CN110261759A - A kind of damage detection system of chip pin - Google Patents
A kind of damage detection system of chip pin Download PDFInfo
- Publication number
- CN110261759A CN110261759A CN201910576249.XA CN201910576249A CN110261759A CN 110261759 A CN110261759 A CN 110261759A CN 201910576249 A CN201910576249 A CN 201910576249A CN 110261759 A CN110261759 A CN 110261759A
- Authority
- CN
- China
- Prior art keywords
- pin
- chip
- damage
- measured
- sampling resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
- G01R19/16566—Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533
- G01R19/1659—Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533 to indicate that the value is within or outside a predetermined range of values (window)
- G01R19/16595—Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533 to indicate that the value is within or outside a predetermined range of values (window) with multi level indication
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of damage detection system of chip pin, the damage detection system includes detection module, signal processing module, sampling resistor and reference power supply module;The ground terminal of the reference power supply module connects the ground pin of chip to be measured, and the voltage output end of reference power supply module connects one end of the sampling resistor, and the other end of the sampling resistor connects the pin to be measured of the chip to be measured;The signal processing module is used to acquire the sampled voltage of the other end of the reference voltage and the sampling resistor, and damage-assessment data is generated according to the resistance value of the reference voltage, the sampled voltage and the sampling resistor, the detection module is also used to receive the damage-assessment data, and the damage-assessment data is compared with preset threshold, if the difference of damage-assessment data and preset threshold is more than preset difference value, it is determined that pin to be measured damages.Technical solution of the present invention can effectively improve detection efficiency, save testing cost.
Description
Technical field
The present invention relates to semiconductor detection technique field more particularly to a kind of damage detection systems of chip pin.
Background technique
With the development of science and technology, semicon industry has obtained development at full speed, from first piece of silicon integrated circuit of nineteen sixty
Be born the extensive use of nanometer technology by now, also promote semicon industry towards the volume of integrated circuit smaller and smaller, chip
The lower and lower direction of power consumption is developed, but semiconductor chip is also faced with antistatic capacity reduction, chip pin rapid wear simultaneously
Bad risk, this status are especially protruded in the highly integrated communications industry.
In the prior art, before semiconductor chip factory, whether met the requirements generally by the function of measurement chip
Whether the pin to judge chip is normal, but for some specifically functional test, will not usually use whole
Pin, that is to say, that certain pins cannot participate in a certain specifically functional test, accordingly, for once specifically functional test
Process can not cover all pins of chip, if desired the pin of measurement chip as much as possible, it is necessary to carry out repeatedly different
Functional test, greatly waste resource.In addition, being surveyed if functional test notes abnormalities due to there is multiple pins to participate in function
Examination, thus be also difficult that the pin damaged is accurately positioned.
Summary of the invention
The technical problem to be solved by the present invention is to damage to overcome fast and accurately position in the prior art
Chip pin defect, a kind of damage detection system of chip pin is provided.
The present invention is to solve above-mentioned technical problem by following technical proposals:
A kind of damage detection system of chip pin, the damage detection system include detection module, signal processing module,
Sampling resistor and reference power supply module;The ground terminal of the reference power supply module connects the ground pin of chip to be measured, described
The voltage output end of reference power supply module for outputting reference voltage to one end of the sampling resistor, the sampling resistor it is another
One end connects the pin to be measured of the chip to be measured;
The signal processing module is used to acquire the sampling electricity of the other end of the reference voltage and the sampling resistor
Pressure, and damage-assessment data is generated according to the resistance value of the reference voltage, the sampled voltage and the sampling resistor;
The detection module for receiving the damage-assessment data, and by the damage-assessment data and preset threshold into
Row compares, if the difference of the damage-assessment data and the preset threshold is more than preset difference value, it is determined that the pin to be measured
It damages.
Preferably, the damage-assessment data includes sample rate current, the preset threshold includes predetermined current threshold, described
Preset difference value includes the first preset difference value;
The signal processing module is used for the resistance according to the reference voltage, the sampled voltage and the sampling resistor
Value generates the sample rate current, and the detection module is used to for the sample rate current being compared with the predetermined current threshold,
If the difference of the sample rate current and the predetermined current threshold is more than first preset difference value, it is determined that the pin to be measured
It damages.
