CN108317768A - The active cooling systems of downhole spectrometer - Google Patents

The active cooling systems of downhole spectrometer Download PDF

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Publication number
CN108317768A
CN108317768A CN201711499466.0A CN201711499466A CN108317768A CN 108317768 A CN108317768 A CN 108317768A CN 201711499466 A CN201711499466 A CN 201711499466A CN 108317768 A CN108317768 A CN 108317768A
Authority
CN
China
Prior art keywords
cooling systems
heat
active cooling
refrigeration mechanism
downhole spectrometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711499466.0A
Other languages
Chinese (zh)
Inventor
沈阳
孔笋
张小康
牛朋
张彬奇
余涵
侯冠中
邢仁东
李国梁
陈运河
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Oilfield Services Ltd
China National Offshore Oil Corp CNOOC
Original Assignee
China Oilfield Services Ltd
China National Offshore Oil Corp CNOOC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Oilfield Services Ltd, China National Offshore Oil Corp CNOOC filed Critical China Oilfield Services Ltd
Priority to CN201711499466.0A priority Critical patent/CN108317768A/en
Publication of CN108317768A publication Critical patent/CN108317768A/en
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Abstract

Disclose a kind of active cooling systems of downhole spectrometer herein, including shell, setting vacuum flask inside the housing and the refrigeration mechanism that is arranged in vacuum flask;The bottle mouth position of the vacuum flask is provided with thermal insulation layer, cavity between the refrigeration mechanism and thermal insulation layer is for loading spectrometer, the first end of the refrigeration mechanism is used to be close to the image-forming block of spectrometer, and the cavity between the second end and bottom of bottle of the refrigeration mechanism is filled with heat-absorbing body.

