KR20060108491A - Apparatus and method for sensing to collect information - Google Patents

Abstract

The present invention relates to a PCB failure pattern inspection apparatus, and more particularly, to a PCB failure pattern inspection apparatus for determining whether or not the PCB pattern by burning a bad pattern by applying a high current to the PCB. .

According to the present invention, at least one PCB with a pattern formed thereon is mounted, the resistance tester for measuring the resistance of the PCB pattern, and applying a high current to the PCB pattern, a power supply unit for supplying a high current to the current tester and a high current It includes a control unit for determining whether the PCB pattern by comparing the first resistance value of the PCB pattern before applying the current and the second resistance value of the PCB pattern after applying a high current.

The present invention has the effect of detecting a defect pattern PCB which has not been detected by conventionally by applying a high current to the PCB to burn out the defect pattern to determine the quality of the PCB pattern.

High current, resistance value, constant current 4 terminal method, printed circuit board, probe pin

Description

Apparatus and Method for Sensing to Collect Information}

1 is a block diagram of a PCB failure pattern inspection apparatus according to an embodiment of the present invention,

2 is a simplified configuration diagram of the withstand current test unit of the PCB bad pattern inspection apparatus of FIG.

3 is a detailed configuration diagram of the withstand current tester of the PCB failure pattern inspection apparatus of FIG.

4 is a front perspective view of the pin block of the withstand current tester;

5 is a flowchart illustrating a PCB defect pattern inspection method according to an embodiment of the present invention;

6 is a diagram illustrating a user interface provided to a user to perform a PCB failure pattern inspection using the PCB failure pattern inspection apparatus according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: current resistance test unit 200: power supply unit

300: control unit 400: input unit

410: output unit

The present invention relates to a PCB failure pattern inspection apparatus and a PCB failure pattern inspection method, and more particularly, PCB failure pattern that determines whether or not the PCB pattern by burning a failure pattern by applying a high current to the PCB. An inspection apparatus and a PCB defect pattern inspection method.

In general, a printed circuit board (PCB) is a circuit line pattern formed of a conductive material such as copper on an electrically insulating substrate, and refers to a substrate immediately before mounting an electronic component.

PCBs are divided into rigid PCBs made of phenol and epoxy and flexible PCBs made of easily bendable materials such as polyimid, depending on the type of substrate material.

On the other hand, as personal portable electronic devices such as mobile phones, PDAs, and digital cameras are popularized, circuit characteristics are stabilized and small and light weight PCBs are used as main boards of personal portable electronic devices, and in particular, FPCB is bent in folder type mobile communication terminals. Used as a circuit of sites.

In order to be used in electronic devices with components mounted on these PCBs, it is necessary to undergo external appearance, micro section and dimensional tests, electrical performance tests, and mechanical performance tests.

However, the conventional PCB test method has a problem that can not find a bad PCB to fall within the error range of the PCB test method. Pattern defects that fall within the error range of the PCB test method are pattern widths that are narrower than the specified width, and the widths of the widths below the specified value due to the inconsistency of the center of the via hole formed in each layer on a multi-layer substrate. Plated with.

The pattern defects falling within the error range of the PCB test method are also directly related to the reliability of the electronic device in which the PCB is finally used. Therefore, the components should be classified and treated as defective in the PCB test step before the components are mounted on the PCB and used in the electronic device. .

The present invention was devised to solve the above-described problems, PCB bad pattern inspection device and PCB bad pattern inspection to determine whether the PCB pattern is damaged by burning a bad pattern by applying a high current to the PCB The purpose is to provide a method.

In addition, an object of the present invention is to provide a PCB failure pattern inspection apparatus capable of inspecting a PCB failure pattern by mounting a plurality of good quality determination target PCB.

Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. Furthermore, the objects and advantages of the present invention can be realized by means and combinations indicated in the claims.

PCB failure pattern inspection apparatus of the present invention for achieving the above object, at least one PCB with a pattern is mounted, measuring the resistance of the PCB pattern, the current resistance test for applying a high current to the PCB pattern The PCB pattern by comparing the first resistance value of the PCB pattern with the high current and the second resistance value of the PCB pattern after applying the high current before applying the high current. It includes; a control unit for determining whether or not.