Preferably, the damage-assessment data includes assessment slope, the preset threshold includes default slope threshold value, described
Preset difference value includes the second preset difference value;
The voltage output end of the reference power supply module is used to export multiple reference voltages of different voltages grade, institute
Signal processing module is stated for acquiring each reference voltage and its corresponding sampled voltage, and according to the benchmark electricity
The resistance value of pressure, the sampled voltage and the sampling resistor generates the assessment slope;
The detection module is for the assessment slope to be compared with the default slope threshold value, if the assessment is oblique
The difference of rate and the default slope threshold value is more than second preset difference value, it is determined that the pin to be measured damages.
Preferably, the detection module is also used to generate prompt information, the prompt information is described to test tube for showing
The raw damage of human hair combing waste;
And/or
The pin to be measured is at least one of power pin, signal input tube foot and signal output pin.
Preferably, the detection module is also used to for the prompt information being sent to pre- after the prompt information generates
The customer mobile terminal first bound.
Preferably, the signal processing module includes single-chip microcontroller and operational amplifier, the first of the operational amplifier
Input terminal connects one end of the sampling resistor, and the second input terminal of the operational amplifier connects the another of the sampling resistor
End, the operational amplifier is for amplifying the voltage difference of the reference voltage and the sampled voltage, the operation
The amplified voltage difference is sent to the data collection terminal mouth of the single-chip microcontroller by the output end of amplifier, the single-chip microcontroller
Data-out port exports the damage-assessment data to the detection module.
Preferably, the chip to be measured includes multiple pins to be measured, the damage detection system further includes switch chip, institute
Stating switch chip includes gating control pin and multiple signal acquisition pins;
Each described signal acquisition pin is connected respectively the pin to be measured, the switch chip it is public
Pin connects the other end of the sampling resistor, and the gating control pin is used to receive the selection control of the detection module output
Signal processed, the switch chip are used to be attached according to the determining other end with the sampling resistor of selection control signal
The pin to be measured.
Preferably, the switch chip includes main switch chip and auxiliary switch chip, the public affairs of the main switch chip
Condominium foot connects the other end of the sampling resistor, and the signal acquisition pin of the main switch chip connects the auxiliary switch core
The signal acquisition pin of the common pin of piece, the auxiliary switch chip connects the pin to be measured.
Preferably, the reference power supply module is programmable power supply, the programmable power supply passes through asynchronous receiving-transmitting transmitter and institute
Detection module connection is stated,
And/or
The detection module is the end PC.
Preferably, the damage detection system further includes power supply module, the power supply module is used to be the signal processing
Module provides operating voltage.
Preferably, the power supply module is linear voltage regulator.
On the basis of common knowledge of the art, above-mentioned each optimum condition, can any combination to get each preferable reality of the present invention
Example.
The positive effect of the present invention is that: the present invention connects chip to be measured using the ground terminal of reference power supply module
Ground pin, and the reference power supply module voltage output end connection sampling resistor one end, the sampling resistor it is another
One end connects the pin to be measured of chip to be measured, so as to treat using pin to be measured as load, and pin to be measured and benchmark
Power module and sampling resistor constitute current loop, and the signal processing module is according to the voltage bad student at sampling resistor both ends
At damage-assessment data, next, the damage-assessment data is compared with preset threshold using detection module, with judgement
Whether the pin to be measured damages.Thus, it is possible to the comprehensive and accurate pin to chip to be measured carries out damage check, and
The pin damaged can be accurately positioned, effectively increase detection efficiency, saved testing cost.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the damage detection system of chip pin of present pre-ferred embodiments.
Specific embodiment
The present invention is further illustrated below by the mode of embodiment, but does not therefore limit the present invention to the reality
It applies among a range.
A kind of damage detection system of chip pin is present embodiments provided, as shown in Figure 1, the damage detection system can
To include detection module 3, signal processing module 7, sampling resistor R and reference power supply module 5, the reference power supply module 5
Ground terminal GND1 connects the ground pin GND2 of chip 6 to be measured, the voltage output end Vout1 connection of the reference power supply module 5
One end of the sampling resistor R, i.e., the voltage output end Vout1 of the described reference power supply module 5 is for outputting reference voltage to institute
One end of sampling resistor R is stated, the other end of the sampling resistor R connects the pin to be measured of the chip to be measured 6.
