CN112345982A - Method and device for detecting welding condition of circuit element - Google Patents
Method and device for detecting welding condition of circuit element Download PDFInfo
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Abstract
The application discloses a circuit element welding condition detection method and device. The method comprises the following steps: a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected and flows through the sampling resistor and the other pin to be detected in sequence to form a detection path; acquiring actual voltage drops of two ends of a sampling resistor in a detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of two pins to be detected and recording the theoretical voltage drops as reference voltages; and comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is normal, and otherwise, obtaining a detection result that the welding condition is abnormal. By the detection method, the detection accuracy, the detection efficiency and the product yield of the component pin welding condition can be improved, and the manual detection and rework cost is reduced.
Description
Technical Field
The application relates to the technical field of circuit detection, in particular to a method and a device for detecting the welding condition of a circuit element.
Background
With the development of the times, the earphone is not only a practical tool for communicating and listening to music, but also gradually becomes a fashionable wearing ornament. In recent years, TWS (True Wireless Stereo) earphones have become popular due to features such as portability and fashion, and with miniaturization of earphones, higher requirements are also placed on packaging of various components inside the earphones, and the earphones need to occupy a small space while satisfying performance, so some compact elements are often used.
Due to the small space between Pin pins of the compact components, the soldering is difficult, and phenomena such as cold solder joint and tin connection often occur. The cold joint is a common line fault and has two generation conditions, namely an unstable state which is caused by improper production process in the production process and is not communicated when being communicated; the other is that the welding point of the welding leg of some parts which generate heat seriously after the long-term use of the electric appliance is easy to be caused by the aging and stripping phenomena. The tin connection means that two or more welding points are connected together by welding flux, the generated reason may be that the preheating temperature is not enough to cause that the element can not reach the temperature, and the tin dragging is poor due to the large heat absorption capacity of the element in the welding process, so that the tin connection is formed; it is also possible that the tin furnace temperature is low or the soldering speed is too fast. The tin connection usually causes a short circuit phenomenon, resulting in an abnormal function of the device.
The abnormal condition of the pin connection of the two elements is difficult to detect by the existing optical detection equipment, so that the reject ratio of the final earphone is high.
Disclosure of Invention
In view of the above, the present disclosure provides a method and an apparatus for detecting a soldering condition of a circuit component, which are used to solve the technical problem of poor detection effect of the circuit component soldering detection method in the prior art.
According to a first aspect of the present application, there is provided a circuit component soldering condition detection method, comprising:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one pin to be detected and flows through the sampling resistor and the other pin to be detected in sequence to form a detection path;
acquiring actual voltage drops of two ends of the sampling resistor in the detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected and recording the theoretical voltage drops as reference voltages;
and comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is normal, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is abnormal.
According to a second aspect of the present application, there is provided a circuit component soldering condition detecting apparatus including an interface unit, a detecting unit, a reference input unit, and a control unit: wherein the content of the first and second substances,
the interface unit comprises two connecting terminals for connecting two pins to be detected of the circuit element;
the detection unit comprises a sampling resistor, the sampling resistor is connected with the two connecting terminals of the interface unit in series, constant current is input from one pin to be detected and sequentially flows through the sampling resistor and the other pin to be detected to form a detection path, and the detection unit is used for acquiring the actual voltage drop of the two ends of the sampling resistor in the detection path and outputting the actual voltage drop as sampling voltage to the control unit;
the reference input unit is used for acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected, and outputting the theoretical voltage drops as reference voltages to the control unit;
the control unit is used for comparing the sampling voltage with the reference voltage value, obtaining a detection result that the welding condition between the two pins to be detected is normal if the difference value between the sampling voltage and the reference voltage value is within a preset voltage difference value threshold, and obtaining a detection result that the welding condition between the two pins to be detected is abnormal if the difference value between the sampling voltage and the reference voltage value is greater than the preset voltage difference value threshold.
In accordance with a third aspect of the present application, there is provided an electronic device comprising: a processor, a memory storing computer-executable instructions,
the executable instructions, when executed by the processor, implement the aforementioned circuit element welding condition detection method.
