CN109144123A - A kind of semiconductor test temperature control equipment and control method - Google Patents

A kind of semiconductor test temperature control equipment and control method Download PDF

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Publication number
CN109144123A
CN109144123A CN201810926945.4A CN201810926945A CN109144123A CN 109144123 A CN109144123 A CN 109144123A CN 201810926945 A CN201810926945 A CN 201810926945A CN 109144123 A CN109144123 A CN 109144123A
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signal
module
temperature
temperature control
electrically output
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CN201810926945.4A
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Chinese (zh)
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王晓勇
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Priority to CN201810926945.4A priority Critical patent/CN109144123A/en
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a kind of semiconductor test temperature control equipments of semiconductor test technical field, the data acquisition module temperature control unit that electrically output connection handles temperature signal and feeds back, the central processing unit that the two-way electric connection of communication module is arranged and transmitted to processed temperature signal, the temperature control unit power governor that electrically output connection is adjusted output power, electrically output connects the drive module that driving compensation is carried out to temperature for the current transformer and voltage transformer, the driving does not open respectively electrically output connection and provides the cooler and heater of cooling function and heating function altogether, the cooler is connected with heat exchanger with heater, and the heat exchanger is arranged inside tester table, the real-time working temperature of tester table is controlled, made by thermal compensation With the condition that tester table can be promoted to be capable of providing semiconductor test, be conducive to the accuracy of test.

