CN112345982B - Circuit element welding condition detection method and device - Google Patents
Circuit element welding condition detection method and device Download PDFInfo
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- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
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Abstract
The application discloses a method and a device for detecting welding conditions of circuit elements. The method comprises the following steps: a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected to form a detection passage; acquiring actual voltage drops of two ends of a sampling resistor in a detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the condition of normal welding of two pins to be detected and recording the theoretical voltage drops as reference voltages; comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold, obtaining a detection result of normal welding conditions between two pins to be detected, otherwise obtaining a detection result of abnormal welding conditions. By the detection method, the detection accuracy, the detection efficiency and the product yield of the welding condition of the element pins can be improved, and the manual detection and rework cost is reduced.
Description
Technical Field
The application relates to the technical field of circuit detection, in particular to a method and a device for detecting welding conditions of circuit elements.
Background
With the development of the age, the earphone is not only a practical tool for talking and listening to music, but also gradually becomes a fashionable wearing ornament. In recent years, TWS (True Wireless Stereo, truly wireless stereo) headphones have become popular due to their portability, fashion, etc., and along with miniaturization of headphones, there is also a higher demand for packaging various components inside the headphones, and it is required to satisfy performance while occupying a small space, so that compact components are often used.
Because the pitch between Pin pins of the compact element is smaller, the Pin pins are difficult to weld, and the phenomena of cold joint, tin connection and the like often occur. The cold joint is a common line fault, and has two production conditions, namely an unstable state caused by improper production process and when the joint is open; the other is a part with serious heating after long-term use of the electric appliance, and the welding spots at the welding feet of the part are extremely easy to be aged and peeled. The tin connection means that two or more welding spots are connected together by solder, and the reason for the generation may be that the preheating temperature is insufficient to cause the element to fail to reach the temperature, and the tin connection is formed due to poor tin dragging caused by large heat absorption of the element in the welding process; it is also possible that the temperature of the tin furnace is low or that the soldering speed is too fast. Tin connection often causes short circuit phenomena, resulting in abnormal function of the device.
The abnormal connection condition of the two element pins is difficult to detect by the existing optical detection equipment, so that the reject ratio of the final earphone is high.
Disclosure of Invention
In view of the above, the main objective of the present application is to provide a method and a device for detecting the welding condition of a circuit element, which are used for solving the technical problem of poor detection effect of the method for detecting the welding condition of the circuit element in the prior art.
According to a first aspect of the present application, there is provided a method for detecting a soldering condition of a circuit element, including:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected to form a detection path;
acquiring actual voltage drops of two ends of the sampling resistor in the detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path and recording the theoretical voltage drops as reference voltages under the condition of normal welding of the two pins to be detected;
comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold, obtaining a detection result of normal welding conditions between the two pins to be detected, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold, obtaining a detection result of abnormal welding conditions between the two pins to be detected.
According to a second aspect of the present application, there is provided a circuit element welding condition detection device, including an interface unit, a detection unit, a reference input unit, and a control unit: wherein,,
the interface unit comprises two connecting terminals for connecting two pins to be detected of the circuit element;
the detection unit comprises a sampling resistor, wherein the sampling resistor is connected with two connecting terminals of the interface unit in series, constant current is input from one pin to be detected, and sequentially flows through the sampling resistor and the other pin to be detected to form a detection passage, and the detection unit is used for acquiring actual voltage drops of two ends of the sampling resistor in the detection passage and outputting the actual voltage drops as sampling voltages to the control unit;
the reference input unit is used for acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the condition of normal welding of the two pins to be detected, and outputting the theoretical voltage drops as reference voltages to the control unit;
and the control unit is used for comparing the sampling voltage with the reference voltage value, if the difference value of the sampling voltage and the reference voltage value is within a preset voltage difference value threshold, a detection result of normal welding conditions between the two pins to be detected is obtained, and if the difference value of the sampling voltage and the reference voltage value is greater than the preset voltage difference value threshold, a detection result of abnormal welding conditions between the two pins to be detected is obtained.
According to a third aspect of the present application, there is provided an electronic device comprising: a processor, a memory storing computer executable instructions,
the executable instructions, when executed by the processor, implement the aforementioned circuit element welding condition detection method.
