CN1738019A - Testing device for interconnection dependability estimation - Google Patents
Testing device for interconnection dependability estimation Download PDFInfo
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- CN1738019A CN1738019A CNA200410056184XA CN200410056184A CN1738019A CN 1738019 A CN1738019 A CN 1738019A CN A200410056184X A CNA200410056184X A CN A200410056184XA CN 200410056184 A CN200410056184 A CN 200410056184A CN 1738019 A CN1738019 A CN 1738019A
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- reference voltage
- constant
- module
- current source
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a real time, fast on-off evaluation test of weld spot according to the demand of weld spot reliability evaluation test system. The invention utilizes the following method-a testing device for evaluating the reliability of interconnection, comprises: a reference voltage adjusting module, plural constant-current sources, a digit signal channel board, a comparative level module connected to said reference voltage adjusting module, plural tested objects and terminal control units connected to said constant-current source and reference voltage adjusting module; wherein, said constant-current source supplies constant current through the tested objects; said reference voltage adjusting module supplies reference voltage; said comparative level module receives the voltage of tested object and reference voltage to be compared and output voltage, via the digit signal channel board, transmitting to the terminal control unit.
Description
Technical field
The present invention relates to field tests, refer more particularly to a kind of testing apparatus that is used for the interlinking reliability assessment.
Technical background
Plate level assembling reliability is related to product quality and long term life, and in the face of intensive day by day, complicated, integrated day by day day by day Circuits System, the quality of solder joint more and more becomes the most critical factor of plate level reliability.Switching performance by acceleration reliability test assessment solder joint is accepted by industry, and wherein important contents is exactly how to reflect real solder joint change in resistance process fast and effectively.
Carry out the welding spot reliability assessment and normally on a breadboard, carry out the resistance monitoring, in the acceleration reliability test process, change to certain resistance (for example 250 ohm) by zero (perhaps very little) then and reflect its change procedure by resistance for a plurality of solder joints of a device or a plurality of solder joints of a plurality of devices; The germinating of this generation crackle in this change procedure of welding spot structure, gathering, expansion are until eventual failure.Because the formation of solder joint crackle is the process of a Millisecond with fracture, resistance will change fast in instantaneous generation; And along with variation of temperature, welding spot structure (comprising its base metal structure and peripheral mechanical connection body) is with the mechanical deformation process of expanding with heat and contract with cold, therefore along with different reliability test processes, the resistance of solder joint will take place to change fast along with the folding of crackle, mechanical engagement degree etc.
So, in the welding spot reliability evaluation process, in real time, fast and the resistance test system that can carry out multi-path monitoring become the key factor that influences result of the test.
But a common in the prior art reliability test may from several days to some months, wherein mechanical cycles of carrying out or temperature cycles reach thousands of or up to ten thousand.
A kind of solder joint resistance monitor mode is after test proceeds to certain circulation cycle, end test, adopt the resistance test instrument to test for the solder joint test circuit, this mode is more directly perceived, can obtain more accurately resistance value carries out the solder joint break-make and judges, but it exists, and speed is slow, single-path testing, can not real-time testing etc. shortcoming, even if lead-in wire is picked out test chamber by peripheral circuit, also can't solve slow-footed shortcoming, and there are a lot of uncertain factors in artificial test.
Another scheme of the prior art is to adopt the mode of automatic scan test, utilize the analog output channel of ADA data collecting card itself to provide+constant pressure source of 10V, formation is by the test loop of solder joint, the pressure drop at tested solder joint two ends in the acquisition circuit, be input to the analog input channel of capture card, and carry out the judgement of resistance.In actual test process, because the restriction of capture card must be mated switching circuit simultaneously, scan successively at multiplexer channel respectively, obtain corresponding test solder joint resistance value, as shown in Figure 1.
This method at first can realize the automatic test of multichannel solder joint resistance, but its test speed is subjected to the restriction of hardware systems such as capture card, switch card, and single-spot testing is estimated more than 0.1s, has been subjected to certain restriction on speed.
Summary of the invention
Purpose of the present invention is exactly the requirement according to welding spot reliability evaluation test test macro, provide a kind of realization in real time, solder joint on off test device fast.For this reason, the present invention adopts following technical scheme:
A kind of testing apparatus that is used for the interlinking reliability assessment comprises:
The reference voltage adjustment module, a plurality of constant-current sources, digital signal channel plate, level comparison module, a plurality of measurands and the control terminal that is connected with described constant-current source and level comparison module with the electrical connection of said reference Voltage Regulator Module;
Described constant-current source provides constant current to pass through measurand;
Described reference voltage adjustment module provides reference voltage;
Described level comparison module receives measurand pressure drop and reference voltage, and the measurand pressure drop is compared with reference voltage and output level, sends control terminal to through the digital signal channel plate.