The ground terminal GND1 of the reference power supply module 5 can be the form of binding post or the form of pin.
The reference power supply module 5, the pin to be measured and the sampling resistor R constitute current loop, and institute
State the load that pin to be measured is considered as in the current loop.
Specifically, the pin to be measured can be power pin, signal input tube foot or signal output pin etc., this implementation
Example to this with no restriction.
The signal processing module 7 can be used for acquiring the reference voltage and the other end of the sampling resistor R
Sampled voltage, and lesion assessment number is generated according to the resistance value of the reference voltage, the sampled voltage and the sampling resistor R
According to the detection module 3 compares the damage-assessment data with preset threshold for receiving the damage-assessment data
Compared with if the difference of the damage-assessment data and the preset threshold is more than preset difference value, it is determined that the pin to be measured occurs
Damage.
In the present embodiment, the detection module 3 can be the end PC.
Specifically, the chip to be measured 6 can be the chip of any type and purposes with pin, for example, communication core
Piece, analog-digital chip etc..The pin to be measured occurs damage and refers to because of Electro-static Driven Comb (ESD) phenomenon in circuit and excessively electric
The impedance of pin to be measured caused by the reasons such as stress (EOS) changes.The type of the damage may include short circuit, open circuit or
Person half damages, wherein although half damage refers to that the pin to be measured can also transmit data, the impedance of pin to be measured is
It is obviously changed, and has resulted in the chip functions and be abnormal.
Further, the detection module 3 can also generate prompt information, and the prompt information is described to be measured for showing
Pin has damaged.The prompt information can be graphics packages block message, text information or voice messaging, for example, when inspection
After survey module 3 determines that the pin to be measured damages, red color lump is shown on the display screen of the detection module 3, or
The related text or the detection module 3 of the display screen display " damage " of the detection module 3 generate simple sound text
Part, the audio files can be the voice etc. of buzzing prompt tone or machine casting.
Further, after the prompt information generates, the detection module 3 is also used to for the prompt information being sent to
The customer mobile terminal bound in advance.The detection module 3 can send the prompt information by the way of wired or wireless.
Specifically, the customer mobile terminal can be mobile phone or ipad (tablet computer) etc., and the embodiment of the present invention is to this
With no restrictions.
Preferably, the reference power supply module 5 can be programmable power supply, and the programmable power supply can be passed by asynchronous receiving-transmitting
Defeated device 4 (UART) connect with the detection module 3, and the detection module 3 can control institute by the asynchronous receiving-transmitting transmitter 4
State the voltage value of the voltage output end Vout1 output of programmable power supply.
In the present embodiment, the signal processing module 7 can specifically include single-chip microcontroller 71 and operational amplifier 72, described
The first input end of operational amplifier 72 connects one end of the sampling resistor R, the second input terminal of the operational amplifier 72
The other end of the sampling resistor R is connected, the operational amplifier 72 is used for the reference voltage and the sampled voltage
Voltage difference amplify, the amplified voltage difference is sent to the single-chip microcontroller by the output end of the operational amplifier 72
71 data collection terminal mouth ADC, the data-out port of the single-chip microcontroller 71 export the damage-assessment data to the detection
Module 3.
Specifically, the single-chip microcontroller 71 can be commented the damage by USB (universal serial bus) interface or serial ports
Estimate data and uploads to detection module 3.
Since the output end of the operational amplifier 72 is sent to described in the data collection terminal mouth ADC of the single-chip microcontroller 71
Voltage difference data is analog signal, then the single-chip microcontroller 71 needs the analog signal being converted to digital signal, and utilizes
The digital signal calculates the damage-assessment data.
In the present embodiment, the single-chip microcontroller 71 can use existing type in the prior art, such as: MCS-51 series type
Number single-chip microcontroller or the single-chip microcontroller of MSP430 model etc..When running the damage detection system, can shift to an earlier date in single-chip microcontroller
Calculation procedure required for burning or downloading are completed in 71.
Multiple pins to be measured, the damage detection system, which can also include opening, to be included the case where for the chip 6 to be measured
Close chip 8, the switch chip 8 include gating control pin (S0, S1, S2, S3) and multiple signal acquisition pins (I0,
I1,……,I16);Each signal acquisition pin (I0, I1 ..., I16) be connected respectively one described in test tube
Foot, the common pin COM of the switch chip 8 connect the second input terminal of the operational amplifier 72, the gating control pipe
Foot (S0, S1, S2, S3) is used to receive the selection control signal that the single-chip microcontroller 71 exports, and the switch chip 8 is used for according to institute
It states selection control signal and determines the pin to be measured communicated with the second input terminal of the operational amplifier 72.
For example, multiple control signal output pin (GP1O_0, GP1O_1, GP1O_ has can be set in the single-chip microcontroller 71
2 ..., GP1O_67), each switch chip 8 may include four gating controls pin (S0, S1, S2, S3), single
Every four control signal output pin of piece machine 71 can be connected respectively four gatings control pin of a switch chip 8
16 (i.e. 0000-1111) a objects may be implemented in (S0, S1, S2, S3), this four gating controls pin (S0, S1, S2, S3)
Gating, accordingly, the signal acquisition pin is also 16, if only with 8,16 signal behavior pins of a switch chip
16 pins to be measured can be correspondingly connected with.If the quantity of pin to be measured is greater than 16, multiple switch chip 8 can be set (i.e.
Main switch chip and auxiliary switch chip), specifically, the signal acquisition pin of the main switch chip (I0, I1 ...,
I16 the common pin COM that) can connect the auxiliary switch chip for playing dilatation of same model recycles the auxiliary to open
Signal acquisition pin (I0, I1 ..., I16) the connection pin to be measured for closing chip, in the testing efficiency of the damage detection system
It, can be according to the usage quantity of the flexible expansion switch chip 8 of actual test demand under the premise of meeting the requirements.
The switch chip 8 can select the chip of CD4067BE model, which may be implemented 16 road gating switches
Function.
In the present embodiment, the damage detection system can also include power supply module 1, and the power supply module 1 can be used for
Operating voltage is provided for the single-chip microcontroller 71 and the switch chip 8.
The power pin VCC connection of the voltage output end Vout2 and single-chip microcontroller of the power supply module, the power supply module
The ground pin GND4 connection of ground terminal GND3 and single-chip microcontroller.The ground terminal GND3 of the power supply module can be the shape of binding post
The form of formula or pin.
The ground terminal GND3 of the power supply module and the ground pin GND4 of single-chip microcontroller can connect identical logical signal
Ground terminal.In addition, the power pin (not shown) of the switch chip 8 can also be with the voltage output end of the power supply module 1
Vout2 connection, to receive the operating voltage that the power supply module 1 provides.
Preferably, the power supply module 1 can select linear voltage regulator, and the linear voltage regulator can be provided substantially without wave
Dynamic stable operating voltage, and influenced by environment temperature smaller, it can guarantee the stable power-supplying fortune of entire detection system
Row.In addition, the single-chip microcontroller 71 and the switch chip 8 can also receive what the detection module 3 provided by USB interface
Operating voltage.
The detection module 3 can also generate detection log, and the detection Log Shipping to server 2 is protected
It deposits, in order to subsequent inquiry.The detection log may include ID (mark), the pin to be measured for detecting date, chip to be measured 6
Number and pin to be measured corresponding to damage-assessment data etc..
In a concrete application scene, such as: the damage-assessment data includes sample rate current, the preset threshold packet
Predetermined current threshold is included, the preset difference value includes the first preset difference value;
The signal processing module 7 is used for according to the reference voltage, the sampled voltage and the sampling resistor R
Resistance value generates the sample rate current, and the detection module 3 is for comparing the sample rate current and the predetermined current threshold
Compared with if the difference of the sample rate current and the predetermined current threshold is more than first preset difference value, it is determined that described to be measured
Pin damages.
Specifically, the predetermined current threshold can be the corresponding electric current of not damaged pin to be measured, which can be used as
Benchmark electric current corresponding with the pin to be measured damaged is compared, since reference voltage is known definite value (by program-controlled electric
Source provides), the resistance value of sampling resistor R is also known definite value, then the sample rate current can reflect the resistance of pin to be measured
Anti- variation, and the variation of impedance can directly correspond to pin to be measured that there is a situation where damage.
