CN109031092A - A kind of PCB high current test method - Google Patents
A kind of PCB high current test method Download PDFInfo
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- CN109031092A CN109031092A CN201810778207.XA CN201810778207A CN109031092A CN 109031092 A CN109031092 A CN 109031092A CN 201810778207 A CN201810778207 A CN 201810778207A CN 109031092 A CN109031092 A CN 109031092A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- General Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of PCB high current test method, including the measurement of preceding resistance value, high-current test, cool, rear resistance value measures, resistance varying-ratio calculates.The present invention by the tests of 5 steps, can by PCB product such as: bottom hole separates, it is radium-shine not thoroughly, radium-shine no marking, blind hole holes, through-hole holes, is missed, radium-shine breakdown, bottom hole residue glue, foreign matter holes, face copper are insufficient, through-hole ICD, through-hole hole copper is insufficient, and hole copper is insufficient, radium-shine hole is small, blind hole folding plating, through-hole folding plating, the problems such as copper powder in hole, laser hole is small, and electroplating hole is broken detects；During test, any damage will not be caused to PCB product, will not influence product turnout, test for nondestructive；It is shorter to test spent time, bulk test can be carried out, timeliness is good, where energy rapid feedback defect problem, in order to adjust in time and improve production technology, avoids unnecessary loss from spoilage.
Description
Technical field
The present invention relates to PCB the field of test technology more particularly to a kind of PCB high current test methods.
Background technique
PCB (PrintedCircuitBoard), Chinese are printed circuit board.Important load as electronic component
Body, PCB are combined with numerous electronic components, construct the miscellaneous electronic product that can be seen in life.Hand
Machine, smartwatch, computer, television set, automobile, satellite, space shuttle ....
With the development of science and technology human living standard is greatly improved, people to the safety of electronic product and
More stringent requirements are proposed for reliability.Perhaps mobile phone perhaps computer primary blank screen once in a while you only need to be reset or restart one
Under, that influences your usage experience；If the explosion on fire of battery of mobile phone, if the vehicle run at high speed is unexpected out of control
, if the catastrophic failure of opportunity of combat guided missile, if the consequence of unexpected these events of failure ... of satellite in the sky can not be gone
Imagination, only wants to never to appear in reality forever.However, with the higher and higher intelligence degree of electronic products, producing
The volume of product is smaller and smaller, and the integration degree of the electronic component for constituting product and PCB is necessarily caused to become increasingly complex, then right
PCB qualitative reliability proposes new problem.
The production process of PCB is extremely complex, and the birth of one piece of PCB needs to undergo drilling, and heavy copper is electroplated, etching ... etc.
All multi-process.In each procedure, or because of device parameter problem, or because of external environment problem, or because personnel's operational issue or because
Process recipe problem, this many factor doping that may be present together, may result in PCB finished product and quality hidden danger occur.
In the production process of electronic product, need to mount and weld miscellaneous electronic component on pcb board material,
So PCB needs to undergo the high temperature procedure for producing such as hot wind reflow oven or wave-soldering.In this type high temp processing procedure, the heat of pcb board material
The connection that expansion may result in internal layer circuit goes wrong, and problems will affect the integrality of PCB circuit signal transmission,
There may be the potential risks of electronic product disabler.Usual problems are higher in pcb board material risk middle grade, influence model
It encloses relatively extensively, will lead to the great economic reimbursement of damages of pcb board production plant.
Pcb board simulation test experiment is tested using such as IR mostly at present, test, hot oil test, the test such as TCT, IST, on
It states test method and can not apply and completed during semi-finished product processing procedure, test spent time is longer and can not carry out batch work
All there is certain defect detection blind area in industry, every kind of test method, and testing is mostly destructive verifying, can only carry out sample and test
Card.If thermal stress is tested, it can not monitor porous, need to be observed by being sliced at random, and can not batch jobs.
Therefore needing to set a kind of PCB high current test side, (English of its high current: High Current Test is referred to as
HCT), it can overcome the disadvantages that the deficiency of the above test method, (semi-finished product) batch testing can be able to carry out in processing procedure production process, and
Any damage will not be caused to PCB product.
