CN217011576U

CN217011576U - Heatable radiator and electronic equipment

Info

Publication number: CN217011576U
Application number: CN202220297114.7U
Authority: CN
Inventors: 韩晓彤; 常永良; 柳顺兵
Original assignee: Zhejiang Uniview Technologies Co Ltd
Current assignee: Zhejiang Uniview Technologies Co Ltd
Priority date: 2022-02-14
Filing date: 2022-02-14
Publication date: 2022-07-19
Anticipated expiration: 2032-02-14

Abstract

The utility model discloses a heatable radiator and electronic equipment, wherein the radiator comprises a radiator main body made of graphene, and the radiator main body is close to a chip and used for radiating the heat of the chip; the radiator main body is provided with at least two electrodes, at least one electrode is electrically connected with the power supply part, and at least one electrode is electrically connected with the grounding part, so that the radiator main body is electrified to be heated to heat the chip. The electronic device comprises a circuit board and a heatable heat sink. The utility model relates to the technical field of circuit boards, and provides a heatable radiator and electronic equipment.

Description

Heatable radiator and electronic equipment

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a heatable radiator and electronic equipment.

Background

The electronic device has temperature specification requirements during working, some heat dissipation measures and heating measures can be added when the specification is not met, in the product design, the heat dissipation measures and the heating measures are often contradictory, a radiator needs to be arranged to reduce the temperature rise of the device under the high-temperature condition, a heating film needs to improve the temperature rise of the device under the low-temperature condition, the radiator and the heating film need to be arranged on the electronic device, and the radiator and the heating film are respectively fixed on a circuit board and have respective functions. The excessive radiators can reduce the temperature rise of the device, but when the temperature rise needs to be improved at low temperature, more energy needs to be consumed for the heating film so as to meet the temperature rise requirement.

When the single-point heating to the chip on the circuit board, the heating film can't directly paste on the chip of veneer, paste the heat conduction pad through the structure usually, perhaps heat inside ambient temperature, realize transmitting the temperature rise of heating film to the chip, this scheme heating film has the bigger consumption, consumes the resource. In addition, when the chips are heated at multiple points at different positions, if the distance between each chip is long, a plurality of heating films are needed to be matched, the structure is complex, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a heatable radiator which is used for heating and radiating chips on a circuit board, wherein the circuit board is provided with a grounding part and a power supply part which can supply power and cut off power, the radiator comprises a radiator main body made of graphene, and the radiator main body is close to the chips and used for radiating the chips;

the radiator main body is provided with at least two electrodes, at least one electrode is electrically connected with the power supply part, and at least one electrode is electrically connected with the grounding part, so that the radiator main body is electrified to be heated to heat the chip.

One possible design is that the heat sink body includes a graphene substrate and at least one graphene fin plate, the graphene fin plate is disposed on the top of the graphene substrate, the bottom surface of the graphene substrate is close to the chip, and the electrode is disposed on the graphene substrate.

In a possible design, the electrode is a metal piece embedded in the graphene substrate, the electrode electrically connected to the power supply portion is a positive terminal, and the electrode electrically connected to the ground portion is a negative terminal.

In one possible design, there are at least two positive terminals, there is one negative terminal, and the positive terminals are electrically connected to the power supply unit respectively;

or at least two negative terminals are arranged, one positive terminal is arranged, and at least one of the negative terminals is electrically connected with the grounding part.

In one possible embodiment, the electrodes are provided in at least three, and the distances between two adjacent electrodes are different from each other.

In one possible design, the power supply portion further comprises a conductive screw and an abutment, the electrode being provided as a first nut;

the conductive screws penetrate through the graphene substrate and are respectively connected with the first nuts and the abutting pieces, and the abutting pieces are arranged on one side, back to the chip, of the circuit board and abut against the power supply portion.

In one possible design, the power supply portion includes a connector and a conductive mechanism, the connector connecting the electrodes by leads; or the connector is connected with a conductive mechanism, and the conductive mechanism is connected with the electrode through a lead.

In one possible design, a plurality of the graphene fin plates are vertically or angularly spaced on the graphene substrate.

The embodiment of the utility model provides electronic equipment which comprises a circuit board provided with a chip and the heatable radiator.