Description

A kind of semiconductor test temperature control equipment and control method
Technical field
The present invention relates to semiconductor test technical field, specially a kind of semiconductor test temperature control equipment and control Method.
Background technique
During producing the product of semiconductor device, it usually needs carry out various functions survey in multiple and different temperature Examination, such as temperature condition are 45 DEG C, 85 DEG C, 95 DEG C, 105 DEG C or 125 DEG C.Influence of the temperature for semiconductor is very significant, because This requires to control semiconductor test temperature in semiconductor test, but the prior art cannot in carrying out semiconductor test One metastable test condition of temperature is enough provided, the local environment of semiconductor can not be monitored in real time and be fed back, Real-time display is carried out to temperature, traditional temprature control method error is excessive, is not suitable for the precision measurements such as semiconductor test reality In testing, for this purpose, it is proposed that a kind of semiconductor test temperature control equipment and control method.
Summary of the invention
It is above-mentioned to solve the purpose of the present invention is to provide a kind of semiconductor test temperature control equipment and control method The problem of being proposed in background technique.
To achieve the above object, the invention provides the following technical scheme: a kind of semiconductor test temperature control equipment, packet Tester table is included, the temperature sensor detected to temperature, the temperature are nested on the table wall of the tester table Sensor electrically exports the data acquisition module of connection temperature collection signal, and the data acquisition module electrically exports connection to temperature The temperature control unit that degree signal is handled and fed back, the communication of the two-way electric connection transmitting signal of temperature control unit Module, the central processing unit that the two-way electric connection of communication module is arranged and transmitted to processed temperature signal, institute Stating central processing unit, electrically output connection carries out the display module of moment display to temperature and to system errors signal respectively The alarm module of Shi Jinhang alarm, the temperature control unit power regulation that electrically output connection is adjusted output power Device, the power governor electrically the output connection current transformer detected to electric current and detect voltage respectively Electrically output connects the driving mould that driving compensation is carried out to temperature for voltage transformer, the current transformer and voltage transformer Block, the driving does not open respectively electrically output connection and provides the cooler and heater of cooling function and heating function altogether, described Cooler is connected with heat exchanger with heater, and the heat exchanger is arranged inside tester table.
Preferably, the central processing unit includes the data reception module being acquired to processed temperature signal, institute Stating data reception module, electrically output connects the A/D conversion module that digital signal is converted to analog signal, the A/D modulus of conversion Electrically output connects the microprocessor for arrange to digital signal processing, A/D turns of connection of the microprocessor electrical property output to block Change the mold block, the signal output mould that the A/D conversion module signal that electrically microprocessor processes are crossed in output connection exports Block.
Preferably, the microprocessor is by semi-conductor silicon chip integrated processor, memory, counter and input, output Interface composition, and the microprocessor uses four groups of I/O interfaces.
Preferably, the display module includes the signal receiving module for receiving A/D modulus of conversion block transmission signals, described Electrically to the filter module for transmitting signal progress interference signal filtering, the filter module is electrical for output connection for signal receiving module Output connection display.
Preferably, the display is set as LED display, and light compensating lamp is provided on the outer wall of display screen.
Preferably, the alarm module includes that received signal acquisition mould is carried out to the virtual signal that central processing unit issues Block, the signal acquisition module signal processing module that electrically output connection handles signal, the signal processing module Electrically output connection alarm.
Preferably, the alarm includes a red diode and a green diode, and red diode and Huang Color diode electrically exports connection signal processing module.
Preferably, the cooler includes storing cold water and providing the water cooler of power, and the water cooler is electrically defeated The flowmeter detected to water flow is connected out.
Preferably, the heater includes the flow controller controlled water flow, and the flow controller is electrical The heating rod that water is heated in output connection.
Preferably, a kind of control method of semiconductor test temperature control equipment:
S1: being placed on tester table firstly the need of by semiconductor, then starts to be tested, during the test, temperature Sensor can carry out real-time monitoring to the temperature on tester table, and the signal detected can be adopted by data acquisition module Collection, is then transferred to temperature control unit;
S2: temperature control unit can be handled acquisition signal, can be compared by the temperature value set with original, difference is being closed It manages in range, then not will do it and act in next step, if difference is excessive, temperature control unit can control power governor and be done Function, in addition, temperature signal can be passed to central processing unit by communication module by temperature control unit, central processing unit is to signal After arrangement and digital-to-analogue conversion is carried out, then shows temperature value by display module;
S3: current transformer and voltage transformer can detect the output valve of power governor, prevent over-current phenomenon avoidance With over-voltage phenomenon, be conducive to improve the safety in circuit, the voltage and current of power governor output can promote drive module to mention For the driving voltage of cooler and heater, when tester table surface temperature is too low, heater can heat water, pass through The heat exchange action of heat exchanger can make the surface of tester table come back to original to set temperature value, when tester table surface temperature mistake Gao Shi, heater will not work, and cooler can drive the flowing of water by water cooler, so as to pass through the heat with heat exchanger Exchange interaction takes away heat, and the surface of tester table can be made to come back to original and set temperature value;
S4: when some link in system breaks down, temperature control unit can be passed error signal by communication module Central processing unit is passed, central processing unit can promote alarm module to alarm after receiving signal, while central controller meeting Stop all signal output, in order to check to whole system, avoids irremediable loss.
Compared with prior art, the beneficial effects of the present invention are:
1. the invention can monitor the temperature on tester table in real time by temperature sensor, and be controlled by temperature Unit controls the real-time working temperature of tester table, and semiconductor is damaged because temperature is excessively high during the test, or Person influences the test accuracy of semiconductor because temperature is too low, reduces the error that ensure that test temperature, is conducive to improve and survey Try accuracy;
2. the system is when tester table surface temperature is too low, heater can heat water, pass through the heat exchange of heat exchanger Acting on, which can make the surface of tester table come back to original, sets temperature value, and when tester table surface temperature is excessively high, heater is not Meeting work, cooler can drive the flowing of water by water cooler, so as to be taken away by the heat exchange action with heat exchanger Heat can make the surface of tester table come back to original and set temperature value, can promote tester table energy by thermal compensation effect The condition of semiconductor test is enough provided, the accuracy of test is conducive to;
3. can be intuitively observed to the temperature of tester table very much by display module, the setting filtering mould in display module The transmission precision of temperature signal can be improved in block, prevents the distortion of temperature signal, at the same also can guarantee signal transmission it is complete Property, interference is avoided the occurrence of, prevents test macro from misjudgment phenomenon occur.