Summary of the invention
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of PCB high current test proposed
Method.
To achieve the goals above, present invention employs following technical solutions:
A kind of PCB high current test method, which is characterized in that specifically includes the following steps:
S1, preceding resistance value measure: carrying out resistance value measurement to the both ends of HCT Coupon test loop using the micro- resistance instrument of four lines；
S2, high-current test: if the test of preceding resistance value passes through, enter high-current test link, operating procedure are as follows:
A) HCT Coupon test zone is evenly heated using heated at constant temperature disk first, keeps test zone temperature big
About 100 DEG C or so, this link can shorten the testing time, but will lead to the situation of change within 100 DEG C cannot detect, such as to survey
Time spent by trying does not require too much, can omit this heating link, the high-current test directly since room temperature；
B) high current test is carried out to HCT Coupon test loop, is loaded using a constant current source in HCT
The both ends of Coupon test loop increase a voltmeter at the both ends close to test loop, and under the action of electric current, electric energy is held
It is continuous to be converted into thermal energy Q=I2* (I is the constant high current of setting to R*T, and R is the resistance value of Coupon test loop, and T is persistently to power on
The time of stream；I and T is got according to the calculating of the copper thickness and line width of the route of designed PCB) area HCT Coupon at this time
Domain temperature can continue to increase, due to metal resistance value can the raising of near-linear as the temperature rises, and test loop two
The voltage V=I*R at end, voltage can increase as the temperature rises；
C) lasting to be powered a period of time, specific time and PCB design to HCT Coupon test loop, and test
Voltage and current is related, usually using hot plate heating method, is then tested using high current, and typical time period is 10~20 seconds,
It is such as heated without using hot plate, then the typical time is 60 seconds, and in this heating process, substrate material and metallic conductor material are all
Different degrees of deformation can occur because of the raising of temperature, generate the stress of multiple directions；
S3, it cools, after being tested by HCT high current, PCB regional temperature to be measured is usually higher at this time, using dry
Dry cooling gas is rapidly cooled cooling to HCT Coupon test zone, the shape before temperature is cooled to when resistance value measurement
State；
S4, rear resistance value measure, and after it experienced violent temperature change, there are the PCB products of quality hidden danger for itself just
Subtle variation can be generated, this moment, needs to carry out HCT Coupon test loop the 4 line resistance values measurement under room temperature；
S5, resistance varying-ratio calculate:
Resistance varying-ratio=100%x (the rear preceding resistance value of resistance value -)/preceding resistance value.
Preferably, in the c of S2) in, if this link is before the deadline, temperature cannot reach setting section or
More than the region of setting, then it represents that designed HCT Coupon test loop there may be the phenomenon that copper is thin or copper is thick, this
In the process, under the action of multiple resultant forces, the weak part of binding force will be torn or be kept completely separate, and then show as at this time
The great reliability of PCB is bad, and if bottom hole separates, gradually slim hole is broken, and interface type hole is broken, through-hole ICD, blind hole ICD etc., due to test
Loop resistance value becomes larger suddenly, and by V=I*R it is found that voltage can show as unexpected rising, if circuit is broken completely, R becomes
It is bordering on infinity, after V is more than the test voltage of setting, constant-current source variation is constant pressure source, and electric current I=V/R at this time, I become
It is bordering on infinitesimal, such phenomenon phenomenon is usually diagnosed as PCB aperture bottom separation etc..
Preferably, in S4, if the junction of the electroplating hole of HCT Coupon connection produces slight slight crack, can make to survey
The resistance value of HCT Coupon becomes larger after examination, if be broken after cooling, HCT Coupon resistance value is infinity, if through excessive
Originally disconnected position is connected to and becomes partial short-circuit, makes HCT after test by the copper ion migration that current draw effect generates
The resistance value of Coupon becomes smaller, and during this, under the action of multiple resultant forces, the weak part of binding force will be torn or completely
Separation, it is bad then to show as the great reliability of PCB at this time, and if bottom hole separates, gradually slim hole is broken, and interface type hole is broken, through-hole ICD,
Blind hole ICD etc., due to becoming larger suddenly for test loop resistance value, by V=I*R it is found that voltage can show as unexpected rising, if
Circuit is broken completely, then R levels off to infinity, and after V is more than the test voltage of setting, constant-current source variation is constant pressure source, this
When electric current I=V/R, I levels off to infinitesimal, and such phenomenon is usually diagnosed as PCB aperture bottom separation etc..