According to a fourth aspect of the present application, there is provided a computer readable storage medium storing one or more programs which, when executed by a processor, implement the aforementioned circuit element soldering condition detection method.
The beneficial effects of this application are:
according to the circuit element welding condition detection method, the sampling resistor is connected in series between the two pins to be detected of the circuit element, a constant current is introduced from one of the pins to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected, so that a detection path can be formed, and a fixed voltage drop can be conveniently obtained at two ends of the sampling resistor in the follow-up process; and whether a current loop is formed between the two pins to be detected is determined by acquiring actual voltage drops of the two ends of the sampling resistor in the detection passage, the actual voltage drops are compared with theoretical voltage drops of the two ends of the sampling resistor in the detection passage under the condition of normal welding of the two pins to be detected, if the difference value of the actual voltage drops is within a preset voltage difference value threshold, the welding condition between the two pins to be detected is normal, and if the difference value of the actual voltage drops is greater than the preset voltage difference value threshold, the abnormal welding condition between the two pins to be detected is indicated. According to the embodiment of the application, the detection accuracy, the detection efficiency and the product yield of the welding condition of the pins of the compact circuit element can be improved through the detection method, and the manual detection and the reworking cost are reduced.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a diagram showing an example of packaging of a connector for headphones according to the prior art;
FIG. 2 is a flow chart of a method for detecting a soldering condition of a circuit element according to an embodiment of the present application;
FIG. 3 is a schematic circuit diagram of a method for detecting soldering conditions of circuit elements according to one embodiment of the present application;
FIG. 4 is a block diagram of a circuit element welding condition detection device according to one embodiment of the present application;
FIG. 5 is a block diagram of a circuit element welding condition detection device according to another embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein.
As shown in fig. 1, a packaging example diagram of a connector for headphones is provided, and two adjacent Pin pins have a pitch of 0.4mm and are compact elements. When the pins are soldered, the pads on the corresponding printed circuit board (Printed circuit boards, abbreviated as PCB) board have too small a distance between the two Pin pins due to the small size, so that the following abnormal conditions easily occur:
1) After a Pin bonding pad is not plated with tin, the Pin of the element is not contacted with a circuit board or is not contacted well after the bonding, so that the problem of poor electrical connectivity is caused;
2) In the process of pasting, tin on a plurality of Pin pins are connected together, so that the problem of abnormal functions caused by communication short circuit among Pin pins after pasting is caused.
Based on this, the embodiment of the present application proposes a method for detecting a welding condition of a circuit element, fig. 2 shows a flow chart of the method for detecting a welding condition of a circuit element according to one embodiment of the present application, and referring to fig. 2, the method for detecting a welding condition of a circuit element according to the embodiment of the present application includes the following steps S210 to S230:
in step S210, a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected, and flows through the sampling resistor and the other pin to be detected in sequence, so as to form a detection path.
If before, because the distance between its adjacent pins is less, the phenomenon that even tin short circuit appears very easily when welding, and because portable equipment such as circuit element volume that sets up inside such as earphone is less, the dissimilar virtual welding phenomenon of welding still can appear in the pin when welding, therefore the circuit element welding condition detection method of this application embodiment mainly is applied to the welding condition detection to the compact element, of course, the person skilled in the art also can be according to actual need with this application scheme suitable expansion to other bigger or non-compact circuit element's detection in, do not do the specific limitation here.
In order to detect the connection condition between two adjacent pins to be detected, the embodiment of the application designs a detection passage, in the detection passage, a sampling resistor is connected in series between the two pins to be detected, a constant current is introduced from one of the pins to be detected, the constant current sequentially flows through two ends of the sampling resistor and the other pin to be detected, and the purpose of adopting the constant current is to obtain voltage drops fixed at two ends of the sampling resistor for follow-up comparison, so that the follow-up comparison is facilitated, and the detection accuracy is improved.
Step S220, the actual voltage drop of the two ends of the sampling resistor in the detection path is obtained and recorded as the sampling voltage, and the theoretical voltage drop of the two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected is obtained and recorded as the reference voltage.