In one possible design, the electronic device further includes a controller and a temperature sensor for measuring an ambient temperature, the controller is electrically connected to the temperature sensor and the power supply portion, respectively, and the controller is configured to control power supply and power off of the power supply portion according to measurement data of the temperature sensor.

The heatable radiator provided by the embodiment of the utility model is additionally provided with the radiator main body made of graphene, and the high heat conductivity coefficient characteristic and the resistance characteristic of the graphene composite material are utilized, so that the heat radiation can be realized, the chip can be heated when the power supply part supplies power, the heat radiation and the heating function are integrated, the structure is simplified, and the energy consumption and the production cost are reduced.

The heatable radiator provided by the embodiment of the utility model is provided with a plurality of positive wiring ends or a plurality of negative wiring ends, and the distances between the positive wiring ends and the negative wiring ends can be adjusted to directly adjust the resistance value by matching different positive wiring ends or negative wiring ends; or the plurality of electrodes are respectively and electrically connected, so that the effect of parallel connection of resistors is achieved, and the heating requirements of different power consumptions can be met under the condition of unchanged voltage.

Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the utility model. The objectives and other advantages of the utility model may be realized and attained by the structure particularly pointed out in the written description and drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the example serve to explain the principles of the utility model and not to limit the utility model.

FIG. 1 is a schematic view of a heatable heat sink according to an embodiment of the present invention;

FIG. 2 is a partial schematic view of the heatable heat sink of FIG. 1;

FIG. 3 is a first schematic view of the heat sink body of FIG. 1;

FIG. 4 is a first schematic view of the heat sink body of FIG. 1;

FIG. 5 is a schematic view of the electrodes of the heat sink body of FIG. 1;

FIG. 6 is a schematic view of a heatable heat sink according to another embodiment of the present invention;

FIG. 7 is a schematic view of a heatable heat sink according to yet another embodiment of the present invention.

Reference numerals: the structure comprises a circuit board 1, a chip 2, a radiator 3, a power supply part 4, a grounding part 5, a positive terminal 6, a graphene substrate 7, a graphene fin plate 8, a conductive screw 9, a negative terminal 10, a fixing hole 11, a first nut 12, a second nut 13, a second edge 14, a first edge 15 and an electrode 16.

Detailed Description

To make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.

At present, a heat radiator and a heating film are respectively arranged on the related electronic devices, and are respectively used for heat radiation and temperature rise of a chip. When the chip needs to be heated on the circuit board, the heating film usually transmits heat to the chip through the heat conducting pad, or the ambient temperature of the circuit board is improved, so that the temperature rise of the chip is realized. In addition, when the chips are heated at multiple points at different positions, if the distance between each chip is long, a plurality of heating films are needed to be matched, the structure is complex, and the production cost is increased.

Referring to fig. 1 to 7, a heatable heat sink according to an embodiment of the present invention includes a circuit board 1 and a chip 2 disposed on the circuit board, wherein the circuit board 1 is provided with a grounding portion 5 and a power supply portion 4 capable of supplying and interrupting power, and the heatable heat sink further includes a heat sink main body 3 made of graphene, the heat sink main body 3 is connected to the circuit board 1, and a bottom surface of the heat sink main body 3 is close to a top surface of the chip 2 to provide heat dissipation for the chip 2. At the same time, the heat sink main body 3 is provided with at least two electrodes 16, at least one of which is electrically connected to the power supply portion 4 and at least one of which 16 is electrically connected to the ground portion 5, so that the heat sink main body is energized to raise the temperature to heat the chip 2 at the time of the power supply portion 4. From this, heatable radiator has increased the radiator main part that graphite alkene made, and it utilizes graphite alkene combined material's high coefficient of thermal conductivity characteristic and resistance characteristic, both can realize the heat dissipation, but the heating chip again for heat dissipation and heating function integration are in the same place, have simplified the structure, have reduced energy consumption and manufacturing cost.