A kind of PCB high current test method provided by the invention, compared with prior art: the present invention passes through 5 steps
Test, can by PCB product such as: bottom hole separates, it is radium-shine not thoroughly, radium-shine no marking, blind hole holes, through-hole holes misses, radium
Shooting is worn, bottom hole residue glue, foreign matter holes, and face copper is insufficient, through-hole ICD, and through-hole hole copper is insufficient, and hole copper is insufficient, and radium-shine hole is small,
The problems such as blind hole folding plating, through-hole folding plate, and copper powder in hole, laser hole is small, and electroplating hole is broken detects；
The present invention during the test, any damage will not be caused to PCB product, will not influence product turnout, be non-
Destruction test；
Test spent time of the invention is shorter, can carry out bulk test, and timeliness is good, can rapid feedback defect problem
Place avoids unnecessary loss from spoilage in order to adjust in time and improve production technology.
Detailed description of the invention
Fig. 1 is the section schematic diagram of HCT Coupon；
Fig. 2 is high current test schematic diagram；
Fig. 3 .1 is that HCT high current tests current graph；
Fig. 4 is cold and hot period exception hole bottom state
Fig. 4 .1 is HCT high current test temperature curve graph；
Fig. 4 .2 is HCT high current test voltage curve graph；
Fig. 5, which is that pcb board is heated, generates deformation schematic diagram；
Fig. 6 is that HCT tests abnormal current situation；
Fig. 7 is that heated at constant temperature disk carries out heating schematic diagram to HCT Coupon test zone；
Fig. 8 is test flow chart of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment and attached
Figure, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used to explain this hair
It is bright, it is not intended to limit the present invention.
Embodiment 1
A kind of PCB high current test method, specifically includes the following steps:
S1, preceding resistance value measure: resistance value measurement is carried out to the both ends of HCT Coupon test loop using four lines micro- resistance instrument,
(shown in HCT Coupon cabling schematic diagram 1), this link can detect PCB plating imperfection problem, if measurement resistance value with
Theoretically there are biggish deviations for resistance value, then problem is mainly caused such as by following possible factor: plating laser blind hole/through-hole hole
Thoroughly/the aperture of broken, laser blind hole no marking/is not less than normal, machine drilling leakage bore or bore partially, pressing combination group staggered floor not etc.；
If the test of S2, preceding resistance value passes through, enter high-current test link, (this link is that analog PCB crosses hot wind reflow
The high temperature production process such as furnace or wave-soldering, the typical temperature during this are between 220 DEG C~260 DEG C), operating procedure are as follows:
A) HCT Coupon test zone is evenly heated using heated at constant temperature disk first, as shown in fig. 7, making to test
About 100 DEG C of regional temperature or so, the main ingredient of PCB substrate is epoxy resin, will appear glass transition at 90 DEG C or so,
There is acute variation before and after inflection point in its thermal expansion coefficient, therefore is heated to 100 DEG C or so, and it is acute that the use time short as far as possible generates it
Strong deformation, this link can shorten the testing time, but will lead to the situation of change within 100 DEG C cannot detect, such as to test
The spent time does not require too much, can omit this heating link, the high-current test directly since room temperature；
B) high current test is carried out to HCT Coupon test loop, is loaded using a constant current source in HCT
The both ends of Coupon test loop increase a voltmeter (as shown in Figure 2) at the both ends close to test loop；In the work of electric current
Under, electric energy continuous transformation is thermal energy Q=I2* (the constant high current that I sets for us, R are Coupon test loop to R*T
Resistance value, T continue the time of upper electric current for us；The copper thickness and line width of the route of PCB of the I and T according to designed by us
Calculating is got) at this time HCT Coupon regional temperature can continue increase (see Fig. 4 .1), since the resistance value of metal can be with temperature
Raising and the raising of near-linear, and the voltage V=I*R at test loop both ends, voltage can increase as the temperature rises
