CN111142009A - PCB interconnection reliability testing method and device - Google Patents
PCB interconnection reliability testing method and device Download PDFInfo
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- CN111142009A CN111142009A CN202010077214.4A CN202010077214A CN111142009A CN 111142009 A CN111142009 A CN 111142009A CN 202010077214 A CN202010077214 A CN 202010077214A CN 111142009 A CN111142009 A CN 111142009A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
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Abstract
The method comprises the steps of measuring the resistance of a hole chain at room temperature, applying current to the hole chain, enabling the temperature of the hole chain to rise to a set test temperature lower limit within a set temperature rise test time window in a temperature rise stage, or enabling the temperature of the hole chain to reach a set test temperature window range within set temperature rise time, continuing applying the current in a temperature preservation stage, keeping the temperature of the hole chain between the set test temperature lower limit and a test temperature upper limit within set temperature preservation time, then stopping applying the current, cooling the hole chain to the room temperature, and measuring the resistance of the hole chain. The device comprises: the device comprises a power module, a test module, a control module and a display and input module. The testing method and the testing device have the advantages of high testing speed, low cost, convenience in testing and large sampling proportion, and can detect interconnection defects of slight through holes, buried holes and blind holes which cannot be detected by PCB electrical testing.
Description
Technical Field
The invention relates to a method and a device for testing interconnection reliability of a PCB (printed circuit board), in particular to a method and a device for testing interconnection reliability of a PCB hole.
Background
The circuit network of multilayer PCB is by the metal circuit of each layer, the pad, and connect various punch combination constitutions of each layer, hole in the PCB includes the through-hole, bury the hole, the blind hole (including little blind hole), wherein the through-hole link up all layers of PCB, can be connected to arbitrary layer, bury the hole and generally run through arbitrary 2 layers or the multilayer except that PCB outside is two-layer, can be connected to arbitrary inlayer except that PCB outside is two-layer, the blind hole then generally connects including an outer 2 layers or multilayer, little blind hole then generally connects adjacent 2 layers, therefore the interconnection of PCB relies on the hole in the PCB to include the through-hole, bury the hole, the blind hole comes the realization.
The interconnection reliability of the PCB mainly comes from the interconnection reliability of the electroplated through hole, the buried hole and the blind hole, and comprises the following steps:
1. the self conduction reliability of interconnection holes such as through holes, buried holes, blind holes and the like;
due to the fact that physical properties of the substrate material and the interconnection hole coating are different after the substrate material and the interconnection hole coating are heated, when the substrate material and the interconnection hole coating are heated, the interconnection hole coating is forced to deform due to thermal expansion in the Z direction of the insulating substrate material, and therefore stress is generated on the interconnection holes, and the main reasons for the reliability of the holes are coating defects such as thin interconnection hole coating, bubble-containing coating, uneven coating thickness, rough coating wall and coating and the like;
2. the reliability of the connection between the interconnection holes such as the through hole, the buried hole and the blind hole and the inner and outer layer circuits;
when drilling dirt, resist residue and precipitation and other foreign matters are remained on the interconnection surface of the interconnection hole and the inner and outer layer circuits or when a chemical copper layer on the interconnection surface has defects, the hole plating layer is separated from the inner and outer layer circuits under the stress generated by expansion with heat and contraction with cold, thereby generating the problem of interconnection reliability.
Conventional electrical testing cannot separate the above via plating defects and interconnect defects because the vias themselves and the vias are still connected to the inner and outer traces, even if the vias are slightly broken or the via plating is separated from the inner and outer traces in severe cases, but when the electrical testing is performed, the stress on the via pads is large due to the clamping action of the electrical testing machine, and these breaks or separations may be "pressed" together to pass the electrical testing.
If a PCB with these minor defects is sent to a customer, assembled to become a PCBA, or made to become a final product for delivery to a user, the minor defects can become exacerbated through cycling of ambient temperatures, eventually resulting in open circuits and product failures, such that the PCB manufacturer may face customer complaints and significant compensation.
The existing PCB interconnection reliability test method comprises the following steps:
1. gas phase high-low temperature circulation, wherein the gas phase high-low temperature circulation test is to alternately place a test sample in a high-temperature and low-temperature gas environment for a certain time and circulation and detect the change conditions of various electrical properties of the test sample;
2. liquid phase high-low temperature circulation, wherein the liquid phase high-low temperature circulation test is to alternately place a test sample in high-temperature and low-temperature liquid environments for a certain time and circulation and detect the change conditions of various electrical properties of the test sample;
3. and (3) reflowing for multiple times, wherein the multiple reflow test is to perform a reflow soldering simulation process on a test sample for multiple times and detect the change conditions of various electrical properties of the test sample before and after reflowing.