In the case of the circuit board 1, there are multiple layers of copper sheets, including copper sheets on the bottom surface thereof, which enable the circuit board 1 to conduct electricity and transmit signals in the transverse direction, and vias (not shown) on the circuit board 1 to conduct electricity and transmit signals in the longitudinal direction of the circuit board 1. The grounding part 5(GND) on the circuit board 1 can be formed by copper sheets and/or via holes, the power supply part 4(Vcc) on the circuit board 1 is usually positioned on the inner layer of the circuit board 1 and can be used as a power supply of the circuit board 1 to supply power, and the power supply part 4 also comprises conductive mechanisms such as bright copper areas (namely the copper sheets on the surface) and/or via holes on the circuit board 1, so that the conduction and signal transmission from the inner layer to the outer layer are realized. In addition, the power supply portion 4 has two states, i.e., a power supply state in which the power supply portion 4 can supply power to the devices connected thereto and a power off state in which the power supply portion 4 cannot supply power.

As shown in fig. 2 to 5, the heat spreader body is made of graphene, and has good thermal conductivity, so that heat of a device in contact with the heat spreader body can be quickly conducted out to reduce the heat of the device, and the heat spreader can be used for heat dissipation of a chip. Meanwhile, the graphene has a resistance characteristic, and when the graphene is electrified, heat can be generated like a resistance wire, so that the temperature of the graphene is increased, and the temperature of a device contacted with the graphene is increased. The heat sink body includes a graphene substrate 7 and a plurality of graphene fins 8, wherein the graphene substrate 7 is a flat plate, which may be rectangular, but is not limited thereto, and may also be circular or irregular. The graphene fin plate 8 is located at the top of the graphene substrate 7 and arranged at equal intervals, and the graphene fin plate 8 is perpendicular to the graphene substrate 7, but not limited thereto, and the intervals and the extending direction of the graphene fin plate 8 can be arranged according to the requirements of the circuit board 1. In addition, the graphene substrate 7 may be fixed on the circuit board 1 by screws, and the fixing holes 11 may be formed therethrough, and screws made of plastic may be inserted through the fixing holes 11 and fastened to the circuit board 1. And after the radiator main body 3 is fixed on the circuit board 1, the graphene substrate 7 is parallel to the circuit board 1, the bottom surface of the graphene substrate is close to the top surface of the chip 2, direct attachment is realized or the graphene substrate is indirectly contacted with the chip 2 through a heat conduction material, and the bottom surface of the graphene substrate 7 can be close to one or more chips 2, so that the graphene substrate acts on the chips 2.

As shown in fig. 2 to 5, the electrode 16 is divided into a positive terminal 6 and a negative terminal 10 according to the electrical connection, wherein the positive terminal 6 is electrically connected to the power supply portion 4, and the negative terminal 10 is electrically connected to the ground portion 5. In this example there are two electrodes, a positive terminal 6 and a negative terminal 10 on the graphene substrate 7 and avoiding the graphene fin 8, the positive terminal 6 and the negative terminal 10 being spaced apart. The circumferential edge of the graphene substrate 7 comprises a first edge 15 and a second edge 14 far away from the first edge 15, wherein the positive terminal 6 is close to the first edge 15, the negative terminal 10 is close to the second edge 14, and all the graphene fins 8 are located between the positive terminal 6 and the negative terminal 10, so that the positive terminal 6 is far away from the negative terminal 10. Further, the graphene substrate 7 is rectangular, and the positive terminal 6 and the negative terminal 10 are respectively located at two opposite corners thereof, but the present invention is not limited thereto, and may be other positions near the circumferential edge.

Specifically, the electrode 16 is formed by a metal part embedded in the graphene substrate 7, wherein the metal part is a first nut 12, the graphene substrate 7 is provided with a through hole, the first nut 12 is located in the through hole, the positive terminal 6 serves as a positive electrode of the heat sink main body 3, and the negative terminal 10 serves as a negative electrode of the heat sink main body 3. Meanwhile, the first nut 12 is electrically connected to the circuit board 1 through the conductive screw 9 and the abutting member, wherein the abutting member is a second nut, the conductive screw 9 and the second nut 13 are both metal members, which have good conductivity, another through hole is provided on the circuit board 1 corresponding to the first nut 12, and the copper sheet on the bottom surface of the circuit board 1 belongs to the grounding portion 5 or the power supply portion 4. Thus, the conductive screw 9 penetrates through the graphene substrate 7 and is screwed with the first nut 12 and the second nut 13, the second nut 13 abuts against a copper sheet on a side of the circuit board 1 opposite to the chip 2, if the copper sheet is a part of the power supply part 4, in a power supply state of the power supply part 4, current moves as indicated by an arrow in fig. 2, the circuit board 1 moves to the graphene substrate 7, and the negative terminal 10 similarly guides the current to the ground part 5 by using the conductive screw 9 and the second nut 13, thereby forming a path. The abutting member is not limited to the second nut 13, and may be another metal member connected to the first screw, as long as the first screw is connected to abut against the bright copper on the bottom of the circuit board 1.