(see Fig. 5)；
C) lasting to be powered a period of time, specific time and PCB design to HCT Coupon test loop, and test
Voltage and current is related.It usually using hot plate heating method, is then tested using high current, typical time period is 10~20 seconds；
It is such as heated without using hot plate, then the typical time is 60 seconds.In this heating process, substrate material and metallic conductor material are all
Different degrees of deformation can occur because of the raising of temperature, generate the stress of multiple directions；(shown in Fig. 5)；
C1) under normal circumstances, the current curve in test, voltage curve, as above figure (3,4,5) is shown for temperature curve etc.,
If before the deadline, temperature cannot reach the section of setting or the region more than setting, then it represents that designed HCT
There may be the phenomenons that copper is thin or copper is thick for Coupon test loop；
C2) during this, under the action of multiple resultant forces, the weak part of binding force will be torn or be kept completely separate,
It is bad that the great reliability of PCB is then shown as at this time, and if bottom hole separates, gradually slim hole is broken, and interface type hole is broken, through-hole ICD, blind hole
ICD etc., due to becoming larger suddenly for test loop resistance value, by V=I*R it is found that voltage can show as unexpected rising, if circuit
Fracture completely, then R levels off to infinity, and after V is more than the test voltage of setting, constant-current source variation is constant pressure source, at this time
Electric current I=V/R, I level off to infinitesimal, and such phenomenon phenomenon is usually diagnosed as PCB aperture bottom separation etc.；
S3, it cools, after being tested by HCT high current, PCB regional temperature to be measured is usually higher at this time, using dry
Dry cooling gas is rapidly cooled cooling to HCT Coupon test zone, the shape before temperature is cooled to when resistance value measurement
State；
S4, rear resistance value measure, and after it experienced violent temperature change, there are the PCB products of quality hidden danger for itself just
Subtle variation can be generated, this moment, it would be desirable to 4 line resistance values under room temperature be carried out to HCT Coupon test loop and measured, such as
The junction of the electroplating hole of fruit HCT Coupon connection produces slight slight crack, can make the resistance value change of HCT Coupon after test
Greatly；If be broken after cooling, HCT Coupon resistance value is infinity；If the copper generated through super-high-current draw from
Originally disconnected position is connected to and becomes partial short-circuit by son migration, and the resistance value of HCT Coupon after testing is made to become smaller；
S5, resistance varying-ratio calculate,
Resistance varying-ratio=100%x (the rear preceding resistance value of resistance value -)/preceding resistance value, if resistance varying-ratio is excessive, show through
It goes through after this time test, there are quality hidden danger for PCB product, and typically resistance value becomes larger common problem such as: blind hole plating folding plating
(also crying crab angle), through-hole folding plating, through-hole ICD, blind hole ICD, blind hole aperture blowing type hole is broken, and hole/face copper fracture is (usually in part
Or when global copper thickness deficiency) etc.；Resistance value becomes smaller common problem such as: laser blind hole breakdown, laser blind hole are missed.
In summary: compared with prior art: the present invention by the tests of 5 steps, can by PCB product such as:
Bottom hole separation, radium-shine not saturating, radium-shine no marking, blind hole holes, through-hole holes are missed, radium-shine breakdown, bottom hole residue glue, foreign matter holes,
Face copper is insufficient, through-hole ICD, and through-hole hole copper is insufficient, and hole copper is insufficient, and radium-shine hole is small, blind hole folding plating, through-hole folding plating, copper in hole
The problems such as powder, laser hole is small, and electroplating hole is broken detects；During test, any damage will not be caused to PCB product, no
It will affect product turnout, tested for nondestructive；It is shorter to test spent time, bulk test can be carried out, timeliness is good, can be fast
Where speed feedback defect problem, in order to adjust in time and improve production technology, unnecessary loss from spoilage is avoided.