Detailed description of the invention
Fig. 1 is operation principle schematic diagram of the present invention;
Fig. 2 is central processing unit block diagram representation of the present invention;
Fig. 3 is that the invention shows module frame chart schematic diagrames;
Fig. 4 is alarm module block diagram representation of the present invention;
Fig. 5 is cooler block diagram representation of the present invention;
Fig. 6 is heater block diagram representation of the present invention.
In figure: 1 tester table, 2 temperature sensors, 3 data acquisition modules, 4 temperature control units, 5 communication modules, in 6 Central processor, 601 data receptions, 602A/D conversion module, 603 microprocessors, 604 signal output modules, 7 display modules, 701 signal receiving modules, 702 filter modules, 703 displays, 8 alarm modules, 801 signal acquisition modules, 802 signal processing moulds It is block, 803 alarms, 9 power governors, 10 current transformers, 11 voltage transformers, 12 drive modules, 13 coolers, 1301 cold Water dispenser group, 1302 flowmeters, 14 heaters, 1401 flow controllers, 1402 heating rods, 15 heat exchangers.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Fig. 1-6 is please referred to, the present invention provides a kind of technical solution: a kind of semiconductor test temperature control equipment, including Tester table 1 is nested the temperature sensor 2 detected to temperature, temperature sensor 2 on the table wall of tester table 1 The electrically data acquisition module 3 of output connection temperature collection signal, data acquisition module 3 electrically output connection to temperature signal into The communication module 5 of signal, communication are transmitted in the temperature control unit 4 of row processing and feedback, the two-way electric connection of temperature control unit 4 The central processing unit 6 that the two-way electric connection of module 5 is arranged and transmitted to processed temperature signal, central processing unit 6 divide The report alarmed when not electrically output is connected to the display module 7 of temperature progress moment display and to system errors signal Alert module 8, the power governor 9 that electrically output connection is adjusted output power of temperature control unit 4, power governor 9 Electrically the output connection current transformer 10 that electric current is detected and the voltage transformer 11 that voltage is detected respectively, electricity Electrically output connects the drive module 12 that driving compensation is carried out to temperature for current transformer 10 and voltage transformer 11, and driving is not opened The electrical output connection of 12 difference provides the cooler 13 and heater 14 of cooling total function and heating function, cooler 13 and heating Device 14 is connected with heat exchanger 15, and heat exchanger 15 is arranged inside tester table 1.
Wherein, central processing unit 6 includes the data reception module 601 being acquired to processed temperature signal, data Electrically output connects the A/D conversion module 602 that digital signal is converted to analog signal, A/D conversion module to receiving module 601 602 electrically export the microprocessor 603 that connection arrange to digital signal processing, and electrically output connects A/D to microprocessor 603 Conversion module 602, the signal that electrically output connection exports the processed signal of microprocessor 603 of A/D conversion module 602 Output module 604, the analog signal that can be issued temperature control unit 4 by this set is by 602 turns of A/D conversion module It is changed to digital signal, convenient for being shown by display module 7;
The microprocessor 603 is made of semi-conductor silicon chip integrated processor, memory, counter and input, output interface, And the microprocessor 603 uses four groups of I/O interfaces, and the processing data of microprocessor 603 can be improved by this set Efficiency is conducive to the transmission rate of temperature signal, improves the real-time monitoring of temperature;
Display module 7 includes the signal receiving module 701 that signal is transmitted for receiving A/D conversion module 602, signal receiving module 701 electrical output connections carry out the filter module 702 of interference signal filtering to transmission signal, and the electrical output of filter module 702 connects Display 703 is connect, very intuitively the temperature of tester table 1 can be observed by this set, while can also understand The situation of change of temperature;
Display 703 is set as LED display, and light compensating lamp is provided on the outer wall of display screen, can be mentioned by this set Height is conducive to observation of the observer to data to the light filling effect of display 703;
Alarm module 8 includes carrying out received signal acquisition module 801 to the virtual signal that central processing unit 6 issues, and signal is adopted The signal processing module 802 that electrically output connection handles signal of collection module 801, the electrically output of signal processing module 802 Alarm 803 is connected, can be alarmed in time the error signal occurred in system by this set, in order to entire System is checked, and irremediable loss is avoided;
Alarm 803 includes a red diode and a green diode, and red diode and green diode are electric Property output connection signal processing module 802, the visual effect of observer can be increased by this set, can timely be found Problem attracts the attention of observer;
Cooler 13 includes storage cold water and provides the water cooler 1301 of power, and water cooler 1301 electrically exports connection to water The flowmeter 1302 that flow is detected is convenient for providing whole system cooling effect by this set, avoids semiconductor It is damaged during the test because temperature is excessively high, while being also beneficial to the accuracy of semiconductor test;
Heater 14 includes the flow controller 1401 controlled water flow, the electrically output connection pair of flow controller 1401 The heating rod 1402 that water is heated can be provided by heater 14 when 1 temperature of tester table is too low by this set Thermal compensation avoids influencing the test accuracy of semiconductor because temperature is too low, convenient for reducing test error.
A kind of control method of semiconductor test temperature control equipment:
S1: being placed on tester table 1 firstly the need of by semiconductor, then starts to be tested, during the test, temperature Sensor 2 can carry out real-time monitoring to the temperature on tester table 1, and the signal detected can be carried out by data acquisition module 3 Acquisition, is then transferred to temperature control unit 4;
S2: temperature control unit 4 can be handled acquisition signal, can be compared by the temperature value set with original, difference exists In zone of reasonableness, then it not will do it and act in next step, if difference is excessive, temperature control unit 4 can control the progress of power governor 9 Acting, in addition, temperature signal can be passed to central processing unit 6, central processing unit 6 by communication module 5 by temperature control unit 4 After arranging to signal and digital-to-analogue conversion is carried out, then shows temperature value by display module 7;
S3: current transformer 10 and voltage transformer 11 can detect the output valve of power governor 9, prevent overcurrent Phenomenon and over-voltage phenomenon are conducive to improve the safety in circuit, and the voltage and current that power governor 9 exports can promote to drive mould Block 12 provides the driving voltage of cooler 13 and heater 14, and when 1 surface temperature of tester table is too low, heater 14 can be to water It is heated, the surface of tester table 1 can be made to come back to original by the heat exchange action of heat exchanger 15 and set temperature value, work as survey When 1 surface temperature of commissioning stage is excessively high, heater 14 will not work, and cooler 13 can drive the stream of water by water cooler 1301 It is dynamic, so as to take away heat by the heat exchange action with heat exchanger 15, the surface of tester table 1 can be made to come back to original If temperature value;
S4: when some link in system breaks down, error signal can be passed through communication module 5 by temperature control unit 4 Central processing unit 6 is passed to, central processing unit 6 can promote alarm module 8 to alarm after receiving signal, while center control Device 6 can stop all signal output, in order to check to whole system, avoid irremediable loss.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding And modification, the scope of the present invention is defined by the appended.