The defects of the tests are that the test time is long, the test cost is high, the tests belong to destructive tests, and the test sampling ratio is not high. The test requires a large and complicated apparatus because of the need for an auxiliary gas heating and cooling device, and the time required for performing one alternate cycle is long because of the heat transfer using gas or liquid, and the time required for one cycle is usually about 30 minutes to one hour.
Disclosure of Invention
The invention aims to provide a method and a device for testing the interconnection reliability of a PCB (printed circuit board), by which slight PCB hole interconnection defects can be quickly detected.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a PCB interconnection reliability test method uses a hole chain for testing, and comprises the following steps:
step 1, measuring the resistance of a pore chain at room temperature;
step 2, the temperature rising stage is carried out by adopting one of the following two control modes,
the temperature rise control mode 1 is that heating current is applied to the hole chain, so that the temperature of the hole chain rises within a set temperature rise test time window to reach a set test temperature lower limit;
a temperature rise control mode 2, wherein heating current is applied to the hole chain, so that the temperature of the hole chain rises within a set temperature rise test time to reach a window range of a set test temperature;
step 3, stopping applying the heating current, and cooling the pore chain to room temperature;
step 4, measuring the resistance of the hole chain at room temperature;
and 5, judging whether the hole chain passes the test or not.
The following heat preservation stage step 2.1 can be added between the step 2 and the step 3,
and 2.1, in the heat preservation stage, continuing to apply the heating current, and keeping the temperature of the hole chain between the set lower test temperature limit and the upper test temperature limit within the set heat preservation time.
The step 5 judges whether the pore chain passes the test standard or not, wherein the standard is one or more of the following 6,
judging according to the ratio of the actual load current to the set heating current, if the ratio of the actual load current to the set heating current in the circuit is not lower than a set threshold value in the test time of the application of the heating current, the hole chain is regarded as passing the test, if the ratio of the actual load current to the set heating current in the circuit is lower than the set threshold value in the test time of the application of the heating current, the hole chain is regarded as failing the test, if the hole chain is judged to fail according to the ratio of the actual load current to the set heating current, the steps 1, 3 and 4 are not carried out, the actual load current in the circuit is detected in the steps 2 and 2.1, and whether the hole chain fails is judged, and if the hole chain fails, the test is terminated or continued;
judging according to the actual load current, if the actual load current in the circuit is not lower than a set threshold value in the test time of the heating current application, the hole chain is regarded as passing the test, if the actual load current in the circuit is lower than the set threshold value in the test time of the heating current application, the hole chain is regarded as not passing the test, if the hole chain is judged to be failed according to the ratio of the actual load current to the set heating current, the step 1, the step 3 and the step 4 can be omitted, the actual load current in the circuit is detected in the step 2 and the step 2.1, and whether the hole chain is failed or not is judged, and if the hole chain is failed, the test is terminated or continued;
judging according to the resistance change rate at room temperature, if the resistance change rate of the pore chain at room temperature before and after heating current is applied does not exceed a set threshold value, the pore chain is regarded as passing the test, and if the resistance change rate of the pore chain at room temperature before and after heating current is applied exceeds the set threshold value, the pore chain is regarded as not passing the test;
judging according to the resistance, if the resistance of the hole chain in the test process does not exceed the set threshold resistance, the hole chain is regarded as passing the test, if the resistance of the hole chain in the test process exceeds the set threshold resistance, the hole chain is regarded as not passing the test, if the hole chain is judged to be failed according to the resistance, the resistance of the hole chain is detected in the steps 2 to 3, whether the hole chain is failed is judged, and if the hole chain is failed, the test can be terminated or continued;
judging according to the temperature rising speed, if the temperature rising speed of the hole chain does not exceed a set threshold value in the test time of applying the heating current, the hole chain is regarded as passing the test, if the temperature rising speed of the hole chain exceeds the set threshold value in the test time of applying the heating current, the hole chain is regarded as not passing the test, if the hole chain is judged to be failed according to the temperature rising speed, the temperature and the temperature rising speed of the hole chain are detected in the steps 2 to 3, whether the hole chain is failed or not is judged, and if the hole chain is failed, the test can be terminated or continued;
and 6 th, judging according to the temperature rising speed change ratio, if the temperature rising speed change ratio of the hole chain does not exceed a set threshold value in the test time of the application of the heating current, the hole chain is regarded as passing the test, if the temperature rising speed change ratio of the hole chain exceeds the set threshold value in the test time of the application of the heating current, the hole chain is regarded as failing the test, if judging whether the hole chain fails according to the temperature rising speed change ratio, detecting the temperature and the temperature rising speed of the hole chain in the steps 2 to 3, calculating the change ratio and judging whether the hole chain fails, and if the hole chain fails, selecting to terminate the test or continue the test.