As also shown in fig. 5, the distance between the positive terminal 6 and the negative terminal 10 is L, which affects the resistance of the heat sink body 3 when it is powered on, so that adjusting the positions of the positive terminal 6 and the negative terminal 10 when the power supply voltage is constant can control the heat generating efficiency of the heat sink body 3.

From the above, under the high temperature condition, this radiator main part 3 can be for the heat dissipation of chip 2, and under the low temperature condition radiator main part 3 can the circular telegram produce the heat, heat chip 2 for radiator main part 3 has integrateed heat dissipation and heating two kinds of functions, can act on a plurality of chips 2 moreover, has simplified the structure, and the consumption also can obviously reduce.

In some exemplary embodiments, as shown in fig. 6, the graphene substrate 7 is rectangular, and the positive terminal 6 and the negative terminal 10 are not located at two opposite corners, but it may also be used to form a through hole on the circuit board 1, where the circuit board 1 needs to be provided with through holes corresponding to the positive terminal 6 and the negative terminal 10.

In some exemplary embodiments, as shown in fig. 7, there are one positive terminal 6 and two negative terminals 10, forming a case of three electrodes, the two negative terminals 10 are at two corners of the graphene substrate 7, the positive terminal 6 is at the other corner, and the distances from the positive terminal 6 to the two negative terminals 10 are different. When the two negative terminals 10 are both connected to the grounding portion 5, since the current of the positive terminal 6 can flow to the two negative terminals 10 in two directions, the heat sink main body 3 can generate the effect of two resistors connected in parallel, which is different from the resistance value electrically connected with the single negative terminal 10, so as to change the resistance of the heat sink main body 3 and the heating power consumption. Therefore, by arranging a plurality of electrodes, parallel resistors can be realized, so that the heating requirements with different power consumption can be met, in addition, the number of the negative terminals 10 is not limited to two, and can also be three or more, and the number of the positive terminals 6 can also be two or more.

In some exemplary embodiments, the positive terminal 6 is provided in plurality, and the negative terminal 10 is provided in one, and in case of forming a plurality of electrodes, a parallel type resistor can be realized, thereby achieving the heating requirements with different power consumption.

In some exemplary embodiments, where three electrodes are formed, the three electrodes are spaced differently from each other, wherein one negative terminal 10, one positive terminal 6, and one is a vacant electrode that can be interchanged with either the negative terminal 10 or the positive terminal 6 described above. For example, when the original empty electrode is connected to the power supply portion and changed to the positive terminal 6, and the original positive terminal 6 is disconnected from the power supply portion to form an empty electrode, the path of the current on the heat sink main body 3 is changed, which results in a change in the resistance value output from the heat sink main body 3. Therefore, by arranging a plurality of electrodes, resistance conversion can be realized, and the heating requirements with different power consumptions are met. In addition, the number of the electrodes to be left vacant is not limited, and the number of the negative terminals 10 and the positive terminals 6 is not limited.

In some exemplary embodiments, the electrodes may be routed directly to a connector on the circuit board, eliminating a conductive screw and a second nut; alternatively, the connector is connected to a conductive mechanism (e.g., copper foil, etc.) that is connected to the electrodes by leads.

In some exemplary embodiments, the pre-embedded position of the first nut is not staggered with respect to the graphene fin plate, and the bottom of the first nut is connected to the power supply portion or the grounding portion through a lead.