According to a fourth aspect of the present application, there is provided a computer readable storage medium storing one or more programs which, when executed by a processor, implement the aforementioned circuit element welding condition detection method.
The beneficial effect of this application is:
according to the circuit element welding condition detection method, a sampling resistor is connected in series between two pins to be detected of a circuit element, a constant current is led into one pin to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected, so that a detection path can be formed, and fixed voltage drop can be obtained at two ends of the sampling resistor subsequently; and then, determining whether a current loop is formed between the two pins to be detected by obtaining the actual voltage drop of the two ends of the sampling resistor in the detection path, comparing the actual voltage drop with the theoretical voltage drop of the two ends of the sampling resistor of the two pins to be detected in the normal welding condition in the detection path, if the difference value between the actual voltage drop and the theoretical voltage drop is within a preset voltage difference value threshold value, indicating that the welding condition between the two pins to be detected is normal, and if the difference value between the actual voltage drop and the theoretical voltage drop is greater than the preset voltage difference value threshold value, indicating that the welding condition between the two pins. According to the embodiment of the application, the detection accuracy, efficiency and product yield of the pin welding condition of the compact circuit element can be improved by the detection method, and the manual detection and rework cost is reduced.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a view showing an example of a package of a connector for a headphone in the related art;
FIG. 2 is a flow chart of a method for detecting a soldering condition of a circuit component according to one embodiment of the present application;
FIG. 3 is a schematic circuit diagram of a method for detecting a soldering condition of a circuit component according to an embodiment of the present application;
FIG. 4 is a block diagram of a circuit component soldering condition detection apparatus according to an embodiment of the present application;
FIG. 5 is a block diagram of a circuit component soldering condition detection apparatus according to another embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device in an embodiment of the present application.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein.
As shown in fig. 1, a diagram of a package of a connector for a headset is provided, and two adjacent Pin pins are spaced by 0.4mm, which is a compact component. When the pins are soldered, the pad on the Printed Circuit Board (PCB) corresponding to the Pin pads is too small in size to make the pitch between two pins too small, which is very easy to cause the following abnormal situations:
1) a certain Pin welding disc is not coated with tin, so that after the chip is pasted, Pin pins of an element are not in contact with a circuit board or are not in good contact, and the problem of poor electrical connectivity is caused;
2) in the process of chip mounting, tin on a plurality of Pin pins are connected together, so that the Pin pins are communicated with each other and short-circuited after chip mounting, and the problem of abnormal functions is caused.
Based on this, the present application provides a circuit component welding condition detecting method, fig. 2 shows a flow chart of the circuit component welding condition detecting method according to an embodiment of the present application, and referring to fig. 2, the circuit component welding condition detecting method of the present application includes the following steps S210 to S230:
step S210, a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected, and the constant current sequentially flows through the sampling resistor and the other pin to be detected, so as to form a detection path.
As mentioned above, the distance between adjacent pins of the compact component is small, so that the short circuit phenomenon due to tin connection is easily caused during soldering, and the volume of the circuit component arranged in the portable device such as an earphone is small, so that the pin can be subjected to insufficient soldering during soldering, therefore, the circuit component soldering condition detection method of the embodiment of the application is mainly applied to the detection of the soldering condition of the compact component, and certainly, the technical personnel in the field can also properly expand the scheme of the application to the detection of other large or non-compact circuit components according to actual needs, and no specific limitation is made herein.
In order to detect the connection condition between two adjacent pins to be detected, a detection path is designed for detection in the embodiment of the application, a sampling resistor is connected in series between the two pins to be detected in the detection path, a constant current is introduced from one of the pins to be detected, the constant current sequentially flows through two ends of the sampling resistor and the other pin to be detected, and the purpose of adopting the constant current is to obtain voltage drops fixed at two ends of the sampling resistor for follow-up, so that the follow-up comparison is facilitated, and the accuracy of the detection is improved.
Step S220, obtaining and recording actual voltage drops of the two ends of the sampling resistor in the detection path as sampling voltages, and obtaining and recording theoretical voltage drops of the two ends of the sampling resistor in the detection path of the two pins to be detected under normal welding conditions as reference voltages.