Description

The active cooling systems of downhole spectrometer
Technical field
This application involves but be not limited to oil exploration technology field, the active refrigeration system of especially a kind of downhole spectrometer System.
Background technology
Spectral analysis module is a function module of earth layer measuring instrument, utilizes the light absorption by the module fluid Characteristic analyzes the constitutive property and content of downhole fluid in real time, and guarantee is provided for the accurate sampling of earth layer measuring instrument.
Currently, downhole spectrometer needs work long hours in high temperature hole condition.If the space environment residing for spectrometer is super Certain temperature is crossed, the optical device of spectrometer can fail or permanent damages.In addition, CCD (the Charge-coupled of spectrometer Device, charge coupled cell) spectrum atlas that can just collect at low temperature of imaging system, temperature, which increases, can cause it dark Electric current exponentially grade increases, to obtain the spectrogram that noise is more than script information so that gathered data is unavailable.
Invention content
The technical issues of the application solves is to provide a kind of active cooling systems of downhole spectrometer, can effectively overcome existing Have the defects of technology, enable to downhole spectrometer can in high temperature external environment (175 DEG C) long-time works fine.
In order to solve the above technical problems, this application provides a kind of active cooling systems of downhole spectrometer, including shell, The refrigeration mechanism that vacuum flask inside the housing is set and is arranged in vacuum flask;
The bottle mouth position of the vacuum flask is provided with thermal insulation layer, and the cavity between the refrigeration mechanism and thermal insulation layer is for loading Spectrometer, the first end of the refrigeration mechanism are used to be close to the image-forming block of spectrometer, the second end and bottle of the refrigeration mechanism Cavity between bottom is filled with heat-absorbing body.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
Heat-conducting mechanism is also filled between the refrigeration mechanism and heat-absorbing body, the second end of the refrigeration mechanism is close to institute State heat-conducting mechanism.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
The refrigeration mechanism includes semiconductor chilling plate.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
Heat Conduction Material coating is provided on the end face of the second end of the refrigeration mechanism.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
The refrigeration mechanism is also associated with control circuit, and the control circuit is used to control the cryogenic temperature of refrigeration mechanism.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
Temperature sensor is additionally provided in the vacuum flask, the temperature sensor is connect with control circuit.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
The shell is set as bearing shell.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
The heat-absorbing body includes alloy heat sink material.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
The thermal insulation layer includes heat-barrier material.
The active cooling systems of above-mentioned downhole spectrometer can also have following features,
The heat-conducting mechanism includes Heat Conduction Material.
The application above-mentioned technical proposal has the advantages that:
Compared with the prior art, the active cooling systems of above-mentioned downhole spectrometer provided by the present application have it is heat-insulated it is good, lead The features such as hot fast, semiconductor refrigerating effect is good, can ensure that spectrometer has excellent working performance in the hot environment of underground.
Other features and advantage will illustrate in the following description, also, partly become from specification It obtains it is clear that being understood by implementing the embodiment of the present invention.The purpose of the application and other advantages can be by illustrating Specifically noted structure is realized and is obtained in book, claims and attached drawing.
Description of the drawings
Attached drawing is used for providing further understanding technical scheme, and a part for constitution instruction, with this The embodiment of application is used to explain the technical solution of the application together, does not constitute the limitation to technical scheme.
Fig. 1 is the structural schematic diagram of the embodiment of the present invention one;
It illustrates:
1- shells, 2- vacuum flask, 3- heat-absorbing bodies, 4- heat-conducting mechanisms, 5- refrigeration mechanisms, 6- spectrometers, 7- thermal insulation layers.
Specific implementation mode
Embodiments herein is described in detail below in conjunction with attached drawing.It should be noted that not conflicting In the case of, the features in the embodiments and the embodiments of the present application mutually can be combined arbitrarily.
Embodiment one:
In conjunction with shown in Fig. 1, the embodiment of the present invention one provides a kind of active cooling systems of downhole spectrometer, including shell The refrigeration mechanism 5 that 1, vacuum flask 2 inside shell 1 is set and be arranged in vacuum flask 2;The bottle mouth position of vacuum flask 2 is arranged There is thermal insulation layer 7, the cavity between refrigeration mechanism 5 and thermal insulation layer 7 is for loading spectrometer 6, and the first end of refrigeration mechanism 5 is for tight The image-forming block for pasting spectrometer 6, the cavity between the second end and bottom of bottle of refrigeration mechanism 5 are filled with heat-absorbing body 3.
In concrete operations, by the setting of above-mentioned refrigeration mechanism 5, can effectively it control at the CCD image-forming blocks of spectrometer 6 Temperature, can be realized by refrigeration mechanism 5 for heat at CCD image-forming blocks and quickly conduct and be transferred at heat-absorbing body 3, with Reach that space interior temperature is uniform, can effectively avoid spectrometer 6 optical device will not because of hot-spot and performance declines Or damage;Above-mentioned thermal insulation layer 7 include heat-barrier material, can by the setting of above-mentioned thermal insulation layer 7, can effectively obstruct external heat source into Enter 6 working space of spectrometer.
In the present embodiment, Heat Conduction Material coating is provided on the end face of the second end of above-mentioned refrigeration mechanism 5.
In concrete operations, the quick transmission operation of heat, Neng Goujin by the setting of above-mentioned Heat Conduction Material coating, can be realized One step ensures the imaging effect of the CCD image-forming blocks of spectrometer 6
In the present embodiment, refrigeration mechanism 5 includes semiconductor chilling plate.
In concrete operations, the Refrigeration Technique of semiconductor chilling plate can make 6 imaging system temperature of spectrometer compare working space Low 40 DEG C or so of temperature so that 6 imaging effect of spectrometer is best, and noise is minimum.
In the present embodiment, it is also filled with heat-conducting mechanism 4 between refrigeration mechanism 5 and heat-absorbing body 3, the second of refrigeration mechanism 5 It is close to heat-conducting mechanism 4 in end.
In concrete operations, above-mentioned heat-absorbing body 3 includes alloy heat sink material, the preferably alloy of low melting point, high specific heat capacity Material, above-mentioned heat-absorbing material can largely absorb heat, so that the control for a long time of the temperature of entire vacuum flask 2 is in heat-absorbing material Near melting temperature.In addition, above-mentioned heat-conducting mechanism 4 includes Heat Conduction Material, the setting of above-mentioned heat-conducting mechanism 4 can be further It improves and goes back heat conduction efficiency between refrigeration mechanism 5 and heat-absorbing body 3, and then can speed up and realize that the temperature of inner space is uniform Property.
In the present embodiment, above-mentioned refrigeration mechanism 5 is also associated with control circuit, and control circuit is for controlling refrigeration mechanism 5 Cryogenic temperature.
In concrete operations, when spectrometer 6 works under the hot environment of underground, in order to make the dark electricity of 6 optical device of spectrometer Stream and imaging noise are as small as possible, can select suitable temperature control control system according to the temperature in vacuum flask 2;It can be by controlling electricity Road starts semiconductor chilling plate, and selection needs the temperature controlled at this time.Spectrometer 6 worked after a period of time, semiconductor chilling plate First end temperature rise, be arranged second end Heat Conduction Material coating can rapidly by these heat transfers to heat-absorbing body 3, To keep the temperature equalization in entire vacuum flask 2.
Preferably, it is additionally provided with temperature sensor in vacuum flask 2, temperature sensor is connect with control circuit.
In concrete operations, the real-time prison of the temperature in vacuum flask 2 can be realized by the setting of above-mentioned temperature sensor It surveys, and then necessary reference data is provided for the control of subsequent temperature.
In the present embodiment, above-mentioned shell 1 is set as bearing shell.
In concrete operations, above-mentioned bearing shell being capable of stable structure of the effective protection whole system under down-hole high pressure environment Property, the service life and operational reliability of whole system can be effectively improved.
Active cooling systems in the present embodiment enable to the continuous work more than 20 under 175 DEG C of hole condition of spectrometer 6 small When, it can effectively meet job requirements.
In the description of the present application, term " setting ", " connected ", " connection ", " fixation " etc. shall be understood in a broad sense, example Such as, " connection " may be fixed connection or may be dismantle connection, or integral connection;It can be directly connected, it can also Indirectly connected through an intermediary.For the ordinary skill in the art, above-mentioned art can be understood as the case may be The concrete meaning of language in this application.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc. Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the application It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with Suitable mode combines.
Although those skilled in the art should be understood that the embodiment disclosed by the embodiment of the present invention is as above, described The content only embodiment of the present invention and the embodiment that uses for ease of understanding, be not limited to the embodiment of the present invention.It is any Technical staff in fields of the embodiment of the present invention, in the premise for not departing from the spirit and scope disclosed by the embodiment of the present invention Under, any modification and variation, but the scope of patent protection of the embodiment of the present invention can be carried out in the form and details of implementation, Still it should be subject to the scope of the claims as defined in the appended claims.