In some exemplary embodiments, an electronic device includes a controller (not shown in the figure) and a temperature sensor (not shown in the figure) for measuring an ambient temperature, wherein the controller is configured to be electrically connected to the temperature sensor, and the controller is further electrically connected to the power supply portion 4 to control switching between a power supply state and a power off state of the power supply portion 4. After the electronic equipment is started, when temperature data measured by the temperature sensor is lower than or equal to a first preset temperature, a low-temperature signal is sent to the controller, the controller controls the power supply part 4 to be in a power supply state according to the low-temperature signal, the radiator main body 3 is electrified to generate heat and heat the chip 2, when the temperature data measured by the temperature sensor is higher than a second preset temperature, a high-temperature signal is sent to the controller, the controller controls the power supply part 4 to be in a power-off state according to the high-temperature signal, and the heating process of the radiator main body 3 is stopped. After the electronic device is started, if the temperature data measured by the temperature sensor is higher than a second preset temperature, the controller controls the power supply part 4 to keep a power-off state according to the high-temperature signal, so that the radiator main body 3 only plays a role in heat dissipation.

In combination with the above embodiment, the heatable radiator provided by the embodiment of the utility model is additionally provided with the radiator main body made of graphene, and the high thermal conductivity coefficient characteristic and the resistance characteristic of the graphene composite material are utilized, so that the heat radiation can be realized, the chip can be heated when the power supply part supplies power, the heat radiation and the heating function are integrated, the structure is simplified, and the energy consumption and the production cost are reduced. The heatable radiator provided by the embodiment of the utility model is provided with a plurality of positive wiring ends or a plurality of negative wiring ends which are matched with different positive wiring ends or negative wiring ends, and the distance between the positive wiring ends and the negative wiring ends can be adjusted to directly adjust the resistance value; or a plurality of electrodes are respectively electrically connected, so that the effect of parallel connection of resistors is achieved, and the heating requirements of different power consumption can be met under the condition of unchanged voltage.

In the description of the present invention, it should be noted that the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "opposite", "four corners", "periphery", "mouth" structure ", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the structures referred to have specific orientations, are configured and operated in specific orientations, and thus, are not to be construed as limiting the present invention.

In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "connected," "directly connected," "indirectly connected," "fixedly connected," "mounted," and "assembled" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; the terms "mounted," "connected," and "fixedly connected" may be directly connected or indirectly connected through intervening media, or may be connected through two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A heatable radiator is used for heating and radiating chips on a circuit board, and the circuit board is provided with a grounding part and a power supply part which can supply power and cut off power, and is characterized in that the radiator comprises a radiator main body made of graphene, and the radiator main body is close to the chips and used for radiating the chips;

2. The heatable heat sink of claim 1, wherein the heat sink body comprises a graphene substrate and at least one graphene fin plate, the graphene fin plate is disposed on top of the graphene substrate, a bottom surface of the graphene substrate is proximate to the chip, and the electrodes are disposed on the graphene substrate.

3. The heatable heat sink of claim 2, wherein the electrode is a metal member embedded in the graphene substrate, the electrode electrically connected to the power supply portion is a positive terminal, and the electrode electrically connected to the ground portion is a negative terminal.

4. The heatable heat sink of claim 3, wherein there are at least two of the positive terminals, one of the negative terminals, and a plurality of the positive terminals electrically connected to the power supply portions, respectively;

5. Heatable heat sink according to any one of claims 2-4, characterised in that the electrodes are provided in at least three, the distance between two adjacent electrodes being different.

6. Heatable heat sink according to any one of claims 2-4, characterized in that the power supply part further comprises an electrically conductive screw and an abutment, the electrode being provided as a first nut;

7. The heatable heat sink according to any one of claims 2-4, wherein the power supply portion comprises a connector and an electrically conductive mechanism, the connector connecting the electrodes by leads; or the connector is connected with a conductive mechanism, and the conductive mechanism is connected with the electrode through a lead.

8. The heatable heat sink of any one of claims 2 to 4, wherein a plurality of the graphene fin plates are disposed vertically or at angular intervals on the graphene substrate.

9. An electronic device comprising a circuit board provided with a chip, characterized in that the electronic device further comprises a heatable heat sink according to any one of claims 1-8.

10. The electronic device of claim 9, further comprising a controller and a temperature sensor for measuring an ambient temperature, the controller being electrically connected to the temperature sensor and the power supply portion, respectively, the controller being configured to control the power supply and the power disconnection of the power supply portion according to measurement data of the temperature sensor.