CN216719633U - Output structure of power supply - Google Patents
Output structure of power supply Download PDFInfo
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- CN216719633U CN216719633U CN202220060154.XU CN202220060154U CN216719633U CN 216719633 U CN216719633 U CN 216719633U CN 202220060154 U CN202220060154 U CN 202220060154U CN 216719633 U CN216719633 U CN 216719633U
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- output
- circuit board
- heat dissipation
- power supply
- dissipation plates
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Abstract
An output structure of a power supply comprises a working circuit board, an output circuit board, a plurality of output connectors, a plurality of heat dissipation plates and a plurality of thermistors, the output circuit board is electrically connected with the working circuit board and is provided with at least one temperature sensing circuit, the output connectors are arranged on the output circuit board, the heat dissipation plates are arranged on the output circuit board and close to the output connectors, the heat dissipation plates simultaneously sense heat transferred by at least one of the output circuit board and the output connectors, the thermistors are respectively arranged corresponding to one of the heat dissipation plates and connected with the temperature sensing circuit, each thermistor senses heat on one of the corresponding heat dissipation plates to change resistance, so that the temperature sensing circuit generates resistance change, and the working circuit board performs heat dissipation processing based on different electrical signals.
Description
Technical Field
The present invention relates to an output structure of a power supply, and more particularly, to an output structure of a power supply that is capable of improving the conventional output structure of a power supply that is incapable of sensing the temperature of key components independently.
Background
In view of the above, although the conventional power supply is provided with a temperature sensing element (such as a thermistor) for sensing the temperature of the power supply, the conventional temperature sensing element actually senses the internal ambient temperature of the power supply. That is to say, when the conventional power supply is implemented, the conventional power supply must work for a period of time, and after a large amount of heat energy generated by the electronic component is accumulated inside the power supply, the internal ambient temperature of the power supply is raised, and at this time, the conventional temperature sensing component senses the temperature rise of the power supply, so that the work management module inside the power supply starts a corresponding heat dissipation mechanism.
However, the conventional temperature sensing device is prone to fail to detect the device temperature in the power supply, for example, when the power supply outputs a large current, the output connector is prone to generate a high temperature after operating for a period of time, and the ambient temperature sensed by the temperature sensing device is not greatly increased, and the work management module still controls the cooling fan to maintain the original rotation speed mode, so that the output connector cannot obtain effective cooling, and the output connector may be burned.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to solve the problem that the conventional temperature sensing mechanism can only sense the internal environment of the power supply and cannot independently sense the key components.
To achieve the above object, the present invention provides an output structure of a power supply, comprising a working circuit board, an output circuit board, a plurality of output connectors, a plurality of heat dissipation plates and a plurality of thermistors, wherein the working circuit board is provided with a working management module, the output circuit board is electrically connected with the working circuit board, the output circuit board is provided with at least one output circuit for obtaining power from the working circuit board and at least one temperature sensing circuit electrically connected with the working management module, the output connectors are arranged on the output circuit board and electrically connected with the output circuits, the heat dissipation plates are arranged on the output circuit board and close to the output connectors, the heat dissipation plates simultaneously sense heat transmitted by at least one of the output circuit board and the output connectors, the thermistors are respectively arranged corresponding to one of the heat dissipation plates, the thermistors are electrically connected with the temperature sensing circuit, each thermistor senses heat on one of the corresponding heat dissipation plates to change resistance, so that the temperature sensing circuit generates resistance change, and the work management module carries out heat dissipation processing based on different electric signals.
In one embodiment, the heat dissipation plates are perpendicular to the output circuit board and are disposed near a sidewall of at least one of the output connectors.
In one embodiment, each of the heat dissipation plates contacts the sidewall of one of the output connectors.
In one embodiment, the power supply has a back plate facing the output circuit board, the back plate has a plurality of openings formed therein corresponding to the output connectors, and the heat dissipation plates do not extend through the openings.
