JP3719137B2 - Printed wiring board inspection equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board inspection apparatus.
[0002]
[Prior art]
A conventional inspection apparatus of this type will be described with reference to the drawings. FIG. 7 is a block diagram of a main part of a conventional printed wiring board inspection apparatus. Reference numeral 12 denotes a holder made of an insulator that can move up and down. Reference numeral 9 denotes a plurality of elastic spring probes made of a metal material and attached to the holder 12.
[0003]
The lower end of the spring probe 9 has a conical shape so as to come into contact with the electrode 3 of the printed wiring board 2 to be inspected, one end of the wiring member 8 a is connected to the upper end, and the other end is connected to the inspection unit 18.
[0004]
The printed wiring board 2 to be inspected has a configuration in which a wiring pattern made of a copper foil of a conductor material, a plurality of electrodes 3 and the like are provided on one surface of an insulating base material 5 such as phenol resin, epoxy resin, or polyimide resin.
[0005]
At the time of inspection, the holder 12 is lowered at the position of the electrode 3 which is a point to be inspected on the printed wiring board 2 to be inspected, and the lower end of the spring probe 9 is elastically contacted to be connected via the wiring member 8a. The inspection unit 18 performs comparison calculation and determination to measure and inspect the electrical connection state at a predetermined location of the printed wiring board 2 to be inspected.
[0006]
[Problems to be solved by the invention]
However, in the conventional configuration, when the density of the electrodes 3 is high, it is necessary to mount the thin spring probes 9 densely. However, the thin spring probes 9 are easily damaged, and a plurality of spring probes 9 are attached. It is not easy to make contact with the electrode 3 with high accuracy and sure elasticity, and as a result, there is a problem that it is difficult to measure and inspect the printed wiring board of the high-density electrode.
[0007]
The present invention is intended to solve the above-described conventional problems, and an object of the present invention is to provide an inspection apparatus capable of reliably performing a measurement inspection of a printed wiring board having a high-density electrode.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, a printed wiring board inspection apparatus according to the present invention includes a contact portion disposed at a position facing a plurality of electrodes formed on a printed wiring board to be inspected, and a wiring portion connected to the contact portion. An inspection board provided with a connected wiring terminal; a connection part that is in electrical contact with the wiring terminal; a camera that recognizes a relative positional relationship between the inspection board and the printed wiring board to be inspected; An alignment mechanism for relatively moving the inspection substrate and the printed wiring board to be inspected, a pressing portion for pressing the contact portion to connect to the electrode, and an electrical connection between the connecting portion and the printed wiring board to be inspected It consists of an inspection unit that measures and inspects the state . The inspection board is provided with a hole to see through the reference mark provided on the printed wiring board to be inspected, and a camera that detects the reference mark through the hole is installed in the pressing part. Do it Is obtained by the structure, is connected inspection board and the objective printed circuit board easily and reliably in the inspection apparatus, it is possible the electrical connection state measurement and inspection.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, there is provided a contact portion disposed at a position facing a plurality of electrodes formed on a printed wiring board to be inspected, and a wiring terminal connected to the contact portion via the wiring portion. An inspection board provided; a connection portion that is electrically connected to the wiring terminal by pressure contact; a camera that recognizes a relative positional relationship between the inspection board and the printed wiring board to be inspected; An alignment mechanism that relatively moves the inspection printed wiring board, a pressing portion that presses the contact portion to connect to the electrode, and an electrical connection state of the printed wiring board that is connected to the connection portion is measured and inspected. Ri Do and a checking unit which, on the testing board, provided with a hole for the perspective a reference mark provided on the objective printed circuit board, formed by installing a camera for detecting reference mark through the hole in the pressing portion Inspection equipment for printed wiring boards , And the is not limited to the materials used, the inspection substrate and the objective printed circuit board can be aligned easily and accurately, it has the effect of measurement and inspection can be easily and reliably.
[0014]
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same number is given to the same mechanism member as what was demonstrated by the prior art, and detailed description is simplified.
[0015]
1 and 2, 3 is an electrode, 5 is an insulating substrate, and 2 is a printed wiring board to be inspected. Reference numeral 1 denotes an inspection substrate, in which a wiring pattern 7 is formed on one surface with a conductor material such as copper foil, and an insulating material is provided with a through hole filled with a conductive material 6 made of copper, silver, nickel, filler, or the like. A necessary number of base materials 5a are stacked and electrically connected.