For a certain hole chain of a PCB of a certain model, the heating current value set by batch test is measured by a sampling test method; the sampling test method comprises the following steps:
step one, setting the testing parameters,
when the temperature-raising stage of the step 2 of claim 1 adopts a temperature-raising control mode 1, setting temperature-raising test time, a temperature-raising test time window, a lower test temperature limit and an upper test temperature limit, and if the temperature-raising stage of the step 2.1 of claim 1 is carried out in batch test, setting temperature-keeping time;
when the temperature raising stage of the step 2 in the claim 1 adopts the control mode 2, the temperature raising test time, the test temperature window, the lower test temperature limit and the upper test temperature limit are set, and if the temperature raising stage of the step 2.1 in the claim 1 is carried out in batch test, the temperature keeping time is also set;
step two, a temperature rising stage,
the step 2 of claim 1 wherein the temperature-raising phase is controlled by applying a predetermined trial heating current to the sampled hole chain, if the temperature of the hole chain reaches a predetermined lower temperature limit within the predetermined temperature-raising test time window, entering the next step, and if the temperature of the sampled hole chain does not reach the predetermined lower temperature limit within the predetermined temperature-raising test time window, adjusting the trial heating current and repeating the step until the temperature of the hole chain reaches the predetermined lower temperature limit within the predetermined temperature-raising test time window;
when the temperature-raising stage of step 2 in claim 1 adopts the temperature-raising control mode 2, a preset trial heating current is applied to the sampled hole chain, if the temperature of the hole chain reaches the range of the set test temperature window within the set temperature-raising test time, the next step is carried out, if the temperature of the hole chain does not reach the range of the set test temperature window within the set temperature-raising test time, the trial heating current is adjusted, and then the step is repeated until the temperature of the hole chain reaches the range of the set test temperature window within the set temperature-raising test time;
step three, a heat preservation stage, namely after entering the heat preservation stage, continuing to apply heating current, if the temperature of the sampled hole chain does not exceed the upper test temperature limit and is not lower than the lower test temperature limit within the set heat preservation time, primarily selecting the current value as the heating current value of the hole chain of the model, if the temperature of the sampled hole chain exceeds the upper test temperature limit or is lower than the lower test temperature limit within the set heat preservation time, adjusting the trial heating current, repeating the steps two to three until the temperature of the sampled hole chain does not exceed the upper test temperature limit and is not lower than the lower test temperature limit within the set heat preservation time, and if the heat preservation stage of the step 2.1 in the claim 1 is not performed during batch test, not performing the step;
step four, testing all other sampling samples,
the temperature rise stage of the step 2 of claim 1 adopts a control mode 1, and when the heat preservation stage of the step 2.1 of claim 1 is carried out during batch test, the second step and the third step are carried out on all sampling sample until all sampling hole chains reach a set test temperature lower limit in a set temperature rise test time window under a certain heating current, and do not exceed a test temperature upper limit and are not lower than the test temperature lower limit in a set heat preservation time, and finally the current value is selected as the heating current value of the hole chain of the type;
the temperature rise stage of the step 2 of claim 1 adopts a control mode 1, and when the heat preservation stage of the step 2.1 of claim 1 is not carried out during batch testing, the step two is carried out on all sampling samples until all sampling hole chains reach a set testing temperature lower limit within a set temperature rise testing time window under a certain heating current, and finally the current value is selected as the heating current value of the hole chain of the type;
the temperature rise stage of the step 2 of claim 1 adopts a control mode 2, and when the heat preservation stage of the step 2.1 of claim 1 is carried out during batch test, the second step and the third step are carried out on all sampling sample until all sampling hole chains reach the range of the set test temperature window within the set temperature rise test time under a certain heating current, and do not exceed the upper test temperature limit and are not lower than the lower test temperature limit within the set heat preservation time, and finally the current value is selected as the heating current value of the hole chain of the type;
the step 2 of claim 1 adopts a control mode 2 in the temperature rising stage, and when the step 2.1 of claim 1 is not performed in the heat preservation stage in the quantity test, the step two is performed on all the sampling samples until all the sampling hole chains reach the set test temperature window range within the set temperature rising test time under a certain heating current, and finally the current value is selected as the heating current value of the hole chain of the type.
A testing device of a PCB interconnection reliability testing method comprises the following steps: the device comprises a power module, a test module, a control module and a display and input module.
The power supply module is connected with a test sample through a cable and a connector, is used for providing test current and heating the sample, is connected with the control module through the cable, is connected with a control instruction of the control module, and can read the output current and voltage of the control module;
the test module is connected with a test sample through a cable and a connector, is used for measuring the temperature and the resistance of the sample, is connected with the control module through the cable, receives a control instruction of the control module, and transmits test data to the control module;
the control module is connected with the power supply module, the measuring module and the display and input module through cables, and is used for sending a control instruction to control the modules, receiving signals and data of other modules and processing the data;
and the display and input module displays and outputs data and diagrams in the test process and inputs test settings.
The testing method and the testing device have the advantages of high testing speed, low cost, convenience in testing and large sampling proportion, and can detect slight PCB hole interconnection defects which cannot be detected by PCB electrical testing.
The invention has the beneficial effects that:
compared with the traditional PCB interconnection reliability test method and device, the test method and device of the invention have the advantages that:
1) the testing speed is high, and the temperature rise speed of the hole chain is high due to the fact that current is used for heating from the inside of the hole chain, and one test can be completed within dozens of seconds at the fastest speed;
2) the test cost is low, the test is convenient, and the test equipment is simple. The test equipment mainly comprises a current source, a resistance measuring instrument and a temperature measuring instrument, a clamp can be used or not used in the test, and the temperature is not required to be reduced to be lower than the room temperature, so that huge and complicated refrigeration equipment is not required;
4) the test result is simple and clear, and whether the test is passed or not can be judged only by observing the resistance and the change of the resistance, the change of the current or the change of the temperature rise speed;
5) the product is not damaged in the testing process, so the sampling proportion is large. A PCB is manufactured, different numbers of test hole chains can be designed according to user requirements, and therefore all PCBs can be tested completely in one hundred percent.
Drawings
FIG. 1 is a flow chart for determining heating current in a sample test.
Fig. 2 is a schematic diagram of a time-temperature curve of the testing process when the control mode 1 is adopted in the temperature rise stage.
Fig. 3 is a schematic diagram of a time-temperature curve of the testing process when the control mode 2 is adopted in the temperature rise stage.
FIG. 4 is a schematic structural diagram of a testing apparatus.
Detailed Description
Referring to fig. 1, the testing apparatus 101 of the PCB interconnection reliability testing method of the present invention includes: a power module 102, a test module 103, a control module 104, and a display and input module 105.
The power module 102 is connected to the test sample 106 through a cable and a connector, and is configured to provide a test current to heat the sample 106, and is connected to the control module 104 through a cable to receive a control instruction from the control module 104, and the output current and voltage of the power module can be read by the control module 104;
the test module 103 is connected with a test sample 106 through a cable and a connector, is used for measuring the temperature and the resistance of the sample 106, is connected with the control module 104 through a cable, receives a control instruction of the control module 104, and transmits test data to the control module 104;
the control module 104 is connected with the power module 102, the measurement module 103 and the display and input module 105 through cables, and is used for sending control instructions to control the modules, receiving signals and data of other modules and processing data;
the display and input module 105 displays and outputs data and diagrams in the test process, and inputs test settings.
A6 first-order HDI printed circuit board of layer uses first-order HDI blind hole chain test its interconnection reliability.
Firstly, the testing device 101 is used, the heating current value used for testing the hole chain is determined in a sampling mode, 3 hole chains are extracted, and the numbers of the hole chains are sample 1, sample 2 and sample 3, and the sampling testing method comprises the following steps:
step one, setting the testing parameters,
the temperature rise stage adopts a control mode 1, the heat preservation stage is carried out during batch testing, the temperature rise testing time is set to be 10 seconds, the temperature rise testing time window is plus or minus 3 seconds, the heat preservation time is set to be 30 seconds, the lower limit of the testing temperature is 200 ℃, and the upper limit of the testing temperature is 240 ℃;
step two, a temperature rising stage,
applying a preset trial heating current to the well strands of sample 1, continuing to apply the heating current into the incubation phase if the well strand temperature of sample 1 reaches the set lower test temperature limit of 200 ℃ within 10+/-3 seconds (i.e., 7-13 seconds) of the set elevated test time window, and adjusting the trial heating current repeating step until the well strand temperature of sample 1 reaches the set lower test temperature limit of 200 ℃ within 10+/-3 seconds (i.e., 7-13 seconds) of the set elevated test time window if the temperature of the well strands of sample 1 does not reach the set lower test temperature limit of 200 ℃; the temperature of the well chain of sample 1 reached the set lower test temperature limit of 200 ℃ within 10+/-3 seconds (i.e., 7-13 seconds) of the set temperature rise test time window at a heating current of 2.3 amps;
step three, a heat preservation stage,
after entering the heat preservation phase, continuing to apply the heating current, if the temperature of the pore chain of the sample 1 does not exceed the upper test temperature limit 240 ℃ and is not lower than the lower test temperature limit 200 ℃ within 30 seconds of the set heat preservation time, primarily selecting the current value as the heating current value of the pore chain of the model, if the temperature of the pore chain of the sample 1 exceeds the upper test temperature limit 240 ℃ or is lower than the lower test temperature limit 200 ℃ within 30 seconds of the set heat preservation time, adjusting the trial current, and repeating the steps 2 to 3 until the temperature of the pore chain of the sample 1 does not exceed the upper test temperature limit 240 ℃ and is not lower than the lower test temperature limit 200 ℃ within 30 seconds of the set heat preservation time, and under the heating current of 2.3 amperes, the temperature of the pore chain of the sample 1 does not exceed the upper test temperature limit 240 ℃ and is not lower than the lower test temperature limit 200 ℃ within 30 seconds of the set heat preservation time;
step four, testing all other sampling samples,
and (3) performing the steps 2 and 3 on all the sampling samples, wherein all the sampling hole chains reach the set lower test temperature limit of 200 ℃ within 10+/-3 seconds (namely 7-13 seconds) of the set temperature rise test time window under the heating current of 2.3 amperes, do not exceed the upper test temperature limit of 240 ℃ within 30 seconds of the set heat preservation time and do not fall below the lower test temperature limit of 200 ℃, and therefore, 2.3 amperes are finally selected as the heating current value of the hole chain of the model.
Then, the heating current is 2.3 amperes, the hole chains of all products are tested in batch, whether the test is passed or not is judged according to the resistance change rate of the hole chains at room temperature before and after the heating current is applied, and the steps are as follows:
step 1, measuring the resistance of a pore chain at room temperature;
step 2, in the temperature rise stage, 2.3 amperes of heating current is applied to the hole chain until the temperature rise test time is finished within 10 seconds;
step 3, in the heat preservation stage, heating current is continuously applied for 2.3 amperes until the heat preservation time is finished within 30 seconds;
step 4, cooling the pore chain to room temperature;
step 5, measuring the resistance of the hole chain at room temperature;
step 6, judging whether the pore chain passes the test or not, judging according to the resistance change rate of the pore chain at room temperature before and after the heating current is applied, if the resistance change rate of the pore chain at room temperature before and after the testing current is applied does not exceed a set threshold value of 10%, the pore chain is regarded as passing the test, and if the resistance change rate of the pore chain at room temperature before and after the testing current is applied exceeds the set threshold value of 10%, the pore chain is regarded as not passing the test;
the present invention is not limited to the above embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts based on the disclosed technical solutions, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (6)
1. A PCB interconnection reliability test method is characterized by comprising the following steps:
step 1, measuring the resistance of a pore chain at room temperature;
step 2, the temperature rising stage is carried out by adopting one of the following two control modes,
the temperature rise control mode 1 is that heating current is applied to the hole chain, so that the temperature of the hole chain rises within a set temperature rise test time window to reach a set test temperature lower limit;
a temperature rise control mode 2, wherein heating current is applied to the hole chain, so that the temperature of the hole chain rises within the set temperature rise test time to reach the range of a set test temperature window;
step 3, stopping applying the heating current, and cooling the pore chain to room temperature;
step 4, measuring the resistance of the hole chain at room temperature;
and 5, judging whether the hole chain passes the test or not.