In another concrete application scene, such as: the damage-assessment data includes assessment slope, the preset threshold
Including presetting slope threshold value, the preset difference value includes the second preset difference value;
The voltage output end Vout1 of the reference power supply module 5 is used to export multiple benchmark of different voltages grade
Voltage (such as: the different voltages within the scope of ± 500mV), the signal processing module 7 is for acquiring each reference voltage
And its corresponding sampled voltage, and according to the resistance value of the reference voltage, the sampled voltage and the sampling resistor R
Generate the assessment slope;
The detection module 3 is for the assessment slope to be compared with the default slope threshold value, if the assessment
The difference of slope and the default slope threshold value is more than second preset difference value, it is determined that the pin to be measured damages.
Specifically, the assessment slope is slope possessed by reference voltage-sample rate current curve.For one to test tube
For foot, by multiple groups reference voltage-sample rate current data come its degree of impairment of W-response, testing result can be made more
Accurately.
The present embodiment connects the ground pin of chip to be measured, and benchmark electricity using the ground terminal of reference power supply module
Source module voltage output end connection sampling resistor one end, the other end of the sampling resistor connect chip to be measured to test tube
Foot, so as to treat using pin to be measured as load, and pin to be measured and reference power supply module and sampling resistor are constituted
The voltage difference of current loop, signal processing module sampling resistor both ends generates damage-assessment data, next, utilizing inspection
It surveys module 3 to be compared the damage-assessment data with preset threshold, to judge whether the pin to be measured damages.By
This, can carry out damage check with the comprehensive and accurate pin to chip to be measured, and can be accurately positioned the pin damaged,
Detection efficiency is effectively increased, testing cost has been saved.
Although specific embodiments of the present invention have been described above, it will be appreciated by those of skill in the art that this is only
For example, protection scope of the present invention is to be defined by the appended claims.Those skilled in the art without departing substantially from
Under the premise of the principle and substance of the present invention, many changes and modifications may be made, but these change and
Modification each falls within protection scope of the present invention.
Claims (11)
1. a kind of damage detection system of chip pin, which is characterized in that the damage detection system includes detection module, signal
Processing module, sampling resistor and reference power supply module;The ground terminal of the reference power supply module connects the ground connection of chip to be measured
Pin, the voltage output end of the reference power supply module for outputting reference voltage to one end of the sampling resistor, it is described to adopt
The other end of sample resistance connects the pin to be measured of the chip to be measured;
The signal processing module is used to acquire the sampled voltage of the other end of the reference voltage and the sampling resistor, and
Damage-assessment data is generated according to the resistance value of the reference voltage, the sampled voltage and the sampling resistor;
The detection module compares the damage-assessment data with preset threshold for receiving the damage-assessment data
Compared with if the difference of the damage-assessment data and the preset threshold is more than preset difference value, it is determined that the pin to be measured occurs
Damage.
2. the damage detection system of chip pin as described in claim 1, which is characterized in that the damage-assessment data includes
Sample rate current, the preset threshold include predetermined current threshold, and the preset difference value includes the first preset difference value;
The signal processing module is used for raw according to the resistance value of the reference voltage, the sampled voltage and the sampling resistor
At the sample rate current, the detection module is for the sample rate current to be compared with the predetermined current threshold, if institute
The difference for stating sample rate current and the predetermined current threshold is more than first preset difference value, it is determined that the pin to be measured occurs
Damage.
3. the damage detection system of chip pin as described in claim 1, which is characterized in that the damage-assessment data includes
Slope is assessed, the preset threshold includes default slope threshold value, and the preset difference value includes the second preset difference value;
The voltage output end of the reference power supply module is used to export multiple reference voltages of different voltages grade, the letter
Number processing module for acquiring each reference voltage and its corresponding sampled voltage, and according to the reference voltage,
The resistance value of the sampled voltage and the sampling resistor generates the assessment slope;
The detection module for the assessment slope to be compared with the default slope threshold value, if the assessment slope and
The difference of the default slope threshold value is more than second preset difference value, it is determined that the pin to be measured damages.
4. the damage detection system of chip pin as described in any one of claims 1-3, which is characterized in that
The detection module is also used to generate prompt information, and the prompt information is for showing that the pin to be measured damages;
And/or
The pin to be measured is at least one of power pin, signal input tube foot and signal output pin.
5. the damage detection system of chip pin as claimed in claim 4, which is characterized in that when the prompt information generates
Afterwards, the detection module is also used to the prompt information being sent to the customer mobile terminal bound in advance.
6. the damage detection system of chip pin as described in any one of claims 1-3, which is characterized in that the signal processing
Module includes single-chip microcontroller and operational amplifier, and the first input end of the operational amplifier connects the one of the sampling resistor
End, the second input terminal of the operational amplifier connect the other end of the sampling resistor, and the operational amplifier is used for institute
The voltage difference for stating reference voltage and the sampled voltage amplifies, and the output end of the operational amplifier is by amplified institute
The data collection terminal mouth that voltage difference is sent to the single-chip microcontroller is stated, the data-out port output damage of the single-chip microcontroller is commented
Data are estimated to the detection module.
7. the damage detection system of chip pin as described in any one of claims 1-3, which is characterized in that the chip to be measured
Including multiple pins to be measured, the damage detection system further includes switch chip, and the switch chip includes gating control pin
And multiple signal acquisition pins;
Each described signal acquisition pin is connected respectively the pin to be measured, the common pin of the switch chip
The other end of the sampling resistor is connected, the gating control pin is used to receive the selection control letter of the detection module output
Number, the switch chip is used for the institute being attached according to the determining other end with the sampling resistor of selection control signal
State pin to be measured.
8. the damage detection system of chip pin as claimed in claim 7, which is characterized in that the switch chip includes that master opens
Chip and auxiliary switch chip are closed, the common pin of the main switch chip connects the other end of the sampling resistor, described
The signal acquisition pin of main switch chip connects the common pin of the auxiliary switch chip, the signal of the auxiliary switch chip
It acquires pin and connects the pin to be measured.
9. the damage detection system of chip pin as described in any one of claims 1-3, which is characterized in that
The reference power supply module is programmable power supply, and the programmable power supply is connected by asynchronous receiving-transmitting transmitter and the detection module
It connects,
And/or
The detection module is the end PC.
10. the damage detection system of chip pin as described in any one of claims 1-3, which is characterized in that
The damage detection system further includes power supply module, and the power supply module is used to provide work for the signal processing module
Voltage.
11. the damage detection system of chip pin as claimed in claim 10, which is characterized in that the power supply module is linear
Voltage-stablizer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910576249.XA CN110261759B (en) | 2019-06-28 | 2019-06-28 | Chip pin damage detection system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910576249.XA CN110261759B (en) | 2019-06-28 | 2019-06-28 | Chip pin damage detection system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110261759A true CN110261759A (en) | 2019-09-20 |
CN110261759B CN110261759B (en) | 2021-05-07 |
Family
ID=67922907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910576249.XA Active CN110261759B (en) | 2019-06-28 | 2019-06-28 | Chip pin damage detection system |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110261759B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110988650A (en) * | 2019-11-22 | 2020-04-10 | 佳讯飞鸿(北京)智能科技研究院有限公司 | Track circuit state monitoring system and method |
CN112345982A (en) * | 2020-09-29 | 2021-02-09 | 歌尔科技有限公司 | Method and device for detecting welding condition of circuit element |
CN113589202A (en) * | 2020-04-30 | 2021-11-02 | 华为技术有限公司 | Detection circuit and detection device for charging interface |
CN113625155A (en) * | 2021-08-11 | 2021-11-09 | 湖南省计量检测研究院 | Multifunctional communication chip detection system based on big data |
CN116256623A (en) * | 2023-05-15 | 2023-06-13 | 成都爱旗科技有限公司 | Chip electrical characteristic analysis system and method based on volt-ampere characteristic curve |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120079261A (en) * | 2011-01-04 | 2012-07-12 | 주식회사 만도 | Apparatus and method for detecting a switch fault |
CN204289400U (en) * | 2014-12-10 | 2015-04-22 | 北京海泰方圆科技有限公司 | A kind ofly test the device that wafer nation determines break-make |
CN106338684A (en) * | 2016-11-09 | 2017-01-18 | 上海华力微电子有限公司 | Failure analysis method |