In the case of a specific detection, the actual voltage drop across the sampling resistor may be measured in the detection path, and this actual voltage drop may be referred to herein as the sampling voltage for ease of understanding. In addition, in order to determine the connection condition of the detection path, that is, determine the welding condition between the two pins to be detected, it is also necessary to obtain the theoretical voltage drop of the two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected, which can be recorded as the reference voltage here, as the comparison basis. The normal soldering condition here may include a condition where two pins to be tested should be connected or should not be connected.
Step S230, comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within the preset voltage difference value threshold, obtaining a detection result of normal welding conditions between the two pins to be detected, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold, obtaining a detection result of abnormal welding conditions between the two pins to be detected.
After the actually detected sampling voltage and the reference voltage under the normal welding condition are obtained, comparing the two voltage values and calculating the difference value of the two voltage values, if the difference value of the two voltage values is smaller than or equal to a preset voltage difference value threshold, namely the difference value is within an acceptable range, the connection between the two pins to be detected can be considered to be in accordance with the normal welding condition, and if the difference value of the two voltage values is larger than the preset voltage difference value threshold, the connection between the two pins to be detected is considered to be not in accordance with the normal welding condition, so that the detection result of the final circuit element welding condition can be obtained. The preset voltage difference threshold can be flexibly set according to actual detection requirements, and the smaller the value is, the higher the accuracy requirement on the detection result is.
According to the embodiment of the application, the detection accuracy, the detection efficiency and the product yield of the welding condition of the pins of the circuit element can be improved through the detection method, and the manual detection and the reworking cost are reduced.
In one embodiment of the present application, the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
The sampling resistor of the embodiment of the application can be an adjustable resistor with the resistance value adjustable according to actual detection requirements, and can be further suitable for detection of various circuit elements. Specifically, the resistance of the sampling resistor to be set can be determined according to the pin to be detected of the circuit element, the resistance of the adjustable resistor is adjusted to the corresponding resistance in advance and fixed before detection, and the current is constant, so that the resistance is also determined after the pin to be detected is determined, the voltage drop of the fixed ends of the sampling resistor can be obtained, the subsequent comparison is facilitated, and the detection accuracy is improved.
Of course, the sampling resistor can also adopt a resistor with a constant resistance value, and the sampling resistor with a proper resistance value can be directly selected to be connected into a detection passage according to the actual detection requirement before detection, so that the adjustment of the resistance value is not needed, and the detection flow is simplified. The sampling resistor is specifically selected, and can be flexibly set by a person skilled in the art according to actual requirements, and is not specifically limited herein.
In addition, the sampling resistor is connected in series in the detection passage, and then the welding condition of the pins to be detected of the circuit element can be detected in a mode of detecting the voltage drop at two ends of the sampling resistor.
In one embodiment of the present application, the reference voltage is obtained by means of keyboard input.
The theoretical voltage drop, namely the reference voltage, can be obtained by a user through a mode of manual input of a keyboard, and therefore the actual setting requirement of the user on the reference voltage can be met. In addition, the reference voltage is input in the detection process, so that the reference voltage does not need to be stored in advance, and a certain storage space can be saved.
Of course, the theoretical voltage drops of the two ends of the sampling resistor of the two pins to be detected in the normal welding condition in the detection path can be defined in advance and stored, and the corresponding theoretical voltage drops are directly called according to the pins to be detected during detection, so that manual input of users each time is not needed, and the detection efficiency and the automation of the detection flow are improved.
In one embodiment of the present application, if a current loop is not formed between two pins to be detected under the normal welding condition, the acquired reference voltage is equal to zero; if a current loop is formed between the two pins to be detected under the normal welding condition, the acquired reference voltage is equal to the product of the constant current and the resistance value of the sampling resistor.
Specifically, the normal welding condition between two pins to be detected in the embodiment of the present application may include the following two conditions: a current loop is not formed between two pins to be detected under the condition of normal welding, and because the current loop cannot be formed, the current value in a detection path where the two pins to be detected are located is zero, and therefore the theoretical voltage drop of two ends of a sampling resistor of the two pins to be detected under the condition of normal welding in the detection path is equal to zero. The other is that a current loop is formed between the two pins to be detected under the condition of normal welding, and the resistance value of the sampling resistor is also determined because the input current value in the detection path is constant, when the detection path forms a closed current loop, the theoretical voltage drop of the two ends of the sampling resistor of the two pins to be detected under the condition of normal welding in the detection path is equal to the product of the constant current value and the sampling resistor resistance value.