2. The PCB interconnection reliability test method of claim 1, wherein the following heat preservation stage step 2.1 can be added between the step 2 and the step 3,
and 2.1, in the heat preservation stage, continuing to apply the heating current, and keeping the temperature of the hole chain between the set lower test temperature limit and the upper test temperature limit within the set heat preservation time.
3. The PCB interconnection reliability test method of claim 1, wherein the step 5 judges whether the hole chain passes the test standard or not to be one or more of the following 6,
judging according to the ratio of the actual load current to the set heating current, if the ratio of the actual load current to the set heating current in the circuit is not lower than a set threshold value in the test time of the application of the heating current, the hole chain is regarded as passing the test, if the ratio of the actual load current to the set heating current in the circuit is lower than the set threshold value in the test time of the application of the heating current, the hole chain is regarded as failing the test, if the hole chain is judged to fail according to the ratio of the actual load current to the set heating current, the steps 1, 3 and 4 are not carried out, the actual load current in the circuit is detected in the steps 2 and 2.1, and whether the hole chain fails is judged, and if the hole chain fails, the test is terminated or continued;
judging according to the actual load current, if the actual load current in the circuit is not lower than a set threshold value in the test time of the heating current application, the hole chain is regarded as passing the test, if the actual load current in the circuit is lower than the set threshold value in the test time of the heating current application, the hole chain is regarded as not passing the test, if the hole chain is judged to be failed according to the ratio of the actual load current to the set heating current, the step 1, the step 3 and the step 4 can be omitted, the actual load current in the circuit is detected in the step 2 and the step 2.1, and whether the hole chain is failed or not is judged, and if the hole chain is failed, the test is terminated or continued;
judging according to the resistance change rate at room temperature, if the resistance change rate of the pore chain at room temperature before and after heating current is applied does not exceed a set threshold value, the pore chain is regarded as passing the test, and if the resistance change rate of the pore chain at room temperature before and after heating current is applied exceeds the set threshold value, the pore chain is regarded as not passing the test;
judging according to the resistance, if the resistance of the hole chain in the test process does not exceed the set threshold resistance, the hole chain is regarded as passing the test, if the resistance of the hole chain in the test process exceeds the set threshold resistance, the hole chain is regarded as not passing the test, if the hole chain is judged to be failed according to the resistance, the resistance of the hole chain is detected in the steps 2 to 3, whether the hole chain is failed is judged, and if the hole chain is failed, the test can be terminated or continued;
judging according to the temperature rising speed, if the temperature rising speed of the hole chain does not exceed a set threshold value in the test time of applying the heating current, the hole chain is regarded as passing the test, if the temperature rising speed of the hole chain exceeds the set threshold value in the test time of applying the heating current, the hole chain is regarded as not passing the test, if the hole chain is judged to be failed according to the temperature rising speed, the temperature and the temperature rising speed of the hole chain are detected in the steps 2 to 3, whether the hole chain is failed or not is judged, and if the hole chain is failed, the test can be terminated or continued;
and 6 th, judging according to the temperature rising speed change ratio, if the temperature rising speed change ratio of the hole chain does not exceed a set threshold value in the test time of the application of the heating current, the hole chain is regarded as passing the test, if the temperature rising speed change ratio of the hole chain exceeds the set threshold value in the test time of the application of the heating current, the hole chain is regarded as failing the test, if judging whether the hole chain fails according to the temperature rising speed change ratio, detecting the temperature and the temperature rising speed of the hole chain in the steps 2 to 3, calculating the change ratio and judging whether the hole chain fails, and if the hole chain fails, selecting to terminate the test or continue the test.
4. The PCB interconnection reliability test method of claim 1, wherein the heating current value set for the batch test of a certain type of the via chain of a certain type of the PCB is measured by a sampling test method, the sampling test method comprising the steps of:
step one, setting the testing parameters,
when the temperature-raising stage of the step 2 of claim 1 adopts a temperature-raising control mode 1, setting temperature-raising test time, a temperature-raising test time window, a lower test temperature limit and an upper test temperature limit, and if the temperature-raising stage of the step 2.1 of claim 1 is carried out in batch test, setting temperature-keeping time;
when the temperature raising stage of the step 2 in the claim 1 adopts the control mode 2, the temperature raising test time, the test temperature window, the lower test temperature limit and the upper test temperature limit are set, and if the temperature raising stage of the step 2.1 in the claim 1 is carried out in batch test, the temperature keeping time is also set;
step two, a temperature rising stage,
the step 2 of claim 1 wherein the temperature-raising phase is controlled by applying a predetermined trial heating current to the sampled hole chain, if the temperature of the hole chain reaches a predetermined lower temperature limit within the predetermined temperature-raising test time window, entering the next step, and if the temperature of the sampled hole chain does not reach the predetermined lower temperature limit within the predetermined temperature-raising test time window, adjusting the trial heating current and repeating the step until the temperature of the hole chain reaches the predetermined lower temperature limit within the predetermined temperature-raising test time window;
when the temperature-raising stage of step 2 in claim 1 adopts the temperature-raising control mode 2, a preset trial heating current is applied to the sampled hole chain, if the temperature of the hole chain reaches the range of the set test temperature window within the set temperature-raising test time, the next step is carried out, if the temperature of the hole chain does not reach the range of the set test temperature window within the set temperature-raising test time, the trial heating current is adjusted, and then the step is repeated until the temperature of the hole chain reaches the range of the set test temperature window within the set temperature-raising test time;
step three, a heat preservation stage, namely after entering the heat preservation stage, continuing to apply heating current, if the temperature of the sampled hole chain does not exceed the upper test temperature limit and is not lower than the lower test temperature limit within the set heat preservation time, primarily selecting the current value as the heating current value of the hole chain of the model, if the temperature of the sampled hole chain exceeds the upper test temperature limit or is lower than the lower test temperature limit within the set heat preservation time, adjusting the trial heating current, repeating the steps two to three until the temperature of the sampled hole chain does not exceed the upper test temperature limit and is not lower than the lower test temperature limit within the set heat preservation time, and if the heat preservation stage of the step 2.1 in the claim 1 is not performed during batch test, not performing the step;
step four, testing all other sampling samples,
the temperature rise stage of the step 2 of claim 1 adopts a control mode 1, and when the heat preservation stage of the step 2.1 of claim 1 is carried out during batch test, the second step and the third step are carried out on all sampling sample until all sampling hole chains reach a set test temperature lower limit in a set temperature rise test time window under a certain heating current, and do not exceed a test temperature upper limit and are not lower than the test temperature lower limit in a set heat preservation time, and finally the current value is selected as the heating current value of the hole chain of the type;
the temperature rise stage of the step 2 of claim 1 adopts a control mode 1, and when the heat preservation stage of the step 2.1 of claim 1 is not carried out during batch testing, the step two is carried out on all sampling samples until all sampling hole chains reach a set testing temperature lower limit within a set temperature rise testing time window under a certain heating current, and finally the current value is selected as the heating current value of the hole chain of the type;
the temperature rise stage of the step 2 of claim 1 adopts a control mode 2, and when the heat preservation stage of the step 2.1 of claim 1 is carried out during batch test, the second step and the third step are carried out on all sampling sample until all sampling hole chains reach the range of the set test temperature window within the set temperature rise test time under a certain heating current, and do not exceed the upper test temperature limit and are not lower than the lower test temperature limit within the set heat preservation time, and finally the current value is selected as the heating current value of the hole chain of the type;
the step 2 of claim 1 adopts a control mode 2 in the temperature rising stage, and when the step 2.1 of claim 1 is not performed in the heat preservation stage in the quantity test, the step two is performed on all the sampling samples until all the sampling hole chains reach the set test temperature window range within the set temperature rising test time under a certain heating current, and finally the current value is selected as the heating current value of the hole chain of the type.
5. A test apparatus for implementing the PCB interconnection reliability test method of claim 1, comprising: the device comprises a power module, a test module, a control module and a display and input module.
6. The PCB interconnection reliability test device of claim 4,
the power supply module is connected with a test sample through a cable and a connector, is used for providing test current and heating the sample, is connected with the control module through the cable, is connected with a control instruction of the control module, and can read the output current and voltage of the control module;
the test module is connected with a test sample through a cable and a connector, is used for measuring the temperature and the resistance of the sample, is connected with the control module through the cable, receives a control instruction of the control module, and transmits test data to the control module;
the control module is connected with the power supply module, the measuring module and the display and input module through cables, and is used for sending a control instruction to control the modules, receiving signals and data of other modules and processing the data;
and the display and input module displays and outputs data and diagrams in the test process and inputs test settings.
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