Here, the current resistance test unit is installed in the magazine box, the magazine box, at least one plate on which the PCB is mounted, a pin block with a probe pin contacted with the pattern of the PCB and the probe pin is connected to the pattern of the PCB And a cylinder for driving the pin block to be in contact.

In addition, the pin block may include two pairs of probe pins, one pair of probe pins may apply a constant current to the PCB pattern, and the other pair of probe pins may measure the voltage of the PCB pattern.

In addition, the PCB failure pattern inspection apparatus of the present invention, the error range, high current size of the determination of the good or bad PCB pattern by the user. Supply time. And an input unit configured to receive a frequency of supply and transmit the received frequency to the controller, wherein the controller sets an error range of the determination of the quantity of both parts of the PCB pattern as a reference for determining the quantity of PCB. Supply time. It is preferable to control the withstand voltage test unit according to the number of supply.

In addition, the PCB failure pattern inspection apparatus of the present invention further includes an output unit for receiving the first resistance value, the second resistance value and the PCB determination result from the control unit to output to the user.

In addition, the PCB failure pattern inspection method of the present invention, a) a first resistance measurement step of measuring the first resistance value of the PCB pattern by contacting the probe pin to the PCB pattern, b) the probe pin to the PCB pattern A high current application step of applying a high current through the second current; c) a second resistance measurement step of measuring a second resistance value of the PCB pattern through the probe pin after applying the high current; and d) the first resistance value And a resistance value comparing step of determining whether the PCB pattern is good by comparing the second resistance value with the second resistance value.

Here, in step d), if the first resistance value and the second resistance value match, it is determined that the PCB pattern is good, and if the first resistance value and the second resistance value do not match, the PCB pattern It is preferable to judge that this is bad.

Also, in the step d), if the difference between the first resistance value and the second resistance value is within an error range set by the user, it is preferable to determine that the first resistance value and the second resistance value match. .

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a block diagram of a PCB failure pattern inspection apparatus according to an embodiment of the present invention. As shown, the PCB failure pattern inspection apparatus according to an embodiment of the present invention includes the withstand current test unit 100, the power supply unit 200, the control unit 300, the input unit 400 and the output unit 410. It is.

Here, the printed circuit board (PCB) is preferably, but not limited to, FPCB, and includes another type of substrate having a circuit line pattern formed of a conductive material on an electrically insulating substrate. Hereinafter, a case where the PCB is an FPCB will be described by way of example.

The withstand current test unit 100 includes one or more FPCBs to be subjected to the determination of acceptance, and the first measurement of the resistance of the pattern formed in the FPCB under the control of the control unit 300 and applying a high current to the pattern After the second measurement of the resistance of the pattern is a component for transmitting to the controller (300). The high current applied to the pattern is preferably a constant current.

The control unit 300 controls the withstand voltage test unit 100 to measure the pattern resistance of the FPCB and apply a high current to the pattern. The control unit 300 receives the primary resistance value and the secondary resistance value measured after applying the high current to the initial resistance value and the pattern measured initially from the withstand voltage test part 100, and then the primary resistance value and the secondary resistance value. When the difference is within the set error range, it is judged as good, and when the difference is outside the set error range, it is determined as bad.

In addition, the control unit 300 may receive an allowable error range of the FPCB pattern resistance from the user through the input unit 400 and set it as a reference for determining the FPCB quantity.

In addition, the control unit 300 receives a current amount, a current supply time, and a current supply frequency applied to a pattern from the user through the input unit 400 and sets the reference, and according to the set criteria, the withstand current test unit 100. Can be controlled.

In addition, the controller 300 may provide the user with the measured resistance value and the result of the determination of the adequacy of the FPCB through the output unit 410. The controller 300 may be connected to other control means such as a personal computer through a communication port.

The input unit 400 may include a device that allows a user to easily input data such as a mouse and a keyboard, and the output unit 410 may display data input by the user and a FPCB defect pattern determination result to the user. Monitor, printer, or the like.

The power supply unit 200 supplies power to the components of the FPCB failure pattern inspection apparatus such as the withstand current test unit 100, the control unit 300, and the input / output unit 400, 410 so that the FPCB failure pattern inspection apparatus of the present embodiment may operate normally. To supply. The power supply unit 200 may further include a DC power supply unit for supplying a constant current to the withstand current test unit 100, and the power supply unit 100, the control unit 300, the input / output unit 400, 410, or the like. It may be configured to include a distribution filter (distribute filter) and a switch to distribute the supply.

2 is a simplified configuration diagram of the withstand current test unit of the PCB failure pattern inspection apparatus of FIG. As shown, the withstand current tester may be implemented in the form of a box (box) that can be mounted on the body of the PCB failure pattern inspection apparatus.

The withstand current test unit 100 is preferably mounted along a guide rail formed on the body of the PCB failure pattern inspection apparatus, but the method of coupling to the body of the PCB failure pattern inspection apparatus is not limited thereto. For example, the withstand current test unit 100 may be implemented in a form that is fixed to the body of the PCB failure pattern inspection apparatus, and may have a structure that can be mounted on the body of the PCB failure pattern inspection apparatus by a method other than the guide rail. There is also.

3 is a detailed configuration diagram of the withstand current tester of the PCB failure pattern inspection apparatus of FIG. 1, and FIG. 4 is a front perspective view of the pin block of the withstand current tester. 3 and 4, the withstand current test unit 100 includes a magazine box 102, a plate 110, a pin block 120, and a cylinder 130.

Magazine box 102 is an appearance of the withstand current test unit 100, it is preferable to have a shape that can be coupled to the body of the PCB failure pattern device. Both sides of the magazine box 102 may be formed with a plate fixing surface 104 that can be fixed to the plate 110.

Plate 110 is a flat support on which the FPCB is mounted, it is preferable that both side ends are fixed in contact with the plate fixing surface 104. A plurality of plates 110 may be installed in the magazine box 102, and the number of plates may be appropriately selected according to the use and size of the FPCB, the capacity of the PCB defect pattern inspection apparatus, and the like. In the present embodiment, 15 magazines 110 are installed in the magazine box 102.

The pin block 120 is a block in which a plurality of probe pins 123 are installed, and a pin holder 122 capable of fixing the probe pins 123 is formed on the side where the FPCB is located, and a cylinder on the opposite side thereof. It is preferable that the driving protrusion 124 receiving the driving force of the 130 is formed.

The pin block 120 moves up and down by the driving force of the cylinder 130 based on the fixed plate 110. When the pin block 120 is lowered, the probe pin 123 is in contact with the pattern of the FPCB mounted on the plate 110 to form an electrical circuit.

The pin block 120 may be guided by one or more guiding rods 125 to stably move up and down by the driving force of the cylinder 130. At this time, it is preferable that a plurality of guiding protrusions 126 having a through hole in which the guiding rods 125 are inserted are formed on the side where the driving protrusion 124 is formed. The guiding rods 125 are preferably firmly fixed to both top and bottom surfaces of the magazine box 102 at both ends.

The probe pins 123 directly contact the pattern of the FPCB to measure the resistance of the FPCB pattern and apply a high current to the FPCB pattern. It is preferable that four probe pairs (two pairs) are provided for the FPCB. . That is, when 15 plates 110 are installed in the magazine box 102, four probe pins 123 are provided for each plate 110, and all 60 are installed.

One pair of two pairs of probe pins 123 may be used as a constant current supply pin for applying a constant current to the FPCB pattern, and the other pair may be used as a sensing pin for measuring the voltage of the FPCB. Since the constant current has a constant value, when the voltage measured through the sensing pin is transmitted to the controller 300, the controller 300 may measure the resistance of the FPCB pattern. Hereinafter, this resistance measurement method will be referred to as a constant current four-terminal measurement method.

The cylinder 130 is a supply source connected to the driving protrusion 124 of the pin block 120 to provide a driving force for the pin block 120 to move up and down, and may be a pneumatic or hydraulic cylinder. The cylinder 130 may be fixed to the cylinder support 132 to transmit the lifting motion driving force of the pin block 120 in a stable state, wherein the cylinder support 132 is firmly fixed to the bottom of the magazine box 102 It is desirable to be.