Described measurand is: solder joint, circuit, through hole or mutual limit micro-system.
Described reference voltage module is an adjustable resistance.
Described constant-current source module and voltage comparison module are a plurality of of quantity correspondence.
Described control terminal is a computer.
Technical solution of the present invention can guarantee that test macro carries out in real time, fast and the test of multichannel, and the tested object change in resistance is directly adopted comparative result output, has simplified data transmission capacity, has promoted transmission speed greatly.
Description of drawings
Fig. 1 is an automatic scan solder joint resistance test system sketch in the prior art;
Fig. 2 is a testing apparatus schematic diagram of the present invention.
Embodiment
Below in conjunction with Figure of description the specific embodiment of the present invention is described.
The present invention can adjust tested object to be had multiplely, as solder joint, circuit, through hole and relevant interconnection micro-system, in the following examples, is that example is made related description with the solder joint.
In the process of the test of reality, as previously mentioned, the change in resistance of tested pilot such as solder joint is the expansion, fracture along with crackle and changing rapidly, and the degree of mechanical engagement has influenced the size of solder joint resistance to a great extent.Therefore, if the test speed must guarantee rapidly, continuously, just might obtain real solder joint on off operating mode.
As shown in Figure 2, be testing apparatus schematic diagram of the present invention.Described device comprises: the reference voltage adjustment module, a plurality of constant-current sources, digital signal channel plate, level comparison module, a plurality of solder joints and the control terminal that is connected with described constant-current source and level comparison module with the electrical connection of said reference Voltage Regulator Module; Described constant-current source provides constant current to pass through tested solder joint; Described reference voltage adjustment module provides reference voltage; Described level comparison module receives solder joint pressure drop and reference voltage, and the solder joint pressure drop is compared with reference voltage and output level, sends control terminal to through the digital signal channel plate.
When concrete the application, described control terminal is a computer.Described constant-current source module and voltage comparison module are a plurality of of quantity correspondence.
The a plurality of solder joints that are connected with described constant-current source and level comparison module are tested object, can also be circuit, through hole or relevant interconnection micro-system in practice.
In the design of testing apparatus, we at first design a power integrated module, it provides multiple constant current source (for example 128 tunnel), constant current is by tested solder joint, the pressure drop of solder joint feeds back to the level comparison module, and compares with the reference level value, according to comparative result, the output high-low level, this signal is entered the test terminal by the collection of digital signal passage capture card.The reference level that is used for comparison is by regulator potentiometer, changes the output of reference voltage adjustment module and reaches.
This level comparison module can be provided with separately, also can be arranged on the inside of this constant-current source module, and is integrated to carry out, and reduces the volume of testing apparatus.
The design of testing apparatus of the present invention has guaranteed the consistency of multichannel reference level, the resistance of solder joint is converted into level signal and compares, when resistance surpasses certain threshold value (250 ohm as described above), corresponding pressure drop is greater than the reference level value, export a high level signal, otherwise then export a low level signal.The test speed of whole system depend on comparison circuit response speed and and the speed of digital signal passage capture card, reach the microsecond level, be higher than the picking rate of automatic scan mode far away.
Technical scheme of the present invention can guarantee that test macro carries out in real time, fast and the test of multichannel, and the solder joint change in resistance is directly adopted comparative result output, has simplified data transmission capacity, has promoted transmission speed greatly.
Claims (5)
1, a kind of testing apparatus that is used for the interlinking reliability assessment is characterized in that comprising:
The reference voltage adjustment module, a plurality of constant-current sources, digital signal channel plate, level comparison module, a plurality of measurands and the control terminal that is connected with described constant-current source and level comparison module with the electrical connection of said reference Voltage Regulator Module;
Described constant-current source provides constant current to pass through measurand;
Described reference voltage adjustment module provides reference voltage;
Described level comparison module receives measurand pressure drop and reference voltage, and the measurand pressure drop is compared with reference voltage and output level, sends control terminal to through the digital signal channel plate.
2, device as claimed in claim 1 is characterized in that described measurand is: solder joint, circuit, through hole or mutual limit micro-system.
3, device as claimed in claim 1 or 2 is characterized in that described reference voltage module is an adjustable resistance.
4, device as claimed in claim 1 is characterized in that described constant-current source module and voltage comparison module are a plurality of of quantity correspondence.