Claims (10)

1. a kind of active cooling systems of downhole spectrometer, which is characterized in that including shell, the vacuum flask of setting inside the housing And the refrigeration mechanism being arranged in vacuum flask;
The bottle mouth position of the vacuum flask is provided with thermal insulation layer, and the cavity between the refrigeration mechanism and thermal insulation layer is for loading spectrum Instrument, the first end of the refrigeration mechanism are used to be close to the image-forming block of spectrometer, the second end and bottom of bottle of the refrigeration mechanism it Between cavity be filled with heat-absorbing body.
2. the active cooling systems of downhole spectrometer according to claim 1, which is characterized in that
Heat-conducting mechanism is also filled between the refrigeration mechanism and heat-absorbing body, the second end of the refrigeration mechanism is close to described lead Heat engine structure.
3. the active cooling systems of downhole spectrometer according to claim 1 or 2, which is characterized in that
The refrigeration mechanism includes semiconductor chilling plate.
4. the active cooling systems of downhole spectrometer according to claim 3, which is characterized in that
Heat Conduction Material coating is provided on the end face of the second end of the refrigeration mechanism.
5. the active cooling systems of downhole spectrometer according to claim 1 or 2, which is characterized in that
The refrigeration mechanism is also associated with control circuit, and the control circuit is used to control the cryogenic temperature of refrigeration mechanism.
6. the active cooling systems of downhole spectrometer according to claim 5, which is characterized in that
Temperature sensor is additionally provided in the vacuum flask, the temperature sensor is connect with control circuit.
7. the active cooling systems of downhole spectrometer according to claim 1 or 2, which is characterized in that
The shell is set as bearing shell.
8. the active cooling systems of downhole spectrometer according to claim 1 or 2, which is characterized in that
The heat-absorbing body includes alloy heat sink material.
9. the active cooling systems of downhole spectrometer according to claim 1 or 2, which is characterized in that
The thermal insulation layer includes heat-barrier material.
10. the active cooling systems of downhole spectrometer according to claim 2, which is characterized in that
The heat-conducting mechanism includes Heat Conduction Material.
CN201711499466.0A 2017-12-29 2017-12-29 The active cooling systems of downhole spectrometer Pending CN108317768A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711499466.0A CN108317768A (en) 2017-12-29 2017-12-29 The active cooling systems of downhole spectrometer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711499466.0A CN108317768A (en) 2017-12-29 2017-12-29 The active cooling systems of downhole spectrometer

Publications (1)

Publication Number Publication Date
CN108317768A true CN108317768A (en) 2018-07-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109323482A (en) * 2018-10-24 2019-02-12 中国石油天然气集团有限公司 Semiconductor cooler and its refrigeration control method

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US20140084783A1 (en) * 2012-07-18 2014-03-27 Intematix Corporation Red-emitting nitride-based calcium-stablized phosphors
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Publication number Priority date Publication date Assignee Title
CN202506405U (en) * 2012-04-19 2012-10-31 南京国电环保科技有限公司 Constant-temperature box for miniature optical-fiber spectrometer
JP2013228211A (en) * 2012-04-24 2013-11-07 Shimadzu Corp Mass spectroscope and mass spectroscopic method
US20140084783A1 (en) * 2012-07-18 2014-03-27 Intematix Corporation Red-emitting nitride-based calcium-stablized phosphors
CN204679166U (en) * 2015-05-20 2015-09-30 郝俊 A kind of humidity control system of spectroanalysis instrument light source
CN105823272A (en) * 2016-03-16 2016-08-03 王少斌 Refrigerating device for downhole instruments
CN205980426U (en) * 2016-06-08 2017-02-22 西安威尔罗根能源科技有限公司 Logging instrument electronic refrigerating device in pit

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109323482A (en) * 2018-10-24 2019-02-12 中国石油天然气集团有限公司 Semiconductor cooler and its refrigeration control method
CN109323482B (en) * 2018-10-24 2020-08-11 中国石油天然气集团有限公司 Semiconductor refrigerator and refrigeration control method thereof

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Application publication date: 20180724