CN106526362A (en) * | 2016-10-25 | 2017-03-22 | 上海移远通信技术股份有限公司 | Test system of wireless communication module |
CN108510923A (en) * | 2018-03-30 | 2018-09-07 | 武汉精立电子技术有限公司 | A kind of detection liquid crystal module ID pins open the device of short circuit |
-
2019
- 2019-06-28 CN CN201910576249.XA patent/CN110261759B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120079261A (en) * | 2011-01-04 | 2012-07-12 | 주식회사 만도 | Apparatus and method for detecting a switch fault |
CN204289400U (en) * | 2014-12-10 | 2015-04-22 | 北京海泰方圆科技有限公司 | A kind ofly test the device that wafer nation determines break-make |
CN106526362A (en) * | 2016-10-25 | 2017-03-22 | 上海移远通信技术股份有限公司 | Test system of wireless communication module |
CN106338684A (en) * | 2016-11-09 | 2017-01-18 | 上海华力微电子有限公司 | Failure analysis method |
CN108510923A (en) * | 2018-03-30 | 2018-09-07 | 武汉精立电子技术有限公司 | A kind of detection liquid crystal module ID pins open the device of short circuit |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110988650A (en) * | 2019-11-22 | 2020-04-10 | 佳讯飞鸿(北京)智能科技研究院有限公司 | Track circuit state monitoring system and method |
CN113589202A (en) * | 2020-04-30 | 2021-11-02 | 华为技术有限公司 | Detection circuit and detection device for charging interface |
CN113589202B (en) * | 2020-04-30 | 2023-01-13 | 华为技术有限公司 | Detection circuit and detection device for charging interface |
CN112345982A (en) * | 2020-09-29 | 2021-02-09 | 歌尔科技有限公司 | Method and device for detecting welding condition of circuit element |
CN113625155A (en) * | 2021-08-11 | 2021-11-09 | 湖南省计量检测研究院 | Multifunctional communication chip detection system based on big data |
CN113625155B (en) * | 2021-08-11 | 2024-06-11 | 湖南省计量检测研究院 | Multifunctional communication chip detection system based on big data |
CN116256623A (en) * | 2023-05-15 | 2023-06-13 | 成都爱旗科技有限公司 | Chip electrical characteristic analysis system and method based on volt-ampere characteristic curve |
CN116256623B (en) * | 2023-05-15 | 2023-08-08 | 成都爱旗科技有限公司 | Chip electrical characteristic analysis system and method based on volt-ampere characteristic curve |
Also Published As
Publication number | Publication date |
---|---|
CN110261759B (en) | 2021-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110261759A (en) | A kind of damage detection system of chip pin | |
CN101084446A (en) | Method and system for generating signal for testing semiconductor device | |
CN101344566B (en) | Test device and method for detecting winding deformation of power transformer | |
CN101084445A (en) | Method and system for testing semiconductor device | |
CN102592068A (en) | Method for detecting malicious circuit in FPGA (field programmable gate array) chip by power consumption analysis and system thereof | |
IL187610A0 (en) | System and method for analyzing power flow in semiconductor plasma generation systems | |
BR0314032A (en) | Aircraft multifunction wire insulation and test device, and method of testing a cable comprising a plurality of lines | |
CN108572280A (en) | A kind of large range high precision explosive device resistance tester | |
CN109633419A (en) | A kind of chip detecting method based on ATE | |
CN104833942B (en) | Electric energy meter battery power consumption automonitor and application method | |
CN105116278B (en) | A kind of electric energy meter is visited one house after another wire searcher | |
CN1757193B (en) | Techniques for automatic eye-diagram degradation for testing of a high-speed serial receiver | |
CN114167132B (en) | Power consumption detection method and device of wireless terminal, electronic equipment and storage medium | |
CN102288817B (en) | A kind of charging pile consumption detection system and detection method based on virtual load calibrating | |
CN101452048B (en) | Integrated circuit chip temperature test device and method | |
CN100422752C (en) | Error factor acquisition device, method, program, and recording medium | |
CN116930846A (en) | Current transformer detection method, system, terminal and storage medium | |
CN105223495A (en) | A kind of method of testing of the Analog-digital circuit fault diagnosis based on expert system | |
CN108196211A (en) | A kind of number table automatic verification system | |
TR200101776T1 (en) | Device for testing cables equipped with plugs | |
JPWO2004083879A1 (en) | Test apparatus and setting method | |
CN201319063Y (en) | Detecting and analyzing device of relay protection testing device | |
CN206178072U (en) | TZ automatic probe station tester of 603B | |
CN101833028B (en) | Device convenient for testing output voltage of power supply | |
KR20030067890A (en) | Tester for mixed signal semiconductor device and method of testing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |