CN110261759B - Chip pin damage detection system - Google Patents

Chip pin damage detection system Download PDF

Info

Publication number
CN110261759B
CN110261759B CN201910576249.XA CN201910576249A CN110261759B CN 110261759 B CN110261759 B CN 110261759B CN 201910576249 A CN201910576249 A CN 201910576249A CN 110261759 B CN110261759 B CN 110261759B
Authority
CN
China
Prior art keywords
pin
chip
voltage
damage
sampling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910576249.XA
Other languages
Chinese (zh)
Other versions
CN110261759A (en
Inventor
刘正保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quectel Wireless Solutions Co Ltd
Original Assignee
Quectel Wireless Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quectel Wireless Solutions Co Ltd filed Critical Quectel Wireless Solutions Co Ltd
Priority to CN201910576249.XA priority Critical patent/CN110261759B/en
Publication of CN110261759A publication Critical patent/CN110261759A/en
Application granted granted Critical
Publication of CN110261759B publication Critical patent/CN110261759B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/165Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
    • G01R19/16566Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533
    • G01R19/1659Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533 to indicate that the value is within or outside a predetermined range of values (window)
    • G01R19/16595Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533 to indicate that the value is within or outside a predetermined range of values (window) with multi level indication
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]

Abstract

The invention discloses a damage detection system of a chip pin, which comprises a detection module, a signal processing module, a sampling resistor and a reference power supply module, wherein the detection module is used for detecting the damage of the chip pin; the grounding end of the reference power supply module is connected with the grounding pin of the chip to be tested, the voltage output end of the reference power supply module is connected with one end of the sampling resistor, and the other end of the sampling resistor is connected with the pin to be tested of the chip to be tested; the signal processing module is used for collecting the reference voltage and the sampling voltage at the other end of the sampling resistor, generating damage assessment data according to the reference voltage, the sampling voltage and the resistance value of the sampling resistor, the detection module is further used for receiving the damage assessment data, comparing the damage assessment data with a preset threshold value, and determining that the pin to be detected is damaged if the difference value between the damage assessment data and the preset threshold value exceeds the preset difference value. The technical scheme of the invention can effectively improve the detection efficiency and save the test cost.