Claims (10)

1. a kind of semiconductor test temperature control equipment, including tester table (1), it is characterised in that: the tester table (1) Table wall on be nested the temperature sensor (2) detected to temperature, the temperature sensor (2) electrically output connection The data acquisition module (3) of temperature collection signal, electrically output connects to temperature signal the data acquisition module (3) The temperature control unit (4) of reason and feedback, the communication module of the two-way electric connection transmitting signal of temperature control unit (4) (5), the central processing unit that the two-way electric connection of the communication module (5) is arranged and transmitted to processed temperature signal (6), electrically output connection carries out the display module (7) of moment display to temperature and to system the central processing unit (6) respectively There is the alarm module (8) alarmed when error signal, electrically output is connected to output power the temperature control unit (4) The power governor (9) being adjusted, the power governor (9) electric current that electrically output connection detects electric current respectively Mutual inductor (10) and the voltage transformer (11) that voltage is detected, the current transformer (10) and voltage transformer (11) The drive module (12) that connection carries out driving compensation to temperature is electrically exported, (12) are not opened in the driving, and electrical output connects respectively It connects and the cooler (13) and heater (14) of cooling function and heating function altogether, the cooler (13) and heater (14) is provided It is connected with heat exchanger (15), and the heat exchanger (15) setting is internal in tester table (1).
2. a kind of semiconductor test temperature control equipment according to claim 1, it is characterised in that: the central processing Device (6) includes the data reception module (601) being acquired to processed temperature signal, the data reception module (601) Electrically output connection is converted to the A/D conversion module (602) of digital signal, A/D conversion module (602) electricity to analog signal Property output connection arrange to digital signal the microprocessor (603) of processing, the microprocessor (603) electrically output connection A/D conversion module (602), electrically output is connected microprocessor (603) processed signal the A/D conversion module (602) The signal output module (604) exported.
3. a kind of semiconductor test temperature control equipment according to claim 2, it is characterised in that: the microprocessor (603) it is made of semi-conductor silicon chip integrated processor, memory, counter and input, output interface, and the microprocessor (603) four groups of I/O interfaces are used.
4. a kind of semiconductor test temperature control equipment according to claims 1 and 2, it is characterised in that: the display Module (7) includes the signal receiving module (701) for receiving A/D conversion module (602) transmission signal, and the signal receives mould Electrically output connects the filter module (702) that interference signal filtering is carried out to transmission signal, the filter module to block (701) (702) electrically output connection display (703).
5. a kind of semiconductor test temperature control equipment according to claim 4, it is characterised in that: the display (703) it is set as LED display, and is provided with light compensating lamp on the outer wall of display screen.
6. a kind of semiconductor test temperature control equipment according to claim 1, it is characterised in that: the alarm module It (8) include that received signal acquisition module (801) are carried out to the virtual signal that central processing unit (6) issue, the signal acquisition Module (801) signal processing module (802) that electrically output connection handles signal, the signal processing module (802) Electrically output connection alarm (803).
7. a kind of semiconductor test temperature control equipment according to claim 6, it is characterised in that: the alarm It (803) include a red diode and a green diode, and electrically output connects for red diode and green diode Connect signal processing module (802).
8. a kind of semiconductor test temperature control equipment according to claim 1, it is characterised in that: the cooler It (13) include storing cold water and the water cooler (1301) of power being provided, electrically output is connected to water the water cooler (1301) The flowmeter (1302) that flow is detected.
9. a kind of semiconductor test temperature control equipment according to claim 1, it is characterised in that: the heater It (14) include the flow controller (1401) controlled water flow, the flow controller (1401) electrically output connection pair The heating rod (1402) that water is heated.
10. a kind of control method of semiconductor test temperature control equipment, it is characterised in that:
S1: being placed on tester table (1) firstly the need of by semiconductor, then start to be tested, during the test, temperature Real-time monitoring can be carried out to the temperature on tester table (1) by spending sensor (2), and the signal detected can pass through data acquisition module (3) it is acquired, is then transferred to temperature control unit (4);
S2: temperature control unit (4) can be handled acquisition signal, can be compared by the temperature value set with original, difference In the reasonable scope, then it not will do it and act in next step, if difference is excessive, temperature control unit (4) can control power governor (9) it does work, in addition, temperature signal can be passed to central processing unit by communication module (5) by temperature control unit (4) (6), after central processing unit (6) arranges signal and digital-to-analogue conversion is carried out, then shows temperature value by display module (7) Come;
S3: current transformer (10) and voltage transformer (11) can detect the output valve of power governor (9), prevent out Existing over-current phenomenon avoidance and over-voltage phenomenon are conducive to improve the safety in circuit, and the voltage and current of power governor (9) output can promote Drive module (12) are made to provide the driving voltage of cooler (13) and heater (14), surface temperature is too low when tester table (1) When, heater (14) can heat water, and the surface of tester table (1) can be made by the heat exchange action of heat exchanger (15) It comes back to original and sets temperature value, when tester table (1) surface temperature is excessively high, heater (14) will not work, cooler (13) The flowing of water can be driven, by water cooler (1301) so as to take away heat by the heat exchange action with heat exchanger (15) Amount, can make the surface of tester table (1) come back to original and set temperature value;
S4: when some link in system breaks down, error signal can be passed through communication module by temperature control unit (4) (5) it passes to central processing unit (6), central processing unit (6) can promote alarm module (8) to alarm after receiving signal, together When central controller (6) all signal outputs can be stopped, in order to be checked to whole system, avoiding irretrievable Loss.
CN201810926945.4A 2018-08-15 2018-08-15 A kind of semiconductor test temperature control equipment and control method Pending CN109144123A (en)

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CN201810926945.4A CN109144123A (en) 2018-08-15 2018-08-15 A kind of semiconductor test temperature control equipment and control method

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CN201810926945.4A CN109144123A (en) 2018-08-15 2018-08-15 A kind of semiconductor test temperature control equipment and control method

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110940910A (en) * 2019-12-17 2020-03-31 广东利扬芯片测试股份有限公司 Carrying disc cooling system and wafer testing equipment
CN112765859A (en) * 2021-01-27 2021-05-07 胜达克半导体科技(上海)有限公司 Temperature management method based on automatic testing machine

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CN203689187U (en) * 2014-01-10 2014-07-02 科达半导体有限公司 Temperature control device for detecting semiconductor device
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CN104197408A (en) * 2014-08-08 2014-12-10 浙江大铭新材料股份有限公司 Electric heating system with direct-current power regulator
KR101695906B1 (en) * 2015-03-18 2017-01-12 티오에스주식회사 apparatus for controlling temperature, tester including the same
CN207541512U (en) * 2017-10-18 2018-06-26 浙江悦居智能科技股份有限公司 A kind of wireless temperature TT&C system

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Publication number Priority date Publication date Assignee Title
CN103631283A (en) * 2012-08-22 2014-03-12 华邦电子股份有限公司 Semiconductor device and temperature control method thereof and test system
CN203689187U (en) * 2014-01-10 2014-07-02 科达半导体有限公司 Temperature control device for detecting semiconductor device
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Publication number Priority date Publication date Assignee Title
CN110940910A (en) * 2019-12-17 2020-03-31 广东利扬芯片测试股份有限公司 Carrying disc cooling system and wafer testing equipment
CN112765859A (en) * 2021-01-27 2021-05-07 胜达克半导体科技(上海)有限公司 Temperature management method based on automatic testing machine
CN112765859B (en) * 2021-01-27 2024-02-06 胜达克半导体科技(上海)股份有限公司 Temperature management method based on automatic testing machine

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Application publication date: 20190104