The stroke distance of the cylinder 130 may be selected as an optimal distance according to the thickness of the PCB, the size of the magazine box 102 and the number of plates 110 installed in the magazine box 102. have. In the present embodiment in which 15 plates 110 are installed in the magazine box 102 and FPCBs are mounted on each plate 110, the stroke distance of the cylinder 130 is preferably about 15 mm.

The following describes a PCB defect pattern inspection method according to an embodiment of the present invention.

Figure 5 is a flow chart of the PCB bad pattern inspection method according to an embodiment of the present invention. As shown in the PCB defect pattern inspection method according to an embodiment of the present invention, the first resistance measurement step (S100), the high current application step (S102), the second resistance measurement step (S104), the resistance value comparison step (S106) and the quantity determination step (S107, S108).

In the first resistance measurement step (S100), the probe pin is contacted with the FPCB pattern, which is the object of acceptance determination, to measure the resistance (first resistance value) of the first FPCB pattern. In the resistance measurement of the FPCB pattern, it is preferable to use the constant current four-terminal method described above. Contact of the probe pins to the FPCB pattern can be achieved by lowering the pin block with the probe pins into the cylinder.

The high current applying step (S102) is a step of applying a high current to the FPCB to burn out the defective pattern. In this case, the defective pattern is a conventional FPCB pattern having a narrow width below the prescribed value, or a plate having a width below the prescribed value due to a mismatch between the centers of via holes formed in each layer in a multi-layer substrate. In PCB test method, the error is included in the error range means the pattern is not detectable.

In the high current applying step (S102), a high current is applied to the FPCB pattern through a constant current supply pin among the probe pins in contact with the FPCB pattern. The high current applied to the FPCB does not affect the good pattern formed on the FPCB, but the narrow pattern, which is narrow and does not meet the specification, is preferably selected to be burned out by the heat generated by the resistance.

The selection parameter of the high current applied to the FPCB may include the current intensity, the current supply time, and the number of current supply. The high current selection parameter may be determined as an optimal value depending on the type and use of the FPCB to be judged as good or bad. In the case of the FPCB determination, the strength of the current is selected in the range of 1A to 10A, the current supply time is selected in the range of 100mS to 500mS, and the number of current supply is preferably selected in the range of 1 to 10 times. The high current selection parameter may be determined by the user through a user interface provided by the FPCB failure pattern inspection apparatus.

If the FPCB pattern includes a bad pattern, in the high current application step S102, the bad pattern is burned out, and as a result, the FPCB pattern is electrically open. On the other hand, if the FPCB pattern does not include a bad pattern, the FPCB can maintain the same FPCB pattern as before the constant current application step.

In the second resistance measurement step S104, after the high current application step S102, the resistance of the FPCB pattern is measured. As the resistance measurement method of the FPCB pattern, it is preferable to use the constant current four-terminal method as in the first resistance measurement step S100.

If the FPCB pattern includes a bad pattern, the resistance value (second resistance value) of the FPCB pattern after the high current application step S102 may preferably have an infinite value.

The resistance value comparing step S106 compares the first resistance value measured in the first resistance measurement step S100 and the second resistance value measured in the second resistance measurement step S104.

When comparing the first resistance value and the second resistance value of the FPCB pattern, a certain error range may be recognized. This is to accommodate the variation generated in the good pattern of the FPCB within the error range due to the high current applied in the high current applying step (S102).

For example, the range of error can range from 0.00 Ohm to 5.00 Ohm. When the error range is 1 ohm, when the difference between the first resistance value and the second resistance value is less than 1 ohm, it may be determined that the first resistance value and the second resistance value coincide with each other.

The quantity determination step (S107, S108) determines the FPCB acceptance according to the result of the resistance value comparison step (S106). In the resistance value comparison step (S106), when the first resistance value and the second resistance value of the FPCB pattern match, the FPCB is determined to be a good quality FPCB not including a defective pattern (S107). If the first resistance value and the second resistance value of the FPCB pattern do not match, the FPCB is determined to be a defective FPCB including a defective pattern (S108).

6 illustrates a user interface provided to a user for performing a PCB failure pattern inspection using the PCB failure pattern inspection apparatus according to an embodiment of the present invention.

As shown, the user can set a high current and resistance value comparison error applied to the FPCB pattern through the user interface. The applied high current is 6A, the current supply time is set to 200mS, the number of current supply is set to 2 times, and the resistance comparison error is set to 1Ohm from 11Ohm maximum to 10Ohm minimum.

15 PCBs were mounted on a PCB failure pattern inspection apparatus according to an embodiment of the present invention, and a result of inspecting the failure pattern was as follows. The first resistance value is 10 and the second resistance value is 11, the first resistance value and the second resistance value. The result of the comparison is within the range of 1 ohm, the difference in which the difference is set. Show the case.

As mentioned above, although this invention was demonstrated by the limited embodiment and drawing, this invention is not limited by this, The person of ordinary skill in the art to which this invention belongs, Of course, various modifications and variations are possible within the scope of equivalent claims.

PCB defect pattern inspection apparatus and PCB defect pattern inspection method of the present invention as described above is a defect that has not been conventionally detected by applying a high current to the PCB to burn out the defect pattern to determine the quality of the PCB pattern There is an effect that can detect a pattern PCB.

In addition, it is possible to inspect the PCB failure pattern by mounting a plurality of PCBs to be judged good quality, there is an effect that can increase the efficiency of PCB failure pattern inspection.

Claims (10)

At least one printed circuit board (PCB) having a pattern formed thereon, measuring a resistance of the PCB pattern and applying a high current to the PCB pattern; A power supply unit supplying a high current to the current resistance test unit; And A control unit which determines whether the PCB pattern is good by comparing the first resistance value of the PCB pattern with the high current before applying the high current and the second resistance value of the PCB pattern; PCB failure pattern inspection apparatus comprising a. The method of claim 1, The current resistance test unit, Magazine box, At least one plate installed in the magazine box and mounted with a PCB; A pin block having a probe pin installed in contact with the PCB pattern, And a cylinder driving the pin block so that the probe pin contacts the pattern of the PCB. PCB bad pattern inspection device. The method of claim 1, The pin block has two pairs of probe pins, A pair of probe pins apply a constant current to the PCB pattern, Another pair of probe pins to measure the voltage of the PCB pattern PCB bad pattern inspection device. The method of claim 1, Error range, high current size, to judge the PCB pattern by the user. Supply time. It further includes an input unit for receiving the number of supply and transmits to the control unit, The control unit sets the error range of the determination of the positive part of the PCB pattern as a reference of the PCB positive judgment, the magnitude of the high current. Supply time. To control the current resistance test unit according to the number of supply PCB bad pattern inspection device. The method of claim 1, Output unit for receiving the first resistance value, the second resistance value and the PCB determination result from the control unit and outputs to the user PCB failure pattern inspection device further comprising. a) first resistance measurement step of measuring a first resistance value of the PCB pattern by contacting the probe pin to the PCB pattern; b) applying a high current to the PCB pattern through the probe pin; c) a second resistance measurement step of measuring a second resistance value of the PCB pattern through the probe pin after applying the high current; And a resistance value comparing step of determining whether the PCB pattern is good by comparing the first resistance value with the second resistance value; PCB failure pattern inspection method comprising a. The method of claim 6, The probe pin is two pairs, A pair of probe pins apply a constant current to the PCB pattern, Another pair of probe pins to measure the voltage of the PCB pattern How to check PCB bad pattern. The method of claim 6, wherein b), Determining the applied high current with at least one parameter value selected from among current magnitude, current supply time and number of current supply parameters Included How to check PCB bad pattern. The method of claim 6, wherein step d), If the first resistance value and the second resistance value match, it is determined that the PCB pattern is good, If the first resistance value and the second resistance value does not match, it is determined that the PCB pattern is bad How to check PCB bad pattern. The method of claim 9, wherein step d), When the difference between the first resistance value and the second resistance value is within the error range set by the user, it is determined that the first resistance value and the second resistance value match. How to check PCB bad pattern.

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