In one embodiment, the length of the heat sinks is smaller than the distance from the output circuit board to the back plate.
In one embodiment, each of the heat dissipation plates is disposed on the output circuit board in any one of the following ways:
first, the input connector is disposed close to only one of the output connectors;
and the second mode is that at least two adjacent output connectors are arranged close to each other.
In one embodiment, at least one of the output connectors has a plurality of high-potential connection pins and a plurality of reference-potential connection pins, and at least one of the heat dissipation plates is electrically connected to the high-potential connection pins of one of the output connectors disposed in close proximity thereto.
In one embodiment, at least one of the heat dissipation plates is electrically connected to one of the output lines.
In one embodiment, the thermistors are arranged in parallel in the temperature sensing circuit.
In one embodiment, the output circuit board is provided with a plurality of holes for the heat dissipation plates to be inserted.
According to the disclosure of the present invention, compared with the conventional art, the present invention has the following features: the utility model senses the temperature of the output connectors and the output circuit board by the thermistors, when the power supply outputs large current for a long time, the thermistors can change the resistance value of the temperature sensing circuit based on the temperature of the heat dissipation plates, so that the work management module can take heat dissipation measures in real time, and the output connectors and the output circuit board are prevented from being damaged due to overhigh temperature for a long time.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is an exploded view of an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of the present invention;
FIG. 4 is a schematic diagram of an output circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic circuit diagram of an embodiment of the present invention;
FIG. 6 is a schematic diagram of thermistors connected in parallel according to an embodiment of the utility model.
[ notation ] to show
100: power supply
10: output structure
11: working circuit board
111: work management module
12: output circuit board
121: output line
122: temperature sensing circuit
123: hole site
124: distance between two adjacent plates
13: output connector
131: side wall
132: high potential connecting pin
133: reference potential connecting pin
14: heat radiation plate
141: length of
15: thermal resistor
20: output end
40: back plate
41: opening holes
Detailed Description
The present invention is described in detail and technical content with reference to the accompanying drawings, wherein:
referring to fig. 1 to 6, the present invention provides an output structure 10, the output structure 10 is located on an output terminal 20 of a power supply 100, and includes a working circuit board 11, an output circuit board 12, a plurality of output connectors 13, a plurality of heat dissipation plates 14, and a plurality of thermistors 15. In detail, the working circuit board 11 is located in the power supply 100 and is provided with a working management module 111, the working management module 111 is used as a control source of the power supply 100, and the working management module 111 may be a Micro Controller Unit (MCU) for controlling other components (such as an inductor, a capacitor, a resistor, etc.) in the power supply 100 to work. The output circuit board 12 is electrically connected to the working circuit board 11 and provides the output connectors 13 thereon, the output circuit board 12 includes a plurality of output lines 121 and at least one temperature sensing line 122, the output lines 121 may be conductive layers formed on the output circuit board 12, the output lines 121 obtain power from the working circuit board 11 and provide power to the output connectors 13, and the temperature sensing line 122 is electrically connected to the work management module 111, and the work management module 111 may generate at least one electrical signal based on the temperature sensing line 122.
In addition, the heat dissipation plates 14 are disposed on the output circuit board 12 and made of a heat conductive material, such as a metal plate. The heat dissipation plates 14 are close to the output connectors 13, and the distance between the heat dissipation plates 14 and the output connectors 13 must be within a range where the heat dissipation plates 14 can sense the heat radiation of at least one of the output connectors 13, so that the heat dissipation plates 14 can simultaneously sense the heat transferred by at least one of the output circuit board 12 and the output connectors 13. In addition, the thermistors 15 are respectively disposed corresponding to one of the heat dissipation plates 14, and each of the thermistors 15 is electrically connected to the temperature sensing circuit 122, in an embodiment, the thermistors 15 are disposed in parallel in the temperature sensing circuit 122, as shown in fig. 6. Each of the thermistors 15 senses heat on one of the heat dissipating plates 14, and when the temperature of at least one of the output circuit board 12 and the output connectors 13 rises, at least one of the thermistors 15 corresponding to the output connectors 13 is subjected to a temperature effect, so as to change the resistance of the temperature sensing circuit 122, and the work management module 121 generates different electrical signals based on the resistance change of the temperature sensing circuit 122, so as to control a heat dissipating module (not shown) of the power supply 100 to provide different heat dissipating processes for the output circuit board 12 and the output connectors 13.