HCT test philosophy is introduced below:
A proprietary test circuit is designed on pcb board material, and (this circuit has been connected various electroplating holes, such as blind hole, and through-hole buries
Hole etc., abbreviation HCT Coupon), additional certain condition makes HCT Coupon test zone form a high-temperature area,
Because the thermal expansion coefficient of pcb board substrate is much higher than the thermal expansion coefficient of line conductor electro-coppering, necessarily cause at high operating temperatures
Deformation caused by PCB substrate is much larger than the deformation of electro-coppering, the stress of multiple directions can be generated, as there are quality for PCB product
If hidden danger, binding site will be torn or even pull apart under the action of multiaxial stress.HCT is exactly that deformation is utilized to generate deformation
Power come detect electro-coppering integrality and bond ability.
HCT tests advantage:
Advantage one: HCT can test in art production process, detect bad pcb board, in time with range of reducing risks
Expansion.
Advantage two: HCT can carry out batch row test, and it is independently to set that test, which will not destroy production board .HCT Coupon,
Meter heats just for the position HCT Coupon in typesetting white space, test process, does not influence, will not generate on other regions
PCB test is scrapped.
Advantage three: HCT test on-line testing may be implemented, can feed back product at high temperature each tie point in circuit whether be
Completely.For blind hole, the bad product of apertures bear building-up resultant force, pcb board meeting drawing crack hole bottom in expanded by heating, but it is cold
But it is connected again together after because substrate shrinks blind hole, resistance value measurement traditional at this time can not detect such defect situation.
Resistance value becomes between the test of advantage four: HCT can carry out batch internal resistance value variation and be criticized with batch testing, after the completion of test
Different monitoring analysis.The R value of single batch of PCB product resistance value can be managed according to processing procedure level, increased for batch interior small production that peels off
Product carry out detecting ability.Same item number can be compared by equipment background data base simultaneously, determine the stability of processing procedure, and can detect
It is abnormal by the gross
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (3)
1. a kind of PCB high current test method, which is characterized in that specifically includes the following steps:
S1, preceding resistance value measure: carrying out resistance value measurement to the both ends of HCT Coupon test loop using the micro- resistance instrument of four lines；
S2, high-current test: if the test of preceding resistance value passes through, enter high-current test link, operating procedure are as follows:
A) HCT Coupon test zone is evenly heated using heated at constant temperature disk first, makes test zone temperature about
100 DEG C or so, this link can shorten the testing time, but will lead to the situation of change within 100 DEG C cannot detect, such as to test
The spent time does not require too much, can omit this heating link, the high-current test directly since room temperature；
B) high current test is carried out to HCT Coupon test loop, is loaded using a constant current source in HCT Coupon
The both ends of test loop increase a voltmeter, under the action of electric current, electric energy continuous transformation at the both ends close to test loop
For thermal energy Q=I2* R*T (I be setting constant high current, R be Coupon test loop resistance value, T be continue upper electric current when
Between；I and T is got according to the calculating of the copper thickness and line width of the route of designed PCB) HCT Coupon regional temperature at this time
Can continue to increase, due to metal resistance value can the raising of near-linear as the temperature rises, and the electricity at test loop both ends
V=I*R is pressed, voltage can increase as the temperature rises；
C) lasting to be powered a period of time, specific time and PCB design, and the voltage of test to HCT Coupon test loop
It is current related.It usually using hot plate heating method, is then tested using high current, typical time period is 10~20 seconds；If not
It is heated using hot plate, then the typical time is 60 seconds.In this heating process, substrate material and metallic conductor material all can be because
The raising of temperature and different degrees of deformation occurs, generate the stress of multiple directions；
S3, it cools, after being tested by HCT high current, PCB regional temperature to be measured is usually higher at this time, cold using drying
But gas is rapidly cooled cooling to HCT Coupon test zone, the state before temperature is cooled to when resistance value measurement；
S4, rear resistance value measure, and after it experienced violent temperature change, there are the PCB products of quality hidden danger to produce for itself
Raw subtle variation needs to carry out HCT Coupon test loop the 4 line resistance values measurement under room temperature this moment；
S5, resistance varying-ratio calculate:
Resistance varying-ratio=100%x (the rear preceding resistance value of resistance value -)/preceding resistance value.
2. a kind of PCB high current test method according to claim 1, it is characterised in that: in the c of S2) in, if this link
Before the deadline, temperature cannot reach the section of setting or the region more than setting, then it represents that designed HCT
Coupon test loop is there may be the phenomenon that copper is thin or copper is thick, and during this, under the action of multiple resultant forces, binding force is weak
Part will be torn or be kept completely separate, it is bad then to show as the great reliability of PCB at this time, gradually slim if bottom hole separates
Hole is broken, and interface type hole is broken, through-hole ICD, blind hole ICD etc., due to becoming larger suddenly for test loop resistance value, by V=I*R it is found that electricity
Pressure can show as unexpected rising, if circuit is broken completely, R levels off to infinity, V be more than setting test voltage it
Afterwards, constant-current source variation is constant pressure source, and electric current I=V/R at this time, I level off to infinitesimal, and such phenomenon phenomenon is usually diagnosed as
PCB aperture bottom separation etc..
3. a kind of PCB high current test method according to claim 1, it is characterised in that: in S4, if HCT Coupon
The junction of the electroplating hole of connection produces slight slight crack, and the resistance value of HCT Coupon after testing can be made to become larger, if after cooling
Fracture, then HCT Coupon resistance value is infinity, if in the copper ion migration generated through super-high-current draw, it will originally
The connection of disconnected position and become partial short-circuit, so that the resistance value of HCT Coupon after test is become smaller, during this, in multiple conjunctions
Under the action of power, the weak part of binding force will be torn or be kept completely separate, and then show as the great reliability of PCB at this time not
Good, if bottom hole separates, gradually slim hole is broken, and interface type hole is broken, through-hole ICD, blind hole ICD etc., unexpected due to test loop resistance value
Become larger, by V=I*R it is found that voltage can show as unexpected rising, if circuit is broken completely, R levels off to infinity, in V
After the test voltage of setting, constant-current source variation is constant pressure source, and electric current I=V/R at this time, I level off to infinitesimal, such
Phenomenon is usually diagnosed as PCB aperture bottom separation etc..
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110146804A (en) * | 2019-06-08 | 2019-08-20 | 四会富仕电子科技股份有限公司 | A kind of PCB dynamic conducting method for testing reliability |
| CN111346843A (en) * | 2020-03-06 | 2020-06-30 | 湖北亿纬动力有限公司 | Screening method of lithium battery cell, storage medium and testing equipment |
| CN114113961A (en) * | 2021-11-05 | 2022-03-01 | 珠海市大鹏电子科技有限公司 | Screening method of photoelectric coupler |
| CN114859216A (en) * | 2022-07-07 | 2022-08-05 | 河北中电科航检测技术服务有限公司 | Intelligent working device for circuit board detection |
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| CN110146804A (en) * | 2019-06-08 | 2019-08-20 | 四会富仕电子科技股份有限公司 | A kind of PCB dynamic conducting method for testing reliability |
| WO2020248555A1 (en) * | 2019-06-08 | 2020-12-17 | 四会富仕电子科技股份有限公司 | Pcb dynamic conduction reliability test method |
| CN111346843A (en) * | 2020-03-06 | 2020-06-30 | 湖北亿纬动力有限公司 | Screening method of lithium battery cell, storage medium and testing equipment |
| CN111346843B (en) * | 2020-03-06 | 2022-04-12 | 湖北亿纬动力有限公司 | Screening method of lithium battery cell, storage medium and testing equipment |
| CN114113961A (en) * | 2021-11-05 | 2022-03-01 | 珠海市大鹏电子科技有限公司 | Screening method of photoelectric coupler |
| CN114859216A (en) * | 2022-07-07 | 2022-08-05 | 河北中电科航检测技术服务有限公司 | Intelligent working device for circuit board detection |
| CN114859216B (en) * | 2022-07-07 | 2022-09-09 | 河北中电科航检测技术服务有限公司 | Intelligent working device for circuit board detection |
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