 4, preferably, described temperature sensor 7 is for mounting thermistor, be attached at described insulating heat-conductive film 4 upper surfaces for gathering the temperature value of described insulating heat-conductive film 4, described insulating heat-conductive film 4 directly contacts with semiconductor devices 5 to be detected, and its surface temperature is the temperature of described semiconductor devices to be detected;
The temperature controller 8 being connected with described temperature sensor 7;
With the relay 9 that described temperature controller 8 is connected, described relay 9 provides power supply to described PTC electric hot plate 1, to control the heat production of described PTC electric hot plate 1.
Wherein, before detection that semiconductor devices 5 to be detected is switched on, can set initial heating temperature value by described temperature controller 8, semiconductor devices 5 to be detected is rapidly heated to its detected temperatures, and keep this temperature, in the time that semiconductor devices 5 energisings to be detected are detected to its output performance, described in described temperature sensor 7 continuous collecting, detect the temperature of semiconductor devices 5, the detected temperatures value comparison that described temperature controller 8 should have described temperature value and semiconductor devices to be detected 5, if the temperature value gathering is identical with described detected temperatures value, the control signal of output is constant, the control signal that received by the relay 9 of its control is constant, the magnitude of voltage that offers described PTC heating plate 1 is constant, if the temperature value gathering is greater than described detected temperatures value, corresponding the reducing of control signal that described temperature controller 8 is exported, thereby the control signal that received by the relay 9 of its control reduces, and then reduce to supply with the magnitude of voltage of described PTC heating plate 1, heat production is reduced, thereby reduce the temperature of semiconductor devices 5 to be detected, make it trend towards its detected temperatures, if the temperature value gathering is less than described detected temperatures value, the corresponding increase of control signal that described temperature controller 8 is exported, thereby increased by the control signal that the relay 9 of its control receives, and then the magnitude of voltage of described PTC heating plate 1 is supplied with in increase, heat production is increased, thereby improve the temperature of semiconductor devices 5 to be detected, make it trend towards its detected temperatures.Within described semiconductor devices to be detected 5 maintains a less scope of its detected temperatures dynamically and so forth, with the accuracy that ensures to measure.
It should be noted that above-described embodiment is a kind of preferred implementation of the present utility model, is not unique embodiment.As described in semiconductor devices 5 to be detected can be fixed by one or more shell fragments 10 that are fixed on aluminum heat-conducting plate 2, as shown in 2, in Fig. 2, miscellaneous part is identical with Fig. 1.
Known by foregoing description, semiconductor devices detection temperature control equipment described in the present embodiment, the temperature that can control semiconductor devices to be detected in the time measuring keeps dynamic stable within the scope of its detected temperatures, has guaranteed the accuracy of measuring.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims (9)

1. a semiconductor devices detection temperature control equipment, is characterized in that, comprising:
Heat generating component;
The heat-conducting plate that is arranged on described heat generating component top, described heat-conducting plate and described heat generating component connect airtight;
Be attached at the insulating heat-conductive film of described heat-conducting plate top;
Control module, described control module is used for controlling described heat generating component described semiconductor devices to be detected is heated to detected temperatures, and gather the temperature value of described semiconductor devices to be detected at detection-phase, and according to the heat production of heat generating component described in described temperature value control, with the temperature stabilization that ensures described semiconductor devices to be detected in described detected temperatures.
2. device according to claim 1, is characterized in that, described control module comprises:
Temperature sensor, described temperature sensor connects airtight in described insulating heat-conductive film upper surface for gathering the temperature value of described insulating heat-conductive film, and then obtains the temperature value of described semiconductor devices to be detected;
Temperature controller, described temperature controller is according to described temperature value output control signal;
Relay, described relay provides power supply to described heat generating component according to described control signal, to control the heat production of described heat generating component.
3. device according to claim 2, is characterized in that, described temperature sensor is for mounting thermistor.
4. device according to claim 1, is characterized in that, described heat generating component is PTC electric hot plate.
5. device according to claim 1, is characterized in that, described heat-conducting plate is aluminum heat-conducting plate.
6. device according to claim 1, is characterized in that, described heat generating component and described heat-conducting plate connect airtight by set bolt.
7. device according to claim 1, is characterized in that, described device, in the time described semiconductor devices to be detected being heated to detection, connects airtight semiconductor devices to be measured on described insulating heat-conductive film by set bolt.
8. device according to claim 1, is characterized in that, described device, in the time described semiconductor devices to be detected being heated to detection, connects airtight semiconductor devices to be measured on described insulating heat-conductive film by shell fragment.
9. install according to claim 1, it is characterized in that, described insulating heat-conductive film is epoxy resin glued membrane.
CN201420015876.9U 2014-01-10 2014-01-10 Temperature control device for detecting semiconductor device Active CN203689187U (en)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109144123A (en) * 2018-08-15 2019-01-04 王晓勇 A kind of semiconductor test temperature control equipment and control method
CN110261695A (en) * 2019-06-12 2019-09-20 深圳市江波龙电子股份有限公司 A kind of test device
CN110857893A (en) * 2018-08-23 2020-03-03 比亚迪股份有限公司 Temperature sensor working threshold detection device
CN110905720A (en) * 2019-12-10 2020-03-24 郑州爱因特电子科技有限公司 Operation control method, device, equipment and medium of wind driven generator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109144123A (en) * 2018-08-15 2019-01-04 王晓勇 A kind of semiconductor test temperature control equipment and control method
CN110857893A (en) * 2018-08-23 2020-03-03 比亚迪股份有限公司 Temperature sensor working threshold detection device
CN110261695A (en) * 2019-06-12 2019-09-20 深圳市江波龙电子股份有限公司 A kind of test device
CN110905720A (en) * 2019-12-10 2020-03-24 郑州爱因特电子科技有限公司 Operation control method, device, equipment and medium of wind driven generator

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