5, device as claimed in claim 4 is characterized in that described control terminal is a computer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410056184XA CN1323432C (en) | 2004-08-18 | 2004-08-18 | Testing device for interconnection dependability estimation |
| PCT/CN2005/001250 WO2006017980A1 (en) | 2004-08-18 | 2005-08-12 | A test device for evaluating the reliability of the connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410056184XA CN1323432C (en) | 2004-08-18 | 2004-08-18 | Testing device for interconnection dependability estimation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1738019A true CN1738019A (en) | 2006-02-22 |
| CN1323432C CN1323432C (en) | 2007-06-27 |
Family
ID=35907223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200410056184XA Expired - Fee Related CN1323432C (en) | 2004-08-18 | 2004-08-18 | Testing device for interconnection dependability estimation |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1323432C (en) |
| WO (1) | WO2006017980A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105467172A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | CAF testing plate with switching circuit |
| CN110658403A (en) * | 2019-09-30 | 2020-01-07 | 无锡市同芯恒通科技有限公司 | Solder joint reliability test system and method |
| CN111142009A (en) * | 2020-01-24 | 2020-05-12 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
| CN111142010A (en) * | 2020-01-24 | 2020-05-12 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
| CN112034400A (en) * | 2020-09-29 | 2020-12-04 | 西安微电子技术研究所 | Reliability verification device and method for surface-mounted device assembly |
| CN112345982A (en) * | 2020-09-29 | 2021-02-09 | 歌尔科技有限公司 | Method and device for detecting welding condition of circuit element |
| CN112526359A (en) * | 2020-10-23 | 2021-03-19 | 风帆有限责任公司 | Lead-acid storage battery through-wall welding spot detection method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108919027A (en) * | 2018-06-08 | 2018-11-30 | 北京长城华冠汽车科技股份有限公司 | Connector fault condition detection method and system |
| CN112173166A (en) * | 2020-09-21 | 2021-01-05 | 成都国营锦江机器厂 | Tail-rotor deicing distributor testing device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0973331A (en) * | 1995-06-30 | 1997-03-18 | Seiko Instr Inc | Semiconductor integrated circuit device |
| CN1164028A (en) * | 1996-05-01 | 1997-11-05 | 捷智科技股份有限公司 | Apparatus and method for measuring PC board |
| JP3974961B2 (en) * | 1996-10-17 | 2007-09-12 | 株式会社佐藤精機 | Soldering inspection device |
| JP3617621B2 (en) * | 2000-09-29 | 2005-02-09 | シャープ株式会社 | Semiconductor integrated circuit inspection apparatus and inspection method thereof |
| JP2003004794A (en) * | 2001-06-18 | 2003-01-08 | Canon Inc | Electronic component, circuit board and inspection method for solder joint of electronic component to circuit board |
| CN1327236C (en) * | 2003-11-20 | 2007-07-18 | 上海交通大学 | Multi-channel surface stick welding spot fatigue state real-time monitoring system |
-
2004
- 2004-08-18 CN CNB200410056184XA patent/CN1323432C/en not_active Expired - Fee Related
-
2005
- 2005-08-12 WO PCT/CN2005/001250 patent/WO2006017980A1/en active Application Filing
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105467172A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | CAF testing plate with switching circuit |
| CN105467172B (en) * | 2016-01-01 | 2019-05-21 | 广州兴森快捷电路科技有限公司 | A kind of CAF test board having switching circuit |
| CN110658403A (en) * | 2019-09-30 | 2020-01-07 | 无锡市同芯恒通科技有限公司 | Solder joint reliability test system and method |
| CN111142009A (en) * | 2020-01-24 | 2020-05-12 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
| CN111142010A (en) * | 2020-01-24 | 2020-05-12 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
| CN111142010B (en) * | 2020-01-24 | 2022-03-29 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
| CN111142009B (en) * | 2020-01-24 | 2022-04-08 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
| CN112034400A (en) * | 2020-09-29 | 2020-12-04 | 西安微电子技术研究所 | Reliability verification device and method for surface-mounted device assembly |
| CN112345982A (en) * | 2020-09-29 | 2021-02-09 | 歌尔科技有限公司 | Method and device for detecting welding condition of circuit element |
| CN112526359A (en) * | 2020-10-23 | 2021-03-19 | 风帆有限责任公司 | Lead-acid storage battery through-wall welding spot detection method |
| CN112526359B (en) * | 2020-10-23 | 2022-11-18 | 风帆有限责任公司 | Lead-acid storage battery through-wall welding spot detection method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006017980A1 (en) | 2006-02-23 |
| CN1323432C (en) | 2007-06-27 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: ELEC & ELTEK (GUANGZHOU) ELECTRONIC COMPANY LIMITED Assignor: Huawei Technologies Co., Ltd. Contract fulfillment period: 2007.12.17 to 2012.12.16 contract change Contract record no.: 2009440001249 Denomination of invention: Testing device for interconnection dependability estimation Granted publication date: 20070627 License type: Exclusive license Record date: 2009.8.14 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.12.17 TO 2012.12.16; CHANGE OF CONTRACT Name of requester: ELEC + ELTEK (GUANGZHOU) ELECTRONICS CO., LTD. Effective date: 20090814 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070627 Termination date: 20160818 |
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| CF01 | Termination of patent right due to non-payment of annual fee |