In the detection, the actual voltage drop across the sampling resistor can be measured in the detection path, and for the sake of understanding, the actual voltage drop can be referred to as the sampling voltage. In addition, in order to determine the communication condition of the detection path, that is, to determine the welding condition between the two pins to be detected, it is further required to obtain a theoretical voltage drop of the two ends of the sampling resistor of the two pins to be detected in the detection path under the normal welding condition, which can be referred to as a reference voltage as a basis for comparison. The normal soldering condition here may include a condition where the two pins to be detected should be connected or should not be connected.
Step S230, comparing the sampled voltage with a reference voltage, obtaining a detection result that the welding condition between the two pins to be detected is normal if the difference between the two is within a preset voltage difference threshold, and obtaining a detection result that the welding condition between the two pins to be detected is abnormal if the difference between the two is greater than the preset voltage difference threshold.
After the actually detected sampling voltage and the reference voltage under the normal welding condition are obtained, comparing the two voltage values and calculating the difference value of the two voltage values, if the difference value of the two voltage values is smaller than or equal to the preset voltage difference value threshold value, namely the difference value is within the acceptable range, the connection between the two pins to be detected can be considered to accord with the normal welding condition, if the difference value of the two voltage values is larger than the preset voltage difference value threshold value, the connection between the two pins to be detected can be considered not to accord with the normal welding condition, and therefore the final detection result of the welding condition of the circuit element can be obtained. The preset voltage difference value threshold can be flexibly set according to actual detection requirements, and the smaller the value is, the higher the precision requirement on the detection result is.
According to the embodiment of the application, the detection accuracy, the detection efficiency and the product yield of the circuit element pin welding condition can be improved by the detection method, and the manual detection and rework cost is reduced.
In an embodiment of the application, the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
The sampling resistor of the embodiment of the application can be an adjustable resistor with a resistance value capable of being adjusted according to actual detection requirements, and further can be suitable for detection of various circuit elements. Specifically, the resistance value of the sampling resistor to be set can be determined according to the pin to be detected of the circuit element, the resistance value of the adjustable resistor is adjusted to the corresponding resistance value in advance before detection and is fixed, and the resistance value is determined after the pin to be detected is determined due to constant current, so that the voltage drop of the two ends of the sampling resistor can be obtained, subsequent comparison is facilitated, and the accuracy of detection is improved.
Of course, the sampling resistor can also be a constant-resistance resistor, and the sampling resistor with a proper resistance value can be directly selected to be connected into the detection access according to actual detection requirements before detection, so that the adjustment of the resistance value is not needed, and the detection flow is simplified. Specifically, how to select the sampling resistor is flexibly set by a person skilled in the art according to actual requirements, and is not specifically limited herein.
In addition, the sampling resistor is connected in series in the detection path, so that the welding condition of the pin to be detected of the circuit element can be detected in a mode of detecting the voltage drop at two ends of the sampling resistor.
In one embodiment of the present application, the reference voltage is obtained by means of keyboard input.
The theoretical voltage drop of the embodiment of the application, namely the reference voltage, can be obtained by a user through a keyboard manual input mode, and further the actual setting requirement of the user on the reference voltage can be met. In addition, because the reference voltage is input in the detection process, the reference voltage does not need to be stored in advance, and further certain storage space can be saved.
Certainly, theoretical voltage drops of two ends of the sampling resistor of the two pins to be detected in the detection path under the normal welding condition can be defined in advance and stored, and the corresponding theoretical voltage drops are directly called according to the pins to be detected during detection, so that manual input by a user every time is not needed, and the detection efficiency and the automation of the detection process are improved.
In an embodiment of the present application, if a current loop is not formed between two pins to be detected under a normal welding condition, the obtained reference voltage is equal to zero; if a current loop is formed between the two pins to be detected under the normal welding condition, the obtained reference voltage is equal to the product of the constant current and the resistance value of the sampling resistor.
Specifically, the normal welding condition between the two pins to be detected in the embodiment of the present application may include the following two conditions: one is that a current loop is not formed between two pins to be detected under the normal welding condition, and because the current loop cannot be formed, the current value in the detection path where the two pins to be detected are located is zero, so that the theoretical voltage drop of the two ends of the sampling resistor of the two pins to be detected in the detection path under the normal welding condition is equal to zero. And when the detection path forms a closed current loop, the theoretical voltage drop of two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected is equal to the product of the magnitude of the constant current and the resistance value of the sampling resistor.
For example, in the first case, the two pins to be detected may be a power pin and a ground pin, respectively, or a communication pin and other functional pins adjacent to the communication pin, and under a normal welding condition, the power pin and the ground pin should not be electrically connected, that is, a current loop is not formed, and the communication pin and the other functional pins adjacent to the communication pin should not form a current loop; for the second case, one of the two pins to be detected may be a chip pin, and the other one may be a pin formed by a solder joint of the chip pin on the circuit board.
In one embodiment of the present application, the method further comprises: and storing the detection result of the welding condition between the two pins to be detected so as to perform data statistical analysis on the detection result, and/or displaying the detection result of the welding condition between the two pins to be detected through a display interface so as to display the detection result to a user.
Specifically, in order to perform statistical analysis on the welding conditions between the pins in the circuit element subsequently, the detection result of the welding conditions between the pins to be detected may also be stored. In addition, in order to enable a user to obtain a detection result of the welding condition between the pins to be detected in time, the detection result can be displayed through a display interface such as an LCD display screen, and the user can visually obtain the detection result.
To illustrate in more detail the specific principles of the circuit component soldering condition detection method of the present application, the following three application scenarios are provided for further explanation.
The first situation is as follows: the two pins to be detected are a power supply pin and a ground pin respectively. Welding abnormity is formed between the power supply pin and the ground pin, the abnormity is most obvious in performance on products, the chip cannot be powered on directly, and the chip does not work.
As shown in FIG. 3, the device Pinx is set as the power pin VDD, and the device Piny is set as the ground pin GND. The reference voltage is input through the keyboard S1, and corresponds to the case where the resistance is infinite, and the reference voltage is 0. After acquiring the reference voltage, the control unit MCU may correspond the input to the reference situation a 1.
Two connecting terminals are designed in the detection path and used as an interface channel m, one connecting terminal is used for connecting a power supply pin VDD, and the other connecting terminal is used for connecting a ground pin GND. A constant current value, denoted as I, is input from the power supply pin VDD1，I1Flows through one end of the interface channel m in sequence and flows through the sampling resistor R1Flows through the other end of the interface channel m and the ground pin GND to form a detection path, and then the sampling resistor R1Has a fixed voltage drop across it, the control unit MCU will note the detected voltage drop as V1This input may be referred to as sample case B1. Comparing the sampling condition B1 with the reference condition A1 in the control unit MCU to judge when V is1At 0, the sample condition B1 is equivalent to the reference condition A1, i.e., no current loop is formed between the power pin VDD and the ground pin GND, indicating that the welding is normal when V1Is I1*R1The sampling case B1 is not equivalent to the reference case a1, and a current loop is formed between the power pin VDD and the ground pin GND, indicating that a short circuit abnormality occurs between the two pins.
Case two: the two pins to be detected are respectively a communication pin and other functional pins adjacent to the communication pin. When the communication pin and other functional pins adjacent to the communication pin are welded abnormally, other signals are superposed on the communication signal, and the communication is abnormal due to interference on normal communication.
As shown in fig. 3, the component Pinx is set as the communication pin IOx, and the component Piny is set as the other function pin IOy adjacent to the communication pin IOx. The reference voltage is input through the keyboard S1, and corresponds to the case where the resistance is infinite, and the reference voltage is 0. After acquiring the reference voltage, the control unit MCU may correspond the input to the reference situation a 2.
The detection path is designed with two connection terminals as an interface channel m, one connection terminal is used for connecting the communication pin IOx, and the other connection terminal is used for connecting other function pins IOy adjacent to the communication pin IOx. A constant current value, denoted as I, is input from communication pin IOx2，I2Flows through one end of the interface channel m in sequence and flows through the sampling resistor R2Flows through the other end of the interface channel m and the other function pin IOy to form a detection path, and then the sampling resistor R can be detected2Has a fixed voltage drop across it, the control unit MCU will note the detected voltage drop as V2This input may be referred to as sample case B2. Comparing the sampling condition B2 with the reference condition A2 in the control unit MCU to judge when V is2At 0, the sample condition B2 is equivalent to the reference condition A2, i.e., no current loop is formed between the communication pin IOx and the other function pin IOy, indicating that the weld is normal when V2Is I2*R2The sampling case B2 is not identical to the reference case a2, and a current loop is formed between the communication pin IOx and the other functional pin IOy, indicating that a short circuit abnormality occurs between the two pins.
Case three: the two pins to be detected are respectively the chip pins and the corresponding welding spot pins of the chip pins on the circuit. The chip pin and the pin corresponding to the welding point of the chip pin on the circuit are in cold joint, which is common in production and can cause the function of the chip part to be abnormal.
As shown in fig. 3, a component Pinx is a chip pin IOm, and a component Piny is a pad pin Point m corresponding to the chip pin on the circuit board. A reference voltage, in this case equal to the product of the magnitude of the constant current and the resistance of the sampling resistor, is input through the keyboard S1. After acquiring the reference voltage, the control unit MCU may correspond the input to the reference situation a 3.
Two connecting terminals are designed in the detection path and serve as an interface channel m, one connecting terminal is used for connecting a chip pin IOm, and the other connecting terminal is used for connecting a welding Point pin Point m corresponding to the chip pin. A constant current value, denoted as I, is input from chip pin IOm3，I3Flows through one end of the interface channel m in sequence and flows through the sampling resistor R3The other end of the interface channel m and the welding Point pin Point m form a detection path, and the sampling resistor R can be detected3Has a fixed voltage drop across it, the control unit MCU will note the detected voltage drop as V3This input may be referred to as sample case B3. Comparing the sampling condition B3 with the reference condition A3 in the control unit MCU to judge when V is3Is I3*R3When the sampling case B3 is equal to the reference case A3, a current loop is formed between the chip pin IOm and the pad pin Point m, indicating that the bonding is normal when V3When the value is 0, the sampling condition B3 is not the same as the reference condition A3, and no current loop is formed between the chip pin IOm and the pad pin Point m, indicating that the cold joint of the chip pin IOm is abnormal.
The method for detecting the welding condition of the circuit element belongs to the same technical concept as the method for detecting the welding condition of the circuit element, and the embodiment of the application also provides a device for detecting the welding condition of the circuit element. Fig. 4 shows a block diagram of a circuit component soldering condition detecting apparatus according to an embodiment of the present application, and referring to fig. 4, the circuit component soldering condition detecting apparatus 400 includes: an interface unit 410, a detection unit 420, a reference input unit 430 and a control unit 440. Wherein the content of the first and second substances,
an interface unit 410 including two connection terminals for connecting two pins to be detected of the circuit element;
the detection unit 420 comprises a sampling resistor, the sampling resistor is connected with the two connecting terminals of the interface unit in series, constant current is input from one pin to be detected and sequentially flows through the sampling resistor and the other pin to be detected to form a detection path, and the detection unit 420 is used for acquiring the actual voltage drop of the two ends of the sampling resistor in the detection path and outputting the actual voltage drop as sampling voltage to the control unit;
the reference input unit 430 is configured to obtain a theoretical voltage drop of two ends of the sample resistor in the detection path under a normal welding condition of the two pins to be detected, and output the theoretical voltage drop as a reference voltage to the control unit;
the control unit 440 is configured to compare the sampled voltage with a reference voltage value, obtain a detection result that the welding condition between the two pins to be detected is normal if a difference between the two is within a preset voltage difference threshold, and obtain a detection result that the welding condition between the two pins to be detected is abnormal if the difference between the two is greater than the preset voltage difference threshold.
In an embodiment of the application, the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
In an embodiment of the present application, the reference input unit 430 includes a keyboard, and the reference input unit obtains the reference voltage by means of keyboard input.
In an embodiment of the present application, if a current loop is not formed between two pins to be detected under a normal welding condition, the reference voltage obtained by the reference input unit is equal to zero; if a current loop is formed between the two pins to be detected under the normal welding condition, the reference voltage obtained by the reference input unit is equal to the product of the constant current and the resistance value of the sampling resistor.
As shown in fig. 5, there is provided a block diagram of another circuit component welding condition detecting apparatus, which is mainly composed of an interface unit 410, a detecting unit 420, a reference input unit 430, a control unit 440, a storage unit 450, a display unit 460, a power supply unit 470, and the like.
Wherein the content of the first and second substances,
the interface unit 410 is used for setting and distinguishing specific detection signal names, for example, the interface channel m is used for detecting the communication condition between the power pin VDD and the ground pin GND.
And a detection unit 420 connected to the interface unit 410 and the control unit 440, for receiving a signal from the interface unit and outputting a detection signal to the control unit 440.
The reference input unit 430 is connected to the control unit 440, and is used for outputting a reference signal given by a user to the control unit 440.
The control unit 440 is a main control unit, and an MCU chip may be used herein, and is responsible for collecting the signal from the reference input unit 430 as a reference signal given by a user, collecting the signal from the detection unit 420 as an actual measurement signal, comparing the given reference signal with the actual measurement signal to obtain a detection result, and outputting the detection result to the storage unit 450 for storage, so as to allow for historical result lookup and statistical analysis, and further outputting the detection result to the display unit 460 after internal programming to visually display the detection result.
The storage unit 450 is connected to the control unit 440, and is configured to store the detection result of the welding condition between the two pins to be detected, which is output by the control unit 440, so as to perform data statistics and analysis on the detection result.
And the display unit 460 is connected with the control unit 440 and is used for displaying the detection result of the welding condition between the two pins to be detected through a display interface and visually presenting the detection result to a user. For example, PASS is displayed when the detection result is normal, and NG is displayed when the detection result is abnormal.
And the power supply unit 470, connected to the detection unit 420, the reference input unit 430, the control unit 440, the storage unit 450 and the display unit 460, is used for providing electrical signals for each functional unit to ensure the normal operation of each functional unit.
It should be noted that:
fig. 6 illustrates a schematic structural diagram of an electronic device. Referring to fig. 6, at a hardware level, the electronic device includes a memory and a processor, and optionally further includes an interface module, a communication module, and the like. The Memory may include a Memory, such as a Random-Access Memory (RAM), and may also include a non-volatile Memory, such as at least one disk Memory. Of course, the electronic device may also include hardware required for other services.
The processor, the interface module, the communication module, and the memory may be connected to each other via an internal bus, which may be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one double-headed arrow is shown in FIG. 6, but that does not indicate only one bus or one type of bus.
A memory for storing computer executable instructions. The memory provides computer executable instructions to the processor through the internal bus.
A processor executing computer executable instructions stored in the memory and specifically configured to perform the following operations:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected and flows through the sampling resistor and the other pin to be detected in sequence to form a detection path;
acquiring actual voltage drops of two ends of a sampling resistor in a detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of two pins to be detected and recording the theoretical voltage drops as reference voltages;
and comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is normal, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is abnormal.
The functions performed by the circuit component welding condition detection device disclosed in the embodiment of fig. 4 of the present application may be implemented in or by a processor. The processor may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware in a processor or instructions in the form of software. The Processor may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components. The various methods, steps, and logic blocks disclosed in the embodiments of the present application may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of the method disclosed in connection with the embodiments of the present application may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in a memory, and a processor reads information in the memory and completes the steps of the method in combination with hardware of the processor.
The electronic device may further perform the steps performed by the method for detecting the soldering condition of the circuit component in fig. 2, and implement the functions of the method for detecting the soldering condition of the circuit component in the embodiment shown in fig. 2, which are not described herein again.
Embodiments of the present application also provide a computer-readable storage medium storing one or more programs which, when executed by a processor, implement the aforementioned circuit element welding condition detection method, and are specifically configured to perform:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one of the pins to be detected and flows through the sampling resistor and the other pin to be detected in sequence to form a detection path;
acquiring actual voltage drops of two ends of a sampling resistor in a detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of two pins to be detected and recording the theoretical voltage drops as reference voltages;
and comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is normal, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is abnormal.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.
The present application is described in terms of flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In a typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include forms of volatile memory in a computer readable medium, Random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of a computer-readable medium.
Computer-readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) characterized by computer-usable program code.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A method for detecting a soldering condition of a circuit member, comprising:
a sampling resistor is connected in series between two pins to be detected of the circuit element, a constant current is input from one pin to be detected and flows through the sampling resistor and the other pin to be detected in sequence to form a detection path;
acquiring actual voltage drops of two ends of the sampling resistor in the detection path and recording the actual voltage drops as sampling voltages, and acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected and recording the theoretical voltage drops as reference voltages;
and comparing the sampling voltage with the reference voltage, if the difference value of the sampling voltage and the reference voltage is within a preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is normal, and if the difference value of the sampling voltage and the reference voltage is greater than the preset voltage difference value threshold value, obtaining a detection result that the welding condition between the two pins to be detected is abnormal.
2. The method according to claim 1, wherein the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
3. The method of claim 1, wherein the reference voltage is obtained by means of a keyboard input.
4. The method of claim 1,
if a current loop is not formed between the two pins to be detected under the normal welding condition, the obtained reference voltage is equal to zero;
if a current loop is formed between the two pins to be detected under the normal welding condition, the obtained reference voltage is equal to the product of the constant current and the resistance value of the sampling resistor.
5. The method of claim 1, further comprising:
storing the detection result of the welding condition between the two pins to be detected so as to perform data statistical analysis on the detection result, and/or,
and displaying the detection result of the welding condition between the two pins to be detected through a display interface so as to show the detection result to a user.
6. A circuit component welding condition detection device is characterized by comprising an interface unit, a detection unit, a reference input unit and a control unit: wherein the content of the first and second substances,
the interface unit comprises two connecting terminals for connecting two pins to be detected of the circuit element;
the detection unit comprises a sampling resistor, the sampling resistor is connected with the two connecting terminals of the interface unit in series, constant current is input from one pin to be detected and sequentially flows through the sampling resistor and the other pin to be detected to form a detection path, and the detection unit is used for acquiring the actual voltage drop of the two ends of the sampling resistor in the detection path and outputting the actual voltage drop as sampling voltage to the control unit;
the reference input unit is used for acquiring theoretical voltage drops of two ends of the sampling resistor in the detection path under the normal welding condition of the two pins to be detected, and outputting the theoretical voltage drops as reference voltages to the control unit;
the control unit is used for comparing the sampling voltage with the reference voltage value, obtaining a detection result that the welding condition between the two pins to be detected is normal if the difference value between the sampling voltage and the reference voltage value is within a preset voltage difference value threshold, and obtaining a detection result that the welding condition between the two pins to be detected is abnormal if the difference value between the sampling voltage and the reference voltage value is greater than the preset voltage difference value threshold.
7. The device according to claim 6, wherein the sampling resistor is an adjustable resistor, and the resistance value of the adjustable resistor is adjusted and fixed according to the two pins to be detected.
8. The apparatus according to claim 6, wherein the reference input unit comprises a keyboard, and the reference input unit obtains the reference voltage by means of keyboard input.
9. The apparatus of claim 6,
if a current loop is not formed between the two pins to be detected under the normal welding condition, the reference voltage acquired by the reference input unit is equal to zero;
if a current loop is formed between the two pins to be detected under the normal welding condition, the reference voltage acquired by the reference input unit is equal to the product of the constant current and the resistance value of the sampling resistor.
10. The apparatus of claim 6, further comprising:
a storage unit for storing the detection result of the welding condition between the two pins to be detected, so as to perform data statistical analysis on the detection result, and/or,
and the display unit is used for displaying the detection result of the welding condition between the two pins to be detected through a display interface so as to show the detection result to a user.
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