For example, for the first case, the two pins to be detected may be a power pin and a ground pin, or may be a communication pin and other functional pins adjacent to the communication pin, and in the case of normal welding, the power pin and the ground pin should be not electrically connected, i.e. no current loop is formed, and the communication pin and other functional pins adjacent to the communication pin should not form a current loop; for the second case, one of the two pins to be tested may be a chip pin, and the other may be a pin formed by a solder joint of the chip pin on the circuit board, where the chip pin and the pin formed by the solder joint of the chip pin on the circuit board should form a current loop under the normal soldering condition.
In one embodiment of the present application, the method further comprises: storing the detection result of the welding condition between the two pins to be detected so as to carry out data statistics analysis on the detection result, and/or displaying the detection result of the welding condition between the two pins to be detected through a display interface so as to be displayed to a user.
Specifically, in order to perform statistical analysis on the welding conditions among the pins in the circuit element, the detection result of the welding conditions among the pins to be detected can be stored. In addition, in order to enable a user to timely obtain the detection result of the welding condition between the pins to be detected, the detection result can be displayed through a display interface such as an LCD display screen, and the user can intuitively obtain the detection result.
To illustrate the specific principles of the circuit element solder condition detection method of the present application in more detail, the following three application scenarios are provided for further illustration.
Case one: the two pins to be detected are a power pin and a ground pin respectively. The welding between the power pin and the ground pin is abnormal, the abnormal performance on the product is most obvious, the chip can not be electrified, and the chip does not work.
As shown in fig. 3, the element Pinx is set to the power pin VDD, and the element Piny is set to the ground pin GND. The reference voltage is input through the keyboard S1, and in this example, the reference voltage corresponds to the case where the resistance is infinite, and the reference voltage is 0. After the reference voltage is acquired, the control unit MCU may correspond this input to the reference case A1.
Two connection terminals are designed in the detection path as an interface channel m, one for connecting to the power supply pin VDD and the other for connecting to the ground pin GND. A constant current value is input from the power pin VDD and is recorded as I 1 ，I 1 One end of the interface channel m flows through the sampling resistor R 1 Through the other end of the interface channel m and the ground pin GND to form a detection path, a sampling resistor R is formed 1 There will be a fixed voltage drop across it, which is recorded as V by the control unit MCU 1 This input may be corresponding to sampling case B1. The sampling situation B1 is compared with the reference situation A1 in the MCU, when V 1 When 0, sampling case B1 is equivalent to reference case A1, i.e. no current loop is formed between power supply pin VDD and ground pin GND, indicating that the weld is normal, when V 1 Is I 1 *R 1 When the sampling situation B1 is not equal to the reference situation A1, a current loop is formed between the power pin VDD and the ground pin GND, which indicates that a short circuit abnormality occurs between the two pins.
And a second case: the two pins to be detected are a communication pin and other functional pins adjacent to the communication pin respectively. When the welding of the communication pin and other function pins adjacent to the communication pin is abnormal, other signals are superposed on the communication signal, so that the normal communication is interfered, and the communication is abnormal.
As shown in fig. 3, pinx is set as the communication pin IOx, and Piny is set as the other functional pin IOy adjacent to the communication pin IOx. The reference voltage is input through the keyboard S1, and in this example, the reference voltage corresponds to the case where the resistance is infinite, and the reference voltage is 0. After the reference voltage is acquired, the control unit MCU may correspond this input to the reference case A2.
Two connection terminals are designed in the detection path as an interface channel m, one connection terminal is used for connecting the communication pin IOx, and the other connection terminal is used for connecting other functional pins IOy adjacent to the communication pin IOx. A constant current value is input from the communication pin IOx and is recorded as I 2 ，I 2 One end of the interface channel m flows through the sampling resistor R 2 Through the other end of the interface channel m and the other functional pins IOy to form a detection path, the sampling resistor R can be detected 2 There will be a fixed voltage drop across it, which is recorded as V by the control unit MCU 2 This input may be corresponding to sampling case B2. Comparing the sampling situation B2 with the reference situation A2 in the MCU, when V 2 When 0, sampling case B2 is equivalent to reference case A2, i.e. no current loop is formed between communication pin IOx and other function pins IOy, indicating that the weld is normal, when V 2 Is I 2 *R 2 When the sampling situation B2 is not equal to the reference situation A2, a current loop is formed between the communication pin IOx and the other functional pin IOy, which indicates that a short circuit abnormality occurs between the two pins.