Description

Chip pin damage detection system
Technical Field
The invention relates to the technical field of semiconductor detection, in particular to a chip pin damage detection system.
Background
With the development of science and technology, the semiconductor industry has been rapidly developed, and from the birth of the first silicon integrated circuit in 1960 to the wide application of the nano process, the semiconductor industry is also promoted to develop towards the direction that the volume of the integrated circuit is smaller and the power consumption of the chip is lower, but at the same time, the semiconductor chip also faces the risks that the electrostatic protection capability is reduced and the pin of the chip is easy to damage, and the current situation is particularly prominent in the highly integrated communication industry.
In the prior art, before a semiconductor chip leaves a factory, whether pins of the chip are normal is generally judged by measuring whether functions of the chip meet requirements, but for a specific function test, all pins are generally not used, that is, some pins do not participate in the specific function test, so that all pins of the chip cannot be covered in a specific function test process, if as many pins of the chip as possible are required to be measured, different function tests are required for many times, and resources are greatly wasted. In addition, if the functional test finds an abnormality, it is difficult to accurately locate the damaged pin because a plurality of pins participate in the functional test.
Disclosure of Invention
The invention aims to overcome the defect that damaged chip pins cannot be quickly and accurately positioned in the prior art, and provides a chip pin damage detection system.
The invention solves the technical problems through the following technical scheme:
a damage detection system of a chip pin comprises a detection module, a signal processing module, a sampling resistor and a reference power supply module; the grounding end of the reference power supply module is connected with the grounding pin of the chip to be tested, the voltage output end of the reference power supply module is used for outputting reference voltage to one end of the sampling resistor, and the other end of the sampling resistor is connected with the pin to be tested of the chip to be tested;
the signal processing module is used for acquiring the reference voltage and the sampling voltage at the other end of the sampling resistor and generating damage evaluation data according to the reference voltage, the sampling voltage and the resistance value of the sampling resistor;
the detection module is used for receiving the damage assessment data, comparing the damage assessment data with a preset threshold value, and determining that the pin to be detected is damaged if the difference value between the damage assessment data and the preset threshold value exceeds a preset difference value.
Preferably, the damage-assessment data includes a sampled current, the preset threshold includes a preset current threshold, and the preset difference includes a first preset difference;
the signal processing module is used for generating the sampling current according to the reference voltage, the sampling voltage and the resistance value of the sampling resistor, the detection module is used for comparing the sampling current with the preset current threshold value, and if the difference value between the sampling current and the preset current threshold value exceeds the first preset difference value, the pin to be detected is determined to be damaged.
Preferably, the damage assessment data includes an assessment slope, the preset threshold includes a preset slope threshold, and the preset difference includes a second preset difference;
the voltage output end of the reference power supply module is used for outputting a plurality of reference voltages with different voltage grades, the signal processing module is used for collecting each reference voltage and the corresponding sampling voltage thereof, and generating the evaluation slope according to the reference voltage, the sampling voltage and the resistance value of the sampling resistor;
the detection module is used for comparing the evaluation slope with the preset slope threshold, and if the difference value between the evaluation slope and the preset slope threshold exceeds the second preset difference value, determining that the pin to be detected is damaged.
Preferably, the detection module is further configured to generate a prompt message, where the prompt message is used to indicate that the pin to be detected is damaged;
and/or the presence of a gas in the gas,
the pin to be tested is at least one of a power supply pin, a signal input pin and a signal output pin.
Preferably, after the prompt message is generated, the detection module is further configured to send the prompt message to a pre-bound user mobile terminal.
Preferably, the signal processing module includes a single chip microcomputer and an operational amplifier, a first input end of the operational amplifier is connected to one end of the sampling resistor, a second input end of the operational amplifier is connected to the other end of the sampling resistor, the operational amplifier is configured to amplify a voltage difference between the reference voltage and the sampling voltage, an output end of the operational amplifier transmits the amplified voltage difference to a data acquisition port of the single chip microcomputer, and a data output port of the single chip microcomputer outputs the damage assessment data to the detection module.
Preferably, the chip to be tested comprises a plurality of pins to be tested, the damage detection system further comprises a switch chip, and the switch chip comprises a gating control pin and a plurality of signal acquisition pins;
each signal acquisition pin corresponds one respectively and connects one the pin that awaits measuring, the public pin of switch chip is connected the other end of sampling resistance, the gating control pin is used for receiving the selection control signal that detection module output, the switch chip be used for according to the selection control signal confirm with the other end of sampling resistance is connected the pin that awaits measuring.
Preferably, the switch chip includes a main switch chip and an auxiliary switch chip, a common pin of the main switch chip is connected to the other end of the sampling resistor, a signal acquisition pin of the main switch chip is connected to the common pin of the auxiliary switch chip, and a signal acquisition pin of the auxiliary switch chip is connected to the pin to be tested.
Preferably, the reference power supply module is a program-controlled power supply, the program-controlled power supply is connected with the detection module through an asynchronous transceiver transmitter,
and/or the presence of a gas in the gas,
the detection module is a PC terminal.
Preferably, the damage detection system further includes a power supply module, and the power supply module is configured to provide a working voltage for the signal processing module.
Preferably, the power supply module is a linear voltage regulator.
On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the invention.
The positive progress effects of the invention are as follows: the ground terminal of the reference power supply module is connected with the ground pin of the chip to be detected, the voltage output end of the reference power supply module is connected with one end of the sampling resistor, the other end of the sampling resistor is connected with the pin to be detected of the chip to be detected, the pin to be detected can be regarded as a load, the pin to be detected, the reference power supply module and the sampling resistor form a current loop, the signal processing module generates damage assessment data according to the voltage difference between the two ends of the sampling resistor, and then the damage assessment data is compared with a preset threshold value by using the detection module to judge whether the pin to be detected is damaged or not. Therefore, the damage detection can be comprehensively and accurately carried out on the pin of the chip to be detected, the damaged pin can be accurately positioned, the detection efficiency is effectively improved, and the test cost is saved.
Drawings
Fig. 1 is a schematic structural diagram of a system for detecting damage to a chip pin according to a preferred embodiment of the invention.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention.
The embodiment provides a damage detection system for a chip pin, as shown in fig. 1, the damage detection system may include a detection module 3, a signal processing module 7, a sampling resistor R and a reference power module 5, a ground terminal GND1 of the reference power module 5 is connected to a ground pin GND2 of a chip 6 to be detected, a voltage output terminal Vout1 of the reference power module 5 is connected to one end of the sampling resistor R, that is, a voltage output terminal Vout1 of the reference power module 5 is used for outputting a reference voltage to one end of the sampling resistor R, and the other end of the sampling resistor R is connected to the pin to be detected of the chip 6 to be detected.
The ground terminal GND1 of the reference power supply module 5 may be in the form of a post or a pin.
The reference power supply module 5, the pin to be tested and the sampling resistor R form a current loop, and the pin to be tested can be regarded as a load in the current loop.
Specifically, the pin to be tested may be a power pin, a signal input pin, or a signal output pin, which is not limited in this embodiment.
The signal processing module 7 can be used for collecting the reference voltage and the sampling voltage at the other end of the sampling resistor R, generating damage assessment data according to the reference voltage, the sampling voltage and the resistance of the sampling resistor R, the detection module 3 is used for receiving the damage assessment data, comparing the damage assessment data with a preset threshold value, and determining that the pin to be detected is damaged if the difference value between the damage assessment data and the preset threshold value exceeds the preset difference value.
In this embodiment, the detection module 3 may be a PC terminal.
Specifically, the chip 6 to be tested may be any type and purpose chip with pins, such as a communication chip, a digital-to-analog conversion chip, and the like. The damage of the pin to be tested refers to the change of the impedance of the pin to be tested caused by the electrostatic discharge (ESD) phenomenon, the over-current stress (EOS) and the like in the circuit. The damage type may include a short circuit, an open circuit, or a half damage, where the half damage means that although the pin to be tested may also transmit data, the impedance of the pin to be tested has changed significantly and has caused the chip to malfunction.
Further, the detection module 3 may further generate a prompt message, where the prompt message is used to indicate that the pin to be detected is damaged. The prompt message may be graphic color block information, text information or voice information, for example, when the detection module 3 determines that the pin to be detected is damaged, a red color block is displayed on the display screen of the detection module 3, or the display screen of the detection module 3 displays the relevant text of "damage", or the detection module 3 generates a simple sound file, which may be a buzzing prompt tone or a voice broadcasted by a machine, etc.
Further, after the prompt message is generated, the detection module 3 is further configured to send the prompt message to a pre-bound user mobile terminal. The detection module 3 may send the prompt message in a wired or wireless manner.
Specifically, the user mobile terminal may be a mobile phone or an ipad (tablet personal computer), and the embodiment of the present invention is not limited thereto.
Preferably, the reference power module 5 may be a programmable power supply, the programmable power supply may be connected to the detection module 3 through an asynchronous receiver transmitter 4(UART), and the detection module 3 may control the voltage value output by the voltage output terminal Vout1 of the programmable power supply through the asynchronous receiver transmitter 4.
In this embodiment, the signal processing module 7 may specifically include a single chip microcomputer 71 and an operational amplifier 72, a first input end of the operational amplifier 72 is connected to one end of the sampling resistor R, a second input end of the operational amplifier 72 is connected to the other end of the sampling resistor R, the operational amplifier 72 is configured to amplify a voltage difference between the reference voltage and the sampling voltage, an output end of the operational amplifier 72 transmits the amplified voltage difference to a data acquisition port ADC of the single chip microcomputer 71, and a data output port of the single chip microcomputer 71 outputs the damage assessment data to the detection module 3.
Specifically, the single chip microcomputer 71 may upload the damage evaluation data to the detection module 3 through a USB (universal serial bus) interface or a serial port.
Since the voltage difference data transmitted from the output terminal of the operational amplifier 72 to the data acquisition port ADC of the single chip microcomputer 71 is an analog signal, the single chip microcomputer 71 needs to convert the analog signal into a digital signal and calculate the damage assessment data using the digital signal.
In this embodiment, the single chip 71 may be of a type existing in the prior art, for example: a single chip microcomputer of MCS-51 series model or a single chip microcomputer of MSP430 model, etc. When the damage detection system is operated, the required calculation program can be burned or downloaded in the single chip 71 in advance.
For the condition that the chip 6 to be tested comprises a plurality of pins to be tested, the damage detection system can further comprise a switch chip 8, wherein the switch chip 8 comprises a gating control pin (S0, S1, S2 and S3) and a plurality of signal acquisition pins (I0, I1, … … and I16); each of the signal acquisition pins (I0, I1, … …, I16) is correspondingly connected to one of the pins to be tested, the common pin COM of the switch chip 8 is connected to the second input terminal of the operational amplifier 72, the gating control pins (S0, S1, S2, S3) are used for receiving the selection control signal output by the single chip microcomputer 71, and the switch chip 8 is used for determining the pin to be tested which is communicated with the second input terminal of the operational amplifier 72 according to the selection control signal.
For example, the single chip microcomputer 71 may be provided with a plurality of control signal output pins (GP1O _0, GP1O _1, GP1O _2, … …, GP1O _67), each switch chip 8 may include four gate control pins (S0, S1, S2, S3), each four control signal output pins of the single chip microcomputer 71 may be respectively connected to four gate control pins (S0, S1, S2, S3) of one switch chip 8, the four gate control pins (S0, S1, S2, S3) may implement gating of 16 (i.e. 0000-1111) objects, correspondingly, the number of signal acquisition pins is also 16, and if only one switch chip 8 is adopted, the 16 signal selection pins may be correspondingly connected to 16 pins to be detected. If the number of the pins to be tested is greater than 16, a plurality of switch chips 8 (namely, a main switch chip and an auxiliary switch chip) can be arranged, specifically, the signal acquisition pins (I0, I1, … … and I16) of the main switch chip can be connected with the common pins COM of the auxiliary switch chips with the same model and the capacity expansion function, and then the signal acquisition pins (I0, I1, … … and I16) of the auxiliary switch chips are connected with the pins to be tested, so that the use number of the switch chips 8 can be flexibly expanded according to actual test requirements on the premise that the test efficiency of the damage detection system meets requirements.
The switch chip 8 can be a chip of a CD4067BE model, and the chip can realize the function of the 16-way gating switch.
In this embodiment, the damage detection system may further include a power supply module 1, and the power supply module 1 may be configured to provide a working voltage for the single chip 71 and the switch chip 8.
The voltage output end Vout2 of the power supply module is connected with a power supply pin VCC of the single chip microcomputer, and the grounding end GND3 of the power supply module is connected with a grounding pin GND4 of the single chip microcomputer. The ground GND3 of the power supply module may be in the form of a terminal or a pin.
The ground end GND3 of the power supply module and the ground pin GND4 of the single chip microcomputer can be connected with the same logic signal ground end. In addition, a power pin (not shown) of the switch chip 8 may also be connected to the voltage output terminal Vout2 of the power supply module 1 to receive the operating voltage provided by the power supply module 1.
Preferably, the power supply module 1 may be a linear regulator, and the linear regulator may provide a stable working voltage without fluctuation, and is less affected by the ambient temperature, so as to ensure stable power supply operation of the whole detection system. In addition, the single chip 71 and the switch chip 8 may also receive the working voltage provided by the detection module 3 through a USB interface.
The detection module 3 may also generate a detection log, and transmit the detection log to the server 2 for saving, so as to facilitate subsequent query. The detection log may include a detection date, an ID (identification) of the chip 6 to be detected, a number of the pin to be detected, damage evaluation data corresponding to the pin to be detected, and the like.
In one particular application scenario, for example: the damage assessment data comprises a sampling current, the preset threshold comprises a preset current threshold, and the preset difference comprises a first preset difference;
the signal processing module 7 is configured to generate the sampling current according to the reference voltage, the sampling voltage, and the resistance of the sampling resistor R, the detection module 3 is configured to compare the sampling current with the preset current threshold, and if the difference between the sampling current and the preset current threshold exceeds the first preset difference, it is determined that the pin to be detected is damaged.
Specifically, the preset current threshold may be a current corresponding to the non-damaged pin to be tested, and the current may be used as a reference to be compared with a current corresponding to the damaged pin to be tested, and since the reference voltage is a known constant value (provided by the program control power supply), and the resistance value of the sampling resistor R is also a known constant value, the sampling current may reflect the change of the impedance of the pin to be tested, and the change of the impedance may directly correspond to the damaged condition of the pin to be tested.
In another specific application scenario, for example: the damage assessment data comprises an assessment slope, the preset threshold comprises a preset slope threshold, and the preset difference comprises a second preset difference;
the voltage output terminal Vout1 of the reference power module 5 is configured to output a plurality of reference voltages (e.g., different voltages in a range of ± 500 mV) with different voltage levels, and the signal processing module 7 is configured to collect each reference voltage and the corresponding sampling voltage, and generate the evaluation slope according to the reference voltage, the sampling voltage, and the resistance value of the sampling resistor R;
the detection module 3 is configured to compare the evaluation slope with the preset slope threshold, and determine that the pin to be detected is damaged if a difference between the evaluation slope and the preset slope threshold exceeds the second preset difference.
Specifically, the evaluation slope is a slope that a reference voltage-sampling current curve has. For a pin to be detected, the damage condition of the pin is integrally reflected by a plurality of groups of reference voltage-sampling current data, so that the detection result is more accurate.
This embodiment utilizes reference power module's earthing terminal to connect the ground connection pin of the chip that awaits measuring, and reference power module's voltage output end connects the one end of sampling resistor, the pin that awaits measuring of chip is connected to the other end of sampling resistor to can regard the pin that awaits measuring as the load, and the pin that awaits measuring and reference power module and sampling resistor have constituted current loop, the voltage difference at signal processing module sampling resistor both ends generates the damage evaluation data, and next, utilizes detection module 3 will damage evaluation data and predetermine the threshold value and compare, in order to judge whether the damage takes place for the pin that awaits measuring. Therefore, the damage detection can be comprehensively and accurately carried out on the pin of the chip to be detected, the damaged pin can be accurately positioned, the detection efficiency is effectively improved, and the test cost is saved.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.

Claims (11)

1. The damage detection system of the chip pin is characterized by comprising a detection module, a signal processing module, a sampling resistor and a reference power supply module; the grounding end of the reference power supply module is connected with the grounding pin of the chip to be tested, the voltage output end of the reference power supply module is used for outputting reference voltage to one end of the sampling resistor, and the other end of the sampling resistor is connected with the pin to be tested of the chip to be tested;
the signal processing module is used for acquiring the reference voltage and the sampling voltage at the other end of the sampling resistor and generating damage evaluation data according to the reference voltage, the sampling voltage and the resistance value of the sampling resistor;
the detection module is used for receiving the damage assessment data, comparing the damage assessment data with a preset threshold value, and determining that the pin to be detected is damaged if the difference value between the damage assessment data and the preset threshold value exceeds a preset difference value.
2. The system for detecting damage to a chip pin according to claim 1, wherein the damage-assessment data includes a sampled current, the preset threshold includes a preset current threshold, and the preset difference includes a first preset difference;
the signal processing module is used for generating the sampling current according to the reference voltage, the sampling voltage and the resistance value of the sampling resistor, the detection module is used for comparing the sampling current with the preset current threshold value, and if the difference value between the sampling current and the preset current threshold value exceeds the first preset difference value, the pin to be detected is determined to be damaged.
3. The system for detecting damage to a chip pin according to claim 1, wherein the damage-assessment data includes an assessment slope, the preset threshold includes a preset slope threshold, and the preset difference includes a second preset difference;
the voltage output end of the reference power supply module is used for outputting a plurality of reference voltages with different voltage grades, the signal processing module is used for collecting each reference voltage and the corresponding sampling voltage thereof, and generating the evaluation slope according to the reference voltage, the sampling voltage and the resistance value of the sampling resistor;
the detection module is used for comparing the evaluation slope with the preset slope threshold, and if the difference value between the evaluation slope and the preset slope threshold exceeds the second preset difference value, determining that the pin to be detected is damaged.
4. The system for detecting damage to a chip pin according to any one of claims 1 to 3,
the detection module is also used for generating prompt information, and the prompt information is used for indicating that the pin to be detected is damaged;
and/or the presence of a gas in the gas,
the pin to be tested is at least one of a power supply pin, a signal input pin and a signal output pin.
5. The system for detecting damage to chip pins according to claim 4, wherein the detection module is further configured to send the prompt message to a pre-bound user mobile terminal after the prompt message is generated.
6. The system according to any one of claims 1 to 3, wherein the signal processing module includes a single chip and an operational amplifier, a first input terminal of the operational amplifier is connected to one end of the sampling resistor, a second input terminal of the operational amplifier is connected to the other end of the sampling resistor, the operational amplifier is configured to amplify a voltage difference between the reference voltage and the sampling voltage, an output terminal of the operational amplifier transmits the amplified voltage difference to a data acquisition port of the single chip, and a data output port of the single chip outputs the damage assessment data to the detection module.
7. The system for detecting damage to chip pins according to any one of claims 1 to 3, wherein the chip under test includes a plurality of pins under test, the system further includes a switch chip, the switch chip includes a gating control pin and a plurality of signal acquisition pins;
each signal acquisition pin corresponds one respectively and connects one the pin that awaits measuring, the public pin of switch chip is connected the other end of sampling resistance, the gating control pin is used for receiving the selection control signal that detection module output, the switch chip be used for according to the selection control signal confirm with the other end of sampling resistance is connected the pin that awaits measuring.
8. The system for detecting damage to a chip pin according to claim 7, wherein the switch chip includes a main switch chip and an auxiliary switch chip, a common pin of the main switch chip is connected to the other end of the sampling resistor, a signal acquisition pin of the main switch chip is connected to a common pin of the auxiliary switch chip, and a signal acquisition pin of the auxiliary switch chip is connected to the pin to be tested.
9. The system for detecting damage to a chip pin according to any one of claims 1 to 3,
the reference power supply module is a program-controlled power supply, the program-controlled power supply is connected with the detection module through an asynchronous transceiver transmitter,
and/or the presence of a gas in the gas,
the detection module is a PC terminal.
10. The system for detecting damage to a chip pin according to any one of claims 1 to 3,
the damage detection system further comprises a power supply module, and the power supply module is used for providing working voltage for the signal processing module.
11. The system for detecting damage to a chip pin of claim 10, wherein the power supply module is a linear regulator.
CN201910576249.XA 2019-06-28 2019-06-28 Chip pin damage detection system Active CN110261759B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910576249.XA CN110261759B (en) 2019-06-28 2019-06-28 Chip pin damage detection system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910576249.XA CN110261759B (en) 2019-06-28 2019-06-28 Chip pin damage detection system