[0016]
The conductive material 6 and the wiring pattern 7 constitute a multilayer wiring portion 21, 1 b is the lowermost layer of the laminated insulating base material 5 a, and the lower surface is connected to the conductive material 6 of the through hole, and the electrode 3 A plurality of contact points 4 having a shape similar to that of the contact point 14 are provided as contact points 14.
[0017]
Moreover, 1c is the uppermost layer of the laminated | stacked insulating base material 5a, and has provided the several wiring terminal 8 connected with the electroconductive substance 6 of a through hole on the upper surface. The wiring terminal 8 can also be formed on the lower surface or the outer peripheral end surface 1d of the lowermost layer 1b of the inspection substrate 1.
[0018]
The plurality of contacts 4 and the wiring pattern 7 that are the contact portions 14 are formed by photo-etching or plating of copper foil. The insulating substrate 5a is made of an insulating resin such as phenol, polyimide, epoxy, or polyester, or a material obtained by adding a reinforcing material such as paper, glass fiber, or aramid fiber to the insulating resin.
[0019]
Reference numeral 11 denotes an inspection plate made of an insulating material that can move up and down, and is provided with a stretchable spring probe 9 whose lower end abuts against a wiring terminal 8 provided on the inspection substrate 1. Further, the upper end of the spring probe 9 is connected to the inspection unit 18 by a flexible wiring member 8a, and this portion constitutes the connection unit 19.
[0020]
Reference numeral 10 denotes a pressing member made of an elastic body such as a spring, rubber, or resin. The pressing member 20 is disposed or mounted between the inspection plate 11 and the inspection substrate 1 to constitute the pressing portion 20.
[0021]
The wiring terminal 8 is disposed on the upper surface of the inspection substrate 1 larger than the printed wiring board 2 to be inspected, and the contact portion 14 can press all the corresponding electrodes 3 by the downward movement of the pressing member 10. It has a configuration.
[0022]
In addition, a spring probe 9 is used for the connection portion 19 so that it can cope with various inspections of the printed wiring board 2 to be inspected, and the inspection substrate 1 can be replaced. A connection body may be used, and when the printed wiring board 2 to be inspected is limited to one type, it may be fixed to the wiring terminal 8 with a flexible or stretchable or flexible wiring material.
[0023]
As shown in FIG. 2, a wiring portion 21 a of the inspection substrate 1 is provided on the upper surface of the inspection substrate 1 with which the pressing portion 20 abuts. Therefore, the pressing force of the pressing portion 20 is not uniformly transmitted to the entire contact portion 14 due to a step due to the wiring portion 21a, and for example, a state in which the contact 4d does not contact the electrode 3f may occur.
[0024]
Therefore, in order to prevent this, a plane holding body 21b made of a metal foil or an insulating film having the same thickness as the wiring portion 21a is provided adjacent to the wiring portion 21a, and an upper surface opposite to the surface on which the contact portion 14 is provided. A uniform pressing force is applied to the contact portion 14 so that the right side of the inspection substrate 1 shown in FIG. 2 is slightly lowered to bring the contact 4d and the electrode 3f into contact with each other.
[0025]
At the time of inspection, the printed wiring board 2 to be inspected is placed on and contacted with a measurement inspection stage (not shown), and then the inspection plate 11 is lowered to bring the lower end of the spring probe 9 into elastic contact with the surface of the wiring terminal 8. Subsequently, the inspection plate 11 and the inspection substrate 1 are simultaneously lowered together. Then, the contact portions 14 are brought into contact with and connected to the corresponding electrodes 3 of the printed wiring board 2 to be inspected, and a predetermined electrical connection state of the printed wiring board 2 to be inspected is measured, inspected, and determined by the inspection portion 18.
[0026]
FIG. 3 is a configuration diagram of the main parts of the alignment mechanism and the recognition mechanism for alignment and confirmation of the inspection substrate 1 and the printed wiring board 2 to be inspected. As shown in FIG. Alignment that drives them in the X-axis, Y-axis, and θ-axis directions to relatively move the inspection camera 1 and the inspection substrate 1 and the printed wiring board 2 to be inspected, which can be moved horizontally and vertically. The mechanism 33 is configured to be coupled to a part of the pressing portion 20.