Case three: the two pins to be detected are the chip pins and the corresponding welding spot pins of the chip pins on the circuit respectively. The chip pins and the pins corresponding to the welding spots on the circuit have virtual welding, which is common in production, and the chip part has abnormal functions.
As shown in fig. 3, the element Pinx is set to be a certain chip pin IOm, and the element Piny is set to be a solder Point pin m corresponding to the chip pin on the circuit board. The reference voltage is input through the keyboard S1, and in this example, the reference voltage is equal to the product of the magnitude of the constant current and the resistance of the sampling resistor. After the reference voltage is acquired, the control unit MCU may correspond this input to the reference case A3.
Two connecting terminals are designed in the detection passage and used as an interface channel m, and one connecting terminal is used for connecting a chipAnd a pin IOm, wherein the other connecting terminal is used for connecting with a welding Point pin Point m corresponding to the chip pin. A constant current value is input from the chip pin IOm and is recorded as I 3 ，I 3 One end of the interface channel m flows through the sampling resistor R 3 The other end of the interface channel m and the welding Point pin Point m form a detection path, and the sampling resistor R can be detected 3 There will be a fixed voltage drop across it, which is recorded as V by the control unit MCU 3 This input may be corresponding to sampling case B3. Comparing the sampling situation B3 with the reference situation A3 in the MCU, when V 3 Is I 3 *R 3 When the sampling case B3 is equal to the reference case A3, i.e. a current loop is formed between the chip pin IOm and the pad pin Point m, indicating that the soldering is normal, when V 3 When 0, sampling case B3 is not equivalent to reference case A3, where no current loop is formed between chip pin IOm and pad pin Point m, indicating that chip pin IOm is cold-soldered abnormally.
The method belongs to a technical conception with the method for detecting the welding condition of the circuit element, and the embodiment of the application also provides a device for detecting the welding condition of the circuit element. Fig. 4 shows a block diagram of a circuit element welding condition detection apparatus according to an embodiment of the present application, referring to fig. 4, a circuit element welding condition detection apparatus 400 includes: an interface unit 410, a detection unit 420, a reference input unit 430, and a control unit 440. Wherein,,
an interface unit 410, including two connection terminals, for connecting two pins to be detected of the circuit element;
the detection unit 420 comprises a sampling resistor, the sampling resistor is connected in series with two connecting terminals of the interface unit, constant current is input from one of the pins to be detected and sequentially flows through the sampling resistor and the other pin to be detected to form a detection path, and the detection unit 420 is used for acquiring actual voltage drops of two ends of the sampling resistor in the detection path and outputting the actual voltage drops as sampling voltages to the control unit;
the reference input unit 430 is configured to obtain theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected, and output the theoretical voltage drops as reference voltages to the control unit;
the control unit 440 is configured to compare the sampled voltage with a reference voltage value, obtain a detection result of normal welding conditions between the two pins to be detected if the difference is within a preset voltage difference threshold, and obtain a detection result of abnormal welding conditions between the two pins to be detected if the difference is greater than the preset voltage difference threshold.
In one embodiment of the present application, the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
In one embodiment of the present application, the reference input unit 430 includes a keyboard, and the reference input unit obtains the reference voltage by way of keyboard input.
In one embodiment of the present application, if a current loop is not formed between two pins to be detected under the normal welding condition, the reference voltage acquired by the reference input unit is equal to zero; if a current loop is formed between the two pins to be detected under the normal welding condition, the reference voltage acquired by the reference input unit is equal to the product of the constant current and the resistance value of the sampling resistor.
As shown in fig. 5, there is provided a block diagram of another circuit element welding condition detection device mainly composed of an interface unit 410, a detection unit 420, a reference input unit 430, a control unit 440, a storage unit 450, a display unit 460, a power supply unit 470, and the like.
Wherein,,
the interface unit 410 is configured to distinguish specific detection signal names, for example, the interface channel m is used to detect the connection condition between the power pin VDD and the ground pin GND.
The detection unit 420 is connected to the interface unit 410 and the control unit 440, and is configured to receive a signal from the interface unit and output a detection signal to the control unit 440.
The reference input unit 430 is connected to the control unit 440, and is used for giving a reference signal to a user and outputting the reference signal to the control unit 440.
The control unit 440 is a main control unit, and may adopt an MCU chip, and is responsible for collecting signals from the reference input unit 430, giving reference signals to a user, collecting signals from the detection unit 420 as actual measurement signals, comparing the given reference signals with the actual measurement signals to obtain detection results, outputting the detection results to the storage unit 450 for storage, and for reference and statistical analysis of historical results, and in addition, outputting the detection results after internal programming to the display unit 460 for visual display of the detection results.
The storage unit 450 is connected to the control unit 440, and is configured to store the detection result of the welding condition between the two pins to be detected output by the control unit 440, so as to perform data statistics analysis on the detection result.
And the display unit 460 is connected with the control unit 440 and is used for displaying the detection result of the welding condition between the two pins to be detected through a display interface and visually presenting the detection result to a user. For example, PASS is displayed correspondingly when the detection result is normal, and NG is displayed correspondingly (not passed) when the detection result is abnormal.
And a power supply unit 470 connected to the detection unit 420, the reference input unit 430, the control unit 440, the storage unit 450, and the display unit 460, for supplying electric signals to the respective functional units to ensure the normal operation of the respective functional units.
It should be noted that:
fig. 6 illustrates a schematic structure of an electronic device. Referring to fig. 6, at a hardware level, the electronic device includes a memory and a processor, and optionally includes an interface module, a communication module, and the like. The Memory may include a Memory, such as a Random-Access Memory (RAM), and may also include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory, and the like. Of course, the electronic device may also include hardware required for other services.
The processor, interface module, communication module, and memory may be interconnected by an internal bus, which may be an ISA (Industry Standard Architecture ) bus, a PCI (Peripheral Component Interconnect, peripheral component interconnect standard) bus, or an EISA (Extended Industry Standard Architecture ) bus, among others. The buses may be divided into address buses, data buses, control buses, etc. For ease of illustration, only one bi-directional arrow is shown in FIG. 6, but not only one bus or type of bus.
And a memory for storing computer executable instructions. The memory provides computer-executable instructions to the processor via the internal bus.
A processor executing computer executable instructions stored in the memory and specifically configured to perform the following operations:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected to form a detection passage;
acquiring actual voltage drops of two ends of a sampling resistor in a detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the condition of normal welding of two pins to be detected and recording the theoretical voltage drops as reference voltages;
comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold, obtaining a detection result of normal welding conditions between the two pins to be detected, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold, obtaining a detection result of abnormal welding conditions between the two pins to be detected.
The functions performed by the circuit element welding condition detection device disclosed in the embodiment shown in fig. 4 of the present application may be applied to a processor or implemented by the processor. The processor may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware in a processor or by instructions in the form of software. The processor may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU), a network processor (Network Processor, NP), etc.; but also digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), field programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The disclosed methods, steps, and logic blocks in the embodiments of the present application may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the embodiments of the present application may be embodied directly in hardware, in a decoded processor, or in a combination of hardware and software modules in a decoded processor. The software modules may be located in a random access memory, flash memory, read only memory, programmable read only memory, or electrically erasable programmable memory, registers, etc. as well known in the art. The storage medium is located in a memory, and the processor reads the information in the memory and, in combination with its hardware, performs the steps of the above method.
The electronic device may further execute the steps executed by the method for detecting the welding condition of the circuit element in fig. 2, and implement the functions of the method for detecting the welding condition of the circuit element in the embodiment shown in fig. 2, which is not described herein again.
The embodiments of the present application also provide a computer readable storage medium storing one or more programs that, when executed by a processor, implement the foregoing method for detecting a welding condition of a circuit element, and are specifically configured to perform:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected to form a detection passage;
acquiring actual voltage drops of two ends of a sampling resistor in a detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the condition of normal welding of two pins to be detected and recording the theoretical voltage drops as reference voltages;
comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold, obtaining a detection result of normal welding conditions between the two pins to be detected, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold, obtaining a detection result of abnormal welding conditions between the two pins to be detected.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) containing computer-usable program code.