Publications (2)

Publication Number Publication Date
CN110261759A CN110261759A (en) 2019-09-20
CN110261759B true CN110261759B (en) 2021-05-07

Family

ID=67922907

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910576249.XA Active CN110261759B (en) 2019-06-28 2019-06-28 Chip pin damage detection system

Country Status (1)

Country Link
CN (1) CN110261759B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110988650A (en) * 2019-11-22 2020-04-10 佳讯飞鸿(北京)智能科技研究院有限公司 Track circuit state monitoring system and method
CN113589202B (en) * 2020-04-30 2023-01-13 华为技术有限公司 Detection circuit and detection device for charging interface
CN112345982B (en) * 2020-09-29 2023-05-26 歌尔科技有限公司 Circuit element welding condition detection method and device
CN116256623B (en) * 2023-05-15 2023-08-08 成都爱旗科技有限公司 Chip electrical characteristic analysis system and method based on volt-ampere characteristic curve

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120079261A (en) * 2011-01-04 2012-07-12 주식회사 만도 Apparatus and method for detecting a switch fault
CN204289400U (en) * 2014-12-10 2015-04-22 北京海泰方圆科技有限公司 A kind ofly test the device that wafer nation determines break-make
CN106338684A (en) * 2016-11-09 2017-01-18 上海华力微电子有限公司 Failure analysis method
CN106526362A (en) * 2016-10-25 2017-03-22 上海移远通信技术股份有限公司 Test system of wireless communication module
CN108510923A (en) * 2018-03-30 2018-09-07 武汉精立电子技术有限公司 A kind of detection liquid crystal module ID pins open the device of short circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120079261A (en) * 2011-01-04 2012-07-12 주식회사 만도 Apparatus and method for detecting a switch fault
CN204289400U (en) * 2014-12-10 2015-04-22 北京海泰方圆科技有限公司 A kind ofly test the device that wafer nation determines break-make
CN106526362A (en) * 2016-10-25 2017-03-22 上海移远通信技术股份有限公司 Test system of wireless communication module
CN106338684A (en) * 2016-11-09 2017-01-18 上海华力微电子有限公司 Failure analysis method
CN108510923A (en) * 2018-03-30 2018-09-07 武汉精立电子技术有限公司 A kind of detection liquid crystal module ID pins open the device of short circuit

Also Published As

Publication number Publication date
CN110261759A (en) 2019-09-20

Similar Documents

Publication Publication Date Title
CN110261759B (en) Chip pin damage detection system
CN106405294B (en) Portable power distribution product transmission calibrator and implementation test method thereof
CN105044622A (en) Test instrument power supply power self-detection device and self-detection method
CN111239637B (en) Server power supply current sharing detection device and method
CN110658439B (en) Test method and system for protection circuit
CN102098368A (en) Mobile phone
CN108594015A (en) Cable static impedance auto testing instrument and test method
CN101452048B (en) Integrated circuit chip temperature test device and method
CN217687601U (en) MCU temperature sensor ATE equipment
CN207611103U (en) A kind of active information component test device and test fixture
CN105510934A (en) GNSS module detection system and GNSS module detection method
CN214474957U (en) Production test burning system for one-to-eight Bluetooth product
TW201043970A (en) Current measuring device and computer system utilizing the same
US4163938A (en) Calibrating device for control stations and indicators
CN211653008U (en) Integrated multi-instrument detector
CN213275769U (en) Novel low-voltage loop resistance tester
CN210984288U (en) Non-volatile memory test equipment
CN102346701A (en) Power supply test system for CPU (Central Processing Unit)
US9360524B2 (en) Testing system for serial interface
CN202502157U (en) Apparatus for measuring resistance-type parameter and equipment voltage
CN219871530U (en) Voltage measuring device
CN202330515U (en) Multi-measuring range current measurement parallel display unit
CN219434949U (en) Test circuit and test device
CN217060325U (en) Instrument with automatic range switching function
CN219475713U (en) Current detection circuit, current measurement circuit board and current test electronic equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant