CN109031092B - PCB high current testing method - Google Patents
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- CN109031092B CN109031092B CN201810778207.XA CN201810778207A CN109031092B CN 109031092 B CN109031092 B CN 109031092B CN 201810778207 A CN201810778207 A CN 201810778207A CN 109031092 B CN109031092 B CN 109031092B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
Abstract
The invention discloses a PCB high current testing method, which comprises the steps of front resistance value measurement, large current testing, cooling, rear resistance value measurement and resistance value change rate calculation. The invention can test the PCB product by 5 steps, such as: the method comprises the following steps of hole bottom separation, laser non-penetration, laser miss-drilling, blind hole breaking, through hole breaking, miss-connection, laser breakdown, hole bottom residual glue, foreign body breaking, surface copper deficiency, through hole ICD, through hole copper deficiency, blind hole copper deficiency, laser hole small, blind hole folded plating, through hole folded plating, copper powder in the hole, laser hole small, electroplating hole breaking and the like; in the testing process, the PCB product can not be damaged, the product shipment can not be influenced, and the non-destructive testing is carried out; the test time is short, batch test can be performed, the timeliness is good, the defect problem can be fed back quickly, the production process can be adjusted and improved in time, and unnecessary scrapping loss is avoided.
Description
Technical Field
The invention relates to the technical field of PCB testing, in particular to a PCB high current testing method.
Background
Pcb (printedcuittboard), the chinese name of which is printed circuit board. As an important carrier of electronic components, PCBs are combined with numerous electronic components to construct various electronic products that can be seen in life. Cell phones, smart watches, computers, televisions, automobiles, satellites, space shuttles ….
With the progress of science and technology, the living standard of human beings is greatly improved, and people put forward higher requirements on the safety and reliability of electronic products. Perhaps, the mobile phone or the computer is occasionally blank, and only the user needs to reset or restart the mobile phone or the computer, so that the user experience is only influenced; if the mobile phone battery is on fire and exploded, if the vehicle is suddenly out of control at high speed, if the fighter missile suddenly fails, if the satellite suddenly fails … …, the consequences of these events cannot be imagined, and it is only expected that the events never occur in reality. However, as the degree of intelligence of electronic products is higher and higher, the volume of the products is smaller and smaller, which inevitably leads to the integration degree of the electronic components and the PCB constituting the products being more and more complicated, and thus presents a new problem to the reliability of the quality of the PCB.
The PCB manufacturing process is very complicated, and the creation of a PCB requires many processes such as drilling, copper deposition, electroplating, etching …, etc. In each process, the potential quality hazard of the finished PCB product may occur due to the doping of a plurality of possible factors, such as equipment parameter problems, external environment problems, personnel operation problems, or process recipe problems.
In the production process of electronic products, various electronic components need to be mounted and welded on a PCB plate, so that the PCB needs to undergo high-temperature production processes such as a hot air reflow oven or wave soldering and the like. In such high temperature processes, thermal expansion of the PCB board may cause problems with the connection of the inner layer circuitry, which may affect the integrity of the PCB circuit signal transmission and may also present a potential risk of electronic product failure. Such problems are generally of a high level of risk in PCB boards and of a wide range of impact, resulting in huge economic losses for PCB board production plants.
At present, tests such as IR (infrared radiation) tests, hot oil tests, TCT (thermal conductivity test) tests, IST (integrated test) tests and the like are mostly used in PCB (printed circuit board) simulation test tests, the test methods cannot be applied to the process of semi-finished products for completion, the test takes a long time and cannot be carried out in batch, each test method has a certain defect detection blind area, most tests are destructive verification, and only sample verification can be carried out. If the thermal stress test is carried out, the porosity cannot be monitored, observation needs to be carried out through random slicing, and batch operation cannot be carried out.
Therefore, a High Current Test method for PCB (High Current Test HCT) is needed to make up for the above Test method, and batch Test can be performed during the manufacturing process (semi-finished product) without any damage to the PCB product.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a PCB high-current testing method.
In order to achieve the purpose, the invention adopts the following technical scheme:
a PCB high current testing method specifically comprises the following steps:
s1, measuring the front resistance value: measuring the resistance values of two ends of the HCT Coppon test loop by using a four-wire micro resistance meter;
s2, high-current test: if the resistance value passes the test, entering a large current test link, and the operation steps are as follows:
a) firstly, uniformly heating an HCT Coupon test area by using a constant-temperature heating plate to enable the temperature of the test area to be about 100 ℃, wherein the test time can be shortened in the link, but the change condition within 100 ℃ can not be detected, if the time consumed by the test is not too much, the heating link can be omitted, and the high-current test can be directly started from the normal temperature;
b) carrying out high current test on the HCT Coupon test loop, loading a constant current source at two ends of the HCT Coupon test loop, adding a voltmeter at two ends close to the test loop, and continuously converting electric energy into heat energy Q (I) under the action of current2R T, where I is a set constant high current, R is the resistance of the Coupon test loop, and T is the time for which the current continues to flow; i and T are calculated according to the copper thickness and the width of the designed PCB trace, and at this time, the temperature of the HCT Coupon region will continuously increase, and since the resistance value of the metal will increase almost linearly with the increase of the temperature, and the voltage V ═ I × R at the two ends of the test loop will increase with the increase of the temperature;
c) continuously electrifying the HCT Coupon test loop for a period of time, wherein the specific time is related to the PCB design and the voltage and current of the test, a hot plate heating mode is usually used, a large current is used for testing, and the typical time is 10-20 seconds; without the use of hot plate heating, a typical time would be 60 seconds. In the heating process, the substrate material and the metal conductor material are deformed to different degrees due to the rise of temperature, and stress in multiple directions is generated;
s3, cooling, after the HCT high current test is carried out, the temperature of a PCB to be tested is generally higher, the HCT Coupon test area is rapidly cooled by using dry cooling gas, and the temperature is cooled to the state when the front resistance value is measured;
s4, measuring the rear resistance value, wherein after the PCB undergoes severe temperature change, the PCB with hidden quality danger generates slight change, and at the moment, the HCT Coppon test loop needs to be subjected to 4-wire resistance value measurement at normal temperature;
s5, calculating the resistance change rate: the rate of change of resistance is 100% > (rear resistance-front resistance)/front resistance.
Preferably, in c) of S2, if the temperature does not reach the set interval or exceeds the set interval within the specified time, it indicates that the designed HCT Coupon test loop may have the phenomenon of copper being thin or thick, and in the process, under the action of a plurality of combining forces, the part with weak combining force can be torn or completely separated, which shows that the PCB has poor great reliability, such as hole bottom separation, tapered hole breakage, interface hole breakage, through hole ICD, blind hole ICD, as the resistance of the test loop suddenly increases, as shown by V ═ I × R, the voltage will exhibit a sudden rise, and if the loop breaks completely, R will approach infinity, after V exceeds the set test voltage, the constant current source changes to a constant voltage source, where the current I is V/R, I tends to be infinitesimal, which is usually diagnosed as PCB hole bottom separation.
Preferably, in S4, if a slight crack is generated at the connection of the plated hole of the HCT Coupon after the test, the resistance of the HCT Coupon after the test becomes large, and if the HCT Coupon after the test is broken after cooling, the resistance of the HCT Coupon becomes infinite, if the copper ions generated by the large current drawing function migrate to connect the originally disconnected positions and become a local short circuit, so that the resistance of the HCT Coupon after the test becomes small, during which, the weak-bonding portion is torn or completely separated under the action of multiple bonding forces, which may be manifested as a serious reliability defect of the PCB, such as hole bottom separation, gradually thinned hole breakage, interface hole breakage, via hole ICD, and blind hole ICD, due to the sudden increase of the resistance of the test loop, as known from V ═ R, the voltage may show a sudden increase, and if the loop is completely broken, R approaches infinity, and after V exceeds the set test voltage, the constant current source is changed into a constant voltage source, the current I is equal to V/R, and I is close to infinity, and the phenomenon is usually diagnosed as PCB hole bottom separation.
Compared with the prior art, the PCB high current testing method provided by the invention comprises the following steps: the invention can test the PCB product by 5 steps, such as: the method comprises the following steps of hole bottom separation, laser non-penetration, laser miss-drilling, blind hole breaking, through hole breaking, miss-connection, laser breakdown, hole bottom residual glue, foreign body breaking, surface copper deficiency, through hole ICD, through hole copper deficiency, blind hole copper deficiency, laser hole small, blind hole folded plating, through hole folded plating, copper powder in the hole, laser hole small, electroplating hole breaking and the like;
in the testing process, the PCB product can not be damaged, the product shipment can not be influenced, and the method is a non-destructive test; the invention has the advantages of short test time, batch test, good timeliness and capability of quickly feeding back the defect problem, so that the production process can be adjusted and improved in time, and unnecessary scrapping loss is avoided.
Drawings
FIG. 1 is a schematic cross-sectional view of HCT Coupon;
FIG. 2 is a schematic diagram of a high current test;
FIG. 3 is a HCT high current test current plot;
FIG. 4 shows the bottom state of an abnormal blind hole during cold and hot periods
FIG. 4.1 is a HCT high current test temperature profile;
FIG. 4.2 is a HCT high current test voltage plot;
FIG. 5 is a schematic diagram of deformation of a PCB due to heat;
FIG. 6 illustrates an abnormal current condition for the HCT test;
FIG. 7 is a schematic view of a constant temperature heating plate heating the HCT Coupon test area;
FIG. 8 is a flow chart of the test of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
A PCB high current testing method specifically comprises the following steps:
s1, measuring the front resistance value: using a four-wire micro resistance meter to measure the resistance of two ends of the HCT Coupon test loop (shown in the schematic diagram of HCT Coupon routing 1), this link can detect the imperfection problem of PCB electroplating, if there is a large deviation between the measured resistance and the theoretical resistance, the problem is mainly caused by the following possible factors: electroplating laser blind holes/through hole breakage, laser blind hole miss/non-penetration/small aperture, mechanical drilling miss or drilling deviation, lamination combination group staggered layer and the like;
s2, if the former resistance value test is passed, entering a heavy current test link (the link is a high temperature production process such as simulating a PCB overheating air reflow furnace or wave soldering, and the common temperature in the process is 220-260 ℃), and operating steps are as follows:
a) firstly, a HCT Coupon test area is uniformly heated by using a constant-temperature heating plate, as shown in figure 7, the temperature of the test area is about 100 ℃, the main component of a PCB substrate is epoxy resin, glass transition can occur at about 90 ℃, the thermal expansion coefficient of the PCB substrate is violently changed before and after an inflection point, so that the PCB substrate is heated to about 100 ℃, the PCB substrate is violently deformed in a short time, the test time can be shortened in the link, but the change condition within 100 ℃ can not be detected, if the test time is not too much, the heating link can be omitted, and the high-current test can be directly started from the normal temperature;
b) performing a high current test on the HCT Coupon test loop, using a constant current source to load at two ends of the HCT Coupon test loop, and adding a voltmeter (as shown in fig. 2) near the two ends of the test loop; under the action of current, the electric energy is continuously converted into heat energy Q ═ I2R T, where I is the constant high current we set, R is the resistance of the Coupon test loop, and T is the time we last up the current; i and T are calculated from the copper thickness and the trace width of the traces of the PCB that we have designed, and the temperature of the HCT Coupon region will continue to rise (see fig. 4.1), and since the resistance of the metal will rise almost linearly with the temperature, and the voltage across the test loop, V ═ I × R, will rise with the temperature (see fig. 5);
c) the HCT Coupon test loop is continuously powered on for a period of time, which is related to the PCB design, and the voltage current being tested. A hot plate heating mode is usually used, and a large current is used for testing, wherein the typical time is 10-20 seconds; without the use of hot plate heating, a typical time would be 60 seconds. In the heating process, the substrate material and the metal conductor material are deformed to different degrees due to the rise of temperature, and stress in multiple directions is generated; (shown in FIG. 5);
c1) under normal conditions, as shown in the above figures (3, 4, 5), if the temperature cannot reach the set interval or exceeds the set area within the specified time, the current curve, the voltage curve, the temperature curve and the like in the test indicate that the designed HCT Coupon test loop may have the phenomenon of copper thickness or copper thickness;
c2) in the process, under the action of a plurality of resultant forces, the part with weak binding force is torn or completely separated, at the moment, the serious reliability of the PCB is poor, such as hole bottom separation, gradual thinning type hole breakage, interface type hole breakage, through hole ICD, blind hole ICD and the like, because the resistance value of a test loop is suddenly increased, the voltage can be suddenly increased as known from V to I R, if the loop is completely broken, R is close to infinity, after V exceeds the set test voltage, a constant current source is changed into a constant voltage source, the current I is close to V/R and I is close to infinity, and the phenomenon is generally diagnosed as PCB hole bottom separation and the like;
s3, cooling, after the HCT high current test is carried out, the temperature of a PCB to be tested is generally higher, the HCT Coupon test area is rapidly cooled by using dry cooling gas, and the temperature is cooled to the state when the front resistance value is measured;
s4, measuring the post resistance, wherein after the PCB undergoes severe temperature change, the PCB with hidden quality danger generates slight change, at the moment, the HCT Cooupon test loop needs to be subjected to 4-wire resistance measurement at normal temperature, and if the connection part of the electroplating holes connected with the HCT Cooupon generates slight cracks, the resistance of the HCT Cooupon after the test is increased; if the HCT Coppon is broken after cooling, the HCT Coppon resistance value is infinite; if the copper ions generated by the action of high-current traction are migrated, the originally unconnected positions are connected to form a local short circuit, so that the resistance value of the HCT Coupon after the test is reduced;
s5, calculating the resistance value change rate,
the resistance change rate is 100% × (rear resistance-front resistance)/front resistance, if the resistance change rate is too large, it indicates that the PCB product has quality hidden trouble after the test, and generally speaking, the resistance value becomes large and the common problems are as follows: blind hole electroplating folding plating (also called crab horn), through hole folding plating, through hole ICD, blind hole blowing hole type hole breaking, hole/surface copper fracture (usually when local or whole copper thickness is insufficient), and the like; the resistance becomes small and common problems are as follows: laser blind hole breakdown, laser blind hole missing connection and the like.
In summary, the following steps: compared with the prior art: the invention can test the PCB product by 5 steps, such as: the method comprises the following steps of hole bottom separation, laser non-penetration, laser miss-drilling, blind hole breaking, through hole breaking, miss-connection, laser breakdown, hole bottom residual glue, foreign body breaking, surface copper deficiency, through hole ICD, through hole copper deficiency, blind hole copper deficiency, laser hole small, blind hole folded plating, through hole folded plating, copper powder in the hole, laser hole small, electroplating hole breaking and the like; in the testing process, the PCB product can not be damaged, the product shipment can not be influenced, and the non-destructive testing is carried out; the test time is short, batch test can be performed, the timeliness is good, the defect problem can be fed back quickly, the production process can be adjusted and improved in time, and unnecessary scrapping loss is avoided.
The HCT test principle is described below:
a special test circuit is designed on a PCB (printed circuit board) plate (the circuit is connected with various electroplating holes in series, such as blind holes, through holes, buried holes and the like, which are called HCT Cooupon for short), a high-temperature area is formed in the HCT Cooupon test area under the external condition, and because the thermal expansion coefficient of the PCB plate substrate is far higher than that of the circuit conductor electroplated copper, the deformation of the PCB substrate in a high-temperature state is far larger than that of the electroplated copper, and the stress in multiple directions can be generated, and if the PCB product has quality hidden trouble, the combined part can be torn or even broken under the action of the multi-direction stress. HCT uses deformation force generated by deformation to test the integrity and bonding capability of the electroplated copper.
HCT test advantages:
the method has the advantages that the HCT can be tested in the process production process, and the bad PCB can be detected in time, so that the expansion of the risk range is reduced.
HCT Coupon is designed in the typesetting blank area independently, the test process only aims at the heating of the HCT Coupon position, other areas are not affected, and PCB test scrapping cannot be generated.
The HCT test can realize on-line test and can feed back whether each connection point of the loop is complete at high temperature. With regard to the blind holes, for products with poor bonding force of the hole bottoms, the PCB can crack the hole bottoms of the blind holes when being heated and expanded, but the blind holes are continued together due to shrinkage of the base material after cooling, and the traditional resistance measurement cannot detect the defect conditions.
The HCT test can be carried out in batches, and the intra-batch resistance variation and the inter-batch resistance variation can be monitored and analyzed after the test is finished. The resistance R value of a single batch of PCB products can be controlled according to the process level, and the detection capability of small outlier products in the batch is improved. Meanwhile, the equipment background database can be used for comparing the material numbers, judging the stability of the manufacturing process and detecting the whole batch of abnormal conditions
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (3)
1. A PCB high current testing method is characterized by comprising the following steps:
s1, measuring the front resistance value: measuring the resistance values of two ends of the HCT Coppon test loop by using a four-wire micro resistance meter;
s2, high-current test: if the resistance value passes the test, entering a large current test link, and the operation steps are as follows:
a) firstly, uniformly heating an HCT Coupon test area by using a constant-temperature heating plate to enable the temperature of the test area to be about 100 ℃, wherein the test time can be shortened in the link, but the change condition within 100 ℃ can not be detected, if the time consumed by the test is not too much, the heating link can be omitted, and the high-current test can be directly started from the normal temperature;
b) carrying out high current test on the HCT Coupon test loop, loading a constant current source at two ends of the HCT Coupon test loop, adding a voltmeter at two ends close to the test loop, and continuously converting electric energy into heat energy Q (I) under the action of current2R T, where I is a set constant high current, R is the resistance of the Coupon test loop, and T is the time for which the current continues to flow; i and T are calculated according to the copper thickness and the width of the designed PCB trace, and at this time, the temperature of the HCT Coupon region will continuously increase, and since the resistance value of the metal will increase almost linearly with the increase of the temperature, and the voltage V ═ I × R at the two ends of the test loop will increase with the increase of the temperature;
c) continuously electrifying the HCT Coupon test loop for a period of time, wherein the specific time is related to the PCB design and the voltage and current of the test, a hot plate heating mode is usually used, a large current is used for testing, and the typical time is 10-20 seconds; if the hot plate is not used for heating, the typical time is 60 seconds, and in the heating process, the substrate material and the metal conductor material are deformed to different degrees due to the rise of temperature, so that stress in multiple directions is generated;
s3, cooling, after the HCT high current test is carried out, the temperature of a PCB to be tested is generally higher, the HCT Coupon test area is rapidly cooled by using dry cooling gas, and the temperature is cooled to the state when the front resistance value is measured;
s4, measuring the rear resistance value, wherein after the PCB undergoes severe temperature change, the PCB with hidden quality danger generates slight change, and at the moment, the HCT Coppon test loop needs to be subjected to 4-wire resistance value measurement at normal temperature;
s5, calculating the resistance change rate: the rate of change of resistance is 100% > (rear resistance-front resistance)/front resistance.
2. The PCB high current testing method of claim 1, wherein: in c) of S2, if the temperature does not reach the set interval or exceeds the set interval within the prescribed time, it indicates that the designed HCT Coupon test loop may have the phenomenon of copper being thin or thick, and in the process, under the action of a plurality of combining forces, the part with weak combining force can be torn or completely separated, which shows that the PCB has poor great reliability, such as hole bottom separation, tapered hole breakage, interface hole breakage, through hole ICD, blind hole ICD, as the resistance of the test loop suddenly increases, as shown by V ═ I × R, the voltage will exhibit a sudden rise, and if the loop breaks completely, R will approach infinity, after V exceeds the set test voltage, the constant current source changes to a constant voltage source, where the current I is V/R, I tends to be infinitesimal, which is usually diagnosed as PCB hole bottom separation.
3. The PCB high current testing method of claim 1, wherein: in S4, if a slight crack is generated at the connection of the plating holes connected to the HCT Coupon, the resistance of the HCT Coupon after the test becomes larger, and if the HCT Coupon is broken after cooling, the resistance of the HCT Coupon becomes infinite, if the copper ions migrate due to a large current drawing action, the originally disconnected positions are connected and become a local short circuit, so that the resistance of the HCT Coupon after the test becomes smaller, in this process, the weak portions are torn or completely separated under the action of a plurality of resultant forces, which means that the reliability of the PCB is poor, such as bottom separation, gradually thinner holes, interfacial holes, ICDs, and ICDs, because the resistance of the test loop is suddenly increased, as known from V ═ I R, the voltage will suddenly increase, if the loop is completely broken, R will approach to infinity, and after V exceeds the set test voltage, the constant current source will change to a constant current source, the current I at this time is V/R, I tends to be infinitesimal, and this phenomenon is usually diagnosed as PCB hole bottom separation.
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| CN110146804B (en) * | 2019-06-08 | 2022-04-01 | 四会富仕电子科技股份有限公司 | PCB dynamic conduction reliability test method |
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| CN114113961A (en) * | 2021-11-05 | 2022-03-01 | 珠海市大鹏电子科技有限公司 | Screening method of photoelectric coupler |
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