[0027]
When the inspection substrate 1 and the printed wiring board 2 to be inspected are positioned and brought into contact with each other for measurement and inspection, the corresponding upper and lower surfaces are recognized between the inspection substrate 1 and the printed wiring board 2 to be inspected. The camera 32 is disposed, the position of the contact 4 on the electrode 3 and the contact portion 14 is recognized, and the position of the inspection substrate 1 is corrected by the alignment mechanism 33 in the X axis direction, the Y axis direction, and the θ axis direction. When measuring and inspecting, the recognition camera 32 is retracted in the directions of arrows F and G, respectively, and then the inspection substrate 1 and the printed wiring board 2 to be inspected are brought into contact with each other and connected. It can be aligned with accuracy, and measurement inspection can be performed easily and reliably.
[0028]
Since both the electrode 3 and the contact 4 are part of the pattern formed on the printed wiring board, it is not necessary to add a special recognition mark, and for the electrode 3 and the contact 4 of any shape. Can respond.
[0029]
FIG. 4 is a cross-sectional view of the main part of the pressing portion provided with the inspection substrate having the reference mark and the alignment hole and the camera for recognition thereof. As shown in FIG. 4, the surface on which the electrode 3 is formed is shown. An inspected printed wiring board 2 provided with one or a plurality of reference marks 3d is provided. Further, the inspection substrate 1 having the alignment hole 15 is provided through the central portion of the reference mark 4k disposed in the same positional relationship as the reference mark 3d. The inspection substrate 1 and the substrate to be inspected are positioned on the side opposite to the surface provided with the contact portion 14 formed by the contact 4 of the inspection substrate 1 and at the position where the reference mark 3d can be detected by looking through the alignment hole 15. it is provided with a test printed circuit board pressing portions 20 of the second relative positional relationship recognizing camera 16 to one or chromatic plurality.
[0030]
According to the above configuration, the inspection substrate 1 and the inspected printed wiring board 2 can be aligned with high accuracy based on the positional relationship recognized by the camera 16. Further, since the inspection substrate 1 and the printed wiring board 2 to be inspected are matched in relative positional relationship, it is advantageous that the mounting position accuracy of the camera 16 does not significantly affect the alignment.
[0031]
The reference mark 3d can be processed at the same time as the contact portion 4 if the copper foil, which is a conductor material, is formed by photo-etching or laser cutting as in the case of forming the contact 4 that becomes the contact portion 14. The positional relationship with the contact portion 14 becomes high accuracy.
[0032]
FIG. 5 is a configuration diagram of the main part of an inspection apparatus provided with an alignment mechanism and a press drive unit capable of controlling the pressing force. As shown in FIG. 5, the inspection unit 18, wiring member 8a, and pressing unit 20 described above are shown. The operating body 38 is arranged on the outer periphery of the inspection substrate 1 of the basic inspection apparatus including the inspection substrate 1 and the printed wiring board 2 to be inspected. The operating body 38 operates with the alignment mechanism 33. In addition, a control unit 39 for arbitrarily setting and controlling the pressing force to the pressing unit 20 is provided, and the pressing unit 20 is operated via the press driving unit 37.
[0033]
The press drive unit 37 is disposed separately from the position where the driving force is not transmitted to the alignment mechanism 33, and the inspection substrate 1 and the printed wiring board 2 to be inspected can be aligned with high accuracy, and The pressing for contact is reliable and can be set with high accuracy.
[0034]
In addition, as the contact portion 14 deteriorates or the constituent material of the printed wiring board 2 to be inspected changes, the pressing force applied to the pressing portion 20 is changed by the control portion 39 and optimally set and controlled. The life of the contact portion 14 can be extended without damaging the printed wiring board 2.