The present application is described in terms of flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In one typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include volatile memory in a computer-readable medium, random Access Memory (RAM) and/or nonvolatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of computer-readable media.
Computer readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of storage media for a computer include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium, which can be used to store information that can be accessed by a computing device. Computer-readable media, as defined herein, does not include transitory computer-readable media (transmission media), such as modulated data signals and carrier waves.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises an element.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.
Claims (6)
1. A method for detecting a soldering condition of a circuit element, comprising:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected to form a detection path;
acquiring actual voltage drops of two ends of the sampling resistor in the detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path and recording the theoretical voltage drops as reference voltages under the condition of normal welding of the two pins to be detected;
comparing the sampling voltage with the reference voltage through a control unit, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold, obtaining a detection result of normal welding conditions between the two pins to be detected, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold, obtaining a detection result of abnormal welding conditions between the two pins to be detected;
if a current loop is not formed between the two pins to be detected under the normal welding condition, the acquired reference voltage is equal to zero;
if a current loop is formed between the two pins to be detected under the normal welding condition, the obtained reference voltage is equal to the product of the constant current and the resistance value of the sampling resistor;
and acquiring the reference voltage by means of keyboard input, or acquiring the reference voltage stored in advance.
2. The method of claim 1, wherein the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
3. The method according to claim 1, wherein the method further comprises:
storing the detection result of the welding condition between the two pins to be detected, so as to perform data statistical analysis on the detection result, and/or,
and displaying the detection result of the welding condition between the two pins to be detected through a display interface so as to show the detection result to a user.
4. The circuit element welding condition detection device is characterized by comprising an interface unit, a detection unit, a reference input unit and a control unit: wherein,,
the interface unit comprises two connecting terminals for connecting two pins to be detected of the circuit element;
the detection unit comprises a sampling resistor, wherein the sampling resistor is connected with two connecting terminals of the interface unit in series, constant current is input from one pin to be detected, and sequentially flows through the sampling resistor and the other pin to be detected to form a detection passage, and the detection unit is used for acquiring actual voltage drops of two ends of the sampling resistor in the detection passage and outputting the actual voltage drops as sampling voltages to the control unit;
the reference input unit is used for acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the condition of normal welding of the two pins to be detected, and outputting the theoretical voltage drops as reference voltages to the control unit;
the control unit is used for comparing the sampling voltage with the reference voltage value, if the difference value of the sampling voltage and the reference voltage value is within a preset voltage difference value threshold, a detection result of normal welding conditions between the two pins to be detected is obtained, and if the difference value of the sampling voltage and the reference voltage value is greater than the preset voltage difference value threshold, a detection result of abnormal welding conditions between the two pins to be detected is obtained;
if a current loop is not formed between the two pins to be detected under the normal welding condition, the reference voltage acquired by the reference input unit is equal to zero;
if a current loop is formed between the two pins to be detected under the normal welding condition, the reference voltage acquired by the reference input unit is equal to the product of the constant current and the resistance value of the sampling resistor;
the reference input unit comprises a keyboard, and the reference input unit specifically obtains the reference voltage through a keyboard input mode, or the reference voltage is a reference voltage stored in advance.
5. The device of claim 4, wherein the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
6. The apparatus of claim 4, wherein the apparatus further comprises:
a storage unit for storing the detection result of the welding condition between the two pins to be detected, so as to perform data statistical analysis on the detection result, and/or,
and the display unit is used for displaying the detection result of the welding condition between the two pins to be detected through a display interface so as to be displayed to a user.
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| CN113255778A (en) * | 2021-05-28 | 2021-08-13 | 广汽本田汽车有限公司 | Welding spot quality detection method and device based on multi-model fusion and storage medium |
| CN113504395A (en) * | 2021-08-05 | 2021-10-15 | 上海御渡半导体科技有限公司 | Method for detecting connectivity of ATE channel |
| CN116299020A (en) * | 2021-12-08 | 2023-06-23 | 中兴通讯股份有限公司 | Drive detection method, switching power supply, electronic device, and storage medium |
| CN116028284B (en) * | 2022-08-18 | 2023-10-20 | 荣耀终端有限公司 | Electronic equipment |
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