Compared with the conventional output connector or the conventional output circuit board, the work management module 111 of the present invention can take corresponding heat dissipation measures to the output structure 10, such as increasing the rotation speed of the fan in the power supply 100, based on the resistance change of the temperature sensing circuit 122 when the temperature of the output structure 10 is increased, so as to reduce the situation that the conventional power supply can only use the internal ambient temperature as the control basis of the control source, which leads to the burning of the conventional output connector or the conventional output circuit board due to the high temperature work.
Referring to fig. 1 to 5, in an embodiment, the heat dissipation plates 14 may be disposed on the output circuit board 12 by soldering or may be plugged into the output circuit board 12. In terms of the plugging method, a plurality of holes 123 for installing the heat dissipation plates 14 are formed in advance on the output circuit board 12, and the holes 123 are respectively located around at least one of the output connectors 13, so that the heat dissipation plates 14 are fixed on the output circuit board 12 and are perpendicular to the output circuit board 12 and are arranged close to a sidewall 131 of at least one of the output connectors 13. Specifically, each of the heat dissipation plates 14 may be disposed near the sidewall 131 of one of the output connectors 13, such that each of the heat dissipation plates 14 only senses the temperature of the adjacent one of the output circuit board 12 and the output connectors 13 to the heat dissipation plate 14, and each of the heat dissipation plates 14 may also sense at least two of the adjacent output connectors 13, in this embodiment, each of the heat dissipation plates 14 is disposed near at least two of the adjacent output connectors 13, and at least one of the heat dissipation plates 14 is electrically connected to one of the output lines 121. More specifically, at least one of the output connectors 13 of the present invention has a plurality of high-potential connection pins 132 and a plurality of reference-potential connection pins 133, the potential of the reference-potential connection pins 133 is grounded, and the high-potential connection pins 132 have a high potential, for example +12V, relative to the reference-potential connection pins 133, at least one of the heat dissipation plates 14 is electrically connected to the high-potential connection pins 132 of the output connectors 13 close to the heat dissipation plate 14, and the heat dissipation plates 14 not only sense the temperature of the output circuit board 12 and the corresponding output connector 13, but also receive the current of the output connector 13 having the high-potential connection pins 132, and provide the current buffer of the output connector 13 having the high-potential connection pins 132.
In one embodiment, each of the heat dissipation plates 14 is not in contact with the sidewall 131 of one of the output connectors 13, and the heat dissipation plates 14 sense the temperature of at least one of the output connectors 13 through heat radiation. In addition, each of the heat dissipation plates 14 may also be designed to contact the sidewall 131 of one of the output connectors 13, so that the heat energy on the output connectors 13 is transferred to the corresponding heat dissipation plate 14 through heat conduction.
In addition, the power supply 100 of the present invention has a back plate 40 facing the output circuit board 12 and located at the output end 20, the back plate 40 is formed with a plurality of openings 41 corresponding to the output connectors 13, and the openings 41 provide the output connectors 13 to be exposed on the surface of the back plate 40. The length 141 of the heat dissipation plates 14 is smaller than the distance 124 from the output circuit board 12 to the back plate 40, and the length 141 is the distance from the end of the heat dissipation plates 14 facing the output circuit board 12 to the end facing the back plate 40. After the heat dissipation plates 14 are assembled on the output circuit board 12, the heat dissipation plates 14 do not interfere with the back plate 40, and more specifically, the heat dissipation plates 14 do not pass through the openings 41 of the back plate 40, and when a user views through the output end 20 of the power supply 100, the heat dissipation plates 14 are not exposed on the surface of the back plate 40.
Claims (11)
1. An output structure of a power supply, comprising:
the working circuit board is provided with a working management module;
the output circuit board is electrically connected with the working circuit board, and is provided with at least one output line for obtaining electric power from the working circuit board and at least one temperature sensing line electrically connected with the working management module;
a plurality of output connectors arranged on the output circuit board and electrically connected with the output lines;
a plurality of heat dissipation plates, which are arranged on the output circuit board and close to the output connectors, and sense the heat transmitted by at least one of the output circuit board and the output connectors; and
the plurality of thermistors are respectively arranged corresponding to one of the heat dissipation plates and electrically connected with the temperature sensing circuit, and each thermistor senses heat on one of the heat dissipation plates correspondingly arranged to change resistance value, so that the temperature sensing circuit generates resistance value change, and the work management module carries out heat dissipation processing based on different electric signals.
2. The output structure of the power supply according to claim 1, wherein the heat dissipation plates are perpendicular to the output circuit board and disposed near a sidewall of at least one of the output connectors.
3. The output structure of the power supply according to claim 2, wherein each of the heat dissipation plates contacts the sidewall of one of the output connectors.
4. The output structure of the power supply according to claim 2, wherein the power supply has a back plate facing the output circuit board, the back plate has a plurality of openings formed therein corresponding to the output connectors, and the heat dissipation plates do not protrude through the openings.
5. The output structure of the power supply according to claim 4, wherein the length of the heat sinks is less than the distance from the output circuit board to the back plate.
6. The output structure of the power supply according to claim 1 or 2, wherein each of the heat dissipation plates is disposed on the output circuit board in any one of the following manners:
first, the input connector is disposed close to only one of the output connectors;
and the second mode is that at least two adjacent output connectors are arranged close to each other.
7. The output structure of the power supply according to claim 6, wherein at least one of the output connectors has a plurality of high-potential connection pins and a plurality of reference-potential connection pins, and at least one of the heat dissipation plates is electrically connected to the high-potential connection pins of one of the output connectors disposed in close proximity thereto.
8. The output structure of the power supply according to claim 1, wherein at least one of the output connectors has a plurality of high-potential connection pins and a plurality of reference-potential connection pins, and at least one of the heat dissipation plates is electrically connected to the high-potential connection pins of one of the output connectors disposed in close proximity thereto.
9. The output structure of the power supply according to claim 1, wherein at least one of the heat dissipation plates is electrically connected to one of the output lines.
10. The output structure of the power supply according to claim 1, wherein the thermistors are disposed in parallel in the temperature sensing circuit.
11. The output structure of the power supply according to claim 1, wherein the output circuit board has a plurality of holes for the heat dissipation plates to be inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220060154.XU CN216719633U (en) | 2022-01-11 | 2022-01-11 | Output structure of power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220060154.XU CN216719633U (en) | 2022-01-11 | 2022-01-11 | Output structure of power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216719633U true CN216719633U (en) | 2022-06-10 |
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ID=81891554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220060154.XU Active CN216719633U (en) | 2022-01-11 | 2022-01-11 | Output structure of power supply |
Country Status (1)
| Country | Link |
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| CN (1) | CN216719633U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230244286A1 (en) * | 2022-01-28 | 2023-08-03 | Sea Sonic Electronics Co., Ltd. | Output structure for power supply |
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2022
- 2022-01-11 CN CN202220060154.XU patent/CN216719633U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230244286A1 (en) * | 2022-01-28 | 2023-08-03 | Sea Sonic Electronics Co., Ltd. | Output structure for power supply |
| US11803218B2 (en) * | 2022-01-28 | 2023-10-31 | Sea Sonic Electronics Co., Ltd. | Output structure for power supply with a plurality of heat dissipation plates |
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