[0035]
FIG. 6 is a configuration diagram of a main part of an inspection apparatus provided with an alignment confirmation mechanism combined with a trace addition body. As shown in FIG. 6, an inspection substrate 1 and an inspected printed wiring board 2 are added to a basic inspection apparatus including an inspection portion 18, a wiring member 8a, a pressing portion 20, an inspection substrate 1 and an inspected printed wiring board 2. In other words, in order to confirm that the contact portion 14 and the electrode 3 are in contact with each other and connected, a reference trace 42 is added when the contact and connection are made. Specifically, one or a plurality of trace addition bodies 41 such as dummy pins, conduction pins, or laser irradiation bodies are provided, and the alignment confirmation mechanism 40 is inserted and driven through the alignment holes 15 provided in the inspection substrate 1. Thus, the trace 42 is formed.
[0036]
If this part is further explained, the trace addition body 41 combined with the alignment confirmation mechanism 40 provided in the vicinity of the contact portion 14 and on the diagonal line is measured by inspecting the electrical connection state of the printed wiring board 2 to be inspected. At the same time, it is driven to add a trace 42 to the dummy electrode or resist of the printed wiring board 2 to be inspected. Then, after performing the measurement inspection, the trace 42 is detected by a recognition camera or the like, thereby confirming the alignment, that is, the state in which the contact portion 14 and the electrode 3 are in contact with and connected to each other. It is possible to easily and reliably confirm the alignment of the inspection printed wiring board 2 and the state of contact or contact.
[0037]
It is also possible to apply a method of applying ink, paint, or the like to a part of the surface of the contact portion 14 and transferring it when contacting the electrode 3.
[0038]
The case where a plurality of electrodes 3 are provided on one side of the printed wiring board 2 to be inspected has been described above. However, the printed wiring board 2 to be inspected having a plurality of electrodes 3 on both sides includes the same attachment mechanism as described above. If two or more inspection substrates 1 are provided and are arranged so as to sandwich the printed wiring board 2 to be inspected, and two or more inspection substrates 1 are integrated and moved to perform measurement and inspection. Good.
[0039]
【The invention's effect】
As described above, according to the present invention, measurement and inspection of a printed wiring board having a high-density electrode can be easily and reliably performed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a principal part of a printed wiring board inspection apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a principal part of the pressing part, an inspection substrate and a printed wiring board to be inspected. FIG. 4 is a configuration diagram of the main part of the alignment mechanism and the recognition mechanism. FIG. 4 is a configuration diagram of the main part of the pressing unit provided with the inspection substrate having the reference mark and the alignment hole and the recognition camera. Fig. 6 is a block diagram of the main part of an inspection apparatus provided with a press drive unit. Fig. 6 is a block diagram of the main part of an inspection apparatus provided with an alignment confirmation mechanism combined with the trace addition body. Main part configuration diagram [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Inspection board | substrate 1b Lowermost layer 1c Uppermost layer 1d End surface 2 Inspected printed wiring board 3, 3f Electrode 3d, 4k Reference mark 4, 4d Contact 5, 5a Insulating base material 6 Conductive substance 7 Wiring pattern 8 Wiring terminal 8a Wiring material DESCRIPTION OF SYMBOLS 9 Spring probe 10 Press member 11 Inspection plate 12 Holder 14 Contact part 15 Positioning hole 16, 32 Camera 18 Inspection part 19 Connection part 20 Press part 21,21a Wiring part 21b Planar holding body 33 Alignment mechanism 37 Press drive part 38 Operation Body 39 Control unit 40 Alignment confirmation mechanism 41 Trace added body 42 Trace

Claims (1)

An inspection board provided with a contact portion disposed at a position facing a plurality of electrodes formed on the printed wiring board to be inspected, and a wiring terminal connected to the contact portion via the wiring portion, and a pressure contact with the wiring terminal A connection part that is electrically connected, a camera that recognizes a relative positional relationship between the inspection substrate and the printed wiring board to be inspected, and an alignment mechanism that relatively moves the inspection substrate and the printed wiring board to be inspected. When a pressing portion for pressing to connect the contact portions to the electrodes, the Ri Do after being connected to the connecting portion and the inspection section for inspecting and measuring an electrical connection state of the objective printed circuit board, a substrate for inspection Is a printed wiring board inspection apparatus in which a hole for seeing through the reference mark provided on the printed wiring board to be inspected is provided, and a camera for detecting the reference mark is installed in the pressing portion through the hole .

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